JP2017114583A - Transport device and substrate used in the same - Google Patents

Transport device and substrate used in the same Download PDF

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JP2017114583A
JP2017114583A JP2015248435A JP2015248435A JP2017114583A JP 2017114583 A JP2017114583 A JP 2017114583A JP 2015248435 A JP2015248435 A JP 2015248435A JP 2015248435 A JP2015248435 A JP 2015248435A JP 2017114583 A JP2017114583 A JP 2017114583A
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base
outer peripheral
substrate
transport
workpieces
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JP6668738B2 (en
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笹岡　嘉一
Yoshikazu Sasaoka
嘉一 笹岡
淳也 田中
Junya Tanaka
淳也 田中
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to KR1020160169414A priority patent/KR101879192B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G29/00—Rotary conveyors, e.g. rotating discs, arms, star-wheels or cones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/26—Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
    • B65G47/30—Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles during transit by a series of conveyors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2812/00—Indexing codes relating to the kind or type of conveyors
    • B65G2812/01—Conveyors composed of several types of conveyors
    • B65G2812/012—Conveyors composed of several types of conveyors for conveying material successively by a series of conveyors
    • B65G2812/013—Conveyors composed of several types of conveyors for conveying material successively by a series of conveyors without relative movement between conveyors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Feeding Of Articles To Conveyors (AREA)

Abstract

PROBLEM TO BE SOLVED: To inhibit displacement of work-pieces in transportation to stably transport the work-pieces and inhibit scratches on a transport surface of a transport part.SOLUTION: A transport device includes: a first substrate 140; a transport part 170; a first driving part 130; and a second driving part 160. The first substrate 140 is made of metal. Work-pieces 1 which are sequentially transported by the first substrate 140 are placed on a transport surface of the transport part 170. The transport surface of the transport part 170 slidably contacts with a lower surface of an outer peripheral part of the first substrate 140. Surface roughness of the lower surface of the outer peripheral part of the first substrate 140 is smaller than surface roughness of an upper surface of the first substrate 140.SELECTED DRAWING: Figure 2

Description

本発明は、搬送装置およびそれに用いられる基盤に関する。   The present invention relates to a transport device and a base used for the transport device.

複数のワークを搬送する搬送装置の構成を開示した先行文献として、特開２００８−１０５８１１号公報(特許文献１)、および、特開２００８−２６０５９４号公報(特許文献２)がある。   As prior literatures that disclose the configuration of a transporting device that transports a plurality of workpieces, there are Japanese Patent Laid-Open No. 2008-105811 (Patent Document 1) and Japanese Patent Laid-Open No. 2008-260594 (Patent Document 2).

特許文献１に記載された搬送装置においては、検査用のガラス製基盤は、複数のワークを整列させて順次供給する基盤の下方に近接配置され、ワークが周縁部に載置される。   In the transport apparatus described in Patent Document 1, a glass substrate for inspection is arranged close to a lower portion of a substrate that sequentially supplies a plurality of workpieces aligned, and the workpiece is placed on the peripheral edge.

特許文献２に記載された搬送装置においては、検査用のガラス製基盤は、複数のワークを整列させて順次供給するリニアフィーダの下方に近接配置され、ワークが周縁部に載置される。   In the transport apparatus described in Patent Document 2, a glass substrate for inspection is arranged close to a lower side of a linear feeder that sequentially supplies a plurality of workpieces aligned, and the workpieces are placed on the peripheral edge.

特開２００８−１０５８１１号公報JP 2008-105811 A 特開２００８−２６０５９４号公報JP 2008-260594 A

検査用のガラス製基盤などの搬送部の搬送面に載置される際のワークの落差が大きい場合、ワークの位置ずれが発生しやすく、ワークを安定して搬送することができない。また、搬送部の搬送面に傷が付きやすい。   When the drop of the workpiece when placed on the conveyance surface of the conveyance section such as a glass substrate for inspection is large, the workpiece is liable to be displaced, and the workpiece cannot be conveyed stably. In addition, the conveyance surface of the conveyance unit is easily damaged.

本発明は上記の問題点に鑑みてなされたものであって、搬送中のワークの位置ずれを抑制して安定してワークを搬送できるとともに搬送部の搬送面の傷付きを抑制できる、搬送装置およびそれに用いられる基盤を提供することを目的とする。   The present invention has been made in view of the above-described problems, and can suppress the positional deviation of the workpiece during conveyance and can stably convey the workpiece, and can also prevent the conveyance surface of the conveyance unit from being damaged. And to provide a base used for it.

本発明の第１の局面に基づく搬送装置は、複数のワークを整列させて順次搬送する第１基盤と、第１基盤から供給された複数のワークを順次搬送する搬送部と、第１基盤を回転させる第１駆動部と、搬送部を駆動する第２駆動部とを備える。第１基盤は、金属で構成されている。搬送部の搬送面に、第１基盤が順次搬送した複数のワークが載置される。搬送部の搬送面は、第１基盤の外周部の下面と摺接する。第１基盤の外周部の下面の表面粗さは、第１基盤の上面の表面粗さより小さい。   A transport device according to a first aspect of the present invention includes a first base that sequentially aligns and transports a plurality of workpieces, a transport unit that sequentially transports a plurality of works supplied from the first base, and a first base. A first drive unit that rotates and a second drive unit that drives the transport unit are provided. The first base is made of metal. A plurality of works sequentially conveyed by the first substrate are placed on the conveyance surface of the conveyance unit. The conveyance surface of the conveyance unit is in sliding contact with the lower surface of the outer peripheral portion of the first base. The surface roughness of the lower surface of the outer peripheral portion of the first substrate is smaller than the surface roughness of the upper surface of the first substrate.

本発明の第２の局面に基づく搬送装置は、複数のワークを整列させて順次搬送する第１基盤と、第１基盤から供給された複数のワークを順次搬送する搬送部と、第１基盤を回転させる第１駆動部と、搬送部を駆動する第２駆動部とを備える。第１基盤は、金属で構成されている。搬送部の搬送面に、第１基盤が順次搬送した複数のワークが載置される。搬送部の搬送面は、第１基盤の外周部の下面と摺接する。第１基盤の外周部の下面の表面粗さは、搬送部の搬送面の表面粗さより小さい。   A transport apparatus according to a second aspect of the present invention includes a first base that sequentially aligns and transports a plurality of works, a transport unit that sequentially transports a plurality of works supplied from the first base, and a first base. A first drive unit that rotates and a second drive unit that drives the transport unit are provided. The first base is made of metal. A plurality of works sequentially conveyed by the first substrate are placed on the conveyance surface of the conveyance unit. The conveyance surface of the conveyance unit is in sliding contact with the lower surface of the outer peripheral portion of the first base. The surface roughness of the lower surface of the outer peripheral portion of the first base is smaller than the surface roughness of the transport surface of the transport unit.

本発明の一形態においては、第１基盤は、めっき膜で構成されている。
本発明の一形態においては、搬送部は、搬送面を有する第２基盤を含む。第２駆動部は、第２基盤を回転させる。第１基盤および第２基盤の各々が、円盤状の外形を有している。第２基盤の外周長さは、第１基盤の外周長さより長い。第２基盤による複数のワークの搬送速度は、第１基盤による複数のワークの搬送速度より大きい。 In one form of this invention, the 1st base | substrate is comprised with the plating film.
In one form of this invention, a conveyance part contains the 2nd base | substrate which has a conveyance surface. The second driving unit rotates the second base. Each of the first base and the second base has a disk-shaped outer shape. The outer peripheral length of the second base is longer than the outer peripheral length of the first base. The conveyance speed of the plurality of workpieces by the second substrate is higher than the conveyance speed of the plurality of workpieces by the first substrate.

本発明の一形態においては、第１基盤の上方に、複数のワークを整列させるガイドが設けられている。ガイドは、第１基盤上に位置する複数のワークが第１基盤の回転に伴って第１基盤の径方向の外側に移動するように、第１基盤の周方向に対して交差する方向に延在している部分を含む。   In one form of this invention, the guide which aligns a some workpiece | work is provided above the 1st base | substrate. The guide extends in a direction intersecting the circumferential direction of the first base so that a plurality of workpieces positioned on the first base move radially outward of the first base as the first base rotates. Including existing parts.

本発明の一形態においては、第１基盤の外周部の厚さが、１０μｍ以上２００μｍ以下である。   In one form of this invention, the thickness of the outer peripheral part of a 1st base | substrate is 10 micrometers or more and 200 micrometers or less.

本発明の一形態においては、第１基盤は、ニッケルおよびコバルトを含む合金で構成されている。   In one form of this invention, the 1st base | substrate is comprised with the alloy containing nickel and cobalt.

本発明の一形態においては、第１基盤は、外周部と外周部に周りを囲まれた中央部とから構成されている。中央部は、外周部より厚い。   In one form of this invention, the 1st base | substrate is comprised from the outer peripheral part and the center part enclosed by the outer peripheral part. The central part is thicker than the outer peripheral part.

本発明の第３の局面に基づく基盤は、回転することによって複数のワークを整列させて順次搬送し、搬送部の搬送面に複数のワークを載置する基盤である。基盤は、金属で構成されている。基盤は、下面が搬送部の搬送面と摺接する外周部を有している。外周部の下面の表面粗さが、上面の表面粗さより小さい。   The base | substrate based on the 3rd aspect of this invention is a base | substrate which places a some workpiece | work on the conveyance surface of a conveyance part, aligning a some workpiece | work by rotating and conveying sequentially. The base is made of metal. The base has an outer peripheral portion whose bottom surface is in sliding contact with the transport surface of the transport unit. The surface roughness of the lower surface of the outer peripheral portion is smaller than the surface roughness of the upper surface.

本発明によれば、搬送中のワークの位置ずれを抑制して安定してワークを搬送できるとともに搬送部の搬送面の傷付きを抑制できる。   ADVANTAGE OF THE INVENTION According to this invention, the position shift of the workpiece | work in conveyance can be suppressed, a workpiece | work can be conveyed stably, and the damage of the conveyance surface of a conveyance part can be suppressed.

本発明の実施形態１に係る搬送装置が適用された検査装置の構成を示す平面図である。It is a top view which shows the structure of the inspection apparatus with which the conveying apparatus which concerns on Embodiment 1 of this invention was applied. 図１の検査装置のＩＩ−ＩＩ線矢印方向から見た断面図である。It is sectional drawing seen from the II-II line arrow direction of the inspection apparatus of FIG. 基板の主面に第１マスクを配置した後、第１めっき膜を形成した状態を示す断面図である。It is sectional drawing which shows the state which formed the 1st plating film after arrange | positioning the 1st mask to the main surface of a board | substrate. めっき膜を基板から剥離させた状態を示す断面図である。It is sectional drawing which shows the state which peeled the plating film from the board | substrate. 本発明の実施形態２に係る搬送装置における第１基盤の周囲を拡大して示す断面図である。It is sectional drawing which expands and shows the circumference | surroundings of the 1st base | substrate in the conveying apparatus which concerns on Embodiment 2 of this invention. 基板の主面に第１マスクを配置した後、第１めっき膜を形成し、さらに、第１めっき膜の外周部の上面に第２マスクを配置した後、第２めっき膜を形成した状態を示す断面図である。After the first mask is disposed on the main surface of the substrate, the first plating film is formed. Further, after the second mask is disposed on the upper surface of the outer peripheral portion of the first plating film, the second plating film is formed. It is sectional drawing shown. 第１めっき膜を基板から剥離させた状態を示す断面図である。It is sectional drawing which shows the state which peeled the 1st plating film from the board | substrate. 本発明の実施形態３に係る搬送装置が適用された検査装置の構成を示す平面図である。It is a top view which shows the structure of the inspection apparatus to which the conveying apparatus which concerns on Embodiment 3 of this invention was applied.

以下、本発明の各実施形態に係る、搬送装置およびそれに用いられる基盤について図を参照して説明する。以下の実施形態の説明においては、図中の同一または相当部分には同一符号を付して、その説明は繰り返さない。   Hereinafter, a transport device and a base used for the same according to each embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

なお、実施形態の説明においては、搬送装置を備える検査装置について説明するが、搬送装置が適用されるのは検査装置に限られず、製造装置などであってもよい。また、搬送されるワークとして、略直方体状の電子部品を一例に説明するが、ワークは電子部品に限られず、ワークの外形も直方体状に限られない。電子部品としては、コンデンサ、インダクタまたは抵抗などがある。割れまたは欠けの発生しやすいセラミック電子部品が、ワークとして好適である。長さが０．２ｍｍ、幅が０．１ｍｍである小型の電子部品から、長さが１２ｍｍ、幅が１０ｍｍである大型の電子部品まで、ワークとして適用可能である。   In the description of the embodiment, an inspection apparatus including a transport apparatus will be described. However, the transport apparatus is not limited to the inspection apparatus, and may be a manufacturing apparatus or the like. Moreover, although a substantially rectangular parallelepiped electronic component will be described as an example of the workpiece to be conveyed, the workpiece is not limited to the electronic component, and the outer shape of the workpiece is not limited to the rectangular parallelepiped shape. Electronic components include capacitors, inductors or resistors. A ceramic electronic component that is easily cracked or chipped is suitable as a workpiece. It can be applied as a workpiece from a small electronic component having a length of 0.2 mm and a width of 0.1 mm to a large electronic component having a length of 12 mm and a width of 10 mm.

(実施形態１)
図１は、本発明の実施形態１に係る搬送装置が適用された検査装置の構成を示す平面図である。図２は、図１の検査装置のＩＩ−ＩＩ線矢印方向から見た断面図である。図１においては、後述する供給部１１０を図示していない。 (Embodiment 1)
FIG. 1 is a plan view showing a configuration of an inspection apparatus to which a transport apparatus according to Embodiment 1 of the present invention is applied. 2 is a cross-sectional view of the inspection apparatus of FIG. 1 as viewed from the direction of arrows II-II. In FIG. 1, the supply part 110 mentioned later is not illustrated.

図１，２に示すように、本発明の実施形態１に係る搬送装置が適用された検査装置１００は、供給部１１０と、整列部１２０と、搬送機構部１５０と、排出部１８０とを備えている。検査装置１００においては、供給部１１０から供給された複数のワーク１を、整列部１２０にて整列しつつ搬送機構部１５０に搬送する。搬送機構部１５０においては、複数のワーク１の各々を搬送しつつ検査し、排出部１８０にて検査後の複数のワーク１を選別する。本発明の実施形態１に係る搬送装置は、整列部１２０と搬送機構部１５０とを備えている。   As shown in FIGS. 1 and 2, the inspection apparatus 100 to which the conveyance device according to the first embodiment of the present invention is applied includes a supply unit 110, an alignment unit 120, a conveyance mechanism unit 150, and a discharge unit 180. ing. In the inspection apparatus 100, the plurality of workpieces 1 supplied from the supply unit 110 are conveyed to the conveyance mechanism unit 150 while being aligned by the alignment unit 120. In the transport mechanism unit 150, each of the plurality of workpieces 1 is inspected while being transported, and the discharge unit 180 selects the plurality of workpieces 1 after the inspection. The transport apparatus according to the first embodiment of the present invention includes an alignment unit 120 and a transport mechanism unit 150.

供給部１１０は、供給路１１１とホッパ１１２とシューター１１３とを含む。検査対象のワーク１は、ホッパ１１２内に一時的に貯蔵され、適量のワーク１が、供給路１１１およびシューター１１３を順次通過して、整列部１２０に含まれる本発明の実施形態１に係る第１基盤１４０上に投入される。   Supply unit 110 includes a supply path 111, a hopper 112, and a shooter 113. The workpiece 1 to be inspected is temporarily stored in the hopper 112, and an appropriate amount of the workpiece 1 sequentially passes through the supply path 111 and the shooter 113, and is included in the alignment unit 120 according to the first embodiment of the present invention. 1 on the board 140.

整列部１２０は、第１駆動部１３０と、回転板１３３と、固定具１３５と、支持台１３６と、第１基盤１４０と、複数のガイドとを含む。ただし、整列部１２０の構成は、上記に限られず、少なくとも第１駆動部１３０と第１基盤１４０とを含んでいればよい。   The alignment unit 120 includes a first driving unit 130, a rotating plate 133, a fixture 135, a support stand 136, a first base 140, and a plurality of guides. However, the configuration of the alignment unit 120 is not limited to the above, and may include at least the first driving unit 130 and the first base 140.

第１基盤１４０は、回転することによって複数のワーク１を整列させて順次搬送する。第１基盤１４０は、円盤状の外形を有している。ただし、第１基盤１４０の外形は、円盤状に限られず、平面視にて多角形状であってもよい。第１基盤１４０の直径は、たとえば、５０ｍｍ以上５００ｍｍ以下である。第１基盤１４０の中心部には、貫通孔が設けられている。   The first substrate 140 rotates and aligns the plurality of workpieces 1 and sequentially conveys them. The first base 140 has a disk-shaped outer shape. However, the outer shape of the first base 140 is not limited to a disk shape, and may be a polygonal shape in plan view. The diameter of the 1st base 140 is 50 mm or more and 500 mm or less, for example. A through hole is provided at the center of the first base 140.

第１基盤１４０の外周部の厚さは、ワーク１のサイズおよび重量によって適宜決定される。サイズおよび重量が大きいワーク１の場合、第１基盤１４０の外周部の剛性を確保するために、第１基盤１４０の外周部の厚さＴ1が厚く設定される。たとえば、長さが１２ｍｍ、幅が１０ｍｍの大型のワーク１の場合、第１基盤１４０の外周部の厚さＴ1は２００μｍに設定される。 The thickness of the outer peripheral portion of the first base 140 is appropriately determined depending on the size and weight of the workpiece 1. In the case of the workpiece 1 having a large size and weight, in order to ensure the rigidity of the outer peripheral portion of the first base 140, the thickness T 1 of the outer peripheral portion of the first base 140 is set to be thick. For example, in the case of a large workpiece 1 having a length of 12 mm and a width of 10 mm, the thickness T 1 of the outer peripheral portion of the first substrate 140 is set to 200 μm.

サイズおよび重量が小さいワークの場合、後述するように第１基盤１４０上から第２基盤１７０上にワーク１が乗り移る際のワーク１の位置ずれを抑制するために、第１基盤１４０の外周部の厚さＴ1が薄く設定される。たとえば、長さが０．２ｍｍ、幅が０．１ｍｍの小型のワーク１の場合、第１基盤１４０の外周部の厚さＴ1は１０μｍに設定される。ワーク１の位置ずれを抑制するためには、第１基盤１４０の外周部の厚さＴ1は、ワーク１の長さの１／２０以下であることが好ましい。 In the case of a work having a small size and weight, in order to suppress displacement of the work 1 when the work 1 is transferred from the first base 140 to the second base 170 as will be described later, The thickness T 1 is set thin. For example, in the case of a small workpiece 1 having a length of 0.2 mm and a width of 0.1 mm, the thickness T 1 of the outer peripheral portion of the first substrate 140 is set to 10 μm. In order to suppress the displacement of the work 1, the thickness T 1 of the outer peripheral portion of the first base 140 is preferably 1/20 or less of the length of the work 1.

上記の観点から、第１基盤１４０の外周部の厚さＴ1は、１０μｍ以上２００μｍ以下であることが好ましい。本実施形態においては、第１基盤１４０の全体において、厚さＴ1が１０μｍ以上２００μｍ以下である。 From the above viewpoint, the thickness T 1 of the outer peripheral portion of the first base 140 is preferably 10 μm or more and 200 μm or less. In the present embodiment, the thickness T 1 of the entire first substrate 140 is 10 μm or more and 200 μm or less.

第１基盤１４０の外周部の下面となる第２主面１４０ｂの表面粗さは、第１基盤１４０の上面となる第１主面１４０ｔの表面粗さより小さい。本実施形態における表面粗さは、算術平均粗さＲａであり、たとえば、レーザ顕微鏡または白色干渉計などにより測定される。第１基盤１４０の第２主面１４０ｂの表面粗さは、たとえば、基準長さを１ｍｍとして、０．００３μｍ以上０．０３μｍ以下である。第１基盤１４０の第１主面１４０ｔの表面粗さは、たとえば、基準長さを１ｍｍとして、０．０３μｍ以上１μｍ以下である。   The surface roughness of the second main surface 140b that is the lower surface of the outer peripheral portion of the first substrate 140 is smaller than the surface roughness of the first main surface 140t that is the upper surface of the first substrate 140. The surface roughness in the present embodiment is an arithmetic average roughness Ra, and is measured by, for example, a laser microscope or a white interferometer. The surface roughness of the second major surface 140b of the first base 140 is, for example, 0.003 μm or more and 0.03 μm or less, where the reference length is 1 mm. The surface roughness of the first major surface 140t of the first base 140 is, for example, 0.03 μm or more and 1 μm or less, where the reference length is 1 mm.

本実施形態においては、第１基盤１４０は、金属で構成されている。第１基盤１４０は、ニッケルおよびコバルトを含む合金で構成されている。ＮｉＣｏは、剛性が高く、しなやかさを有するため、第１基盤１４０を構成する材料として好適である。   In the present embodiment, the first base 140 is made of metal. The first base 140 is made of an alloy containing nickel and cobalt. NiCo is suitable as a material constituting the first substrate 140 because it has high rigidity and flexibility.

第１駆動部１３０は、第１基盤１４０を回転させる。第１駆動部１３０は、第１ベース１３１と、第１ベース１３１に回転可能に支持されている回転部１３２とを含む。本実施形態においては、第１駆動部１３０は、ダイレクトドライブモータである。   The first driving unit 130 rotates the first base 140. The first driving unit 130 includes a first base 131 and a rotating unit 132 that is rotatably supported by the first base 131. In the present embodiment, the first drive unit 130 is a direct drive motor.

ダイレクトドライブモータは、モータ本体と、回転角検出器と、モータドライバと、位置指示器とを含んでいる。モータ本体は、たとえばＳＭ(Synchronous motor)形サーボモータである。回転角検出器は、たとえばエンコーダである。モータドライバは、たとえばサーボアンプである。位置指示器は、たとえばパルス発生器である。   The direct drive motor includes a motor body, a rotation angle detector, a motor driver, and a position indicator. The motor body is, for example, an SM (Synchronous motor) type servo motor. The rotation angle detector is, for example, an encoder. The motor driver is, for example, a servo amplifier. The position indicator is, for example, a pulse generator.

ダイレクトドライブモータにおいては、位置指示器によって設定されたモータ本体の回転角と、回転角検出器によって検出された実際のモータ本体の回転角との差分を、モータドライバにフィードバックして出力を調整ことにより、モータ本体の回転角が設定値に近づくように制御している。   In direct drive motors, the difference between the rotation angle of the motor body set by the position indicator and the actual rotation angle of the motor body detected by the rotation angle detector is fed back to the motor driver to adjust the output. Thus, the rotation angle of the motor body is controlled so as to approach the set value.

回転板１３３は、平面視にて円盤状の外形を有している。回転板１３３の中心部には、鉛直方向上方に突出した軸部１３４が設けられている。軸部１３４が第１基盤１４０の貫通孔を挿通した状態で、回転板１３３上に第１基盤１４０が載置されている。回転板１３３の直径は、第１基盤１４０の直径より小さく、第１基盤１４０の中心部寄りの一部分が、回転板１３３上に載置されている。   The rotating plate 133 has a disk-like outer shape in plan view. A shaft portion 134 that protrudes upward in the vertical direction is provided at the center of the rotating plate 133. The first base 140 is placed on the rotating plate 133 with the shaft portion 134 inserted through the through hole of the first base 140. The diameter of the rotating plate 133 is smaller than the diameter of the first base 140, and a portion near the center of the first base 140 is placed on the rotating plate 133.

軸部１３４の先端部には、軸部１３４の外形に対応した凹部が形成された固定具１３５が嵌め合わされる。第１基盤１４０は、固定具１３５と回転板１３３との間に挟まれて回転板１３３に対して固定されている。   A fixing tool 135 having a recess corresponding to the outer shape of the shaft portion 134 is fitted into the distal end portion of the shaft portion 134. The first base 140 is sandwiched between the fixture 135 and the rotating plate 133 and is fixed to the rotating plate 133.

回転板１３３は、第１駆動部１３０の回転部１３２上に載置され、回転部１３２の回転に伴って回転する。従って、第１駆動部１３０の回転部１３２の回転に伴って、軸部１３４を回転軸として第１基盤１４０が矢印１２で示す方向に回転する。   The rotating plate 133 is placed on the rotating unit 132 of the first driving unit 130, and rotates with the rotation of the rotating unit 132. Therefore, with the rotation of the rotation unit 132 of the first drive unit 130, the first base 140 rotates in the direction indicated by the arrow 12 with the shaft unit 134 as the rotation axis.

支持台１３６は、回転板１３３と間隔をあけて回転板１３３の周りを囲むように固定配置されている。支持台１３６の上面は、第１基盤１４０の下面と摺接する。   The support stand 136 is fixedly disposed so as to surround the rotary plate 133 with a space from the rotary plate 133. The upper surface of the support stand 136 is in sliding contact with the lower surface of the first base 140.

複数のガイドは、第１基盤１４０の上方に配置されている。複数のガイドの各々と第１基盤１４０とは離間している。複数のガイドは、第１基盤１４０上に位置する複数のワーク１を整列させる。本実施形態においては、第１ガイド１２１、第２ガイド１２２、第３ガイド１２３、第４ガイド１２４および第５ガイド１２５の５つのガイドが設けられている。   The plurality of guides are disposed above the first base 140. Each of the plurality of guides and the first base 140 are separated from each other. The plurality of guides align the plurality of workpieces 1 positioned on the first base 140. In the present embodiment, five guides of a first guide 121, a second guide 122, a third guide 123, a fourth guide 124, and a fifth guide 125 are provided.

第１ガイド１２１、第２ガイド１２２、第３ガイド１２３、第４ガイド１２４および第５ガイド１２５の各々は、第１基盤１４０上に位置する複数のワーク１が第１基盤１４０の回転に伴って第１基盤１４０の径方向の外側に移動するように、第１基盤１４０の周方向に対して交差する方向に延在している部分を含む。   Each of the first guide 121, the second guide 122, the third guide 123, the fourth guide 124, and the fifth guide 125 includes a plurality of workpieces 1 positioned on the first base 140 as the first base 140 rotates. It includes a portion extending in a direction intersecting the circumferential direction of the first base 140 so as to move outward in the radial direction of the first base 140.

具体的には、第１ガイド１２１、第２ガイド１２２、第３ガイド１２３、第４ガイド１２４および第５ガイド１２５の各々は、直方体状の外形を有し、平面視にて第１基盤１４０の径方向と交差する方向に配置されている。第１ガイド１２１、第２ガイド１２２、第３ガイド１２３、第４ガイド１２４および第５ガイド１２５の順に、第１基盤１４０の径方向の外側に向かって配置されている。第１ガイド１２１、第２ガイド１２２、第３ガイド１２３、第４ガイド１２４および第５ガイド１２５の各々において、平面視にて、一端は、他端より第１基盤１４０の中心から離れて位置している。   Specifically, each of the first guide 121, the second guide 122, the third guide 123, the fourth guide 124, and the fifth guide 125 has a rectangular parallelepiped outer shape, and the first base 140 is viewed in plan view. It is arranged in a direction crossing the radial direction. The first guide 121, the second guide 122, the third guide 123, the fourth guide 124, and the fifth guide 125 are arranged in this order toward the outside in the radial direction of the first base 140. In each of the first guide 121, the second guide 122, the third guide 123, the fourth guide 124, and the fifth guide 125, one end is located farther from the center of the first base 140 than the other end in plan view. ing.

第１基盤１４０上に位置する複数のワーク１は、第１基盤１４０の回転に伴って、第１ガイド１２１、第２ガイド１２２、第３ガイド１２３、第４ガイド１２４および第５ガイド１２５の少なくともいずれかと、この順に接することにより、より半径の大きな円周軌道に移動しつつ最終的に１列に整列される。第５ガイド１２５の一端は、第１基盤１４０の縁上に位置している。第５ガイド１２５に沿って第５ガイド１２５の一端に接するまで移動したワーク１は、第２基盤１７０上に乗り移って載置される。   The plurality of workpieces 1 positioned on the first base 140 are at least one of the first guide 121, the second guide 122, the third guide 123, the fourth guide 124, and the fifth guide 125 as the first base 140 rotates. By touching any of them in this order, they are finally aligned in one row while moving to a circumferential track having a larger radius. One end of the fifth guide 125 is located on the edge of the first base 140. The workpiece 1 that has moved along the fifth guide 125 until it comes into contact with one end of the fifth guide 125 is placed on the second base 170 and placed thereon.

本実施形態においては、搬送機構部１５０は、第２駆動部１６０と、回転板１６３と、固定具１６５と、支持台１６６と、第２基盤１７０とを含む。ただし、搬送機構部１５０の構成は、上記に限られず、少なくとも第２駆動部１６０と第２基盤１７０とを含んでいればよい。   In the present embodiment, the transport mechanism unit 150 includes a second drive unit 160, a rotating plate 163, a fixture 165, a support base 166, and a second base 170. However, the configuration of the transport mechanism unit 150 is not limited to the above, and may include at least the second drive unit 160 and the second base 170.

搬送部である第２基盤１７０は、搬送面となる上面を有し、第１基盤１４０から供給された複数のワーク１を順次搬送する。搬送面となる第２基盤１７０の外周部の上面は、第１基盤１４０の外周部の下面となる第２主面１４０ｂと摺接する。第２基盤１７０の外周部の上面に、第１基盤１４０が順次搬送した複数のワーク１が載置される。   The second substrate 170 serving as a transfer unit has an upper surface serving as a transfer surface, and sequentially transfers a plurality of workpieces 1 supplied from the first substrate 140. The upper surface of the outer peripheral portion of the second base 170 serving as the transfer surface is in sliding contact with the second main surface 140b serving as the lower surface of the outer peripheral portion of the first base 140. On the upper surface of the outer periphery of the second substrate 170, a plurality of workpieces 1 that are sequentially conveyed by the first substrate 140 are placed.

第２基盤１７０の外周部において第１基盤１４０と摺接する摺接部１０は、ガラスで構成されている。本実施形態においては、第２基盤１７０の全体が、ガラスで構成されている。検査装置１００においては、第２基盤１７０上にてワーク１の６面の各々の外観検査が行なわれるため、第２基盤１７０の外周部を構成する材料としては、光を透過する材料であることが好ましい。上記の観点から、第２基盤１７０の外周部を構成する材料としては、透明なガラスが特に好適である。ただし、第２基盤１７０の外周部が、透明な樹脂で構成されていてもよい。   The sliding contact portion 10 that is in sliding contact with the first base 140 at the outer peripheral portion of the second base 170 is made of glass. In the present embodiment, the entire second base 170 is made of glass. In the inspection apparatus 100, since the appearance inspection of each of the six surfaces of the workpiece 1 is performed on the second substrate 170, the material constituting the outer peripheral portion of the second substrate 170 is a material that transmits light. Is preferred. From the above viewpoint, transparent glass is particularly suitable as a material constituting the outer peripheral portion of the second base 170. However, the outer peripheral part of the 2nd base | substrate 170 may be comprised with transparent resin.

第２基盤１７０は、円盤状の外形を有している。ただし、第２基盤１７０の外形は、円盤状に限られず、平面視にて多角形状であってもよい。第２基盤１７０の中心部には、貫通孔が設けられている。第２基盤１７０の直径は、第１基盤１４０の直径より大きい。すなわち、第２基盤１７０の外周長さは、第１基盤１４０の外周長さより長い。第２基盤１７０の直径は、たとえば、２００ｍｍ以上１０００ｍｍ以下である。第２基盤１７０の厚さＴ10は、第１基盤１４０の厚さＴ1より厚く、たとえば、２ｍｍ以上１０ｍｍ以下である。 The second base 170 has a disk-shaped outer shape. However, the outer shape of the second base 170 is not limited to a disk shape, and may be a polygonal shape in plan view. A through hole is provided at the center of the second base 170. The diameter of the second base 170 is larger than the diameter of the first base 140. That is, the outer peripheral length of the second base 170 is longer than the outer peripheral length of the first base 140. The diameter of the second base 170 is, for example, not less than 200 mm and not more than 1000 mm. The thickness T 10 of the second base 170 is thicker than the thickness T 1 of the first base 140, for example, not less than 2 mm and not more than 10 mm.

第１基盤１４０の外周部の下面の表面粗さは、第２基盤１７０の外周部の上面の表面粗さより小さい。具体的には、第１基盤１４０の外周部の下面の表面粗さは、第２基盤１７０の摺接部１０の表面粗さより小さい。第２基盤１７０の外周部の上面の表面粗さは、たとえば、基準長さを１ｍｍとして、０．００３μｍ以上０．０３μｍ以下である。   The surface roughness of the lower surface of the outer periphery of the first substrate 140 is smaller than the surface roughness of the upper surface of the outer periphery of the second substrate 170. Specifically, the surface roughness of the lower surface of the outer peripheral portion of the first substrate 140 is smaller than the surface roughness of the sliding contact portion 10 of the second substrate 170. The surface roughness of the upper surface of the outer peripheral portion of the second base 170 is, for example, 0.003 μm or more and 0.03 μm or less, where the reference length is 1 mm.

第２駆動部１６０は、第２基盤１７０を回転させる。第２駆動部１６０は、第２ベース１６１と、第２ベース１６１に回転可能に支持されている回転部１６２とを含む。本実施形態においては、第２駆動部１６０は、ダイレクトドライブモータである。   The second driving unit 160 rotates the second base 170. The second driving unit 160 includes a second base 161 and a rotating unit 162 that is rotatably supported by the second base 161. In the present embodiment, the second drive unit 160 is a direct drive motor.

回転板１６３は、平面視にて円盤状の外形を有している。回転板１６３の中心部には、鉛直方向上方に突出した軸部１６４が設けられている。軸部１６４が第２基盤１７０の貫通孔を挿通した状態で、回転板１６３上に第２基盤１７０が載置されている。回転板１６３の直径は、第２基盤１７０の直径より小さく、第２基盤１７０の中心部寄りの一部分が、回転板１６３上に載置されている。   The rotating plate 163 has a disk-like outer shape in plan view. A shaft portion 164 that protrudes upward in the vertical direction is provided at the center of the rotating plate 163. The second base 170 is placed on the rotating plate 163 with the shaft portion 164 inserted through the through hole of the second base 170. The diameter of the rotating plate 163 is smaller than the diameter of the second base 170, and a portion near the center of the second base 170 is placed on the rotating plate 163.

軸部１６４の先端部には、軸部１６４の外形に対応した凹部が形成された固定具１６５が嵌め合わされる。第２基盤１７０は、固定具１６５と回転板１６３との間に挟まれて回転板１６３に対して固定されている。   A fixing tool 165 in which a concave portion corresponding to the outer shape of the shaft portion 164 is formed is fitted to the distal end portion of the shaft portion 164. The second base 170 is sandwiched between the fixture 165 and the rotating plate 163 and fixed to the rotating plate 163.

回転板１６３は、第２駆動部１６０の回転部１６２上に載置され、回転部１６２の回転に伴って回転する。従って、第２駆動部１６０の回転部１６２の回転に伴って、軸部１６４を回転軸として第２基盤１７０が矢印１５で示す方向に回転する。第２基盤１７０の回転方向は、第１基盤１４０の回転方向とは逆方向である。   The rotating plate 163 is placed on the rotating unit 162 of the second driving unit 160 and rotates as the rotating unit 162 rotates. Accordingly, with the rotation of the rotating unit 162 of the second driving unit 160, the second base 170 rotates in the direction indicated by the arrow 15 with the shaft portion 164 as the rotation axis. The rotation direction of the second substrate 170 is opposite to the rotation direction of the first substrate 140.

支持台１６６は、回転板１６３と間隔をあけて回転板１６３の周りを囲むように固定配置されている。支持台１６６の上面は、第２基盤１７０の下面と摺接する。   The support base 166 is fixedly disposed so as to surround the rotary plate 163 with a space from the rotary plate 163. The upper surface of the support base 166 is in sliding contact with the lower surface of the second base 170.

第２基盤１７０による複数のワーク１の搬送速度は、第１基盤１４０による複数のワーク１の搬送速度より大きい。そのため、第２基盤１７０の外周部上に載置された複数のワーク１は、互いに間隔をあけて位置している。これにより、ワーク１の６面の各々の外観検査をすることが可能となる。   The conveyance speed of the plurality of workpieces 1 by the second substrate 170 is higher than the conveyance speed of the plurality of workpieces 1 by the first substrate 140. Therefore, the plurality of workpieces 1 placed on the outer peripheral portion of the second base 170 are positioned with a space therebetween. This makes it possible to inspect each of the six surfaces of the work 1.

第２基盤１７０の外周部上の、第１検査領域Ｐ１、第２検査領域Ｐ２、第３検査領域Ｐ３、第４検査領域Ｐ４、第５検査領域Ｐ５、および、第６検査領域Ｐ６をワーク１が順次通過する際に、１つの検査領域にてワーク１の６面のうちの１面について外観検査が行なわれ、第６検査領域Ｐ６を通過した際には、ワーク１の６面の全ての外観検査が終了している。   The first inspection region P1, the second inspection region P2, the third inspection region P3, the fourth inspection region P4, the fifth inspection region P5, and the sixth inspection region P6 on the outer periphery of the second base 170 are set as the work 1 When one of the six surfaces of the workpiece 1 passes through the sixth inspection region P6, one of the six surfaces of the workpiece 1 is visually inspected in one inspection region. Appearance inspection has been completed.

検査装置１００は、複数のワーク１の各々の外観を検査するための撮影装置である図示しない６台のカメラを備える。具体的には、第２基盤１７０より高い位置、かつ、ワーク１が搬送される円周軌道の内側の位置に配置されて、ワーク１の一方の側面を撮影する第１カメラを備える。第２基盤１７０より高い位置、かつ、ワーク１が搬送される円周軌道の外側の位置に配置されて、ワーク１の他方の側面を撮影する第２カメラを備える。第２基盤１７０より高い位置、かつ、ワーク１が搬送される円周軌道の上方の位置に配置されて、ワーク１の一方の主面を撮影する第３カメラを備える。第２基盤１７０より低い位置、かつ、ワーク１が搬送される円周軌道の下方の位置に配置されて、ワーク１の他方の主面を撮影する第４カメラを備える。第２基盤１７０より高い位置、かつ、ワーク１が搬送される円周軌道の内側または外側の位置に配置されて、ワーク１の一方の端面を撮影する第５カメラを備える。第２基盤１７０より高い位置、かつ、ワーク１が搬送される円周軌道の内側または外側の位置に配置されて、ワーク１の他方の端面を撮影する第６カメラを備える。   The inspection apparatus 100 includes six cameras (not shown) that are imaging apparatuses for inspecting the appearance of each of the plurality of workpieces 1. Specifically, a first camera is provided which is disposed at a position higher than the second base 170 and inside the circumferential track on which the work 1 is conveyed, and photographs one side of the work 1. A second camera is provided which is disposed at a position higher than the second base 170 and at a position outside the circumferential track on which the work 1 is conveyed, and photographs the other side surface of the work 1. A third camera is provided which is disposed at a position higher than the second base 170 and above the circumferential track on which the work 1 is conveyed, and photographs one main surface of the work 1. A fourth camera is provided which is disposed at a position lower than the second base 170 and below the circumferential track on which the work 1 is conveyed and photographs the other main surface of the work 1. A fifth camera for photographing one end face of the work 1 is provided at a position higher than the second base 170 and at a position inside or outside the circumferential track on which the work 1 is conveyed. A sixth camera that images the other end surface of the workpiece 1 is provided at a position higher than the second base 170 and at a position inside or outside the circumferential track on which the workpiece 1 is conveyed.

排出部１８０は、３つの容器と２つのエアーブロワと１つのガイドとを含む。具体的には、排出部１８０は、外観検査において不良品と判断されたワーク１を第１容器１９０内に吹き飛ばす第１エアーブロワ１８１と、外観検査において良品と判断されたワーク１を第２容器１９１内に吹き飛ばす第２エアーブロワ１８２と、第１エアーブロワ１８１または第２エアーブロワ１８２によって吹き飛ばされ損ねたワーク１を第３容器１９２内に落下させるガイド１８３とを備えている。   The discharge unit 180 includes three containers, two air blowers, and one guide. Specifically, the discharge unit 180 includes a first air blower 181 that blows the work 1 determined to be defective in the appearance inspection into the first container 190, and the work 1 determined to be non-defective in the appearance inspection to the second container. A second air blower 182 that blows off into the 191 and a guide 183 that drops the work 1 that has failed to be blown off by the first air blower 181 or the second air blower 182 into the third container 192 are provided.

ガイド１８３は、第２基盤１７０の上方に配置されている。ガイドの１８３と第２基盤１７０とは離間している。ガイド１８３は、直方体状の外形を有し、第２基盤１７０上に位置する複数のワーク１が第２基盤１７０の回転に伴って第２基盤１７０の径方向の外側に移動して第２基盤１７０から落下するように、平面視にて第２基盤１７０の径方向と交差する方向に配置されている。   The guide 183 is disposed above the second base 170. The guide 183 and the second base 170 are separated from each other. The guide 183 has a rectangular parallelepiped outer shape, and a plurality of workpieces 1 positioned on the second base 170 move to the outside in the radial direction of the second base 170 as the second base 170 rotates, so that the second base It is arranged in a direction intersecting with the radial direction of the second base 170 in plan view so as to fall from 170.

本実施形態においては、第１駆動部１３０および第２駆動部１６０の各々が、ダイレクトドライブモータである。ダイレクトドライブモータにおいては、上記のようにフィードバック制御が行なわれている。ダイレクトドライブモータにおいては、さらに、リミッタ制御が行なわれている。   In the present embodiment, each of the first drive unit 130 and the second drive unit 160 is a direct drive motor. In the direct drive motor, feedback control is performed as described above. In the direct drive motor, limiter control is further performed.

具体的には、第１基盤１４０または第２基盤１７０とガイドとの間にワーク１が引っ掛かったときなどの、第１駆動部１３０または第２駆動部１６０の過負荷時においては、位置指示器によって設定されたモータ本体の回転角と、回転角検出器によって検出された実際のモータ本体の回転角との差分が大きくなる。この回転角の差分が閾値を超えた場合には、モータ本体を停止させるリミッタが作動する。また、フィードバック制御によって、モータ本体の回転角が設定値に近づくようにモータドライバの出力を上げた際に、モータドライバの駆動電流が閾値を超えた場合には、モータ本体を停止させるリミッタが作動する。ダイレクトドライブモータにおいて上記のリミッタ制御を行なうことにより、第１基盤１４０および第２基盤１７０の破損を防止することができる。   Specifically, when the work 1 is caught between the first base 140 or the second base 170 and the guide, the position indicator is used when the first drive unit 130 or the second drive unit 160 is overloaded. The difference between the rotation angle of the motor main body set by the above and the actual rotation angle of the motor main body detected by the rotation angle detector becomes large. When the difference between the rotation angles exceeds the threshold, a limiter that stops the motor body is activated. When the motor driver output is increased so that the rotation angle of the motor body approaches the set value by feedback control, if the drive current of the motor driver exceeds the threshold value, a limiter that stops the motor body is activated. To do. By performing the limiter control in the direct drive motor, it is possible to prevent the first base 140 and the second base 170 from being damaged.

ここで、第１基盤１４０の製造方法について説明する。図３は、基板の主面に第１マスクを配置した後、第１めっき膜を形成した状態を示す断面図である。図３に示すように、まず、ステンレス鋼などで形成された平板状の基板９０の主面に、枠状の第１マスク９１が配置される。第１マスク９１は、フォトレジストで構成されている。第１マスク９１で囲まれた内側の領域は、円形の外形を有している。次に、基板９０の主面上の第１マスク９１内の領域に第１基盤１４０となるめっき膜を形成する。   Here, a method for manufacturing the first substrate 140 will be described. FIG. 3 is a cross-sectional view illustrating a state in which the first plating film is formed after the first mask is disposed on the main surface of the substrate. As shown in FIG. 3, first, a frame-shaped first mask 91 is arranged on the main surface of a flat-plate substrate 90 formed of stainless steel or the like. The first mask 91 is made of a photoresist. The inner region surrounded by the first mask 91 has a circular outer shape. Next, a plating film that forms the first substrate 140 is formed in a region in the first mask 91 on the main surface of the substrate 90.

めっき膜において、基板９０と接している第１主面１４０ｔは、基板９０の表面形状を引き写された表面形状を有している。めっき膜において、基板９０と接していない第２主面１４０ｂは、滑らかな表面形状を有している。そのため、めっき膜の第２主面１４０ｂの表面粗さは、めっき膜の第１主面１４０ｔの表面粗さより小さい。   In the plating film, the first main surface 140 t in contact with the substrate 90 has a surface shape obtained by copying the surface shape of the substrate 90. In the plating film, the second main surface 140b not in contact with the substrate 90 has a smooth surface shape. Therefore, the surface roughness of the second main surface 140b of the plating film is smaller than the surface roughness of the first main surface 140t of the plating film.

図４は、めっき膜を基板から剥離させた状態を示す断面図である。図４に示すように、第１マスク９１を除去した後、めっき膜を基板９０から剥離させることにより、第１基盤１４０が作製される。すなわち、本実施形態においては、電鋳法により第１基盤１４０を製造している。なお、第１基盤１４０の中心部の貫通孔は、機械加工によって形成されてもよいし、第１マスク９１によって形成されてもよい。作製された第１基盤１４０は、上下反転した状態で、回転板１３３上に載置される。   FIG. 4 is a cross-sectional view showing a state where the plating film is peeled from the substrate. As shown in FIG. 4, after the first mask 91 is removed, the plating film is peeled off from the substrate 90, thereby producing the first base 140. That is, in the present embodiment, the first base 140 is manufactured by an electroforming method. Note that the through hole at the center of the first base 140 may be formed by machining, or may be formed by the first mask 91. The produced first base 140 is placed on the rotating plate 133 in a state where the first base 140 is turned upside down.

上記のように第１基盤１４０を製造することにより、第１基盤１４０の外周部の下面の表面を滑らかにすることができるため、第１基盤１４０の外周部の下面と摺接する第２基盤１７０の外周部の上面に傷が付くことを抑制することができる。   By manufacturing the first base 140 as described above, the surface of the lower surface of the outer peripheral portion of the first base 140 can be smoothed, and thus the second base 170 that is in sliding contact with the lower surface of the outer peripheral portion of the first base 140 is provided. It is possible to suppress the upper surface of the outer peripheral portion from being damaged.

本実施形態に係る搬送装置においては、第１基盤１４０の外周部の下面と、第２基盤１７０の外周部の上面とを摺接させることにより、第１基盤１４０上から第２基盤１７０上にワーク１が乗り移る際のワーク１の落差を低減することができる。その結果、ワーク１が第１基盤１４０上から第２基盤１７０上に乗り移る際のワーク１の位置ずれを抑制して、ワーク１を安定して搬送することができる。   In the transfer device according to the present embodiment, the lower surface of the outer peripheral portion of the first base 140 and the upper surface of the outer peripheral portion of the second base 170 are brought into sliding contact with each other from the first base 140 to the second base 170. It is possible to reduce a drop of the workpiece 1 when the workpiece 1 is transferred. As a result, it is possible to suppress the positional deviation of the work 1 when the work 1 is transferred from the first base 140 to the second base 170, and to transport the work 1 stably.

第１基盤１４０が金属で構成されていることにより、複数のワーク１が載置されている第１基盤１４０の上面が帯電することを抑制し、第１基盤１４０上にて複数のワーク１をスムーズに移動させて効率よく整列することができる。   Since the first substrate 140 is made of metal, the upper surface of the first substrate 140 on which the plurality of workpieces 1 are placed is prevented from being charged, and the plurality of workpieces 1 are placed on the first substrate 140. It can be moved smoothly and aligned efficiently.

なお、第１基盤１４０の上面に被覆部が設けられていてもよい。たとえば、汚れおよび埃などが付着しにくく耐久性に優れている、テフロン(登録商標)またはポリイミドなどの樹脂からなる被覆部が、第１基盤１４０の上面に設けられていてもよい。この場合、第１基盤１４０の上面が、ワーク１との摩擦によって摩耗することを抑制することができる。第１基盤１４０上から第２基盤１７０上にワーク１が乗り移る際のワーク１の落差を低減するという観点から、被覆部は薄いことが好ましい。   Note that a covering portion may be provided on the upper surface of the first base 140. For example, a covering portion made of a resin such as Teflon (registered trademark) or polyimide that is difficult to adhere dirt and dust and has excellent durability may be provided on the upper surface of the first substrate 140. In this case, it is possible to prevent the upper surface of the first base 140 from being worn by friction with the workpiece 1. From the viewpoint of reducing the drop of the work 1 when the work 1 is transferred from the first base 140 to the second base 170, the covering portion is preferably thin.

(実施形態２)
以下、本発明の実施形態２に係る搬送装置について説明する。なお、本実施形態に係る搬送装置は、第１基盤の中央部と外周部との厚さが異なる点のみ実施形態１に係る搬送装置と異なるため、実施形態１に係る搬送装置と同様の構成については説明を繰り返さない。 (Embodiment 2)
Hereinafter, the conveyance apparatus which concerns on Embodiment 2 of this invention is demonstrated. In addition, since the conveying apparatus which concerns on this embodiment differs from the conveying apparatus which concerns on Embodiment 1 only in the point from which the thickness of the center part and outer peripheral part of a 1st base | substrate differs, the structure similar to the conveying apparatus which concerns on Embodiment 1 The description will not be repeated.

図５は、本発明の実施形態２に係る搬送装置における第１基盤の周囲を拡大して示す断面図である。図５に示すように、本発明の実施形態２に係る搬送装置においては、第１基盤１４０ａは、第１めっき膜１４１と第２めっき膜１４２とから構成されている。   FIG. 5 is an enlarged cross-sectional view of the periphery of the first base in the transport apparatus according to Embodiment 2 of the present invention. As shown in FIG. 5, in the transfer device according to the second embodiment of the present invention, the first base 140 a is composed of a first plating film 141 and a second plating film 142.

第１めっき膜１４１および第２めっき膜１４２の各々は、円盤状の外形を有している。第１めっき膜１４１および第２めっき膜１４２は、互いの中心が重なるように積層されている。平面視にて、第１めっき膜１４１の直径は、第２めっき膜１４２の直径より大きい。すなわち、第１基盤１４０ａは、外周部と外周部に周りを囲まれた中央部とから構成されている。第１基盤１４０ａにおいて、中央部は、外周部より厚い。   Each of the first plating film 141 and the second plating film 142 has a disk-shaped outer shape. The first plating film 141 and the second plating film 142 are laminated so that the centers of each other overlap. In plan view, the diameter of the first plating film 141 is larger than the diameter of the second plating film 142. That is, the first base 140a includes an outer peripheral part and a central part surrounded by the outer peripheral part. In the first base 140a, the central part is thicker than the outer peripheral part.

ここで、第１基盤１４０ａの製造方法について説明する。図６は、基板の主面に第１マスクを配置した後、第１めっき膜を形成し、さらに、第１めっき膜の外周部の上面に第２マスクを配置した後、第２めっき膜を形成した状態を示す断面図である。図６に示すように、まず、ステンレス鋼などで形成された平板状の基板９０の主面に、枠状の第１マスク９１が配置される。次に、基板９０の主面上の第１マスク９１内の領域に第１めっき膜１４１を形成する。   Here, the manufacturing method of the 1st board | substrate 140a is demonstrated. In FIG. 6, after the first mask is disposed on the main surface of the substrate, the first plating film is formed, and further, the second mask is disposed on the upper surface of the outer peripheral portion of the first plating film, and then the second plating film is formed. It is sectional drawing which shows the formed state. As shown in FIG. 6, first, a frame-shaped first mask 91 is arranged on the main surface of a flat plate-like substrate 90 made of stainless steel or the like. Next, a first plating film 141 is formed in a region in the first mask 91 on the main surface of the substrate 90.

次に、第１めっき膜１４１の外周部上および第１マスク９１上に、第２マスク９２が配置される。第２マスク９２は、フォトレジストで構成されている。第２マスク９２で囲まれた内側の領域は、円形の外形を有している。次に、第２マスク９２内の領域に第２めっき膜１４２を形成する。   Next, the second mask 92 is disposed on the outer peripheral portion of the first plating film 141 and on the first mask 91. The second mask 92 is made of a photoresist. The inner region surrounded by the second mask 92 has a circular outer shape. Next, a second plating film 142 is formed in a region in the second mask 92.

図７は、第１めっき膜を基板から剥離させた状態を示す断面図である。図７に示すように、第１マスク９１および第２マスク９２を除去した後、第１めっき膜１４１を基板９０から剥離させることにより、第１基盤１４０ａが作製される。   FIG. 7 is a cross-sectional view showing a state where the first plating film is peeled from the substrate. As shown in FIG. 7, after the first mask 91 and the second mask 92 are removed, the first plating film 141 is peeled from the substrate 90, whereby the first base 140a is manufactured.

第１めっき膜１４１の厚さＴ2を実施形態１のめっき膜の厚さＴ1より薄くしつつ、第１めっき膜１４１の厚さＴ2と第２めっき膜１４２の厚さＴ3との合計の厚さ(Ｔ2＋Ｔ3)を確保することにより、第１基盤１４０ａの剛性を維持することができる。これにより、第１基盤１４０ａの上面と、第２基盤１７０の上面との段差を小さくすることができる。その結果、ワーク１が第１基盤１４０ａ上から第２基盤１７０上に乗り移る際のワーク１の位置ずれを抑制して、ワーク１を安定して搬送することができる。 While the thickness T 2 of the first plating film 141 thinner than the thickness T 1 of the plating film of Embodiment 1, the thickness T 2 of the first plating layer 141 and the thickness T 3 of the second plating layer 142 By ensuring the total thickness (T 2 + T 3 ), the rigidity of the first base 140a can be maintained. Thereby, the level | step difference between the upper surface of the 1st board | substrate 140a and the upper surface of the 2nd board | substrate 170 can be made small. As a result, it is possible to suppress the positional deviation of the work 1 when the work 1 is transferred from the first base 140a to the second base 170, and to transport the work 1 stably.

(実施形態３)
以下、本発明の実施形態３に係る搬送装置について説明する。なお、本実施形態に係る搬送装置は、搬送機構部がベルトコンベアで構成されている点のみ実施形態１に係る搬送装置と異なるため、実施形態１に係る搬送装置と同様の構成については説明を繰り返さない。 (Embodiment 3)
Hereinafter, the conveyance apparatus which concerns on Embodiment 3 of this invention is demonstrated. In addition, since the conveyance apparatus which concerns on this embodiment differs from the conveyance apparatus which concerns on Embodiment 1 only in the point that a conveyance mechanism part is comprised with the belt conveyor, about the structure similar to the conveyance apparatus which concerns on Embodiment 1, description is carried out. Do not repeat.

図８は、本発明の実施形態３に係る搬送装置が適用された検査装置の構成を示す平面図である。図８に示すように、本発明の実施形態３に係る搬送装置が適用された検査装置２００は、搬送機構部２５０としてベルトコンベアを備えている。   FIG. 8 is a plan view showing the configuration of an inspection apparatus to which the transport apparatus according to Embodiment 3 of the present invention is applied. As shown in FIG. 8, the inspection apparatus 200 to which the conveyance device according to Embodiment 3 of the present invention is applied includes a belt conveyor as the conveyance mechanism unit 250.

搬送機構部２５０は、直線状に設けられている。具体的には、搬送機構部２５０は、第５ガイド１２５に沿う方向に延在している。搬送機構部２５０は、搬送部であるベルトを備えている。ベルトは、搬送面となる上面を有し、第１基盤１４０から供給された複数のワーク１を順次搬送する。搬送面となるベルトの上面は、第１基盤１４０の外周部の下面となる第２主面１４０ｂと摺接する。搬送機構部２５０のベルトの上面に、第１基盤１４０が順次搬送した複数のワーク１が載置される。搬送機構部２５０のベルトは、ワーク１を載置した状態で矢印２５に示す方向に駆動される。   The transport mechanism unit 250 is provided in a straight line. Specifically, the transport mechanism unit 250 extends in a direction along the fifth guide 125. The transport mechanism unit 250 includes a belt that is a transport unit. The belt has an upper surface serving as a conveyance surface, and sequentially conveys the plurality of workpieces 1 supplied from the first substrate 140. The upper surface of the belt serving as the transport surface is in sliding contact with the second main surface 140b serving as the lower surface of the outer peripheral portion of the first base 140. A plurality of workpieces 1 sequentially conveyed by the first base 140 are placed on the upper surface of the belt of the conveyance mechanism unit 250. The belt of the transport mechanism unit 250 is driven in the direction indicated by the arrow 25 with the workpiece 1 placed thereon.

搬送機構部２５０のベルトにおいて第１基盤１４０と摺接する摺接部２０は、加硫ゴムなどの透明なゴムで構成されている。第１基盤１４０の外周部の下面の表面粗さは、搬送機構部２５０のベルトの上面の表面粗さより小さい。具体的には、第１基盤１４０の外周部の下面の表面粗さは、搬送機構部２５０のベルトの摺接部２０の表面粗さより小さい。   The sliding contact portion 20 that is in sliding contact with the first base 140 in the belt of the transport mechanism portion 250 is made of a transparent rubber such as vulcanized rubber. The surface roughness of the lower surface of the outer peripheral portion of the first base 140 is smaller than the surface roughness of the upper surface of the belt of the transport mechanism unit 250. Specifically, the surface roughness of the lower surface of the outer peripheral portion of the first base 140 is smaller than the surface roughness of the sliding contact portion 20 of the belt of the transport mechanism portion 250.

本実施形態においても、第１基盤１４０の外周部の下面の表面を滑らかにすることにより、第１基盤１４０の外周部の下面と摺接する搬送機構部２５０のベルトの上面に傷が付くことを抑制することができる。   Also in the present embodiment, the upper surface of the belt of the transport mechanism unit 250 that is in sliding contact with the lower surface of the outer peripheral portion of the first base 140 is damaged by smoothing the surface of the lower surface of the outer peripheral portion of the first base 140. Can be suppressed.

本実施形態に係る搬送装置においては、第１基盤１４０の外周部の下面と、搬送機構部２５０のベルトの上面とを摺接させることにより、第１基盤１４０上から搬送機構部２５０のベルト上にワーク１が乗り移る際のワーク１の落差を低減することができる。その結果、ワーク１が第１基盤１４０上から搬送機構部２５０のベルト上に乗り移る際のワーク１の位置ずれを抑制して、ワーク１を安定して搬送することができる。   In the transport device according to the present embodiment, the lower surface of the outer peripheral portion of the first base 140 and the upper surface of the belt of the transport mechanism unit 250 are brought into sliding contact with each other, so that the top of the belt of the transport mechanism unit 250 from above the first base 140. It is possible to reduce a drop of the work 1 when the work 1 is transferred to the work. As a result, the workpiece 1 can be stably conveyed while suppressing the positional deviation of the workpiece 1 when the workpiece 1 is transferred from the first base 140 onto the belt of the conveyance mechanism unit 250.

上述した実施形態の説明において、組み合わせ可能な構成を相互に組み合わせてもよい。   In the description of the above-described embodiment, configurations that can be combined may be combined with each other.

今回開示された実施形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。   It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

１ ワーク、１０，２０ 摺接部、９０ 基板、９１ 第１マスク、９２ 第２マスク、１００，２００ 検査装置、１１０ 供給部、１１１ 供給路、１１２ ホッパ、１１３ シューター、１２０ 整列部、１２１ 第１ガイド、１２２ 第２ガイド、１２３ 第３ガイド、１２４ 第４ガイド、１２５ 第５ガイド、１３０ 第１駆動部、１３１ 第１ベース、１３２，１６２ 回転部、１３３，１６３ 回転板、１３４，１６４ 軸部、１３５，１６５ 固定具、１３６，１６６ 支持台、１４０，１４０ａ 第１基盤、１４０ｂ 第２主面、１４０ｔ 第１主面、１４１ 第１めっき膜、１４２ 第２めっき膜、１５０，２５０ 搬送機構部、１６０ 第２駆動部、１６１ 第２ベース、１７０ 第２基盤、１８０ 排出部、１８１ 第１エアーブロワ、１８２ 第２エアーブロワ、１８３ ガイド、Ｐ１ 第１検査領域、Ｐ２ 第２検査領域、Ｐ３ 第３検査領域、Ｐ４ 第４検査領域、Ｐ５ 第５検査領域、Ｐ６ 第６検査領域。   DESCRIPTION OF SYMBOLS 1 Workpiece | work, 10 and 20 sliding contact part, 90 board | substrate, 91 1st mask, 92 2nd mask, 100,200 inspection apparatus, 110 supply part, 111 supply path, 112 hopper, 113 shooter, 120 alignment part, 121 1st Guide, 122 Second guide, 123 Third guide, 124 Fourth guide, 125 Fifth guide, 130 First drive unit, 131 First base, 132, 162 Rotating unit, 133, 163 Rotating plate, 134, 164 Shaft , 135,165 Fixing tool, 136,166 Support base, 140, 140a First base, 140b Second main surface, 140t First main surface, 141 First plating film, 142 Second plating film, 150, 250 Transport mechanism 160, second drive unit, 161 second base, 170 second base, 180 discharge unit, 181 first air blower, 82 second air blower, 183 guide, P1 first inspection region, P2 second inspection region, P3 third inspection region, P4 fourth inspection region, P5 fifth inspection region, P6 sixth inspection region.

Claims (14)

複数のワークを整列させて順次搬送する第１基盤と、
前記第１基盤から供給された前記複数のワークを順次搬送する搬送部と、
前記第１基盤を回転させる第１駆動部と、
前記搬送部を駆動する第２駆動部とを備え、
前記第１基盤は、金属で構成されており、
前記搬送部の搬送面に、前記第１基盤が順次搬送した前記複数のワークが載置され、
前記搬送部の前記搬送面は、前記第１基盤の外周部の下面と摺接し、
前記第１基盤の前記外周部の前記下面の表面粗さは、前記第１基盤の上面の表面粗さより小さい、搬送装置。 A first base for aligning a plurality of workpieces and transporting them sequentially;
A transport unit that sequentially transports the plurality of workpieces supplied from the first base;
A first driving unit for rotating the first base;
A second drive unit that drives the transport unit;
The first base is made of metal,
The plurality of workpieces sequentially transported by the first base are placed on a transport surface of the transport unit,
The transport surface of the transport unit is in sliding contact with the lower surface of the outer peripheral portion of the first base,
The conveying device, wherein the surface roughness of the lower surface of the outer peripheral portion of the first substrate is smaller than the surface roughness of the upper surface of the first substrate. 複数のワークを整列させて順次搬送する第１基盤と、
前記第１基盤から供給された前記複数のワークを順次搬送する搬送部と、
前記第１基盤を回転させる第１駆動部と、
前記搬送部を駆動する第２駆動部とを備え、
前記第１基盤は、金属で構成されており、
前記搬送部の搬送面に、前記第１基盤が順次搬送した前記複数のワークが載置され、
前記搬送部の前記搬送面は、前記第１基盤の外周部の下面と摺接し、
前記第１基盤の前記外周部の前記下面の表面粗さは、前記搬送部の前記搬送面の表面粗さより小さい、搬送装置。 A first base for aligning a plurality of workpieces and transporting them sequentially;
A transport unit that sequentially transports the plurality of workpieces supplied from the first base;
A first driving unit for rotating the first base;
A second drive unit that drives the transport unit;
The first base is made of metal,
The plurality of workpieces sequentially transported by the first base are placed on a transport surface of the transport unit,
The transport surface of the transport unit is in sliding contact with the lower surface of the outer peripheral portion of the first base,
The conveyance device, wherein the surface roughness of the lower surface of the outer peripheral portion of the first base is smaller than the surface roughness of the conveyance surface of the conveyance unit. 前記第１基盤は、めっき膜で構成されている、請求項１または請求項２に記載の搬送装置。   The transfer device according to claim 1 or 2, wherein the first base is formed of a plating film. 前記搬送部は、前記搬送面を有する第２基盤を含み、
前記第２駆動部は、前記第２基盤を回転させ、
前記第１基盤および前記第２基盤の各々が、円盤状の外形を有し、
前記第２基盤の外周長さは、前記第１基盤の外周長さより長く、
前記第２基盤による前記複数のワークの搬送速度は、前記第１基盤による前記複数のワークの搬送速度より大きい、請求項１から請求項３のいずれか１項に記載の搬送装置。 The transport unit includes a second base having the transport surface,
The second driving unit rotates the second base,
Each of the first base and the second base has a disk-shaped outer shape,
The outer peripheral length of the second base is longer than the outer peripheral length of the first base,
The conveyance device according to any one of claims 1 to 3, wherein a conveyance speed of the plurality of workpieces by the second substrate is higher than a conveyance speed of the plurality of workpieces by the first substrate. 前記第１基盤の上方に、前記複数のワークを整列させるガイドが設けられており、
前記ガイドは、前記第１基盤上に位置する前記複数のワークが前記第１基盤の回転に伴って前記第１基盤の径方向の外側に移動するように、前記第１基盤の周方向に対して交差する方向に延在している部分を含む、請求項１から請求項４のいずれか１項に記載の搬送装置。 A guide for aligning the plurality of workpieces is provided above the first base,
The guide is arranged with respect to a circumferential direction of the first base so that the plurality of workpieces positioned on the first base move outward in the radial direction of the first base with the rotation of the first base. The conveyance apparatus of any one of Claims 1-4 including the part extended in the direction which cross | intersects. 前記第１基盤の前記外周部の厚さが、１０μｍ以上２００μｍ以下である、請求項１から請求項５のいずれか１項に記載の搬送装置。   The transport apparatus according to claim 1, wherein a thickness of the outer peripheral portion of the first base is 10 μm or more and 200 μm or less. 前記第１基盤は、ニッケルおよびコバルトを含む合金で構成されている、請求項１から請求項６のいずれか１項に記載の搬送装置。   The said 1st base | substrate is a conveying apparatus of any one of Claims 1-6 comprised with the alloy containing nickel and cobalt. 前記第１基盤は、前記外周部と該外周部に周りを囲まれた中央部とから構成されており、
前記中央部は、前記外周部より厚い、請求項１から請求項７のいずれか１項に記載の搬送装置。 The first base is composed of the outer peripheral portion and a central portion surrounded by the outer peripheral portion,
The transport device according to claim 1, wherein the central portion is thicker than the outer peripheral portion. 回転することによって複数のワークを整列させて順次搬送し、搬送部の搬送面に前記複数のワークを載置する基盤であって、
金属で構成されており、
下面が前記搬送部の前記搬送面と摺接する外周部を有し、
前記外周部の前記下面の表面粗さが、上面の表面粗さより小さい、基盤。 It is a base for aligning a plurality of workpieces by rotating and sequentially conveying them, and placing the plurality of workpieces on a conveyance surface of a conveyance unit,
Composed of metal,
The lower surface has an outer peripheral portion that is in sliding contact with the transport surface of the transport unit,
The base | substrate whose surface roughness of the said lower surface of the said outer peripheral part is smaller than the surface roughness of an upper surface. めっき膜で構成されている、請求項９に記載の基盤。   The board | substrate of Claim 9 comprised with the plating film. 円盤状の外形を有する、請求項９または請求項１０に記載の基盤。   The base according to claim 9 or 10, which has a disc-like outer shape. 前記外周部の厚さが、１０μｍ以上２００μｍ以下である、請求項９から請求項１１のいずれか１項に記載の基盤。   The board | substrate of any one of Claims 9-11 whose thickness of the said outer peripheral part is 10 micrometers or more and 200 micrometers or less. ニッケルおよびコバルトを含む合金で構成されている、請求項９から請求項１２のいずれか１項に記載の基盤。   The board | substrate of any one of Claim 9 to 12 comprised with the alloy containing nickel and cobalt. 前記外周部と該外周部に周りを囲まれた中央部とから構成されており、
前記中央部は、前記外周部より厚い、請求項９から請求項１３のいずれか１項に記載の基盤。 It is composed of the outer peripheral part and a central part surrounded by the outer peripheral part,
The base according to claim 9, wherein the central portion is thicker than the outer peripheral portion.
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JP6668738B2 (en) 2020-03-18

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