JP2017067525A - Socket for electronic component and method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To electrically connect an electronic component and a circuit board without blocking a principal surface side of the electronic component.SOLUTION: A socket according to one embodiment holds an electronic component in a state of electrically connectable to a circuit board. The socket comprises a frame which is provided at one end thereof and to which an electronic component is inserted, and at least one holding part which is provided on an inner wall of the frame and movable in a direction crossing the inner wall. The at least one holding part abuts on at least one side face of the electronic component in the frame by moving in the direction crossing the inner wall, so that the electronic component can be held in the frame without covering the principal surface of the electronic component.SELECTED DRAWING: Figure 3

Description

  One aspect of the present invention relates to a socket for an electronic component and a method for attaching the electronic component.

  Conventionally, a socket for electrically connecting an electronic component to a circuit board is known. The socket includes a holding portion for holding the electronic component in a detachable manner, and is attached on the circuit board. Such a socket is used, for example, for inspecting the performance of an electronic component.

  For example, Patent Document 1 below describes a burn-in socket that fixes a semiconductor package on a pedestal when performing a burn-in test. The burn-in socket includes a first package guide having ends pressed against the two side surfaces of the semiconductor package, and a second package having ends pressed against the other two side surfaces of the semiconductor package disposed on the pedestal. A package guide, a first clamp for moving the first package guide away from the position for fixing the semiconductor package on the base, and a second package guide for moving away from the position for fixing the semiconductor package on the base. A second clamp to be moved.

JP 2002-25732 A

  When the burn-in socket is used, the first and second package guides and the first and second clamps are located above the semiconductor package. Such package guide and clamp configurations may cause inconveniences when the burn-in socket is applied to other types of electronic components. For example, when an image sensor that desirably has no obstruction on the main surface side during operation or inspection is attached to the burn-in socket, a package guide or clamp is positioned on the main surface side of the image sensor. Therefore, light is blocked in the region or direction where the package guide or clamp is located, and the image sensor cannot receive light from that region or direction. Similarly, when the light emitting diode is attached to the burn-in socket, a part of the emitted light is blocked by the package guide or the clamp.

  As one means for solving such inconvenience, it is conceivable to solder an electronic component on a circuit board without using a socket. However, if an electronic component is soldered for inspection, the terminals of the electronic component are contaminated with solder, and cannot be reused after the inspection, and the electronic component is discarded.

  Therefore, a socket that electrically connects the electronic component to a circuit board without blocking the main surface side of the electronic component is desired.

  A socket according to one aspect of the present invention is a socket that holds an electronic component in a state where it can be electrically connected to a circuit board. The socket is provided at one end of the socket, the frame into which the electronic component is inserted, and the inner wall of the frame At least one holding portion movable along a direction intersecting the inner wall, and at least one holding portion moves along the direction to move at least one side surface of the electronic component in the frame. The electronic component is held in the frame without covering the main surface of the electronic component.

  In such a side surface, the holding part provided on the inner wall of the frame abuts on the side surface of the electronic component, whereby the electronic component is held without covering the main surface of the electronic component. Therefore, the electronic component can be electrically connected to the circuit board without blocking the main surface side of the electronic component.

  According to one aspect of the present invention, the electronic component can be electrically connected to the circuit board without blocking the main surface side of the electronic component.

It is a perspective view which shows the usage example of the socket which concerns on 1st Embodiment. FIG. 2 is an exploded perspective view corresponding to FIG. 1. It is a perspective view of the socket which concerns on 1st Embodiment. It is a perspective view of a shaft member. It is a top view of a shaft member. It is the elements on larger scale which show the frame before an electronic component is inserted. It is the top view and partial enlarged view which show the flame | frame in which the electronic component was inserted. It is the elements on larger scale which show the state where the holding part hold | maintained the electronic component. It is the elements on larger scale which show the state where the holding part hold | maintained the electronic component. It is the top view and partial enlarged view which show the flame | frame holding the electronic component. It is a perspective view which shows the socket which concerns on 1st Embodiment holding the electronic component. FIG. 12 is a side view corresponding to FIG. 11. It is a perspective view which shows the usage example of the socket which concerns on 2nd Embodiment. FIG. 14 is an exploded perspective view corresponding to FIG. 13. It is a disassembled perspective view of the socket which concerns on 2nd Embodiment. It is a perspective view which shows the utilization method of the socket which concerns on 2nd Embodiment. It is a side view which shows the socket based on 2nd Embodiment holding the electronic component.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
The configuration of the socket 1 according to the first embodiment will be described with reference to FIGS. A socket is an article for electrically connecting an electronic component to a circuit board. Electronic parts are parts used in electrical products. The purpose of using the socket 1 is not limited. For example, the socket 1 may be used for inspecting the performance of an electronic product, may be used as a component for incorporating an electronic component into an electrical product, or may be used to achieve both of these purposes. May be. An electronic component connected to the circuit board via the socket 1 is not limited. For example, the electronic component may have a function of emitting or receiving light (for example, a light emitting diode or an image sensor), or may not have these functions. Alternatively, the electronic component may have other functions. Other examples of the electronic component include various sensors such as a pressure sensor, a temperature sensor, and an atmospheric pressure sensor.

  As shown in FIGS. 1 and 2, the socket 1 is attached to the main surface of the circuit board 70. In the examples shown in these drawings, a backup plate 80 is disposed on the opposite side of the socket 1 across the circuit board 70, and the socket 1 and the backup plate 80 use bolts 81 (a nut may be further used). Fixed to the substrate 70. The backup plate 80 is a component prepared for preventing the circuit board 70 from being warped by the pressure from the socket 1 by attaching the socket 1 to the circuit board 70. An insulating sheet (not shown) is disposed on the side of the backup plate 80 that is in contact with the back surface (the surface opposite to the main surface) of the circuit board 70, or a process for insulation is performed. The backup plate 80 is not an essential component when the socket 1 is used. For example, if there is no possibility that the circuit board 70 is warped, the backup plate 80 can be omitted.

  As shown in FIGS. 1 to 3, the socket 1 has a two-layer structure including a probe holder 10 that houses a plurality of conductive probes 11 and a frame 20 that holds electronic components. The electronic component held by the frame 20 is electrically connected to the circuit board 70 via the plurality of probes 11 in the probe holder 10. How to arrange the plurality of probes 11 in the probe holder 10 is determined according to the arrangement of the terminals of the electronic component to be inserted into the socket 1. In this embodiment, the probe holder 10 and the frame 20 are integrated by the bolt 81, but the integration method is not limited to this. For example, other structures such as a latch mechanism may be used, and the probe holder 10 and the frame 20 may be integrally formed. In this specification, the side of the probe holder 10 in contact with the circuit board 70 is defined as the lower side of the socket 1, and the side of the frame 20 is defined as the upper side of the socket 1.

  A recess 22 into which an electronic component is inserted is formed on the end surface 21 of the frame 20. The end surface 21 can also be referred to as an end surface or an upper surface of the socket 1. In this embodiment, the shape of the outer edge of the recess 22 is rectangular, but the shape may be arbitrarily determined as long as it does not hinder the insertion and holding of the electronic component. One end of the plurality of probes 11 is exposed from the bottom of the recess 22.

  The socket 1 does not include a component that covers the main surface of the electronic component inserted into the recess 22. Here, the “main surface of the electronic component” refers to a surface that faces upward when the electronic component is inserted into the recess 22, and can also be referred to as a surface that can be viewed from above the socket 1 during the insertion. . “The main surface of the electronic component is not covered” means at least when the socket 1 is looked down from directly above the socket 1 (when the angle between the line of sight and the main surface of the electronic component is a right angle). This means that the entire main surface of the component can be seen without being obstructed by anything.

  The depth of the recess 22 is not limited. In the present embodiment, the depth of the recess 22 is such that the main surface of the inserted electronic component and the upper side of each side surface of the electronic component (the portion of each side surface that is connected to the main surface of the electronic component) is the frame 20. (Or socket 1) is set to be exposed. When the inserted electronic component is exposed from the frame or the socket, it means that a part of the electronic component is visible when the socket is viewed from the side. Of course, the depth of the recess 22 may be set so that the electronic component cannot be visually recognized when the socket is viewed from the side.

  The inner wall 23 of the frame 20 that forms the recess 22 is provided with a holding portion (guide) 30 that is movable along a direction intersecting the inner wall 23. In the present embodiment, four holding portions 30 are provided corresponding to the four sides forming the recess 22. As shown in FIG. 3, each holding portion 30 includes an elongated contact portion 31 extending along the inner wall 23 and L-shaped flanges 32 formed at both ends of the contact portion 31. While the contact portion 31 is exposed from the inner wall 23, the flange 32 is accommodated in the frame 20, thereby preventing the holding portion 30 from jumping into the recess 22.

  In the frame 20, a shaft member (guide roller) 40 for moving the holding unit 30 along the direction intersecting the inner wall 23 is provided outside the individual holding unit 30. As shown in FIGS. 3 and 4, the shaft member 40 is a columnar member extending along the vertical direction of the frame 20. As shown in FIG. 4, a notch 41 for receiving a tool (for example, a driver) for turning the shaft member 40 is formed at the upper end of the shaft member 40. The central portion of the shaft member 40 is processed so that a cross section orthogonal to the axial direction of the shaft member 40 has an elliptical shape, and functions as a contact portion 42 that contacts the holding portion 30. Since the cross section of the contact portion 42 has an elliptical shape, as shown in FIG. 5, the contact portion 42 has at least a first diameter D1 and a second diameter D2 larger than the first diameter D1. In the present embodiment, the first diameter D1 is the short diameter of the contact portion 42, and the second diameter D2 is the long diameter of the contact portion 42. Each shaft member 40 is attached to the frame 20 by being inserted into a hole formed in the frame 20 and having substantially the same diameter as the shaft member 40. Accordingly, each shaft member 40 rotates within the hole without substantial movement of the shaft.

  Next, a method for attaching the electronic component to the socket 1 will be described with reference to FIGS. First, the user prepares the electronic component 90 and the socket 1. The socket 1 may already be attached on the circuit board 70 or may not yet be attached.

  Subsequently, the user adjusts the position of each holding unit 30 so that the electronic component 90 can be inserted into the frame 20 (more specifically, the recess 22). This adjustment is an operation for ensuring a sufficient interval between the two holding portions 30 facing each other, and thus the user can easily insert the electronic component 90 into the frame 20 (the recess 22). Specifically, the user rotates the individual shaft members 40 with a screwdriver or the like, and makes the diameter of the contact portion 42 along the direction orthogonal to the inner wall 23 smaller than the second diameter D2, thereby allowing the individual holding portions. 30 is shifted toward the inner wall 23 (that is, toward the outside of the frame 20). As shown in FIG. 6, the user rotates the shaft member 40 so that the diameter R of the contact portion 42 along the direction orthogonal to the inner wall 23 becomes the first diameter D1, so that the corresponding holding portion 30 is most You may shift to an outer position. This diameter R can also be said to be the diameter of the contact part 42 starting from the position of the contact part 42 in contact with the holding part 30. Alternatively, the user may shift the corresponding holding portion 30 to the outside by turning the shaft member 40 so that the diameter R is larger than the first diameter D1 and smaller than the second diameter D2.

  When the position of each holding part 30 is adjusted, the user inserts the electronic component 90 into the frame 20 (more specifically, the recess 22). At this time, as shown in FIG. 7, a gap C is generated between at least one holding unit 30 and the electronic component 90.

  Subsequently, the user rotates the individual shaft members 40 to shift the individual holding portions 30 toward the center of the frame 20, and the individual holding portions 30 (more specifically, so that the electronic component 90 does not move in the frame 20). Each abutting portion 31) is brought into contact with the side surface of the electronic component 90. It can be said that this operation is that the user shifts the individual holding portions 30 toward the center of the recess 22. Alternatively, it can be said that the operation is that the user shifts the individual holding units 30 in a direction away from the inner wall 23. As shown in FIG. 8, the user rotates the shaft member 40 so that the diameter R of the contact portion 42 along the direction orthogonal to the inner wall 23 becomes the second diameter D2, so that the corresponding holding portion 30 is moved most. You may shift to an inner position. Alternatively, as shown in FIG. 9, the user turns the shaft member 40 so that the diameter R is larger than the first diameter D1 and smaller than the second diameter D2, thereby bringing the corresponding holding portion 30 inward. It may be shifted. In any case, as a result of this operation, as shown in FIG. 10, each holding portion 30 (more specifically, each contact portion 31) presses the electronic component 90 from the side, so that the electronic component 90 is held in the frame 20. Is done.

  As shown in FIG. 11, the socket 1 does not have a structure in which the electronic component 90 is held in the frame 20 only by the holding portions 30 and the main surface 91 of the electronic component 90 is covered. This means that nothing is provided on the end face 21 of the frame 20. As shown in FIG. 12, the electronic component 90 held by the frame 20 is exposed from the frame 20 (or the socket 1). Therefore, as shown in FIG. 12, when the socket 1 is mounted on the circuit board 70, the maximum length La from the circuit board 70 to the end surface 21 of the frame 20 is held in the frame 20 from the circuit board 70. Further, it is shorter than the minimum length Lb to the main surface 91 of the electronic component 90. However, as described above, the depth of the recess 22 may be set so that the electronic component is not visible when the socket is viewed from the side. In this case, the maximum length La is equal to or greater than the minimum length Lb. .

  If necessary, the user can remove the electronic component 90 from the socket 1 by turning the shaft member 40 and shifting the holding portion 30 toward the inner wall 23.

(Second Embodiment)
The configuration of the socket 100 according to the second embodiment will be described with reference to FIGS. The second embodiment is different from the first embodiment in a mechanism for shifting the holding unit. In the following, differences from the first embodiment will be particularly described, and description of the same or equivalent matters as in the first embodiment will be omitted.

  As shown in FIGS. 13 and 14, the socket 100 is attached to the main surface of the circuit board 70. In the examples shown in these drawings, a backup plate 80 is disposed on the opposite side of the socket 100 across the circuit board 70, and the socket 100 and the backup plate 80 are fixed to the circuit board 70 using a fastener 181 such as a bolt. . However, as in the first embodiment, the backup plate 80 may not be used.

  As illustrated in FIGS. 13 to 15, the socket 100 has a two-layer structure including a probe holder 110 that houses a plurality of conductive probes 111 and a frame 120 that holds electronic components. In the present embodiment, the probe holder 110 and the frame 120 are integrated by the latch mechanism 190, but the method for integrating the probe holder 110 and the frame 120 is not limited at all as in the first embodiment. In this specification, the probe holder 110 side in contact with the circuit board 70 is defined as the lower side of the socket 100, and the frame 120 side is defined as the upper side of the socket 100.

  A recess 122 into which an electronic component is inserted is formed on the end surface 121 of the frame 120. The end surface 121 can also be referred to as an end surface or an upper surface of the socket 100. Similar to the first embodiment, the shape of the recess 122 is not limited. One end of the plurality of probes 111 connected to the terminals of the electronic component is exposed from the bottom of the recess 122.

  As in the first embodiment, the socket 100 does not include a component that covers the main surface of the electronic component inserted into the recess 122.

  The depth of the recess 122 is not limited. In the present embodiment, the depth of the recess 122 is such that the main surface of the inserted electronic component and the upper side of each side surface of the electronic component (the portion of each side surface connected to the main surface of the electronic component) are the frame 120. (Or the socket 100) is set to be exposed. Of course, the depth of the recess 122 may be set so that the electronic component cannot be visually recognized when the socket is viewed from the side.

  The inner wall 123 of the frame 120 that forms the recess 122 is provided with a holding portion (guide) 130 that can move along a direction intersecting the inner wall 123. In the present embodiment, four holding portions 130 are provided corresponding to the four sides forming the recess 122. As shown in FIG. 15, each holding portion 130 includes an elongated contact portion 131 extending along the inner wall 123, L-shaped flanges 132 formed at both ends of the contact portion 131, and the contact portion 131. And an annular portion 133 provided on the back side (side accommodated in the frame 120). The annular portion 133 forms a through hole 134 that extends along the vertical direction of the frame 120. The contact portion 131 is exposed from the inner wall 123, whereas the flange 132 and the annular portion 133 are accommodated in the frame 120. The flange 132 prevents the holding portion 130 from jumping into the recess 122. In the present embodiment, a space (concave portion) is formed between the flange 132 and the annular portion 133, and the elastic member 135 is provided in the space. The elastic member 135 is disposed so as to expand and contract along a direction intersecting the inner wall 123 of the frame 120. In the present embodiment, the elastic member 135 is a compression spring, and pushes the holding portion 130 toward the center of the concave portion 122 (a direction away from the inner wall 123) in a state where no external pressure is applied to the holding portion 130.

  An insertion port 124 corresponding to the through hole 134 of the holding portion 130 is formed in the end surface 121 of the frame 120. More specifically, the insertion port 124 is formed above the through hole 134 such that one insertion port 124 and one corresponding through hole 134 are connected along the vertical direction of the frame 120.

  Next, a method for attaching the electronic component to the socket 100 will be described with reference to FIGS.

  First, the user prepares the electronic component 90 and the socket 100. The socket 100 may already be attached on the circuit board 70 or may not yet be attached.

  Subsequently, as shown in FIG. 16, the user inserts the wedges 200 into the respective insertion openings 124, thereby shifting the corresponding holding portions 130 toward the inner wall 123 (that is, toward the outside of the frame 120). The wedge 200 is a rod-shaped member having a tip portion 201 formed in a tapered shape. The wedge 200 is not a component of the socket 100, but may be provided with the socket 100. When the user inserts the wedge 200 into the insertion port 124 until the distal end portion 201 reaches the through hole 134 of the holding portion 130, the annular portion 133 is pushed toward the outside of the frame 120 by the distal end portion 201. Moves in that direction. When the user inserts the wedge 200 from each insertion opening 124, a space is formed in the recess 122 so that the electronic component 90 can be inserted. At this time, each elastic member 135 is compressed, and elastic energy is generated there.

  Subsequently, the user inserts the electronic component 90 into the frame 120 (more specifically, the recess 122), and then removes the individual wedges 200. Then, each holding part 130 moves toward the center of the recess 122 (frame 120) by the elastic force of the corresponding elastic member 135 and hits the side surface of the electronic component 90. More specifically, each contact portion 131 hits the side surface of the electronic component 90. This operation can be said to be that the user moves the individual holding units 130 toward the center of the recess 122, or can be said to be that the user moves the individual holding units 130 in a direction away from the inner wall 123.

  The socket 100 does not have a structure that holds the electronic component 90 in the frame 120 only by the holding portions 130 and covers the main surface of the electronic component 90. This means that nothing is provided on the end surface 121 of the frame 120. As shown in FIG. 17, the electronic component 90 held by the frame 120 is exposed from the frame 120 (or the socket 100). Therefore, as shown in FIG. 17, when the socket 100 is mounted on the circuit board 70, the maximum length La from the circuit board 70 to the end surface 121 of the frame 120 is held in the frame 120 from the circuit board 70. The minimum length Lb to the main surface 91 of the electronic component 90 is shorter. However, as described above, the depth of the recess 122 may be set so that the electronic component is not visible when the socket is viewed from the side. In this case, the maximum length La is equal to or greater than the minimum length Lb. .

  If necessary, the user can remove the electronic component 90 from the socket 100 by inserting the wedges 200 into the individual insertion openings 124 and shifting the holding portion 130 toward the inner wall 123.

  As described above, the socket according to one aspect of the present invention is a socket that holds an electronic component in a state in which it can be electrically connected to a circuit board, and is provided at one end of the socket, into which the electronic component is inserted. A frame, and at least one holding portion that is provided on an inner wall of the frame and is movable along a direction intersecting the inner wall, and the at least one holding portion moves along the direction to move electrons in the frame. By contacting the at least one side surface of the component, the electronic component is held in the frame without covering the main surface of the electronic component.

  An electronic component mounting method according to an aspect of the present invention includes a step of preparing the socket and the electronic component, a step of inserting the electronic component into a frame, and a direction in which at least one holding portion intersects the inner wall. Holding the electronic component inserted into the frame by moving the electronic component.

  In such a side surface, the holding part provided on the inner wall of the frame abuts on the side surface of the electronic component, whereby the electronic component is held without covering the main surface of the electronic component. Therefore, the electronic component can be electrically connected to the circuit board without blocking the main surface side of the electronic component. In the past, the only way to realize such an electrical connection was to solder an electronic component to a circuit board. However, by using the socket according to one aspect of the present invention, the electronic component attached to the socket can be removed and reused.

  In the socket according to another aspect, the maximum length from the circuit board to the end face of the frame may be shorter than the minimum length from the circuit board to the main surface of the electronic component held in the frame. In this case, the main surface and some side surfaces of the electronic component are completely exposed from the frame. Therefore, the electronic component can be attached to the socket so that the main surface of the electronic component is not obstructed at all including the periphery.

  The socket according to another aspect further includes at least one shaft member corresponding to at least one holding portion, each shaft member having a contact portion in contact with the corresponding holding portion, wherein the contact portion is at least the first Having a diameter and a second diameter larger than the first diameter, the shaft member rotating, and the diameter of the contact portion changing from the position of the contact portion in contact with the corresponding holding portion, The corresponding holding part may move along a direction intersecting the inner wall. By rotating the shaft member having at least two diameters and changing the position of the holding portion, the position of the holding portion can be easily adjusted.

  In the socket according to another aspect, at least one insertion port into which a member for moving at least one holding portion is inserted may be formed on the end surface of the frame. In this case, the user can easily adjust the position of the holding portion by inserting an arbitrary member into the insertion slot.

  In the socket according to another aspect, each holding portion may have an elastic member that expands and contracts along a direction intersecting the inner wall. In this case, since the holding portion can be moved by the elastic force of the elastic member, the user is saved from adjusting the position of the holding portion. Therefore, the position of the holding part can be set easily.

  In the socket according to another aspect, the electronic component may have a function of emitting or receiving light. Since the main surface and some side surfaces of the electronic component held by the socket are not covered with the frame, the light emitted or received by the electronic component is not blocked by the socket. Therefore, the function of light emission or light reception of the electronic component is not hindered. For example, the socket does not block the light emitted from the light emitting diode just beside it, nor does it block the light incident from the side of the main surface of the image sensor.

  The present invention has been described in detail based on the embodiments. However, the present invention is not limited to the above embodiment. The present invention can be variously modified without departing from the gist thereof.

  In the first embodiment, the cross section of the contact portion 42 of the shaft member 40 has an elliptical shape, but the cross section of the shaft member may have another shape as long as it has at least two diameters. For example, the cross-sectional shape of the shaft member may be a polygon such as a quadrangle or a hexagon.

  In the second embodiment, the holding unit 130 has a compression spring as the elastic member 135, but the type of the elastic member is not limited. For example, a tension spring may be used, or an elastic member other than the spring may be used. The place where the elastic member is installed is not limited, and can be determined according to the function or type of the elastic member. Alternatively, in order to adjust the position of the holding part in the second embodiment, the holding part may have other means such as an adjuster instead of the elastic member.

  DESCRIPTION OF SYMBOLS 1 ... Socket, 10 ... Probe holder, 11 ... Probe, 20 ... Frame, 21 ... End surface of frame, 22 ... Recessed part, 23 ... Inner wall, 30 ... Holding part, 40 ... Shaft member, 42 ... Contact part, 70 ... Circuit board 80 ... Backup plate, 90 ... Electronic component, 91 ... Main surface of electronic component, 100 ... Socket, 110 ... Probe holder, 111 ... Probe, 120 ... Frame, 121 ... End surface of frame, 122 ... Recess, 123 ... Inner wall, 124: insertion port, 130: holding portion, 133: annular portion, 134: through hole, 135: elastic member, 200: wedge, D1: first diameter, D2: second diameter.

Claims (7)

A socket for holding an electronic component in an electrically connectable state with a circuit board,
A frame provided at one end of the socket and into which the electronic component is inserted;
Provided on the inner wall of the frame, and at least one holding portion movable along a direction intersecting the inner wall;
The at least one holding portion moves along the direction and abuts on at least one side surface of the electronic component in the frame, so that the main surface of the electronic component is not covered and the electronic component is Held in the frame,
socket. The maximum length from the circuit board to the end face of the frame is shorter than the minimum length from the circuit board to the main surface of the electronic component held in the frame;
The socket according to claim 1. And further comprising at least one shaft member corresponding to the at least one holding portion,
Each shaft member has a contact portion in contact with the corresponding holding portion,
The contact portion has at least a first diameter and a second diameter larger than the first diameter;
When the shaft member rotates and the diameter of the contact portion changes based on the position of the contact portion in contact with the corresponding holding portion, the corresponding holding portion moves along the direction intersecting the inner wall. To
The socket according to claim 1 or 2. At least one insertion port into which a member for moving the at least one holding part is inserted is formed on the end surface of the frame.
The socket according to claim 1 or 2. Each holding part has an elastic member that expands and contracts along the direction intersecting the inner wall,
The socket according to claim 4. The electronic component has a function of emitting or receiving light,
The socket as described in any one of Claims 1-5. Preparing the socket according to any one of claims 1 to 6 and the electronic component;
Inserting the electronic component into the frame;
A method of attaching an electronic component, the method comprising: holding the electronic component inserted into the frame by moving the at least one holding portion along a direction intersecting the inner wall.

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