JP2017087363A - Ultrasonic polishing device and ultrasonic polishing method - Google Patents

Ultrasonic polishing device and ultrasonic polishing method Download PDF

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JP2017087363A
JP2017087363A JP2015221717A JP2015221717A JP2017087363A JP 2017087363 A JP2017087363 A JP 2017087363A JP 2015221717 A JP2015221717 A JP 2015221717A JP 2015221717 A JP2015221717 A JP 2015221717A JP 2017087363 A JP2017087363 A JP 2017087363A
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amplitude
vibration
machining
ultrasonic
workpiece
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JP6549019B2 (en
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英寛 河鍋
Hidehiro Kawanabe
英寛 河鍋
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SONOTEC CO Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic polishing device that can reduce heat generation caused by friction between a polishing tool and the ultrasonic polishing device without damaging a work-piece at the moment when the polishing tool contacts the work-piece.SOLUTION: The ultrasonic polishing device comprises: a driving circuit 101 that supplies driving power to a vibration generation portion 20; a power detection portion 103 that detects power values of the driving power to be supplied from the driving circuit 101 to the vibration generation portion 20; and a vibration-amplitude detection portion 105 and a frequency detection portion 107 which detect vibration amplitudes and frequencies of the ultrasonic vibration respectively detected by a vibration detection portion 40 for feedback. At the beginning of activation, the vibration generation portion 20 is driven at a vibration amplitude during non-processing smaller than a vibration amplitude during processing. If the frequencies detected by the frequency detection portion 107 change at a change rate equal to a prescribed change rate or more, the vibration amplitude during non-processing is changed to the vibration amplitude during processing. If a change rate of the vibration amplitudes detected by the vibration amplitude detection portion 105 and a change rate of the power values detected by the power detection portion 103 are equal to a prescribed rate or less, the vibration amplitude during processing is changed to the vibration amplitude during non-processing.SELECTED DRAWING: Figure 1

Description

本発明は、研磨工具を超音波振動させることで、ワークを研磨加工する超音波研磨装置及び超音波研磨方法に関するものである。   The present invention relates to an ultrasonic polishing apparatus and an ultrasonic polishing method for polishing a workpiece by ultrasonically vibrating a polishing tool.

従来、振動発生部を振動させることでこの振動発生部に接続した研磨工具を超音波振動させ、この超音波振動する研磨工具をワークに当てることでワークを研磨加工する超音波研磨装置が使用されている。   Conventionally, an ultrasonic polishing apparatus is used that vibrates a polishing tool connected to the vibration generating unit by vibrating the vibration generating unit, and polishes the workpiece by applying the ultrasonic vibrating tool to the workpiece. ing.

特開2014−188613号公報JP 2014-188613 A

しかしながら、上記従来の超音波研磨装置には、以下のような課題があった。
(1)研磨工具がワークに触れる瞬間に傷が付く恐れがあること
例えば図5、図6に示すように、平板状の研磨工具50をワーク200に当てて研磨を行う場合は、予め研磨工具50を研磨時の振幅で超音波振動させておき、この振動する研磨工具50の先端辺50aをワーク200の表面に当接する。熟練者であれば、研磨工具50の先端辺50aをワーク200の表面に当接する際、図6に示すように、先端辺50a全体を均一にワーク200の表面に当接したり、またワーク200への押圧力を適宜加減したりすることで、適切な研磨を行うことができる。しかし、熟練者で無い場合は、例えば研磨工具50の先端辺50aをワーク100の表面に当接する際、図5に示すように、先端辺50aの内の一部(エッジ)のみをワーク200の表面に当接し、しかもワーク200への押圧力を加減できずに最初から研磨時の強い力で先端辺50aのエッジをワーク200表面に押し当ててしまう。このため、ワーク200のエッジが当接した表面に大きな運動エネルギーが印加され、ワーク200表面に傷が付いてしまうという問題があった。一度ワーク200表面に傷が付くと、工程を戻したり、再度制作し直したりしなければならなくなってしまう。また熟練者であっても神経を使う作業なので、長時間にわたる作業における負担軽減が求められていた。
However, the conventional ultrasonic polishing apparatus has the following problems.
(1) There is a risk of scratching at the moment when the polishing tool touches the workpiece. For example, as shown in FIGS. 5 and 6, when polishing is performed by applying a flat polishing tool 50 to the workpiece 200, the polishing tool is previously provided. 50 is ultrasonically vibrated with the amplitude at the time of polishing, and the tip side 50 a of the vibrating polishing tool 50 is brought into contact with the surface of the workpiece 200. If it is an expert, when the front end side 50a of the grinding | polishing tool 50 contact | abuts to the surface of the workpiece | work 200, as shown in FIG. Appropriate polishing can be performed by appropriately adjusting the pressing force of. However, if the person is not an expert, for example, when the tip side 50a of the polishing tool 50 is brought into contact with the surface of the workpiece 100, only a part (edge) of the tip side 50a is shown in FIG. The edge of the front end side 50a is pressed against the surface of the workpiece 200 with a strong force during polishing from the beginning without being able to adjust the pressing force to the workpiece 200. For this reason, there is a problem in that a large kinetic energy is applied to the surface of the workpiece 200 that contacts the edge, and the surface of the workpiece 200 is damaged. Once the surface of the workpiece 200 is scratched, it is necessary to return the process or re-create the work. In addition, even a skilled person is a task that uses nerves, so it has been required to reduce the burden of work over a long period of time.

(2)研磨工具とこれを保持する超音波研磨装置間の摩擦による発熱の恐れがあること
超音波研磨装置は、磨く対象により使用する研磨工具の形状を変更する必要がある。そのため、工具の変更によって振動周波数が変化する。そして振動周波数によっては、振動振幅を始動当初から継続して加工時振幅にしていると、発熱が大きくなる恐れがあった。また一度発熱が大きくなってしまうと、冷めるまで作業ができなくなり、作業効率の低下を招く恐れがあった。
(2) There is a risk of heat generation due to friction between the polishing tool and the ultrasonic polishing apparatus that holds the polishing tool. The ultrasonic polishing apparatus needs to change the shape of the polishing tool used depending on the object to be polished. Therefore, the vibration frequency is changed by changing the tool. Depending on the vibration frequency, if the vibration amplitude is continuously set to the amplitude at the time of machining from the start, there is a concern that heat generation may increase. Further, once the heat generation becomes large, the work cannot be performed until it is cooled, and there is a possibility that the work efficiency is lowered.

本発明は上述の点に鑑みてなされたものでありその目的は、研磨工具がワークに触れる瞬間にワークを傷付けることがなく、また研磨工具とこれを保持する超音波研磨装置間の摩擦による発熱を軽減することができる超音波研磨装置及び超音波研磨方法を提供することにある。   The present invention has been made in view of the above points, and its object is not to damage the workpiece at the moment when the polishing tool touches the workpiece, and to generate heat due to friction between the polishing tool and the ultrasonic polishing apparatus that holds the polishing tool. It is an object to provide an ultrasonic polishing apparatus and an ultrasonic polishing method capable of reducing the above.

本発明は、制御手段によって制御される振動発生部と、前記振動発生部で発生した超音波振動を伝達するホーン部と、前記ホーン部の先端に取り付けられ、超音波振動させることで被加工物を研磨加工する研磨工具と、を具備する超音波研磨装置において、前記制御手段は、前記振動発生部に駆動電力を供給する駆動回路と、前記駆動回路から供給される駆動電力の電力値を検知する電力検知部と、前記振動発生部による超音波振動の振幅及び周波数をそれぞれ検知する振幅検知部及び周波数検知部と、を有し、前記制御手段は、起動当初は、前記振動発生部を、加工時振幅に比べて小さい振幅の非加工時振幅で駆動し、前記周波数検知部によって検知した周波数が所定の変化率以上の変化率で変化した場合は前記振動発生部の振幅を前記非加工時振幅から加工時振幅に変更し、一方、前記振幅検知部によって検知した加工時振幅の振幅変化率と、前記電力検知部によって検知した電力値の変化率の内の少なくとも何れか一方の変化率が、所定の変化率以下となった場合は前記振動発生部の振幅を前記加工時振幅から前記非加工時振幅に変更する制御を行うことを特徴としている。
起動直後の非加工時振幅と、加工時振幅から変更した非加工時振幅は、必ずしも同一である必要はなく、両者の振幅は異なっていても良く、要は加工時振幅よりも小さい振幅であればよい。
上述のように、研磨工具がワークに触れた瞬間は、研磨工具のワークに接触すべき部分の内の一部分のみがワークに接触してこれを傷つけたり、また強い力でワークに接触してこれを磨き過ぎたりする恐れがあるが、本発明の場合、ワークに研磨工具が触れた瞬間は、研磨工具が振幅の小さい非加工時振幅で振動しているので、ワークに大きな研磨力は印加されない。このため、たとえ研磨工具のワークに接触すべき部分の内の一部分のみがワークに接触してもワークを傷つけることはなく、また強い力でワークに接触してもこれを磨き過ぎたりする恐れもない。そして研磨工具がワークに接触してその接触状態が安定するまでの所定時間の間に、研磨工具は加工時振幅に自動的に変更されるので、スムーズにワークの加工を開始することができる。言い換えれば、作業者の熟練度の要求レベルを引き下げることができる。
またワークから研磨工具を引き離した非加工時は、自動的にこれを検知して加工時振幅よりも振幅の小さい非加工時振幅に変更されるので、研磨工具とこれを保持する超音波研磨装置間の摩擦による発熱を抑制でき、また消費電力の低減化も図ることができる。即ち、全行程トータルでの発熱量を抑制することができ、連続稼働時間を延長することができる。またワークから研磨工具を引き離した際に非加工時振幅に変更するので、再度加工のためにワークに触れた時にも、上記と同様、ワークを傷付けたり磨き過ぎたりする恐れがなくなる。
ここで、研磨工具がワークに接触したことの検知に、非加工時振幅の周波数変化を用いたのは以下の理由による。即ち、本願発明者は、振幅の小さい非加工時振幅であれば、研磨工具がワークに触れた瞬間の周波数の変化を捉えることができることを実験により確認し、この周波数の変化を検出することとしたのである。即ち本願発明者は、振幅の小さい非加工時振幅(例えば極小振幅)の場合、その振幅の変化や電力の変化では、研磨工具がワークに触れた瞬間に顕著な変化が認められないことを実験により確認した。また本願発明者は、加工時振幅では、研磨工具がワークに触れた瞬間の周波数の顕著な変化が認められないことも実験により確認した。一方上述のように、振幅の小さい非加工時振幅のときは、研磨工具がワークに触れたことを周波数によって検知できるので、この周波数の変化を上記測定に用いることとしたのである。なお、超音波研磨装置に装着する研磨工具の重量や形状等によってその周波数は異なるため、周波数の絶対値ではなく、その変化率を上記検出に用いた。
一方、ワークから研磨工具を引き離したことの検知に、加工時振幅の振幅変化と電力変化を用いたのは以下の理由による。即ち、加工時振幅の場合、研磨工具がワークから離れる前後の周波数の変化は少ないので、周波数変化をその検出に用いることは困難であることを、実験により確認した。一方、加工時振幅の場合、研磨工具がワークから離れる前後の振幅の変化と電力の変化はこれを捉えることができる程度に大きいことを実験で確認したので、これらをその検出に用いることにしたのである。言い換えれば、振幅の変化率と電力の変化率の両者が所定値以上であれば、研磨工具がワークから離れていないと判断して加工時振幅を継続することとした。なおこの発明の場合、振幅の変化率と電力値の変化率の何れか一方の変化率が所定の変化率以下になった場合に研磨工具がワークから離れていると判定することとしたが、離れたことをより正確に判断するため、両変化率が何れも所定の変化率以下となったときに離れたと判断するように構成しても良い。
The present invention relates to a vibration generating part controlled by a control means, a horn part for transmitting ultrasonic vibration generated by the vibration generating part, and a work piece attached to the tip of the horn part and ultrasonically vibrated. An ultrasonic polishing apparatus comprising: a polishing tool that polishes a polishing tool; wherein the control means detects a drive circuit that supplies drive power to the vibration generator, and a power value of the drive power supplied from the drive circuit Power detection unit, and an amplitude detection unit and a frequency detection unit for detecting the amplitude and frequency of ultrasonic vibration by the vibration generation unit, respectively, the control means, at the start of the start, the vibration generation unit, Driven with a non-machining amplitude that is smaller than the machining amplitude, and when the frequency detected by the frequency detector changes at a rate of change greater than or equal to a predetermined rate of change, the amplitude of the vibration generator is not Change from the working amplitude to the machining amplitude, and on the other hand, the change in at least one of the amplitude change rate of the machining amplitude detected by the amplitude detector and the change rate of the power value detected by the power detector When the rate becomes a predetermined change rate or less, control is performed to change the amplitude of the vibration generating unit from the machining amplitude to the non-machining amplitude.
The non-machining amplitude immediately after start-up and the non-machining amplitude changed from the machining amplitude do not necessarily have to be the same, and the amplitudes of both may be different, as long as the amplitude is smaller than the machining amplitude. That's fine.
As described above, at the moment when the polishing tool touches the workpiece, only a part of the portion of the polishing tool that should contact the workpiece touches the workpiece and damages it, or the workpiece touches the workpiece with a strong force. However, in the case of the present invention, when the polishing tool touches the workpiece, the polishing tool vibrates with a small amplitude during non-machining, so that a large polishing force is not applied to the workpiece. . For this reason, even if only a part of the part of the polishing tool that should contact the workpiece touches the workpiece, the workpiece will not be damaged, and even if it touches the workpiece with a strong force, it may be excessively polished. Absent. Since the polishing tool is automatically changed to the processing amplitude during a predetermined time until the polishing tool comes into contact with the workpiece and the contact state is stabilized, the processing of the workpiece can be started smoothly. In other words, the required level of skill of the worker can be lowered.
Also, when the polishing tool is pulled away from the workpiece, it is automatically detected and changed to a non-processing amplitude that is smaller than the processing amplitude, so the polishing tool and the ultrasonic polishing device that holds it Heat generation due to friction between them can be suppressed, and power consumption can be reduced. That is, the amount of heat generated in the entire process can be suppressed, and the continuous operation time can be extended. In addition, since the amplitude is changed to the non-machining amplitude when the polishing tool is pulled away from the workpiece, there is no possibility that the workpiece is damaged or over-polished as described above when the workpiece is touched again for machining.
Here, the reason why the frequency change of the non-machining amplitude is used to detect that the polishing tool is in contact with the workpiece is as follows. That is, the inventor of the present application confirms by experiment that a change in frequency at the moment when the polishing tool touches the workpiece can be captured if the amplitude is small during non-machining, and detects this change in frequency. It was. That is, the inventor of the present application experimented that in the case of non-machining amplitude with a small amplitude (for example, a minimum amplitude), a change in the amplitude or a change in power does not show a significant change at the moment when the polishing tool touches the workpiece. Confirmed by The inventor of the present application also confirmed by experiment that no significant change in the frequency at the moment when the polishing tool touched the workpiece was observed in the processing amplitude. On the other hand, as described above, when the amplitude is small during non-machining, the frequency of detecting that the polishing tool has touched the workpiece can be detected, and the change in frequency is used for the measurement. Since the frequency varies depending on the weight and shape of the polishing tool attached to the ultrasonic polishing apparatus, the rate of change is used for the detection, not the absolute value of the frequency.
On the other hand, the reason why the change in amplitude and the change in power during processing are used to detect the removal of the polishing tool from the workpiece is as follows. That is, in the case of processing amplitude, since the change in frequency before and after the polishing tool leaves the workpiece is small, it was confirmed by experiment that it is difficult to use the frequency change for detection. On the other hand, in the case of machining amplitude, it was confirmed by experiments that the change in amplitude and the change in power before and after the polishing tool moved away from the workpiece were large enough to capture this, so we decided to use them for the detection. It is. In other words, if both the rate of change in amplitude and the rate of change in power are equal to or greater than a predetermined value, it is determined that the polishing tool is not separated from the workpiece and the amplitude during processing is continued. In the case of the present invention, when the change rate of either the amplitude change rate or the power value change rate is equal to or lower than the predetermined change rate, it is determined that the polishing tool is separated from the workpiece. In order to more accurately determine that the two have been separated, the two change rates may be determined to be separated when both of them are equal to or less than a predetermined change rate.

即ち、前記振幅の変化率と、前記電力値の変化率の両者が、それぞれ所定の変化率以下となった場合に前記振動発生部の振幅を前記加工時振幅から前記非加工時振幅に変更する制御を行うことが、より確実な判定を行う上で好ましい。   That is, when both the change rate of the amplitude and the change rate of the power value are equal to or less than a predetermined change rate, the amplitude of the vibration generating unit is changed from the machining amplitude to the non-machining amplitude. It is preferable to perform the control in order to make a more reliable determination.

また本発明は、振動発生部と、前記振動発生部で発生した超音波振動を伝達するホーン部と、前記ホーン部の先端に取り付けられ、超音波振動させることで被加工物を研磨加工する研磨工具と、を具備する超音波研磨装置を用いた超音波研磨方法において、起動当初に、前記振動発生部を、加工時振幅に比べて小さい振幅の非加工時振幅で駆動するステップと、前記振動発生部の周波数が、前記非加工時振幅時において所定の変化率以上の変化率で変化した場合に前記非加工時振幅から加工時振幅に変更するステップと、前記加工時振幅の振幅変化率と、前記振動発生部を駆動する電力値の変化率の内の少なくとも何れか一方の変化率が、所定の変化率以下となった場合に前記加工時振幅に比べて小さい振幅の非加工時振幅に変更するステップと、を有することを特徴としている。   Further, the present invention provides a vibration generating unit, a horn unit for transmitting ultrasonic vibration generated by the vibration generating unit, and a polishing unit that is attached to a tip of the horn unit and polishes a workpiece by ultrasonic vibration. In an ultrasonic polishing method using an ultrasonic polishing apparatus comprising a tool, at the beginning of startup, the step of driving the vibration generating unit with a non-machining amplitude smaller than a machining amplitude, and the vibration A step of changing the non-machining amplitude from the non-machining amplitude to the machining amplitude when the frequency of the generating portion changes at a rate of change greater than or equal to a predetermined rate of change at the non-machining amplitude; When the change rate of at least one of the power values for driving the vibration generating unit is equal to or less than a predetermined change rate, the non-machining amplitude is smaller than the machining amplitude. Step to change It is characterized by having, when.

本発明によれば、研磨工具がワークに触れる瞬間にワークに傷が付くことを防止でき、また研磨工具とこれを保持する超音波研磨装置間の摩擦による発熱を軽減することができる。   According to the present invention, it is possible to prevent the workpiece from being damaged at the moment when the polishing tool touches the workpiece, and to reduce heat generation due to friction between the polishing tool and the ultrasonic polishing apparatus that holds the polishing tool.

超音波研磨装置1を示す全体概略構成図である。1 is an overall schematic configuration diagram showing an ultrasonic polishing apparatus 1. FIG. 研磨工具50によってワーク200を研磨する状態の要部斜視図である。3 is a perspective view of a main part in a state in which a workpiece 200 is polished by a polishing tool 50. FIG. 超音波研磨装置本体10の制御方法の一例を示す制御フロー図である。FIG. 5 is a control flow diagram illustrating an example of a method for controlling the ultrasonic polishing apparatus main body 10. 超音波研磨装置本体10駆動時の振幅と電力と周波数それぞれの実測値と、制御部109における判定内容とを、経時的に示した図である。It is the figure which showed the measured value of each of amplitude, electric power, and frequency at the time of the ultrasonic polishing apparatus main body 10 drive, and the determination content in the control part 109 over time. 研磨工具50がワーク200に触れた瞬間の状態を示す要部斜視図である。FIG. 4 is a perspective view of a main part showing a state at the moment when a polishing tool 50 touches a workpiece 200. 研磨工具50がワーク200に安定して触れている状態を示す要部斜視図である。FIG. 4 is a perspective view of a main part showing a state in which a polishing tool 50 is stably in contact with a workpiece 200.

以下、本発明の実施形態を図面を参照して詳細に説明する。
図1は本発明の一実施形態にかかる超音波研磨装置1を示す全体概略構成図である。また図2は、超音波研磨装置本体10に取り付けた研磨工具50によって、ワーク(被加工物)200を研磨する状態を示す要部斜視図である。図1に示すように、超音波研磨装置1は、超音波研磨装置本体10と、これを駆動制御する制御手段100とを具備して構成されている。超音波研磨装置本体10は、制御手段100によってその駆動が制御される振動発生部20と、前記振動発生部20で発生した超音波振動を伝達するホーン部30と、前記ホーン部30の先端に取り付けられ超音波振動させることでワーク200を研磨加工する研磨工具50とを具備して構成されている。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an overall schematic configuration diagram showing an ultrasonic polishing apparatus 1 according to an embodiment of the present invention. FIG. 2 is a main part perspective view showing a state in which the workpiece (workpiece) 200 is polished by the polishing tool 50 attached to the ultrasonic polishing apparatus main body 10. As shown in FIG. 1, the ultrasonic polishing apparatus 1 includes an ultrasonic polishing apparatus main body 10 and a control unit 100 that drives and controls the main body 10. The ultrasonic polishing apparatus main body 10 includes a vibration generating unit 20 whose driving is controlled by the control unit 100, a horn unit 30 for transmitting ultrasonic vibration generated by the vibration generating unit 20, and a tip of the horn unit 30. A polishing tool 50 that polishes the workpiece 200 by being attached and ultrasonically vibrated is provided.

振動発生部20は、駆動用圧電素子(ピエゾ圧電素子層等)によって構成され、下記する制御手段100の駆動回路101から供給される駆動電力によって超音波振動を行う。振動発生部20の一端にはホーン部30が連結されており、さらにホーン部30の先端に設けた工具取付部31に研磨工具50が取り付けられている。図2に示すように、ホーン部30の工具取付部31の先端面にはスリット33が設けられており、このスリット33に研磨工具50の一端を挿入し、スリット33の上下の部分を取付ネジ35によって締め付けることで、研磨工具50を挟持・固定する。この例で用いる研磨工具50は長尺矩形状で平板状である。   The vibration generating unit 20 is configured by a driving piezoelectric element (piezoelectric element layer or the like), and performs ultrasonic vibration with driving power supplied from a driving circuit 101 of the control unit 100 described below. A horn portion 30 is connected to one end of the vibration generating portion 20, and a polishing tool 50 is attached to a tool attachment portion 31 provided at the tip of the horn portion 30. As shown in FIG. 2, a slit 33 is provided at the tip surface of the tool mounting portion 31 of the horn portion 30. One end of the polishing tool 50 is inserted into the slit 33, and the upper and lower portions of the slit 33 are attached to the mounting screws. By tightening with 35, the polishing tool 50 is clamped and fixed. The polishing tool 50 used in this example has a long rectangular shape and a flat plate shape.

振動発生部20の他端にはフィードバック用振動検出部40が連結されている。フィードバック用振動検出部40は圧電素子によって構成されており、振動発生部20、即ちこの超音波研磨装置本体10の超音波振動の状態を制御手段100に送信する。   A feedback vibration detecting unit 40 is connected to the other end of the vibration generating unit 20. The feedback vibration detection unit 40 is constituted by a piezoelectric element, and transmits the state of ultrasonic vibration of the vibration generation unit 20, that is, the ultrasonic polishing apparatus main body 10 to the control unit 100.

制御手段100は、前記振動発生部20を駆動する駆動電力を供給する駆動回路101と、前記駆動回路101内において前記駆動電力の電力値を検知する電力検知部103と、前記フィードバック用振動検出部40からの超音波振動の状態にかかる信号を受信して、その超音波振動の振幅を検知する振幅検知部105と、その超音波振動の周波数を検知する周波数検知部107と、前記電力検知部103と振幅検知部105と周波数検知部107からそれぞれ超音波研磨装置本体10の駆動電力値と超音波振動の振幅及び周波数を経時的に入力してこれらの入力信号に基づいて駆動回路101の駆動制御を行う制御部109とを具備して構成されている。   The control means 100 includes a drive circuit 101 that supplies drive power for driving the vibration generating unit 20, a power detection unit 103 that detects a power value of the drive power in the drive circuit 101, and the feedback vibration detection unit. An amplitude detection unit 105 that receives a signal related to the state of ultrasonic vibration from 40 and detects the amplitude of the ultrasonic vibration, a frequency detection unit 107 that detects the frequency of the ultrasonic vibration, and the power detection unit The driving power value of the ultrasonic polishing apparatus main body 10 and the amplitude and frequency of ultrasonic vibration are input over time from the 103, the amplitude detecting unit 105, and the frequency detecting unit 107, respectively, and the driving circuit 101 is driven based on these input signals. And a control unit 109 that performs control.

図3は、上記制御手段100において行われる超音波研磨装置本体10の制御方法の一例を示す制御フロー図である。同図に示すように、まず、超音波研磨装置本体10の図示しないオンオフスイッチがオンされると、制御部109は、駆動回路101に、超音波研磨装置本体10を、非加工時振幅で動作するように動作指令を出力する(ステップST1)。ここで非加工時振幅とは、実際にワークを加工するときの加工時振幅に比べて小さい振幅をいい、特に極小振幅とすることが望ましい。なお、周波数は加工時も非加工時も略同一とする。非加工時振幅は、具体的に、例えば0.5〜5.0μm程度とするが、本発明はこの数値に限定されない。この程度の非加工時振幅で超音波振動を行えば、研磨工具50とこれを保持する工具取付部31間の摩擦による発熱が抑制でき、また消費電力の低減化を図ることもできる。   FIG. 3 is a control flow chart showing an example of a method for controlling the ultrasonic polishing apparatus main body 10 performed in the control means 100. As shown in the figure, first, when an on / off switch (not shown) of the ultrasonic polishing apparatus main body 10 is turned on, the control unit 109 causes the drive circuit 101 to operate the ultrasonic polishing apparatus main body 10 with an amplitude during non-processing. An operation command is output so as to do this (step ST1). Here, the non-machining amplitude means an amplitude smaller than the machining amplitude when the workpiece is actually machined, and is particularly preferably a minimum amplitude. It should be noted that the frequency is substantially the same during machining and non-machining. Specifically, the non-machining amplitude is, for example, about 0.5 to 5.0 μm, but the present invention is not limited to this value. If ultrasonic vibration is performed with such non-working amplitude, heat generation due to friction between the polishing tool 50 and the tool mounting portion 31 holding the polishing tool 50 can be suppressed, and power consumption can be reduced.

次に、ワーク200を加工するために、研磨工具50をワーク200に接触すると、制御部109は、接触したことを、前記超音波振動の周波数の変化率を用いて検出し(ステップST2)、前記超音波振動の振幅が加工時振幅になるように、駆動回路101に、動作指令を出力する(ステップST3)。加工時振幅は、具体的に、例えば5.0〜50.0μm程度とするが、本発明はこの数値に限定されない。なお研磨工具50がワーク200に接触したと判定してから、予め定めた所定時間(例えば0.4秒から1.0秒)が経過した後に、振幅が加工時振幅になるように設定した方が、より好適である。この所定時間は、研磨工具50がワーク200に触れてから正規の接触状態になるまでの時間に近い時間が好ましい。   Next, when the polishing tool 50 comes into contact with the workpiece 200 in order to process the workpiece 200, the control unit 109 detects the contact using the rate of change of the frequency of the ultrasonic vibration (step ST2). An operation command is output to the drive circuit 101 so that the amplitude of the ultrasonic vibration becomes the machining amplitude (step ST3). Specifically, the processing amplitude is, for example, about 5.0 to 50.0 μm, but the present invention is not limited to this value. In addition, after determining that the polishing tool 50 has contacted the workpiece 200, a predetermined time (for example, 0.4 second to 1.0 second) has elapsed, and the amplitude is set to be the machining amplitude. Is more preferred. The predetermined time is preferably a time close to the time from when the polishing tool 50 touches the workpiece 200 until the polishing tool 50 is brought into a normal contact state.

上述のように、本実施形態の場合、ワーク200に研磨工具50が触れた瞬間は、研磨工具50の超音波振動の振幅が小さい非加工時振幅なので、ワーク200に大きな研磨力は印加されない。このため、図5に示すように、研磨工具50のワーク200に接触すべき部分の内の一部分のみがワークに接触してもワーク200を傷つけることを防止でき、また強い力でワーク200に接触してもこれを磨き過ぎる恐れも防止できる。   As described above, in the case of the present embodiment, the moment when the polishing tool 50 touches the workpiece 200 is a non-machining amplitude with a small amplitude of the ultrasonic vibration of the polishing tool 50, so a large polishing force is not applied to the workpiece 200. Therefore, as shown in FIG. 5, even if only a part of the portion of the polishing tool 50 that should contact the workpiece 200 contacts the workpiece, the workpiece 200 can be prevented from being damaged, and the workpiece 200 can be contacted with a strong force. Even so, it is possible to prevent the fear of polishing this too much.

次に、研磨工具50がワーク200に触れた瞬間から上記所定時間が経過すると、研磨工具50は、図6に示すように、ワーク200に対して正規の接触状態になるが、このときに合わせて(またはその後の短い時間で)、研磨工具50の超音波振動の振幅は加工時振幅になる。従って、ワーク200の研磨を行うことができる。即ち、研磨工具50がワーク200に接触してその接触状態が安定するまでの所定時間の間に、研磨工具50は非加工時振幅から加工時振幅に自動的に変更されるので、スムーズにワークの加工を開始することができる。言い換えれば、作業者の熟練度の要求レベルを引き下げることができる。   Next, when the predetermined time elapses from the moment when the polishing tool 50 touches the workpiece 200, the polishing tool 50 enters a normal contact state with the workpiece 200 as shown in FIG. (Or in a short time thereafter), the amplitude of the ultrasonic vibration of the polishing tool 50 becomes the amplitude during processing. Therefore, the workpiece 200 can be polished. That is, since the polishing tool 50 is automatically changed from the non-machining amplitude to the machining amplitude during a predetermined time until the polishing tool 50 comes into contact with the workpiece 200 and the contact state is stabilized, the workpiece is smoothly smoothed. Can be started. In other words, the required level of skill of the worker can be lowered.

ワーク200を研磨している間は、研磨による負荷の経時的な変化に伴ってその超音波振動の振幅と電力が常時変化する。言い換えれば、ワーク200の研磨を停止、即ちワーク200から研磨工具50を引き離すと、前記超音波振動の振幅と電力の変化が生じなくなる。そこで、制御部109は、前記振幅検知部105と電力検知部103からそれぞれ入力した超音波振動の振幅と電力値から、それぞれの変化率(振幅変化率と電力変化率)を算出し、これら両変化率が何れもそれぞれ所定の変化率以下になったことを検出すると、ワーク200から研磨工具50が離れたと判断し(ステップST4)、制御部109は、駆動回路101に、加工時振幅から非加工時振幅に切り替えるように動作指令を出力する(ステップST1)。なお、振幅の変化率と電力の変化率の何れか一方のみに変化があった場合は、研磨工具50がワーク200から離れていないと判断して加工時振幅を継続する。なお、前記起動直後の非加工時振幅と、加工時振幅から変更した非加工時振幅は、必ずしも同一である必要はなく、両者の振幅は異なっていても良い。   While the workpiece 200 is being polished, the amplitude and power of the ultrasonic vibration constantly change as the load due to polishing changes with time. In other words, when the polishing of the workpiece 200 is stopped, that is, when the polishing tool 50 is pulled away from the workpiece 200, the amplitude and power of the ultrasonic vibration are not changed. Therefore, the control unit 109 calculates respective change rates (amplitude change rate and power change rate) from the amplitude and power value of the ultrasonic vibration input from the amplitude detection unit 105 and the power detection unit 103, respectively. When it is detected that each of the change rates is equal to or less than the predetermined change rate, it is determined that the polishing tool 50 has moved away from the workpiece 200 (step ST4), and the control unit 109 causes the drive circuit 101 to determine whether or not the processing amplitude has been exceeded. An operation command is output so as to switch to the machining amplitude (step ST1). If only one of the change rate of amplitude and the change rate of power is changed, it is determined that the polishing tool 50 is not separated from the workpiece 200, and the amplitude during processing is continued. Note that the non-machining amplitude immediately after the start-up and the non-machining amplitude changed from the machining amplitude are not necessarily the same, and both amplitudes may be different.

このようにワーク200から研磨工具50を引き離した非加工時に、自動的にこれを検知して加工時振幅よりも振幅の小さい非加工時振幅に変更するので、研磨工具50とこれを保持する工具取付部31間の摩擦による発熱を抑制でき、また消費電力の低減化を図ることもできる。即ち、全行程トータルでの発熱量を抑制することができ、連続稼働時間を延長することができる。また、再度加工のために再びワーク200に触れた時にも、上記と同様、ワーク200を傷付けたり磨き過ぎたりする恐れがなくなる。即ち、加工工程では、加工中に接触面の確認が困難なため、何度も離間してワーク加工面の確認を行いながら加工を進める。このため接触・離間を繰り返すが、各再接触への備えができる。   In this way, when the polishing tool 50 is separated from the workpiece 200 and is not processed, this is automatically detected and changed to the non-processing amplitude smaller than the processing amplitude, so the polishing tool 50 and the tool that holds the tool are held. Heat generation due to friction between the mounting portions 31 can be suppressed, and power consumption can be reduced. That is, the amount of heat generated in the entire process can be suppressed, and the continuous operation time can be extended. In addition, when the workpiece 200 is touched again for processing again, there is no risk of the workpiece 200 being damaged or excessively polished as described above. That is, in the machining process, since it is difficult to check the contact surface during the machining, the machining is advanced while confirming the workpiece machining surface with many separations. For this reason, contact / separation is repeated, but preparation for each re-contact can be made.

ところで、上記ステップST2において、研磨工具50がワーク200に接触したことの検知に、非加工時振幅の周波数変化を用いたのは以下の理由による。即ち、本願発明者は、振幅の小さい非加工時振幅であれば、研磨工具50がワーク200に触れた瞬間の周波数の変化を捉えることができることを見い出し、この周波数の変化を検出することとした。即ち本願発明者は、振幅の小さい非加工時振幅の場合、その振幅の変化や電力の変化では、研磨工具50がワーク200に触れた瞬間に顕著な変化が認められないことを実験により確認した。また本願発明者は、加工時振幅では、研磨工具50がワーク200に触れた瞬間の周波数の顕著な変化が認められないことも実験により確認した。一方上述のように、振幅の小さい非加工時振幅の時は、研磨工具50がワーク200に触れたことを周波数によって検出できるので、この周波数の変化を上記測定に用いることとしたのである。なお、超音波研磨装置本体10に装着する研磨工具50の重量や形状等によってその周波数は異なるため、周波数の絶対値ではなく、その変化率を上記検出に用いることとした。   By the way, in step ST2, the frequency change of the non-machining amplitude is used for detecting that the polishing tool 50 is in contact with the workpiece 200 for the following reason. That is, the inventor of the present application finds that the change in frequency at the moment when the polishing tool 50 touches the workpiece 200 can be detected if the amplitude is small during non-machining and detects the change in frequency. . That is, the inventor of the present application confirmed by experiments that in the case of non-machining amplitude with a small amplitude, no significant change is recognized at the moment when the polishing tool 50 touches the workpiece 200 with the change in amplitude or the change in power. . In addition, the inventor of the present application also confirmed by experiments that no significant change in the frequency at the moment when the polishing tool 50 touches the workpiece 200 was observed in the processing amplitude. On the other hand, as described above, when the amplitude is small during non-machining, the frequency of detecting that the polishing tool 50 has touched the workpiece 200 can be detected, and the change in frequency is used for the measurement. Since the frequency differs depending on the weight, shape, etc. of the polishing tool 50 attached to the ultrasonic polishing apparatus main body 10, the change rate, not the absolute value of the frequency, is used for the detection.

一方、上記ステップST4において、ワーク200から研磨工具50を引き離したことの検知に、振幅変化と電力変化を用いたのは以下の理由による。即ち、加工時振幅の場合、研磨工具50がワーク200から離れる前後の周波数の変化は少ないので、周波数変化をその検出に用いることは困難であることを、実験により確認した。一方、加工時振幅の場合、研磨工具50がワーク200から離れる前後の振幅の変化と電力の変化はこれを捉えることができる程度に大きいことを実験で確認したので、これらをその検出に用いることとした。   On the other hand, the reason why the change in amplitude and the change in power are used to detect that the polishing tool 50 has been pulled away from the workpiece 200 in step ST4 is as follows. That is, in the case of the processing amplitude, since the change in the frequency before and after the polishing tool 50 is separated from the workpiece 200 is small, it was confirmed by experiment that it is difficult to use the frequency change for the detection. On the other hand, in the case of processing amplitude, since it has been confirmed by experiments that the change in amplitude and the change in power before and after the polishing tool 50 moves away from the workpiece 200 are large enough to capture this, use these for detection. It was.

図4は、前記超音波研磨装置本体10の図示しないオンオフスイッチがオンされてからワーク200の研磨を行い、その後ワーク200から研磨工具50を離間するまでの、振幅と電力と周波数それぞれの測定値と、制御部109における判定内容とを、経時的(十分の一秒間隔)に示した図である。同図において、振幅の測定値は、測定した振幅の電圧換算されたものをA/D変換してデジタルデータとしたビット値で示されている。即ちこの値自体は振幅そのものを示してはいないが、振幅の変化率を判定することはできる。また振幅の差分は、前回測定した(即ち、十分の一秒前に測定した)測定値と今回測定した測定値との間の差を演算して示している。振幅が変動したか否かの判定は、前記差分の値が、±3以上の場合を変動あり(即ち所定の変化率以上に変化した)「○」と判断している。電力の測定値は、測定した電力値を電圧換算されたものをA/D変換してデジタルデータとしたビット値で示されている。即ちこの値自体は電力値そのものを示してはいないが、電力値の変化率を判定することはできる。また電力の差分は、前回測定した(即ち、十分の一秒前に測定した)測定値と今回測定した測定値との間の差を演算して示している。電力が変動したか否かの判定は、前記差分の値が、±4以上の場合を変動あり(即ち所定の変化率以上に変化した)「○」と判断している。周波数の測定値は、周波数そのものであり、単位は「Hz」である。また周波数の差分は、4回前に測定した(即ち、十分の四秒前に測定した)測定値と今回測定した測定値との間の差を演算して示している。周波数が変動したか否かの判定は、前記差分の値が、±6以上の場合を変動あり(即ち所定の変化率以上に変化した)「○」と判断している。周波数において、4回前に測定した測定値と比較し、また差分を±6以上としたのは、変化率自体が小さいので、測定値のバラつきによる判定ミスを防止するためである。なお図4では、上記研磨工具50がワーク200に接触したと判定してからの所定時間の記載を便宜上省略して示している(実際は、経過時間72.3秒と72.4秒の間に所定時間が入る)。   FIG. 4 shows measured values of amplitude, power, and frequency from when the on / off switch (not shown) of the ultrasonic polishing apparatus body 10 is turned on until the workpiece 200 is polished and then the polishing tool 50 is separated from the workpiece 200. And determination contents in the control unit 109 are shown over time (at intervals of one second). In the figure, the measured value of the amplitude is shown as a bit value converted into a digital data by A / D converting the voltage converted from the measured amplitude. That is, this value itself does not indicate the amplitude itself, but the rate of change of the amplitude can be determined. The difference in amplitude is calculated by calculating the difference between the measured value measured last time (that is, measured one tenth of a second before) and the measured value measured this time. In determining whether or not the amplitude has changed, it is determined that the difference value is ± 3 or more, that is, there is a change (that is, it has changed to a predetermined change rate or more) “◯”. The measured value of power is indicated by a bit value obtained by converting the measured power value into a voltage and converting it into digital data. That is, this value itself does not indicate the power value itself, but the rate of change of the power value can be determined. The power difference is calculated by calculating the difference between the measured value measured last time (that is, measured one tenth of a second before) and the measured value measured this time. In determining whether or not the power has fluctuated, a case where the difference value is ± 4 or more is judged as “◯” with fluctuation (that is, changed to a predetermined change rate or more). The measured value of the frequency is the frequency itself, and the unit is “Hz”. The frequency difference is calculated by calculating the difference between the measured value measured four times before (that is, measured four seconds before) and the measured value measured this time. In determining whether or not the frequency has fluctuated, a case where the difference value is ± 6 or more is judged as “◯” with fluctuation (that is, changed to a predetermined change rate or more). The reason why the frequency is compared with the measurement value measured four times before and the difference is set to ± 6 or more is to prevent a determination error due to variation in the measurement value because the change rate itself is small. In FIG. 4, the description of the predetermined time after determining that the polishing tool 50 has contacted the workpiece 200 is omitted for the sake of convenience (actually, the elapsed time is between 72.3 seconds and 72.4 seconds). A predetermined time is entered).

図4において、経過時間70.1秒のところでオンオフスイッチをオンすると、上述のように、超音波研磨装置本体10は非加工時振幅で超音波振動を開始する。このときの振幅及び駆動電力は小さいので正確に測定できず、振幅の測定値は「0」、電力も「0」となる。一方周波数は、「23020(Hz)」程度となる。この表の場合、経過時間「72.0」において、研磨工具50がワーク200に接触するが、非加工時振幅の場合、その接触前後の振幅と電力には顕著な変化が見られないことが分かる。つまり上述のように、非加工時振幅の場合、その振幅と電力では前記接触は検知できない。一方、非加工時振幅の場合、周波数には、測定可能な変化が生じる。そこでこの周波数の変化を測定することで、研磨工具50がワーク200に接触したことを測定する。この例では、実際に接触してから十分の三秒後に接触と判定し、上記所定時間経過後に制御部109は振幅を非加工時振幅から加工時振幅に変更する指令を出力する。これによって、接触した直後ではなく、所定時間をおいてから加工時振幅に移行するので、その間にワーク200に対して研磨工具50を安定した接触状態に移行でき、スムーズにワーク200の加工を開始することができる。   In FIG. 4, when the on / off switch is turned on at an elapsed time of 70.1 seconds, as described above, the ultrasonic polishing apparatus main body 10 starts ultrasonic vibration with a non-machining amplitude. At this time, the amplitude and the driving power are small and cannot be measured accurately. The measured value of the amplitude is “0” and the power is “0”. On the other hand, the frequency is about “23020 (Hz)”. In the case of this table, the polishing tool 50 comes into contact with the workpiece 200 at the elapsed time “72.0”. However, in the case of non-machining amplitude, there is a case where no significant change is observed in the amplitude and power before and after the contact. I understand. That is, as described above, in the case of non-machining amplitude, the contact cannot be detected by the amplitude and power. On the other hand, in the case of non-machining amplitude, there is a measurable change in frequency. Therefore, by measuring this change in frequency, it is measured that the polishing tool 50 has contacted the workpiece 200. In this example, it is determined that the contact has occurred three seconds after the actual contact, and after the predetermined time has elapsed, the control unit 109 outputs a command to change the amplitude from the non-machining amplitude to the machining amplitude. As a result, the amplitude shifts to machining amplitude after a predetermined time, not immediately after contact, so that the polishing tool 50 can be shifted to a stable contact state with respect to the workpiece 200 during that time, and the machining of the workpiece 200 starts smoothly. can do.

振幅が加工時振幅になり、ワーク200の加工が開始されると、その直後から振幅と電力の絶対値が大きくなり、またその後のワーク加工中は、振幅と電力の値に常時変化が生じる。そしてこの表の場合、経過時間「77.2」において、研磨工具50がワーク200から離間するが、加工時振幅の場合、その離間前後の周波数に顕著な変化が見られないことが分かる。つまり上述のように、加工時振幅の場合、その周波数では前記離間は検知できない。一方、加工時振幅の場合、研磨工具50が離間した際の振幅と電力には、測定可能な変化が生じる(明らかに変化がなくなる)。そこでこの振幅と電力の両者の変化を測定することで、制御部109は研磨工具50がワーク200から離れたと判定し、同時に振幅を非加工時振幅に変更する指令を出力する。振幅と電力の両者を測定することとしたのは、何れか一方のみを測定すると、判定ミスを生じる恐れがあるからである。さらにこの例では、判定ミスを防止するため、振幅と電力の両者が所定の変化率以下となった状態が十分の五秒間継続したとき(経過時間「77.7」)に離間と判定している。但し、本発明においては、振幅と電力の何れか一方のみの測定値を用いて離間を判定しても良い。   When the amplitude becomes the amplitude during machining and machining of the workpiece 200 is started, the absolute values of the amplitude and power increase immediately after that, and the amplitude and power values constantly change during the subsequent machining of the workpiece. In the case of this table, the polishing tool 50 is separated from the workpiece 200 at the elapsed time “77.2”. However, in the case of machining amplitude, it can be seen that there is no significant change in the frequency before and after the separation. That is, as described above, in the case of machining amplitude, the separation cannot be detected at that frequency. On the other hand, in the case of processing amplitude, measurable changes occur in the amplitude and power when the polishing tool 50 is separated (obviously, there is no change). Therefore, by measuring changes in both the amplitude and power, the control unit 109 determines that the polishing tool 50 has moved away from the workpiece 200, and simultaneously outputs a command to change the amplitude to the non-machining amplitude. The reason for measuring both the amplitude and the power is that if only one of them is measured, a determination error may occur. Furthermore, in this example, in order to prevent a determination error, when the state where both the amplitude and the power are less than the predetermined change rate continues for a sufficient five seconds (elapsed time “77.7”), it is determined that they are separated. Yes. However, in the present invention, the separation may be determined using a measured value of only one of the amplitude and power.

上述のように、ワーク200の研磨を終了または中断した際は、その超音波振動の振幅を加工時よりも小さい非加工時振幅に変更するので、研磨工具50とこれを保持する工具取付部31間の摩擦による発熱を抑制でき、また消費電力の低減化を図ることもできる。再度研磨工具50をワーク200に接触させれば、ステップST1からステップST2に移行して、再び加工時振幅に変更される。   As described above, when the polishing of the workpiece 200 is finished or interrupted, the amplitude of the ultrasonic vibration is changed to a non-machining amplitude smaller than that during machining, so that the polishing tool 50 and the tool mounting portion 31 that holds the polishing tool 50 are retained. Heat generation due to friction between them can be suppressed, and power consumption can be reduced. When the polishing tool 50 is brought into contact with the workpiece 200 again, the process proceeds from step ST1 to step ST2, and the amplitude is changed to the machining amplitude again.

以上本発明の実施形態を説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲、及び明細書と図面に記載された技術的思想の範囲内において種々の変形が可能である。なお直接明細書及び図面に記載がない何れの形状や構造や材質であっても、本願発明の作用・効果を奏する以上、本願発明の技術的思想の範囲内である。例えば上記例では、フィードバック用振動検出部を用いて超音波振動の振幅と周波数を検知したが、これを用いず、駆動時のインピーダンスを測定しながら自動追尾するシステム(例えばブリッジ回路)等の他の検出手段(方法)を用いて超音波振動の振幅と周波数を検知しても良い。また、上記記載及び各図で示した実施形態は、その目的及び構成等に矛盾がない限り、互いの記載内容を組み合わせることが可能である。また、上記記載及び各図の記載内容は、その一部であっても、それぞれ独立した実施形態になり得るものであり、本発明の実施形態は上記記載及び各図を組み合わせた一つの実施形態に限定されるものではない。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. Note that any shape, structure, or material not directly described in the specification and drawings is within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above example, the amplitude and frequency of the ultrasonic vibration are detected using the feedback vibration detection unit. However, without using this, other than a system (for example, a bridge circuit) that automatically tracks while measuring the impedance during driving, etc. The amplitude and frequency of the ultrasonic vibration may be detected using the detection means (method). Moreover, as long as there is no contradiction in the objective, a structure, etc., the embodiment shown by the said description and each figure can combine the description content of each other. In addition, the above description and the description of each drawing can be an independent embodiment even if it is a part of it, and the embodiment of the present invention is an embodiment in which the above description and each drawing are combined. It is not limited to.

1 超音波研磨装置
10 超音波研磨装置本体
20 振動発生部
30 ホーン部
31 工具取付部
33 スリット
35 取付ネジ
40 フィードバック用振動検出部
50 研磨工具
100 制御手段
101 駆動回路
103 電力検知部
105 振幅検知部
107 周波数検知部
109 制御部
200 ワーク(被加工物)
DESCRIPTION OF SYMBOLS 1 Ultrasonic polishing apparatus 10 Ultrasonic polishing apparatus main body 20 Vibration generation part 30 Horn part 31 Tool attachment part 33 Slit 35 Attachment screw 40 Feedback vibration detection part 50 Polishing tool 100 Control means 101 Drive circuit 103 Power detection part 105 Amplitude detection part 107 Frequency detection unit 109 Control unit 200 Workpiece (workpiece)

Claims (3)

制御手段によって制御される振動発生部と、
前記振動発生部で発生した超音波振動を伝達するホーン部と、
前記ホーン部の先端に取り付けられ、超音波振動させることで被加工物を研磨加工する研磨工具と、を具備する超音波研磨装置において、
前記制御手段は、前記振動発生部に駆動電力を供給する駆動回路と、
前記駆動回路から供給される駆動電力の電力値を検知する電力検知部と、
前記振動発生部による超音波振動の振幅及び周波数をそれぞれ検知する振幅検知部及び周波数検知部と、を有し、
前記制御手段は、
起動当初は、前記振動発生部を、加工時振幅に比べて小さい振幅の非加工時振幅で駆動し、
前記周波数検知部によって検知した周波数が所定の変化率以上の変化率で変化した場合は前記振動発生部の振幅を前記非加工時振幅から加工時振幅に変更し、
一方、前記振幅検知部によって検知した加工時振幅の振幅変化率と、前記電力検知部によって検知した電力値の変化率の内の少なくとも何れか一方の変化率が、所定の変化率以下となった場合は前記振動発生部の振幅を前記加工時振幅から前記非加工時振幅に変更する制御を行うことを特徴とする超音波研磨装置。
A vibration generator controlled by the control means;
A horn for transmitting ultrasonic vibration generated by the vibration generator;
In an ultrasonic polishing apparatus provided with a polishing tool attached to the tip of the horn portion and polishing the workpiece by ultrasonic vibration,
The control means includes a drive circuit that supplies drive power to the vibration generating unit;
A power detection unit that detects a power value of drive power supplied from the drive circuit;
An amplitude detector and a frequency detector for detecting the amplitude and frequency of the ultrasonic vibration by the vibration generator, respectively,
The control means includes
At the start, the vibration generator is driven with a non-machining amplitude smaller than the machining amplitude.
When the frequency detected by the frequency detector changes at a change rate equal to or higher than a predetermined change rate, the amplitude of the vibration generating unit is changed from the non-machining amplitude to the machining amplitude,
On the other hand, the change rate of at least one of the amplitude change rate of the processing amplitude detected by the amplitude detection unit and the change rate of the power value detected by the power detection unit is equal to or less than a predetermined change rate. In this case, the ultrasonic polishing apparatus controls to change the amplitude of the vibration generating unit from the machining amplitude to the non-machining amplitude.
請求項1に記載の超音波研磨装置であって、
前記振幅の変化率と、前記電力値の変化率の両者が、それぞれ所定の変化率以下となった場合に前記振動発生部の振幅を前記加工時振幅から前記非加工時振幅に変更する制御を行うことを特徴とする超音波研磨装置。
The ultrasonic polishing apparatus according to claim 1,
Control that changes the amplitude of the vibration generating unit from the machining amplitude to the non-machining amplitude when both the amplitude change rate and the power value change rate are equal to or less than a predetermined change rate, respectively. An ultrasonic polishing apparatus characterized by performing.
振動発生部と、
前記振動発生部で発生した超音波振動を伝達するホーン部と、
前記ホーン部の先端に取り付けられ、超音波振動させることで被加工物を研磨加工する研磨工具と、を具備する超音波研磨装置を用いた超音波研磨方法において、
起動当初に、前記振動発生部を、加工時振幅に比べて小さい振幅の非加工時振幅で駆動するステップと、
前記振動発生部の周波数が、前記非加工時振幅時において所定の変化率以上の変化率で変化した場合に前記非加工時振幅から加工時振幅に変更するステップと、
前記加工時振幅の振幅変化率と、前記振動発生部を駆動する電力値の変化率の内の少なくとも何れか一方の変化率が、所定の変化率以下となった場合に前記加工時振幅に比べて小さい振幅の非加工時振幅に変更するステップと、を有することを特徴とする超音波研磨方法。
A vibration generating unit;
A horn for transmitting ultrasonic vibration generated by the vibration generator;
In an ultrasonic polishing method using an ultrasonic polishing apparatus, comprising a polishing tool attached to the tip of the horn part and polishing the workpiece by ultrasonic vibration,
At the beginning of driving, the step of driving the vibration generating unit with a non-machining amplitude smaller than the machining amplitude;
When the frequency of the vibration generating unit is changed at a change rate equal to or higher than a predetermined change rate at the non-machining amplitude, the non-machining amplitude is changed to the machining amplitude;
Compared to the machining amplitude when the rate of change in amplitude of the machining amplitude and the rate of change of at least one of the power values for driving the vibration generator are less than a predetermined rate of change. And a step of changing to a non-machining amplitude with a small amplitude.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021246126A1 (en) * 2020-06-01 2021-12-09 株式会社ソノテック Ultrasonic processing device
CN113909577A (en) * 2021-10-12 2022-01-11 科益展智能装备有限公司 Ultrasonic machining apparatus and control method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02152756A (en) * 1988-12-02 1990-06-12 Brother Ind Ltd Detecting device for tool contact of ultrasonic machine
JPH02311252A (en) * 1989-05-25 1990-12-26 Sonotetsuku:Kk Ultrasonic machining device
JPH067745A (en) * 1992-04-21 1994-01-18 Emerson Electric Co Processing method by ultrasonic energy and ultrasonic processing device
JPH0691496A (en) * 1992-09-07 1994-04-05 Nippon Electric Ind Co Ltd Operating device of ultrasonic polishing device
JPH1128421A (en) * 1997-07-09 1999-02-02 Taga Electric Co Ltd Control method of ultrasonic generating device
JP2008068364A (en) * 2006-09-14 2008-03-27 Ricoh Co Ltd Vibration cutting apparatus and vibration cutting method
JP2010207971A (en) * 2009-03-11 2010-09-24 Masahiko Jin Contact detection method, spindle device system, spindle device, and machine tool system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02152756A (en) * 1988-12-02 1990-06-12 Brother Ind Ltd Detecting device for tool contact of ultrasonic machine
JPH02311252A (en) * 1989-05-25 1990-12-26 Sonotetsuku:Kk Ultrasonic machining device
JPH067745A (en) * 1992-04-21 1994-01-18 Emerson Electric Co Processing method by ultrasonic energy and ultrasonic processing device
JPH0691496A (en) * 1992-09-07 1994-04-05 Nippon Electric Ind Co Ltd Operating device of ultrasonic polishing device
JPH1128421A (en) * 1997-07-09 1999-02-02 Taga Electric Co Ltd Control method of ultrasonic generating device
JP2008068364A (en) * 2006-09-14 2008-03-27 Ricoh Co Ltd Vibration cutting apparatus and vibration cutting method
JP2010207971A (en) * 2009-03-11 2010-09-24 Masahiko Jin Contact detection method, spindle device system, spindle device, and machine tool system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021246126A1 (en) * 2020-06-01 2021-12-09 株式会社ソノテック Ultrasonic processing device
CN113909577A (en) * 2021-10-12 2022-01-11 科益展智能装备有限公司 Ultrasonic machining apparatus and control method thereof

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