JP2017103346A - Optical module - Google Patents

Optical module Download PDF

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JP2017103346A
JP2017103346A JP2015235440A JP2015235440A JP2017103346A JP 2017103346 A JP2017103346 A JP 2017103346A JP 2015235440 A JP2015235440 A JP 2015235440A JP 2015235440 A JP2015235440 A JP 2015235440A JP 2017103346 A JP2017103346 A JP 2017103346A
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mounting substrate
carrier
mounting
optical module
temperature sensor
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JP6555106B2 (en
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芳幸 加茂
Yoshiyuki Kamo
芳幸 加茂
安井　伸之
Nobuyuki Yasui
伸之 安井
庸輔 秋田
Yosuke Akita
庸輔 秋田
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To provide an optical module which can be hardly influenced by environmental temperature without adding another material and can secure a clearance at a time of mounting.SOLUTION: Semiconductor laser elements 7 to 10 are provided on a carrier 1. A mounting substrate 6 is provided on the carrier 1. A digging 16 is provided in the mounting substrate 6. A temperature sensor 17 is provided on the carrier 1 in the digging 16 of the mounting substrate 6.SELECTED DRAWING: Figure 1

Description

本発明は、光モジュールに関する。   The present invention relates to an optical module.

サーミスタなどの熱に敏感な温度センサを実装する際に、環境温度の影響を受け難くする必要がある。そこで、従来は、温度センサに接着剤などの有機物を塗布する（例えば、特許文献１（要約）参照）か、又はヒートシンクに設けられた掘り込み内にサーミスタを配置していた（例えば、特許文献２（図８）参照）。   When mounting a temperature sensor that is sensitive to heat, such as a thermistor, it is necessary to make it less susceptible to environmental temperatures. Therefore, conventionally, an organic substance such as an adhesive is applied to the temperature sensor (see, for example, Patent Document 1 (Abstract)), or a thermistor is disposed in a dug provided in a heat sink (for example, Patent Document 1). 2 (FIG. 8)).

特開２００６−３２４５２４号公報JP 2006-324524 A 特開２００７−５６８１号公報JP 2007-5681 A

接着剤などの有機物を別途塗布する従来技術では、プロセスが増える手間に加えて密閉内でのガス発生などを考慮する必要があった。また、ヒートシンクは加工費が高いという問題があった。   In the conventional technique in which an organic material such as an adhesive is separately applied, it is necessary to consider the generation of gas in the sealed space in addition to the labor of increasing the number of processes. In addition, the heat sink has a problem of high processing costs.

本発明は、上述のような課題を解決するためになされたもので、その目的は別材料を追加することなく環境温度の影響を受け難くでき、実装時のクリアランスを確保することができる光モジュールを得るものである。   The present invention has been made in order to solve the above-described problems, and an object of the present invention is to make it difficult to be affected by the environmental temperature without adding another material, and to ensure clearance during mounting. Is what you get.

本発明に係る光モジュールは、キャリアと、前記キャリア上に設けられた半導体レーザ素子と、前記キャリア上に設けられ、掘り込みを有する実装基板と、前記実装基板の前記掘り込み内において前記キャリア上に設けられた温度センサとを備えることを特徴とする。   An optical module according to the present invention includes a carrier, a semiconductor laser element provided on the carrier, a mounting substrate provided on the carrier and having a dig, and the carrier within the digging of the mounting substrate. And a temperature sensor provided in the apparatus.

本発明では、実装基板の掘り込み内に温度センサが設けられている。これにより、光モジュール外部から温度センサへの熱流入が実装基板により遮断される。従って、別材料を追加することなく環境温度の影響を受け難くできる。また、温度センサの上面の高さが低くなって部材の段差が少なくなるため、ピンセットによる他部材の実装又はキャピラリによるワイヤボンドなどの実装時のクリアランスを確保することができる。   In the present invention, the temperature sensor is provided in the digging of the mounting substrate. Thereby, the heat inflow from the outside of the optical module to the temperature sensor is blocked by the mounting substrate. Therefore, it is difficult to be influenced by the environmental temperature without adding another material. In addition, since the height of the upper surface of the temperature sensor is reduced and the step of the member is reduced, it is possible to secure a clearance when mounting other members using tweezers or wire bonding using a capillary.

本発明の実施の形態１に係る光モジュールを示す平面図である。It is a top view which shows the optical module which concerns on Embodiment 1 of this invention. 図１のＩ−ＩＩに沿った断面図である。It is sectional drawing in alignment with I-II of FIG. 本発明の実施の形態２に係る光モジュールを示す平面図である。It is a top view which shows the optical module which concerns on Embodiment 2 of this invention. 本発明の実施の形態２に係る光モジュールの変形例を示す平面図である。It is a top view which shows the modification of the optical module which concerns on Embodiment 2 of this invention.

本発明の実施の形態に係る光モジュールについて図面を参照して説明する。同じ又は対応する構成要素には同じ符号を付し、説明の繰り返しを省略する場合がある。   An optical module according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

実施の形態１．
図１は、本発明の実施の形態１に係る光モジュールを示す平面図である。図２は図１のＩ−ＩＩに沿った断面図である。キャリア１上に実装基板２〜６が設けられている。実装基板２〜５上にそれぞれ半導体レーザ素子７〜１０が設けられている。実装基板２上の配線１１が半導体レーザ素子７の下面電極に接続され、実装基板２上の配線１２が半導体レーザ素子７の上面電極にワイヤ１３により接続されている。他の実装基板２〜６も同様である。各実装基板２〜５の配線１２，１３が実装基板６のパッドにそれぞれワイヤ１４，１５により接続されている。実装基板６には回路が設けられているが、ここでは図示を省略する。 Embodiment 1 FIG.
FIG. 1 is a plan view showing an optical module according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view taken along the line I-II in FIG. Mounting substrates 2 to 6 are provided on the carrier 1. Semiconductor laser elements 7 to 10 are provided on the mounting substrates 2 to 5, respectively. The wiring 11 on the mounting substrate 2 is connected to the lower surface electrode of the semiconductor laser element 7, and the wiring 12 on the mounting substrate 2 is connected to the upper surface electrode of the semiconductor laser element 7 by the wire 13. The same applies to the other mounting boards 2 to 6. The wirings 12 and 13 of the mounting substrates 2 to 5 are connected to the pads of the mounting substrate 6 by wires 14 and 15, respectively. Although a circuit is provided on the mounting substrate 6, illustration is omitted here.

実装基板６の中央部には掘り込み１６が設けられている。この実装基板６の掘り込み１６内において、サーミスタなどの温度センサ１７がキャリア１上に設けられている。ここでは掘り込み１６は実装基板６を上下に貫通する貫通孔であるが、これに限らず実装基板６の厚さ方向の途中まで掘り込まれた窪みであってもよい。何れの場合でも、温度センサ１７の上面の高さが実装基板６の上面の高さよりも低くなることが好ましい。   A digging 16 is provided in the center of the mounting substrate 6. A temperature sensor 17 such as a thermistor is provided on the carrier 1 in the digging 16 of the mounting substrate 6. Here, the digging 16 is a through-hole penetrating the mounting substrate 6 up and down. However, the digging 16 is not limited to this, and may be a depression dug in the middle of the mounting substrate 6 in the thickness direction. In any case, the height of the upper surface of the temperature sensor 17 is preferably lower than the height of the upper surface of the mounting substrate 6.

キャリア１の裏面には、ペルチェ素子などの熱電変換素子１８が設けられている。熱電変換素子１８は、温度センサ１７により検出した温度に基づいて制御される。熱電変換素子１８は、供給される制御電流の電流量に応じてキャリア１から熱量を奪う又は与える。制御電流の方向に応じて熱電変換素子１８の下面が吸熱面又は放熱面の一方となり、上面が吸熱面又は放熱面の他方となる。   A thermoelectric conversion element 18 such as a Peltier element is provided on the back surface of the carrier 1. The thermoelectric conversion element 18 is controlled based on the temperature detected by the temperature sensor 17. The thermoelectric conversion element 18 takes away or gives heat from the carrier 1 in accordance with the amount of control current supplied. Depending on the direction of the control current, the lower surface of the thermoelectric conversion element 18 is one of the heat absorption surface and the heat dissipation surface, and the upper surface is the other of the heat absorption surface and the heat dissipation surface.

以上説明したように、本実施の形態では、実装基板６の掘り込み１６内に温度センサ１７が設けられている。これにより、光モジュール外部から温度センサ１７への熱流入が実装基板６により遮断される。従って、別材料を追加することなく環境温度の影響を受け難くできるため、半導体レーザ素子７〜１０の温度を精度よく測定できる。そして、シビアな温度管理が求められる製品に対してより厳密に温度管理をすることができる。特に、光モジュールの場合は、半導体レーザ素子７〜１０の発振波長の温度依存性を小さく抑えることができる。   As described above, in the present embodiment, the temperature sensor 17 is provided in the digging 16 of the mounting substrate 6. Thereby, the heat inflow from the outside of the optical module to the temperature sensor 17 is blocked by the mounting substrate 6. Therefore, the temperature of the semiconductor laser elements 7 to 10 can be accurately measured because it is difficult to be influenced by the environmental temperature without adding another material. In addition, temperature management can be more strictly performed for products that require severe temperature management. In particular, in the case of an optical module, the temperature dependence of the oscillation wavelength of the semiconductor laser elements 7 to 10 can be kept small.

また、温度センサ１７の上面の高さが低くなって部材の段差が少なくなるため、ピンセットによる他部材の実装又はキャピラリによるワイヤボンドなどの実装時のクリアランスを確保することができる。従って、狭接実装に有利である。   Further, since the height of the upper surface of the temperature sensor 17 is reduced and the step of the member is reduced, it is possible to secure a clearance when mounting other members using tweezers or wire bonding using a capillary. Therefore, it is advantageous for narrow mounting.

実施の形態２．
図３は、本発明の実施の形態２に係る光モジュールを示す平面図である。互いに分離した実装基板１９，２０がキャリア１上に設けられている。実装基板２，３の配線１１，１２が実装基板１９のパッドに接続され、実装基板４，５の配線１１，１２が実装基板２０のパッドに接続されている。実装基板１９，２０上にそれぞれ回路が設けられているが、ここでは図示を省略する。 Embodiment 2. FIG.
FIG. 3 is a plan view showing an optical module according to Embodiment 2 of the present invention. The mounting substrates 19 and 20 separated from each other are provided on the carrier 1. The wirings 11 and 12 of the mounting substrates 2 and 3 are connected to the pads of the mounting substrate 19, and the wirings 11 and 12 of the mounting substrates 4 and 5 are connected to the pads of the mounting substrate 20. Although circuits are provided on the mounting substrates 19 and 20, respectively, illustration is omitted here.

実装基板１９と実装基板２０の間において、温度センサ１７がキャリア１上に設けられている。温度センサ１７の上面の高さが実装基板１９，２０の上面の高さよりも低くなることが好ましい。その他の構成は実施の形態１と同様である。   A temperature sensor 17 is provided on the carrier 1 between the mounting substrate 19 and the mounting substrate 20. The height of the upper surface of the temperature sensor 17 is preferably lower than the height of the upper surfaces of the mounting substrates 19 and 20. Other configurations are the same as those of the first embodiment.

本実施の形態では光モジュール外部から温度センサ１７への熱流入が実装基板１９，２０により遮断される。また、本実施の形態でも温度センサ１７の上面の高さが低くなって部材の段差が少なくなる。このため、実施の形態１と同様の効果を得ることができる。また、実装基板を２つに分けることで配線引き回しの自由度が高くなる。さらに、ワイヤボンド位置も分割されるため、ワイヤ干渉を避けることができる。そして、ワイヤボンドを行う際に必要な実装面積を確保することができるため、ワイヤボンド時のキャピラリなどのクリアランスを確保することができる。   In the present embodiment, heat inflow from the outside of the optical module to the temperature sensor 17 is blocked by the mounting boards 19 and 20. Also in the present embodiment, the height of the upper surface of the temperature sensor 17 is lowered, and the level difference of the members is reduced. For this reason, the same effect as Embodiment 1 can be acquired. Further, dividing the mounting board into two increases the degree of freedom of wiring routing. Furthermore, since the wire bond position is also divided, wire interference can be avoided. And since the mounting area required when performing wire bonding can be ensured, the clearance of the capillary etc. at the time of wire bonding can be ensured.

図４は、本発明の実施の形態２に係る光モジュールの変形例を示す平面図である。図３では実装基板１９，２０が同一形状で左右及び前後対称であるが、これに限らず図４のように実装基板１９，２０が異なる形状でもよい。   FIG. 4 is a plan view showing a modification of the optical module according to Embodiment 2 of the present invention. In FIG. 3, the mounting boards 19 and 20 have the same shape and are bilaterally and longitudinally symmetric. However, the mounting boards 19 and 20 may have different shapes as shown in FIG.

１ キャリア、６，１９，２０ 実装基板、７〜１０ 半導体レーザ素子、１６ 掘り込み、１７ 温度センサ 1 carrier, 6, 19, 20 mounting substrate, 7-10 semiconductor laser element, 16 dug, 17 temperature sensor

Claims (2)

キャリアと、
前記キャリア上に設けられた半導体レーザ素子と、
前記キャリア上に設けられ、掘り込みを有する実装基板と、
前記実装基板の前記掘り込み内において前記キャリア上に設けられた温度センサとを備えることを特徴とする光モジュール。 Career,
A semiconductor laser element provided on the carrier;
A mounting substrate provided on the carrier and having a digging;
An optical module comprising: a temperature sensor provided on the carrier in the digging of the mounting substrate. キャリアと、
前記キャリア上に設けられた半導体レーザ素子と、
前記キャリア上に設けられ、互いに分離した第１及び第２の実装基板と、
前記第１の実装基板と前記第２の実装基板の間において前記キャリア上に設けられた温度センサとを備えることを特徴とする光モジュール。 Career,
A semiconductor laser element provided on the carrier;
First and second mounting boards provided on the carrier and separated from each other;
An optical module comprising: a temperature sensor provided on the carrier between the first mounting substrate and the second mounting substrate.
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