JPS562326U - - Google Patents
Info
- Publication number
- JPS562326U JPS562326U JP8979680U JP8979680U JPS562326U JP S562326 U JPS562326 U JP S562326U JP 8979680 U JP8979680 U JP 8979680U JP 8979680 U JP8979680 U JP 8979680U JP S562326 U JPS562326 U JP S562326U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Sawing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8979680U JPS5938981Y2 (en) | 1980-06-24 | 1980-06-24 | Band saw pulley for frozen food |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8979680U JPS5938981Y2 (en) | 1980-06-24 | 1980-06-24 | Band saw pulley for frozen food |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS562326U true JPS562326U (en) | 1981-01-10 |
JPS5938981Y2 JPS5938981Y2 (en) | 1984-10-30 |
Family
ID=29322923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8979680U Expired JPS5938981Y2 (en) | 1980-06-24 | 1980-06-24 | Band saw pulley for frozen food |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5938981Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017117992A (en) * | 2015-12-25 | 2017-06-29 | 信越半導体株式会社 | Bandsaw cutting device and cutting method of silicon crystal by bandsaw cutting device |
JP2017118010A (en) * | 2015-12-25 | 2017-06-29 | 信越半導体株式会社 | Bandsaw cutting device and cutting method of silicon crystal |
-
1980
- 1980-06-24 JP JP8979680U patent/JPS5938981Y2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017117992A (en) * | 2015-12-25 | 2017-06-29 | 信越半導体株式会社 | Bandsaw cutting device and cutting method of silicon crystal by bandsaw cutting device |
JP2017118010A (en) * | 2015-12-25 | 2017-06-29 | 信越半導体株式会社 | Bandsaw cutting device and cutting method of silicon crystal |
Also Published As
Publication number | Publication date |
---|---|
JPS5938981Y2 (en) | 1984-10-30 |