JP2017101279A5 - - Google Patents

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JP2017101279A5
JP2017101279A5 JP2015234800A JP2015234800A JP2017101279A5 JP 2017101279 A5 JP2017101279 A5 JP 2017101279A5 JP 2015234800 A JP2015234800 A JP 2015234800A JP 2015234800 A JP2015234800 A JP 2015234800A JP 2017101279 A5 JP2017101279 A5 JP 2017101279A5
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cathode
arc
heating
forming apparatus
type film
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JP6528050B2 (en
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但し、アークスポットは、磁場や陰極の表面状態により移動していくため、新しい移動先が既に高温になっていることが好ましく、高温領域は大きい方が好ましい。実質的な放電面全体が高温になっていることが最も好ましい。
次に、陰極の利用効率を従来よりも向上させるという観点から、陰極の周囲に磁界を発生させる磁界発生手段を設け、所定の向きに磁界を生じさせることが好ましい。具体的には、一般に、円柱状の陰極を用いたアーク式成膜装置の場合、図6に示すように、アーク放電中におけるアークスポット31は、陰極4の先端Tから根本(図示省略)に向かって陰極4の側面をスパイラル状に移動する。このとき、アークスポット31が通過した部分のカーボンのみが昇華してDLC膜の成膜に用いられ、通過しなかった部分のカーボンは昇華せずDLC膜の成膜に用いられない。このため、円柱状の陰極4を用いたアーク式成膜装置の場合、陰極4の利用効率は低く留まっていた。
これに対して、図5に示すように、アーク式成膜装置に磁界発生手段としてのコイル12を設けて、陰極4の軸方向と磁力線Mとのなす角度θが陰極4の先端T側が鋭角になるように磁界を生じさせた場合、アークスポットは角度θが鋭角になっている方向に向けて移動する性質があるため、アークスポットが陰極4の先端Tに留まり、陰極4の先端T側から順次カーボンが消費される。この結果、陰極4の利用効率を従来よりも向上させることができる。なお、磁界発生手段として図5では、コイル12を用いているが、これに限定されず、永久磁石を用いてもよい。
However, since the arc spot moves according to the magnetic field and the surface state of the cathode, it is preferable that the new destination is already at a high temperature, and it is preferable that the high temperature region is large. Most preferably, the substantial entire discharge surface is hot.
Next, from the viewpoint of improving the utilization efficiency of the cathode, it is preferable to provide a magnetic field generating means for generating a magnetic field around the cathode to generate the magnetic field in a predetermined direction. Specifically, in general, in the case of an arc type film forming apparatus using a columnar cathode, as shown in FIG. 6, the arc spot 31 during arc discharge extends from the tip T of the cathode 4 to the root (not shown). The side surface of the cathode 4 is moved spirally. At this time, only the portion of the carbon through which the arc spot 31 has passed is sublimated and used for forming the DLC film, and the portion of the carbon that has not passed through is not sublimated and is not used for forming the DLC film. For this reason, in the case of an arc-type film forming apparatus using the columnar cathode 4, the utilization efficiency of the cathode 4 remains low.
On the other hand, as shown in FIG. 5, a coil 12 as a magnetic field generating means is provided in the arc type film forming apparatus, and the angle θ formed between the axial direction of the cathode 4 and the magnetic force lines M is an acute angle on the tip T side of the cathode 4. When the magnetic field is generated so that the arc spot has a characteristic that the arc spot moves in a direction in which the angle θ is an acute angle, the arc spot stays at the tip T of the cathode 4 and the tip T side of the cathode 4 Carbon is consumed sequentially. As a result, the utilization efficiency of the cathode 4 can be improved as compared with the prior art. In FIG. 5, the coil 12 is used as the magnetic field generating means. However, the present invention is not limited to this, and a permanent magnet may be used.

請求項1、2に係る発明は、以上の知見に基づくものであり、請求項1に記載の発明は、
カーボンを主成分とする陰極材料を用いてアーク放電を行うことにより、前記陰極表面に形成されたアークスポットから前記カーボンを昇華させて、基材表面にカーボンを主成分とする炭素膜を成膜するアーク式成膜装置であって、
前記陰極を保持する陰極保持手段と、
前記基材を保持する基材保持手段と、
前記陰極保持手段および前記基材保持手段が収容された真空チャンバーとを備えており、
成膜中、少なくとも前記陰極の前記アークスポット近傍の領域の温度を500〜3000℃にする手段を備えており、
前記陰極が円柱状の陰極であり、
前記円柱状の陰極の軸方向と磁力線とのなす角度が、前記陰極の先端側が鋭角になるように磁界を生じさせる磁界発生手段を備えていることを特徴とするアーク式成膜装置である。
The inventions according to claims 1 and 2 are based on the above knowledge, and the invention according to claim 1
By performing arc discharge using a cathode material mainly composed of carbon, the carbon is sublimated from the arc spot formed on the cathode surface, and a carbon film mainly composed of carbon is formed on the substrate surface. Arc type film forming apparatus
Cathode holding means for holding the cathode;
Substrate holding means for holding the substrate;
A vacuum chamber containing the cathode holding means and the substrate holding means,
During film formation, it comprises means for setting the temperature of the region near the arc spot of the cathode to 500 to 3000 ° C. ,
The cathode is a cylindrical cathode;
An arc type film forming apparatus comprising a magnetic field generating means for generating a magnetic field so that an angle formed between an axial direction of the cylindrical cathode and a line of magnetic force becomes an acute angle on the tip side of the cathode .

即ち、請求項1に記載の発明は、
前記円柱状の陰極を前記基材に向けて送り出す送り出し機構を備えていることを特徴とする請求項1ないし請求項15のいずれか1項に記載のアーク式成膜装置である。
That is, the invention according to claim 16 is
Claims 1, characterized in that it comprises a feeding mechanism feeding the cylindrical cathode toward said substrate is arc deposition apparatus according to any one of claims 1 5.

また、請求項1に記載の発明は、
請求項1ないし請求項1のいずれか1項に記載のアーク式成膜装置を用いて、
少なくとも前記陰極の前記アークスポット近傍の領域の温度を500〜3000℃にしながら前記炭素膜を成膜することを特徴とする成膜方法である。
The invention according to claim 17 is
Using the arc-type film forming apparatus according to any one of claims 1 to 16 ,
In the film forming method, the carbon film is formed at a temperature of at least 500 to 3000 ° C. in the vicinity of the arc spot of the cathode.

請求項17に記載の発明においては、上記したように、成膜に際して粉砕粒子の発生が抑制されるため、平滑なDLC膜を安定して成膜することができる。また、陰極の利用効率を上昇させることもできる。
In the invention according to claim 17, as described above, since the generation of pulverized particles is suppressed during film formation, a smooth DLC film can be stably formed. Moreover, the utilization efficiency of a cathode can also be raised.

Claims (17)

カーボンを主成分とする陰極材料を用いてアーク放電を行うことにより、前記陰極表面に形成されたアークスポットから前記カーボンを昇華させて、基材表面にカーボンを主成分とする炭素膜を成膜するアーク式成膜装置であって、
前記陰極を保持する陰極保持手段と、
前記基材を保持する基材保持手段と、
前記陰極保持手段および前記基材保持手段が収容された真空チャンバーとを備えており、
成膜中、少なくとも前記陰極の前記アークスポット近傍の領域の温度を500〜3000℃にする手段を備えており、
前記陰極が円柱状の陰極であり、
前記円柱状の陰極の軸方向と磁力線とのなす角度が、前記陰極の先端側が鋭角になるように磁界を生じさせる磁界発生手段を備えていることを特徴とするアーク式成膜装置。
By performing arc discharge using a cathode material mainly composed of carbon, the carbon is sublimated from the arc spot formed on the cathode surface, and a carbon film mainly composed of carbon is formed on the substrate surface. Arc type film forming apparatus
Cathode holding means for holding the cathode;
Substrate holding means for holding the substrate;
A vacuum chamber containing the cathode holding means and the substrate holding means,
During film formation, it comprises means for setting the temperature of the region near the arc spot of the cathode to 500 to 3000 ° C. ,
The cathode is a cylindrical cathode;
An arc-type film forming apparatus comprising magnetic field generating means for generating a magnetic field so that an angle formed between an axial direction of the columnar cathode and a line of magnetic force is an acute angle on the tip side of the cathode .
成膜中の少なくとも前記陰極の前記アークスポット近傍の領域の温度を1000〜3000℃にする手段を備えていることを特徴とする請求項1に記載のアーク式成膜装置。   2. The arc type film forming apparatus according to claim 1, further comprising means for setting a temperature in a region in the vicinity of the arc spot of the cathode at least 1000 to 3000 [deg.] C. during film formation. 少なくとも前記陰極の前記アークスポット近傍の領域を加熱して前記陰極の温度を500〜3000℃にする加熱手段を備えていることを特徴とする請求項1または請求項2に記載のアーク式成膜装置。   The arc-type film formation according to claim 1 or 2, further comprising heating means for heating at least a region of the cathode in the vicinity of the arc spot to bring the temperature of the cathode to 500 to 3000 ° C. apparatus. 前記加熱手段が、前記陰極を外部から加熱するヒーターであることを特徴とする請求項3に記載のアーク式成膜装置。   The arc-type film forming apparatus according to claim 3, wherein the heating means is a heater for heating the cathode from the outside. 前記加熱手段が、前記陰極を誘導加熱する誘導加熱装置であることを特徴とする請求項3に記載のアーク式成膜装置。   The arc-type film forming apparatus according to claim 3, wherein the heating unit is an induction heating apparatus that induction-heats the cathode. 前記加熱手段が、前記陰極に電子ビームを照射して前記陰極を加熱する電子ビーム加熱装置であることを特徴とする請求項3に記載のアーク式成膜装置。   4. The arc type film forming apparatus according to claim 3, wherein the heating means is an electron beam heating apparatus that irradiates the cathode with an electron beam to heat the cathode. 前記加熱手段が、前記陰極にレーザー光を照射して前記陰極を加熱するレーザー加熱装置であることを特徴とする請求項3に記載のアーク式成膜装置。   The arc-type film forming apparatus according to claim 3, wherein the heating means is a laser heating apparatus that heats the cathode by irradiating the cathode with laser light. 前記陰極の自己加熱によって、少なくとも前記陰極の前記アークスポット近傍の領域の温度が500〜3000℃となるように構成されていることを特徴とする請求項1または請求項2に記載のアーク式成膜装置。   The arc type composition according to claim 1 or 2, wherein a temperature of at least a region in the vicinity of the arc spot of the cathode is 500 to 3000 ° C by self-heating of the cathode. Membrane device. 前記陰極の自己加熱が、前記アークスポットにおいて発生した熱により行われることを特徴とする請求項8に記載のアーク式成膜装置。   The arc-type film forming apparatus according to claim 8, wherein the self-heating of the cathode is performed by heat generated in the arc spot. 前記陰極の自己加熱が、アーク電流により発生した抵抗発熱により行われることを特徴とする請求項8に記載のアーク式成膜装置。   9. The arc type film forming apparatus according to claim 8, wherein the self-heating of the cathode is performed by resistance heating generated by an arc current. 前記陰極が、直径20mm以下の円柱状の陰極であることを特徴とする請求項8ないし請求項10のいずれか1項に記載のアーク式成膜装置。   The arc type film forming apparatus according to any one of claims 8 to 10, wherein the cathode is a columnar cathode having a diameter of 20 mm or less. 前記陰極が多孔質の陰極であることを特徴とする請求項8ないし請求項10のいずれか1項に記載のアーク式成膜装置。   The arc type film-forming apparatus according to any one of claims 8 to 10, wherein the cathode is a porous cathode. 前記陰極を冷却する冷却手段と、少なくとも前記陰極の前記アークスポット近傍の領域の温度が500〜3000℃となるように前記冷却手段を制御する冷却制御手段とを備えていることを特徴とする請求項8ないし請求項10のいずれか1項に記載のアーク式成膜装置。   A cooling means for cooling the cathode, and a cooling control means for controlling the cooling means so that a temperature of at least a region in the vicinity of the arc spot of the cathode is 500 to 3000 ° C. The arc type film-forming apparatus of any one of Claims 8 thru | or 10. 前記陰極を加熱する加熱手段による熱と、前記陰極の自己加熱によって発生する熱を併用することにより少なくとも前記陰極の前記アークスポット近傍の領域の温度が500〜3000℃となるように構成されていることを特徴とする請求項1または請求項2に記載のアーク式成膜装置。   By combining the heat generated by the heating means for heating the cathode and the heat generated by the self-heating of the cathode, the temperature of at least the area near the arc spot of the cathode is set to 500 to 3000 ° C. 3. An arc type film forming apparatus according to claim 1, wherein the arc type film forming apparatus is provided. 前記陰極を加熱する加熱手段が、ヒーター、誘導加熱、電子ビーム加熱、レーザー加熱のいずれかであり、
前記陰極の自己加熱が、前記アークスポットにおいて発生した熱および/または前記陰極の抵抗発熱により行なわれることを特徴とする請求項14に記載のアーク式成膜装置。
The heating means for heating the cathode is any one of a heater, induction heating, electron beam heating, laser heating,
The arc-type film forming apparatus according to claim 14, wherein the self-heating of the cathode is performed by heat generated at the arc spot and / or resistance heating of the cathode.
前記円柱状の陰極を前記基材に向けて送り出す送り出し機構を備えていることを特徴とする請求項1ないし請求項15のいずれか1項に記載のアーク式成膜装置。 Arc deposition apparatus according to any one of claims 1 to claim 1 5, characterized in that said cylindrical cathode comprises a feed mechanism feeds toward said substrate. 請求項1ないし請求項1のいずれか1項に記載のアーク式成膜装置を用いて、
少なくとも前記陰極の前記アークスポット近傍の領域の温度を500〜3000℃にしながら前記炭素膜を成膜することを特徴とする成膜方法。
Using the arc-type film forming apparatus according to any one of claims 1 to 16 ,
A film forming method comprising forming the carbon film while maintaining a temperature of at least 500 to 3000 ° C. in a region near the arc spot of the cathode.
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