JP2017107867A - 薄膜電池のマスクレス製造 - Google Patents
薄膜電池のマスクレス製造 Download PDFInfo
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- JP2017107867A JP2017107867A JP2017031246A JP2017031246A JP2017107867A JP 2017107867 A JP2017107867 A JP 2017107867A JP 2017031246 A JP2017031246 A JP 2017031246A JP 2017031246 A JP2017031246 A JP 2017031246A JP 2017107867 A JP2017107867 A JP 2017107867A
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- layer
- thin film
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- film battery
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- Y10T29/49108—Electric battery cell making
Abstract
【解決手段】薄膜電池(TFB)は、シャドーマスクの使用を排除及び/又は最小限度に抑えるプロセスにより製造される。レーザーパターニングプロセスが単一層又は積層を除去するが下層は無傷のままである、選択的レーザーアブレーションプロセスは、パターン形成要件のいくつか又はすべてを満たすように使用される。レーザービームが堆積層に到達する前に基板を透過する基板側からのダイパターニングに関して、熱応力不整合誘起レーザーアブレーションを実現するために、アモルファスシリコン層又は微結晶シリコン層のようなダイパターニング補助層を使用することができ、材料を除去するために必要とされるレーザーエネルギーが著しく減少する。
【選択図】図5D
Description
本出願は2011年6月17日に出願された米国仮特許出願第61/498,484号の利益を主張するものであり、その開示内容全体が引用により本明細書に組み込まれている。
本発明の実施形態は、一般的に薄膜電池のためのシャドーマスクレス製作プロセスに関する。
これらの具体例における薄膜スタックは、ガラス基板上に100/500/2000nmの厚さのTi/Au/LiCoO2であり、すべてDCのパルスマグネトロンにより堆積したものである。アブレーション用に使用されたレーザーは、約30μmのスポットサイズの、532nmと1064nmのナノ秒レーザーであった。図7において、ダイパターニングは基板側から532nmのナノ秒パルスレーザーにより行われる。それに対して図8及び9では、ダイパターニングを薄膜側からそれぞれ532nm及び1024nmのナノ秒パルスレーザーにより行われる。ダイパターニングを基板側から行う場合にはアブレーション領域にほとんど「スパイク」がないのに対して、ダイパターニングをデバイス側から行う場合にはアブレーション領域に多くの大きな「スパイク」が存在する。基板側からのレーザーパターニングは、「上(upper)」層の溶融より前の爆発(explosion)プロセスであるのに対して、薄膜側からのパターニングは全薄膜スタックを切除する必要がある。基板側から必要とされるレーザーフルエンスは、薄膜側からのそれよりずっと小さく、多層の厚膜スタックに関しては特に当てはまる。加えて、薄膜側からのレーザーパターニングは、全薄膜スタックを最初に溶融させ、次に蒸発させる必要があり、溶けた放出物はアブレーション領域に「スパイク」を形成する。レーザービームが堆積層に到達する前に基板を通過する基板側からのダイパターニングに関して、実験データは大きなプロセスウィンドウを示している。例えば、30kHzのPRF(パルス繰返し周波数)を有する532nmのナノ秒レーザーは、以下のダイオード電流(40から2000mJ/cm2のフルエンスに対応)と走査速度の範囲で、図7に示すような除去領域に有意な残渣の無い良好なエッジ鮮明度を示す。
さらに、プロセス条件は上記とは異なる場合がある。特に、基板側からのレーザーパターニングの場合にプロセスウィンドウが非常に大きくなることが期待される。基板側からのレーザーパターニングの利点を、エリアレーザーのアブレーションシステムを使用する場合にも見込むことができる。
509 ブランケットのボンディングパッド層
510 ブランケット誘電体
511 ブランケットのボンディングパッド
520 レーザー
Claims (14)
- 基板上にパターン形成された複数の層からなるスタックを有し、
前記スタックは、カソード電流コレクタ層、カソード層、電解質層、アノード層、及びアノード電流コレクタ層を含み、前記スタックはレーザーでダイパターニングされ、さらに前記スタックは、カソード電流コレクタ領域とカソード電流コレクタ領域に隣接する電解質層の一部とを露出させるためにレーザーでパターン形成され、また、前記電解質層に段差を形成するために前記電解質層の前記一部の厚さの一部がレーザーで除去され、
さらに、パターン形成された複数の層の前記スタックの上に形成された封止層を有する、
薄膜電池。 - 前記基板は、ガラスを含む、請求項1に記載の薄膜電池。
- 前記カソード層は、LiCoO2を含む、請求項1に記載の薄膜電池。
- 前記電解質層は、LiPONを含む、請求項1に記載の薄膜電池。
- 前記アノード層は、リチウム金属を含む、請求項1に記載の薄膜電池。
- 前記封止層は、ポリマーを含む、請求項1に記載の薄膜電池。
- さらに、前記基板上の前記基板と前記スタックとの間にダイパターニング補助層を有し、パターン形成された前記スタックは前記ダイパターニング補助層の上に堆積され、前記基板はレーザー光に対して透過的であり、前記ダイパターニング補助層は、前記ダイパターニング補助層と前記基板との間の熱応力不整合を実現するための材料層を含む、請求項1に記載の薄膜電池。
- 前記ダイパターニング補助層は、アモルファスシリコン、微結晶シリコン及びLiCoO2からなる群から選択される材料を有する請求項7に記載の薄膜電池。
- さらに、前記封止層及び前記カソード電流コレクタ領域を覆うボンディングパッド層を有する、請求項1に記載の薄膜電池。
- 前記ボンディングパッド層は、アルミニウムを含む、請求項9に記載の薄膜電池。
- さらに、前記スタックを覆う誘電体層を有し、前記誘電体層は、前記ボンディングパッド層の上に堆積される、請求項9に記載の薄膜電池。
- 前記誘電体層は、窒化シリコンを含む、請求項11に記載の薄膜電池。
- さらに、前記スタックを覆うボンディングパッドを有し、前記ボンディングパッドは前記誘電体層の上に堆積され、前記誘電体層は前記ボンディングパッド層と前記ボンディングパッドとを電気的に分離し、前記ボンディングパッドは前記封止層と前記誘電体層における開口部を介して前記アノード電流コレクタ層と電気的に接続されている、請求項11に記載の薄膜電池。
- 前記ボンディングパッドはアルミニウムを含む、請求項13に記載の薄膜電池。
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US201161498484P | 2011-06-17 | 2011-06-17 | |
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EP2721663A2 (en) | 2014-04-23 |
EP2721663A4 (en) | 2014-10-15 |
JP6283433B2 (ja) | 2018-02-21 |
EP2721663B1 (en) | 2016-10-05 |
JP6100248B2 (ja) | 2017-03-22 |
US20140007418A1 (en) | 2014-01-09 |
WO2013106082A3 (en) | 2013-10-17 |
JP2014520369A (ja) | 2014-08-21 |
KR20140041758A (ko) | 2014-04-04 |
WO2013106082A2 (en) | 2013-07-18 |
EP3118912A1 (en) | 2017-01-18 |
CN106025393B (zh) | 2018-12-11 |
US20170214062A1 (en) | 2017-07-27 |
EP3118912B1 (en) | 2018-03-14 |
CN103636025A (zh) | 2014-03-12 |
CN103636025B (zh) | 2016-06-22 |
CN106025393A (zh) | 2016-10-12 |
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