JP2017112211A - Method of manufacturing light-emitting device - Google Patents
Method of manufacturing light-emitting device Download PDFInfo
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- JP2017112211A JP2017112211A JP2015245253A JP2015245253A JP2017112211A JP 2017112211 A JP2017112211 A JP 2017112211A JP 2015245253 A JP2015245253 A JP 2015245253A JP 2015245253 A JP2015245253 A JP 2015245253A JP 2017112211 A JP2017112211 A JP 2017112211A
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Abstract
Description
本発明は、液晶ディスプレイにおける導光板を用いたバックライトに代表される照明機器を用途とする発光素子をパッケージ化したＬＥＤランプ、等の発光装置に関する。 The present invention relates to a light-emitting device such as an LED lamp packaged with a light-emitting element for use in an illumination device typified by a backlight using a light guide plate in a liquid crystal display.
青色ＬＥＤチップの実用化により、青色ＬＥＤチップと黄色蛍光体との組み合わせによる白色ＬＥＤ光源が種々の分野で利用されている。特に、自発光型のディスプレイではない液晶ディスプレイのバックライトとして利用されることが多い。 With the practical use of blue LED chips, white LED light sources using a combination of blue LED chips and yellow phosphors are used in various fields. In particular, it is often used as a backlight of a liquid crystal display that is not a self-luminous display.
このようなバックライトでは、白色ＬＥＤ光源からの発光光を導光板の側面から入射させた面状光源を利用するものが主流であり、導光板への白色ＬＥＤ光源の白色光の入射ロスを低減させることが、液晶ディスプレイ全体としての消費電力の低減に繋がる。入射ロスを低減させるためには、導光板と白色ＬＥＤ光源との間に空隙を形成しないことが有効である。従って、導光板と白色ＬＥＤ光源との間に弾性体を配置する手法や、白色ＬＥＤ光源の白色光の出射面自体を弾性体とする手法等が提案されている（例えば、特許文献１及び特許文献２参照。）。 In such a backlight, the one that uses a planar light source in which the light emitted from the white LED light source is incident from the side surface of the light guide plate is the mainstream, and the incident loss of white light from the white LED light source to the light guide plate is reduced. This leads to a reduction in power consumption of the entire liquid crystal display. In order to reduce the incident loss, it is effective not to form a gap between the light guide plate and the white LED light source. Therefore, a method of arranging an elastic body between the light guide plate and the white LED light source, a method of using the white light emitting surface of the white LED light source itself as an elastic body, and the like have been proposed (for example, Patent Document 1 and Patent). Reference 2).
しかしながら、導光板と白色ＬＥＤ光源との間に弾性体を配置する場合、白色ＬＥＤ光源のリフレクタ内面ではなく、リフレクタ上面と導光板との間に弾性体が介在してしまう。このリフレクタ上面に位置する弾性体を透過する光に起因して、白色光の色度ズレを生じる問題があった。 However, when an elastic body is disposed between the light guide plate and the white LED light source, the elastic body is interposed between the upper surface of the reflector and the light guide plate instead of the inner surface of the reflector of the white LED light source. There has been a problem of causing chromaticity deviation of white light due to light transmitted through the elastic body located on the upper surface of the reflector.
本発明は、このような従来技術の課題を鑑みてなされたものであって、導光板を用いたバックライト用に供される発光装置等において、導光板への白色光の入射の際に、色度ズレを抑制する発光装置を提供することを目的とする。 The present invention has been made in view of such problems of the prior art, and in a light emitting device or the like provided for a backlight using a light guide plate, when white light is incident on the light guide plate, It is an object of the present invention to provide a light emitting device that suppresses chromaticity deviation.
上記の課題は、凹部を有するケースと、前記凹部の底部に配置される発光素子と、前記発光素子を封止する封止部とを有する発光装置において、前記封止部は、前記凹部の内面の上部を充填しないように凸上に形成され、前記封止部の少なくとも上層は、印圧により変形して前記上部を充填するように変形可能な軟質材料から形成されていることを特徴とする発光装置により解決される。 Said subject is a light-emitting device which has a case which has a recessed part, the light emitting element arrange | positioned at the bottom part of the said recessed part, and the sealing part which seals the said light emitting element, The said sealing part is the inner surface of the said recessed part The upper portion of the sealing portion is formed so as not to be filled, and at least the upper layer of the sealing portion is formed of a soft material that is deformable so as to be deformed by a printing pressure and fill the upper portion. Solved by a light emitting device.
また、前記封止部の下層は前記封止部の上層より硬質材料により形成されていることが好ましい。更に、前記内面の中腹に切欠き部が設けられており、前記封止部の上面が前記内面と前記切欠きの位置と一致することが好ましい。また、前記切欠き部に、更にノッチ又はリッジが設けられていることが好ましい。 Moreover, it is preferable that the lower layer of the said sealing part is formed with a hard material rather than the upper layer of the said sealing part. Furthermore, it is preferable that a notch is provided in the middle of the inner surface, and that the upper surface of the sealing portion coincides with the position of the inner surface and the notch. Moreover, it is preferable that a notch or a ridge is further provided in the notch.
本発明の発光装置の封止部は、凹部の内面の上部を充填しないように凸上に形成され、封止部の少なくとも上層は、印圧により変形して前記上部を充填するように変形可能な軟質材料から形成されている。従って、発光装置を直接導光板に印圧した場合に、封止部の上層が変形して凹部を充填するため、発光装置の上面と導光板との間に軟質材料が介在しない。これにより、導光板への発光装置からの発光光の入射の際に生じる色度ズレを抑制することができる。 The sealing part of the light emitting device of the present invention is formed on the convex so as not to fill the upper part of the inner surface of the concave part, and at least the upper layer of the sealing part can be deformed so as to be deformed by the printing pressure to fill the upper part Made of a soft material. Therefore, when the light emitting device is directly applied to the light guide plate, the upper layer of the sealing portion is deformed and fills the recess, so that no soft material is interposed between the upper surface of the light emitting device and the light guide plate. Thereby, the chromaticity shift | offset | difference which arises in the case of the incident of the emitted light from the light-emitting device to a light-guide plate can be suppressed.
また、封止部の下層は封止部の上層より硬質材料により形成されていると、発光装置を導光板へ印圧して封止部が変形する際に、ケースと発光素子との間の電気的接続に使用するワイヤ等に応力がかかることによる断線を防止することができる。更に、内面の中腹に切欠き部が設けられていると、封止部を凹部の内面の上部を充填しないように凸上に形成しやすくなる。切欠き部に、更にノッチ又はリッジが設けられていると、更に封止部を凹部の内面の上部を充填しないように凸状に形成しやすくなる。 In addition, if the lower layer of the sealing part is formed of a harder material than the upper layer of the sealing part, when the light emitting device is pressed against the light guide plate and the sealing part is deformed, the electric current between the case and the light emitting element is reduced. It is possible to prevent disconnection due to stress applied to the wire or the like used for the general connection. Furthermore, when the notch is provided in the middle of the inner surface, it becomes easy to form the sealing portion on the convex so as not to fill the upper part of the inner surface of the concave. If a notch or a ridge is further provided in the notch, it becomes easier to form the sealing portion in a convex shape so as not to fill the upper part of the inner surface of the recess.
以下に、添付の図面に基づいて、本発明を実施するための最良の形態について説明する。 The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.
（第１の実施の形態）
図１（ａ），（ｂ），（ｃ）は、本発明の第１の実施の形態のＬＥＤランプとその挙動を示す断面図であり、図１（ａ）は、本発明の第１の実施の形態のＬＥＤランプであり、図１（ｂ）は、本発明の第１の実施の形態のＬＥＤランプを導光板に印圧した際の断面図であり、図１（ｃ）は、更に印圧した際の断面図である。
本発明の第１の実施の形態のＬＥＤランプ１０は、図１（ａ）に示す通り、凹部を有するケース１１と、凹部の底面に配置されたＬＥＤチップ１２と、ＬＥＤチップ１２を封止する封止部１３を備えている。
ケース１１の内面上部には切欠き１１ｓが設けられている。これにより、ケース１１の凹部にポッティングにより封止部１３を構成するシリコーン樹脂等の封止材料を滴下した場合に、ケース内面上部にシリコーン樹脂が這い上がらないようにしている。
(First embodiment)
1 (a), (b) and (c) are cross-sectional views showing the LED lamp and its behavior according to the first embodiment of the present invention. FIG. 1 (a) shows the first embodiment of the present invention. FIG. 1B is a cross-sectional view of the LED lamp according to the first embodiment of the present invention when the light guide plate is pressed, and FIG. 1C further illustrates the LED lamp according to the embodiment. It is sectional drawing at the time of printing pressure.
As shown in FIG. 1A, the LED lamp 10 according to the first embodiment of the present invention seals the case 11 having a recess, the LED chip 12 disposed on the bottom surface of the recess, and the LED chip 12. A sealing portion 13 is provided.
A cutout 11 s is provided in the upper part of the inner surface of the case 11. Thereby, when a sealing material such as a silicone resin constituting the sealing portion 13 is dropped into the recess of the case 11 by potting, the silicone resin is prevented from creeping up on the inner surface of the case.
ケース１１は、ポリフタルアミド等の熱可塑性樹脂、エポキシ樹脂等の熱硬化性樹脂、又は、アルミナ等のセラミックから形成されている。 The case 11 is made of a thermoplastic resin such as polyphthalamide, a thermosetting resin such as an epoxy resin, or a ceramic such as alumina.
ＬＥＤチップ１２は、サファイア，ＳｉＣ（炭化珪素）、ＧａＮ（窒化ガリウム）等の
成長基板の上に窒化ガリウム系化合物半導体（Ａｌ１−Ｘ１−Ｙ１ＩｎＸ１ＧａＹ１Ｎ、
０≦Ｘ１≦１，０≦Ｙ１≦１，０≦Ｘ１＋Ｙ１≦１）層が積層されており、正負の電極（
図示せず）に電圧を印加することにより、例えば青色光を発光する。電圧の印加は、ケース底面にケース１１と一体成形されたリード（図示せず。）をＬＥＤチップ１２とワイヤ（図示せず。）により接続し、リードを介して行う。
The LED chip 12 is formed on a growth substrate such as sapphire, SiC (silicon carbide), GaN (gallium nitride) or the like, on a gallium nitride compound semiconductor (Al1-X1-Y1InX1GaY1N,
0 ≦ X1 ≦ 1, 0 ≦ Y1 ≦ 1, 0 ≦ X1 + Y1 ≦ 1) layers are stacked, and positive and negative electrodes (
By applying a voltage to (not shown), for example, blue light is emitted. The voltage is applied by connecting a lead (not shown) integrally formed with the case 11 on the bottom surface of the case via the LED chip 12 and a wire (not shown) and via the lead.
封止部１３は、シリコーン樹脂等の軟質材料からなり、ケース１１の凹部の容量より小さく容量で凸状に形成されている。凸状の頂点は、ケース１１の上面より高い形成されている。封止部１３には、所望の蛍光体を含有されており、ＬＥＤチップ１２の発光光を青色光とし、これを励起光として、黄色光の波長変換光を発するＹＡＧ（Ｙｔｔｒｉｕｍ Ａｌｕｍｉｎｉｕｍ Ｇａｒｎｅｔ）系蛍光体やＢＯＳ（Ｂａｒｉｕｍ Ｏｒｔｈｏ Ｓｉｌｉｃａｔｅ）系蛍光体等を用い、ＬＥＤチップからの発光光と蛍光体による波長変換光の混色により白色光を発する。その他、紫外光を発光するＬＥＤチップと、これを励起光とする青色光、黄色光（緑色光）、赤色光を発する波長変換光とを組み合わせて白色光を得てもよい。 The sealing portion 13 is made of a soft material such as silicone resin, and is formed in a convex shape with a capacity smaller than the capacity of the concave portion of the case 11. The convex vertex is formed higher than the upper surface of the case 11. The sealing portion 13 contains a desired phosphor, and YAG (Yttrium Aluminum Garnet) fluorescent light that emits yellow wavelength-converted light using the emitted light of the LED chip 12 as blue light as excitation light. A white light is emitted by mixing light emitted from the LED chip and wavelength-converted light by the phosphor using a body, a BOS (Barium Ortho Silicate) phosphor, or the like. In addition, white light may be obtained by combining an LED chip that emits ultraviolet light with wavelength-converted light that emits blue light, yellow light (green light), and red light using excitation light.
このような構成を有する本発明の実施の形態のＬＥＤランプ１０によれば、封止部１３がケース１１の凹部の内面の上部を充填しないように凸上に形成され、封止部は、印圧により変形して前記上部を充填するように変形可能な軟質材料から形成されている。従って、ＬＥＤランプ１０を直接導光板Ｇに印圧した場合に、封止部１３が変形してケース１１の凹部を充填するため、ＬＥＤランプ１０のケース１１の上面と導光板との間に封止部１３が介在しない。これにより、導光板ＧへのＬＥＤランプ１０からの白色光の入射の際に生じる色度ズレを抑制することができる。 According to the LED lamp 10 of the embodiment of the present invention having such a configuration, the sealing portion 13 is formed so as not to fill the upper part of the inner surface of the concave portion of the case 11, and the sealing portion is It is formed from a soft material that can be deformed by pressure so as to fill the upper part. Therefore, when the LED lamp 10 is directly pressed onto the light guide plate G, the sealing portion 13 is deformed to fill the concave portion of the case 11, so that the sealing is performed between the upper surface of the case 11 of the LED lamp 10 and the light guide plate. Stop part 13 does not intervene. Thereby, the chromaticity shift | offset | difference which arises when the white light from the LED lamp 10 injects into the light-guide plate G can be suppressed.
ここで、封止部１３を、図２に示す通り、ＬＥＤチップ１２を被覆する下層１３ｌと、下層１３ｌを覆う上層１３ｕとで構成してもよい。この場合、下層１３ｌにのみ蛍光体を含有させれば、白色光の色度ズレが一層抑制される。また、下層１３ｌを上層１３ｕよりも硬い硬質材料で形成すれば、ＬＥＤランプ１０を導光板Ｇへ印圧して封止部１３が変形する際に、ケース１１とＬＥＤチップ１２との間の電気的接続に使用するワイヤ等に応力がかかることによる断線を防止することができる。例えば、このような具体例として、下層１３ｌをメチル系シリコーン樹脂、上層１３ｕをフェニル系シリコーン樹脂で形成する場合が挙げられる。その他、下層１３ｌをエポキシ樹脂やゾルゲルガラス、上層１３ｕをシリコーン樹脂で形成してもよい。尚、下層１３ｌと上層１３ｕは屈折率が同等（±０．０１）であると、ＬＥＤチップ１２の発光光及び蛍光体の波長変換光が封止部１３から取り出しやすいため、好ましい。 Here, as shown in FIG. 2, the sealing portion 13 may be composed of a lower layer 13l covering the LED chip 12 and an upper layer 13u covering the lower layer 13l. In this case, if the phosphor is contained only in the lower layer 13l, the chromaticity deviation of white light is further suppressed. Further, if the lower layer 13l is formed of a hard material harder than the upper layer 13u, when the LED lamp 10 is pressed against the light guide plate G and the sealing portion 13 is deformed, the electrical connection between the case 11 and the LED chip 12 is achieved. It is possible to prevent disconnection due to stress applied to the wire or the like used for connection. For example, as a specific example, there is a case where the lower layer 13l is formed of a methyl silicone resin and the upper layer 13u is formed of a phenyl silicone resin. In addition, the lower layer 13l may be formed of epoxy resin or sol-gel glass, and the upper layer 13u may be formed of silicone resin. It is preferable that the lower layer 13l and the upper layer 13u have the same refractive index (± 0.01) because the light emitted from the LED chip 12 and the wavelength-converted light from the phosphor can be easily extracted from the sealing portion 13.
（第２の実施の形態）
図３は、本発明の第２の実施の形態のＬＥＤランプを示す断面図である。
本実施の形態のＬＥＤランプ２０は、第１の実施の形態のＬＥＤランプ１０と比較してケース２０に切欠き１１ｓがない点において異なる。第１の実施の形態では、シリコーン樹脂のケース内面の上部への這い上がり防止のために切欠き１１ｓを設けていたが、封止部２０を構成するシリコーン樹脂等の軟質樹脂の粘度が高い場合、このような問題は生じないため、敢えてケース２１に切欠き１１ｓを設ける必要はない。
(Second Embodiment)
FIG. 3 is a sectional view showing an LED lamp according to a second embodiment of the present invention.
The LED lamp 20 of the present embodiment is different from the LED lamp 10 of the first embodiment in that the case 20 has no notch 11s. In the first embodiment, the notch 11s is provided to prevent the silicone resin from creeping up to the upper part of the inner surface of the case. However, when the viscosity of a soft resin such as a silicone resin constituting the sealing portion 20 is high Since such a problem does not occur, it is not necessary to dare to provide the notch 11s in the case 21.
（第３の実施の形態）
図４（ａ），（ｂ）は、各々、本発明の第３の実施の形態のＬＥＤランプを示す断面図である。
本実施の形態のＬＥＤランプ３０，４０は、第１の実施の形態と比較して、ケース３１，４１の切欠き１１ｓの段差部に図４（ａ）では、ノッチ３１ｎ、図４（ｂ）ではリッジ４１ｒを設けている点において異なる。
このように、ケース３１，４１にノッチ３１ｎ、又は、リッジ４１ｒを設けた場合、更に封止部を構成するシリコーン樹脂が凹部の内面の上部に這い上がらなくしつつ、封止部３３，４３の形状を凸状に形成しやすくなる。
(Third embodiment)
4 (a) and 4 (b) are cross-sectional views showing an LED lamp according to a third embodiment of the present invention.
Compared with the first embodiment, the LED lamps 30 and 40 of the present embodiment have a notch 31n in FIG. 4 (a) and a stepped portion of the notch 11s of the cases 31 and 41 in FIG. 4 (b). The difference is that the ridge 41r is provided.
As described above, when the notches 31n or the ridges 41r are provided in the cases 31 and 41, the shape of the sealing portions 33 and 43 is prevented while the silicone resin constituting the sealing portion does not crawl up above the inner surface of the recess. Can be easily formed in a convex shape.
上記の本実施の形態では発光素子としてＬＥＤチップを挙げて説明したが、発光サイリ
スタやレーザーチップ等、その他の発光素子を用いてもよい。
In the above embodiment, the LED chip is described as the light emitting element, but other light emitting elements such as a light emitting thyristor and a laser chip may be used.
本発明の発光装置は、導光板を用いた液晶のバックライトや、面状照明機器等の大型照明の他、導光棒を用いた点状正面等、種々の光源にも適用できる。 The light-emitting device of the present invention can be applied to various light sources such as a liquid crystal backlight using a light guide plate, large-sized illumination such as a planar illumination device, and a pointed front using a light guide rod.
１０，２０，３０，４０ ＬＥＤランプ（発光装置）
１１，２１，３１，４１ ケース
１２，２２，３２，４２ ＬＥＤチップ（発光素子）
１３，２３，３３，４３ 封止部
１３ｌ 封止部の下層
１３ｕ 封止部の上層
Ｇ 導光板
10, 20, 30, 40 LED lamp (light emitting device)
11, 21, 31, 41 Case 12, 22, 32, 42 LED chip (light emitting element)
13, 23, 33, 43 Sealing part 13l Lower layer of sealing part 13u Upper layer of sealing part G Light guide plate
Claims (5)
前記凹部の底部に配置される発光素子と、
前記発光素子を封止する封止部と
を有する発光装置において、
前記封止部は、前記凹部の内面の上部を充填しないように凸上に形成され、
前記封止部の少なくとも上層は、印圧により変形して前記上部を充填するように変形可能な軟質材料から形成されている
ことを特徴とする発光装置。 A case having a recess;
A light emitting device disposed at the bottom of the recess;
In a light emitting device having a sealing portion for sealing the light emitting element,
The sealing part is formed on a convex so as not to fill the upper part of the inner surface of the concave part,
At least the upper layer of the sealing portion is formed of a soft material that is deformable so as to be deformed by a printing pressure and fill the upper portion.
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Citations (10)
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|---|---|---|---|---|
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| JP2003234008A (en) * | 2002-02-06 | 2003-08-22 | Nichia Chem Ind Ltd | Surface light emitting device |
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| JP2002314143A (en) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | Light emitting device |
| JP2003234008A (en) * | 2002-02-06 | 2003-08-22 | Nichia Chem Ind Ltd | Surface light emitting device |
| US20070295968A1 (en) * | 2006-06-27 | 2007-12-27 | Kheng Leng Tan | Electroluminescent device with high refractive index and UV-resistant encapsulant |
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| JP2010287680A (en) * | 2009-06-10 | 2010-12-24 | Mitsubishi Chemicals Corp | Light-emitting device |
| JP2012015319A (en) * | 2010-06-30 | 2012-01-19 | Sharp Corp | Light emitting element package, method for manufacturing the same, light emitting element array, and display device |
| WO2012157644A1 (en) * | 2011-05-16 | 2012-11-22 | 日亜化学工業株式会社 | Light-emitting device and method for manufacturing same |
| JP2013008941A (en) * | 2011-06-22 | 2013-01-10 | Lg Innotek Co Ltd | Light emitting device module |
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