JP2017112146A5 - - Google Patents

Download PDF

Info

Publication number
JP2017112146A5
JP2017112146A5 JP2015243519A JP2015243519A JP2017112146A5 JP 2017112146 A5 JP2017112146 A5 JP 2017112146A5 JP 2015243519 A JP2015243519 A JP 2015243519A JP 2015243519 A JP2015243519 A JP 2015243519A JP 2017112146 A5 JP2017112146 A5 JP 2017112146A5
Authority
JP
Japan
Prior art keywords
optical semiconductor
semiconductor element
coating layer
coated optical
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015243519A
Other languages
English (en)
Japanese (ja)
Other versions
JP6543564B2 (ja
JP2017112146A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015243519A priority Critical patent/JP6543564B2/ja
Priority claimed from JP2015243519A external-priority patent/JP6543564B2/ja
Priority to PCT/JP2015/085268 priority patent/WO2016098825A1/ja
Priority to TW104142536A priority patent/TWI691102B/zh
Publication of JP2017112146A publication Critical patent/JP2017112146A/ja
Publication of JP2017112146A5 publication Critical patent/JP2017112146A5/ja
Application granted granted Critical
Publication of JP6543564B2 publication Critical patent/JP6543564B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015243519A 2014-12-17 2015-12-14 被覆光半導体素子の製造方法 Active JP6543564B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015243519A JP6543564B2 (ja) 2015-12-14 2015-12-14 被覆光半導体素子の製造方法
PCT/JP2015/085268 WO2016098825A1 (ja) 2014-12-17 2015-12-16 被覆光半導体素子の製造方法
TW104142536A TWI691102B (zh) 2014-12-17 2015-12-17 被覆光半導體元件之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015243519A JP6543564B2 (ja) 2015-12-14 2015-12-14 被覆光半導体素子の製造方法

Publications (3)

Publication Number Publication Date
JP2017112146A JP2017112146A (ja) 2017-06-22
JP2017112146A5 true JP2017112146A5 (ko) 2019-02-07
JP6543564B2 JP6543564B2 (ja) 2019-07-10

Family

ID=59080894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015243519A Active JP6543564B2 (ja) 2014-12-17 2015-12-14 被覆光半導体素子の製造方法

Country Status (1)

Country Link
JP (1) JP6543564B2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6798581B2 (ja) * 2018-08-27 2020-12-09 日亜化学工業株式会社 発光装置の製造方法
WO2022004564A1 (ja) * 2020-06-29 2022-01-06 京セラ株式会社 発光装置及び照明装置
JP7239840B2 (ja) 2020-08-31 2023-03-15 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8497519B2 (en) * 2011-05-24 2013-07-30 Tsmc Solid State Lighting Ltd. Batwing LED with remote phosphor configuration
US8907502B2 (en) * 2012-06-29 2014-12-09 Nitto Denko Corporation Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device

Similar Documents

Publication Publication Date Title
JP2014032960A5 (ja) 表示装置の作製方法
JP2013033786A5 (ja) 半導体装置、半導体装置の製造方法、および電子機器
JP2014056815A5 (ko)
JP2017508647A5 (ko)
EP2830095A3 (en) Organic light-emitting display apparatus and manufacturing method thereof
JP2013153068A5 (ko)
EP2511963A3 (en) light emitting element sheet, and light emitting device and correspoding fabrication methods.
MX354168B (es) Método para la manufactura de micro características de producto impreso y disposición para la producción continua de tal producto.
WO2014105233A3 (en) Processes for multi-layer devices utilizing layer transfer
JP2012256848A5 (ko)
JP2013038399A5 (ja) 半導体装置
JP2014029853A5 (ko)
JP2013042180A5 (ko)
EP2645415A3 (en) Lead frame, semiconductor device, and method for manufacturing lead frame
JP2011009723A5 (ko)
JP2011100992A5 (ko)
JP2013069807A5 (ko)
JP2017112146A5 (ko)
JP2008288313A5 (ko)
JP2013140965A5 (ko)
JP2015518270A5 (ko)
JP2011029609A5 (ja) 半導体装置の作製方法
RU2015123791A (ru) Способ изготовления обтекателя радиолокационной антенны
JP2014192386A5 (ko)
JP2014150253A5 (ko)