JP2007311538A - Method of fixing electronic component, and method of manufacturing electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of fixing an electronic component which can easily and stably fix a plurality of electronic components onto the fixing surface of a mount target object while preventing offset and breakage of a sheet member. <P>SOLUTION: An insulating sheet 3 is located on an element fixing surface 1, a plurality of foot members 11 of a positioning jig 9 are located on the insulating sheet 3, and then corresponding power elements 12 are inserted at a plurality of positioning sites of the positioning jig 9. As a result, the plurality of power elements 12 are arranged on the insulating sheet 3. Further, holding pins of a position control jig 13 are fitted into pin-through holes of the insulating sheet 3 and pin holes of the element fixing surface 1 to be assembled together. Under the condition that the position of the insulating sheet 3 on the element fixing surface 1 is fixed, the respective power elements 12 are screwed and fixed to the fixing surface, and thereafter the position specifying jig 13 and the positioning jig 9 are removed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method for fixing electronic components, and more particularly, to a method for arranging and fixing a plurality of electronic components on a fixing surface of an attachment object via a sheet member.
The present invention also relates to a method of manufacturing an electronic apparatus having a plurality of electronic components that are fixed to a fixing surface of an attachment object by such a fixing method.

  For example, Patent Document 1 discloses a method of fixing a power element to a heat radiating fin. In this method, after disposing an insulating sheet on the heat radiating fin, a plurality of power elements previously connected to the substrate are placed on the heat radiating fin. In addition, press the metal fittings on top of the power elements, fix the both ends to the radiating fins, and press the power elements against the radiating fins with the springs formed on the bottom surface of the metal fittings. Thus, the plurality of power elements are fixed to the heat radiating fins.

JP-A-6-342989

However, since the presser fitting used in the method of Patent Document 1 is fixed to the heat radiating fins at both ends thereof, the load that holds the power element varies between the center part and the end part of the presser fitting, and a plurality of power elements May not be stably fixed to the radiating fin.
In addition, there is a known method of fixing each power element by screwing to the heat radiating fin. However, in this method, the insulation sheet positioned between the heat radiating fin and the power element is not displaced when the screw is assembled. In addition to causing breakage and the like, it may cause insulation failure, and it is necessary to position and screw the plurality of power elements one by one, which is troublesome.

The present invention has been made to solve such problems, and it is possible to easily and stably fix a plurality of electronic components to a fixing surface of an object to be attached while preventing displacement and tearing of the sheet member. An object of the present invention is to provide a method for fixing an electronic component.
Another object of the present invention is to provide a method for manufacturing an electronic device having a plurality of electronic components that are fixed to a fixing surface of an object to be attached by such a fixing method.

  An electronic component fixing method according to the present invention is a method in which a plurality of electronic components are arranged and fixed on a fixing surface of an attachment object via a sheet member, and the holding pin is passed through the sheet member and formed on the fixing surface. The position of the sheet member on the fixed surface is fixed in at least two places by being fitted into the pin holes, and a plurality of electronic components are attached to the sheet member using a positioning jig having a plurality of positioning portions corresponding to the plurality of electronic components. In this method, the positioning jig is removed after arranging a plurality of electronic components on a fixed surface with a fixing member.

It is possible to use a positioning jig that has a plurality of foot members that are spaced apart from each other and in which a plurality of positioning portions are formed by these foot members.
When a plurality of electronic components are arranged in a predetermined direction on the fixed surface by the positioning jig, and the holding pin is inserted into the pin hole of the fixed surface by the position defining jig formed integrally with the holding pin. The positions of the plurality of electronic components in a direction perpendicular to the predetermined direction on the fixed surface can be defined.

The position of the sheet member on the fixing surface can be fixed by using a plurality of holding pins and a plurality of pin holes corresponding to each other in positional relationship.
As the sheet member, an insulating sheet, a heat radiating sheet, or an impact absorbing sheet can be used.

Moreover, the manufacturing method of the electronic device which concerns on this invention is a method including the fixing method of said electronic component.
Moreover, it is preferable to solder the plurality of electronic components to the substrate after the plurality of electronic components are fixed to the fixing surface by screws and the positioning jig is removed.

  According to the present invention, it is possible to easily and stably fix a plurality of electronic components to the fixing surface of the object to be attached while preventing displacement and tearing of the sheet member.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
With reference to FIGS. 1-6, the fixing method of the electronic component which concerns on embodiment of this invention, and the manufacturing method of an electronic device are demonstrated. For example, a case where an electronic device such as a power module is manufactured by fixing a plurality of power elements 12 as electronic components to the case 2 will be described. First, as shown in FIG. 1, a case 2 having an element fixing surface 1 for fixing a plurality of power elements 12 is prepared, and an insulating sheet 3 is disposed on the element fixing surface 1.

  Here, the element fixing surface 1 is formed so as to protrude perpendicularly to the wall 2 a of the case 2. A plurality of screw holes 4 are formed in the element fixing surface 1 at intervals from each other in the width direction thereof, that is, in a direction substantially parallel to the wall portion 2 a of the case 2. Further, two pin holes 5 are formed in the intermediate portion of the element fixing surface 1 so as to be spaced apart from each other in the width direction of the element fixing surface 1. These two pin holes 5 are located on the wall 2 a side of the case 2 with respect to the plurality of screw holes 4. The insulating sheet 3 is also formed with a plurality of screw-through holes 6 corresponding to the plurality of screw holes 4 of the element fixing surface 1 and corresponding to the two pin holes 5 of the element fixing surface 1. Two pin through holes 7 are formed. The insulating sheet 3 is arranged such that the positions of the screw through holes 6 and the pin through holes 7 coincide with the positions of the corresponding screw holes 4 and pin holes 5 on the element fixing surface 1.

The element fixing surface 1 is formed with a stepped portion 8 projecting upward in the vicinity of the wall 2 a of the case 2, and the insulating sheet 3 is formed on the element fixing surface 1 except for the stepped portion 8. Can be arranged.
The case 2 can be made of aluminum or the like, and a heat radiating fin is provided on the surface of the case 2 opposite to the surface on which the element fixing surface 1 of the wall portion 2a is provided to improve the heat dissipation of the case 2. Can be enhanced. The insulating sheet 3 is for electrically insulating the element fixing surface 1 and the plurality of power elements 12 and can be formed of silicone rubber or the like.

  Next, a positioning jig 9 as shown in FIG. 2 is prepared. The positioning jig 9 includes a prismatic horizontal member 10 and a plurality of foot members 11 that are formed so as to protrude from the front surface of the horizontal member 10 and are arranged parallel to each other with a gap therebetween. Each leg member 11 includes a falling portion 11a extending downward from the front surface of the lateral member 10, and a horizontal portion 11b extending in the horizontal direction from the lower end of the falling portion 11a, and has a substantially L-shape. . A positioning portion for positioning the power element 12 is formed by two horizontal portions 11b adjacent to each other. Moreover, the protrusion part which protrudes slightly toward the front-end | tip of the adjacent horizontal part 11b is formed in the front-end | tip of the horizontal part 11b of each leg member 11. FIG.

  Such a positioning jig 9 is arranged in the case 2. At this time, the lower surface of the lateral member 10 is placed on the upper surface of the wall portion 2a of the case 2, the back surface of the falling portion 11a of each foot member 11 is in contact with the front surface of the wall portion 2a, and the horizontal portion 11b of each foot member 11 is The positioning jig 9 is disposed so that the lower surface is placed on the insulating sheet 3 disposed on the element fixing surface 1 of the case 2. This state is shown in FIG.

  A plurality of leg members 11 are arranged along the width direction of the element fixing surface 1, and one screw-through hole 6 of the insulating sheet 3 is located in each positioning portion. Further, the pin passage hole 7 of the insulating sheet 3 is exposed without being blocked by the plurality of foot members 11.

After the positioning jig 9 is arranged in this manner, as shown in FIG. 4, when the corresponding power elements 12 are inserted into the positioning portions between the plurality of foot members 11, a plurality of power elements are formed on the insulating sheet 3. 12 are arranged along the width direction of the element fixing surface 1. At this time, the position of the power element 12 in the width direction of the element fixing surface 1 is defined by the horizontal portions 11 b of the plurality of leg members 11 of the positioning jig 9. Each power element 12 is formed with a screw-through hole and a connection terminal projecting from the front end surface. The left and right end portions of the front end surface are engaged with the projecting portion at the front end of the horizontal portion 11b of the foot member 11. By combining, not only the power element 12 is prevented from coming out of the positioning portion, but also the screw holes of each power element 12 and the corresponding screw holes 6 of the insulating sheet 3 can be made to coincide with each other. .
At this time, the pin passage hole 7 of the insulating sheet 3 is exposed without being blocked by the power element 12. Here, power elements having various sizes are used as the plurality of power elements 12.

Further, a position defining jig 13 as shown in FIG. 5 is prepared. As described above, when the left and right ends of the front end face of each power element 12 are engaged with the protrusions at the tip of the horizontal portion 11b of the foot member 11, the position defining jig 13 It has a shape that can be disposed between the rear end surface and the falling portions 11 a of the plurality of foot members 11. Two holding pins 14 are formed to protrude from the lower surface of the position defining jig 13, and a plurality of grooves 15 that can accommodate the horizontal portions 11 b of the plurality of foot members 11 of the positioning jig 9 are spaced apart from each other. Are formed in parallel.
The two holding pins 14 are formed so as to correspond to the two pin through holes 7 of the insulating sheet 3 and the two pin holes 5 of the element fixing surface 1.

  The position defining jig 13 having such a structure is assembled from above the plurality of foot members 11 of the positioning jig 9 as shown in FIG. That is, the two holding pins 14 of the position defining jig 13 are fitted into the two pin through holes 7 of the insulating sheet 3 and the two pin holes 5 of the element fixing surface 1 respectively, and a plurality of grooves of the position defining jig 13 15 are respectively fitted to the horizontal portions 11b of the plurality of foot members 11 of the positioning jig 9, and the position defining jig 13 is connected to the rear end surfaces of the plurality of power elements 12 and the falling portions 11a of the plurality of foot members 11. Place between.

  The position of the insulating sheet 3 relative to the element fixing surface 1 is fixed by the holding pins 14 of the position defining jig 13, and the insulating sheet 3 is fixed at two locations by using the two holding pins 14. The rotation of the sheet 3 is prevented. Further, since the position defining jig 13 is positioned between the rear end surfaces of the plurality of power elements 12 and the falling portions 11 a of the plurality of foot members 11, each power element 12 is positioned at the tip of the horizontal portion 11 b of the foot member 11. The position of the power element 12 in the direction perpendicular to the wall 2a of the case 2 is defined by being sandwiched between the protruding portion and the position defining jig 13. At this time, the screw holes of each power element 12 and the corresponding screw holes 6 of the insulating sheet 3 are aligned to communicate with each other, and the connection terminal of each power element 12 is connected to the tip of the positioning jig 9. It protrudes from the outside.

In this state, as shown in FIGS. 7 and 8, the screw member 16 is inserted into the screw through hole of each power element 12 and the corresponding screw through hole of the insulating sheet 3, and the tip portion thereof corresponds to the element fixing surface 1. The position defining jig 13 and the positioning jig 9 are removed after each power element 12 is screwed and fixed to the element fixing surface 1 by fastening to the screw holes. Thereafter, the connection terminals of the plurality of power elements 12 can be respectively soldered to connection terminals of a substrate (not shown). A substrate (not shown) can be assembled to the case 2 in advance.
In this way, a power module having a plurality of power elements 12 can be manufactured.

As described above, each power element 12 is screwed in a state in which the insulating sheet 3 is fixed by the two holding pins 14 of the position defining jig 13 and prevented from moving and rotating. It is possible to prevent displacement and tearing of the insulating sheet 3. Therefore, the insulating sheet 3 can ensure insulation between the plurality of power elements 12 and the element fixing surface.
Further, by fixing each power element 12 to the element fixing surface 1 with screws, each power element 12 can be reliably and stably fixed to the element fixing surface 1.

Further, since the plurality of power elements 12 are arranged on the insulating sheet 3 using the positioning jig 9, the positioning of the plurality of power elements 12 in the arrangement direction can be easily performed.
In addition, the positioning jig 9 and the position defining jig 13 define the position in the arrangement direction of each power element 12 on the insulating sheet 3 and the position in the direction perpendicular to the arrangement direction to move the power element 12. Since the screw member 16 is assembled in a state in which the screwing is prohibited, the screwing operation can be easily performed.

  Also, if you try to fix a power element that has been soldered to the board or the like to the element fixing surface of the case, stress will be generated at the soldering part between the power element and the board when fixing each power element to the element fixing surface. However, in the method of manufacturing an electronic apparatus according to the present invention, after each power element 12 is fixed to the element fixing surface 1, the connection terminal of each power element is connected to a board (not shown). Since the soldering is performed, the reliability of the solder can be improved.

In the above-described embodiment, the position of the insulating sheet 3 is fixed by the two holding pins 14. However, the present invention is not limited to this, and the position defining jig 13 is provided with three or more holding pins. The position of the insulating sheet 3 with respect to the element fixing surface 1 can be fixed by penetrating the holding pin through the insulating sheet 3 and fitting it into three or more pin holes respectively formed corresponding to the element fixing surface 1. it can.
Further, for example, the position of the insulating sheet 3 with respect to the element fixing surface 1 is made by inserting one holding pin having a plate shape into a pin hole that is penetrated through the insulating sheet 3 and is cut out in the plate shape of the element fixing surface 1. Can also be fixed. Even in this configuration, the insulating sheet 3 is fixed at both ends of the plate-shaped holding pins, that is, fixed at two locations, thereby preventing not only the positional deviation of the insulating sheet 3 but also the rotation. it can.

In the above-described embodiment, the position defining jig 13 integrally formed with the holding pins 14 is used. However, the holding pins provided separately from the position defining jig 13 are used. Alternatively, such a holding pin may be left attached to the element fixing surface 1 without being removed even after the power element 12 is fixed.
Further, when a holding pin separate from the position defining jig 13 is used as described above, the timing of fixing the position of the insulating sheet 3 with the holding pin is before the screwing of each power element 12. Anytime. For example, when the insulating sheet 3 is arranged on the element fixing surface 1, the insulating sheet 3 may be penetrated and fitted into the corresponding pin hole of the element fixing surface 1 to fix the position of the insulating sheet 3.

In place of the plurality of power elements 12 having various sizes, a plurality of power elements having the same size can be used.
Further, not only the power element but also various other semiconductor elements can be screwed and fixed on the element fixing surface 1 as electronic components.

The plurality of electronic components can be fixed to the element fixing surface 1 using rivet pins or other various fixing members instead of the screw member 16.
Instead of the insulating sheet 3, a heat radiating sheet having a high heat radiating property, an impact absorbing sheet, or the like can be used.
Further, a plurality of electronic components can be fixed not only to the case 2 but also to various attachment objects by the electronic component fixing method of the present invention.

It is a perspective view which shows a mode that an insulating sheet, a power element, and a screw member are arrange | positioned in the fixing method of the electronic component which concerns on embodiment of this invention. It is a perspective view which shows the positioning jig used in embodiment. It is a top view which shows a mode that the positioning jig of FIG. 2 has been arrange | positioned on the insulating sheet. It is a plane which shows a mode that the several power element was arranged on the insulating sheet in embodiment. It is a perspective view which shows the position prescription jig | tool used in embodiment. It is a top view which shows a mode that the position prescription jig | tool of FIG. 5 was assembled | attached from the positioning jig. It is a perspective view which shows a mode that the several power element in embodiment was screwed and fixed on the element fixing surface. It is a top view which shows a mode that the several power element in embodiment was screwed and fixed on the element fixing surface.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Element fixing surface, 2 Case, 2a Wall part, 3 Insulating sheet, 4 Screw hole, 5 Pin hole, 6 Screw through hole, 7 Pin through hole, 8 Step part, 9 Positioning jig, 10 Horizontal member, 11 Foot member , 11a Falling part, 11b Horizontal part, 12 Power element, 13 Position defining jig, 14 Holding pin, 15 Groove part, 16 Screw member.

Claims (7)

In the method of arranging and fixing a plurality of electronic components on the fixing surface of the mounting object via the sheet member,
Fix the position of the sheet member on the fixed surface at least two places by inserting the holding pin through the sheet member and fitting the pin into the pin hole formed on the fixed surface,
A plurality of electronic components are arranged on the sheet member using a positioning jig having a plurality of positioning portions corresponding to the plurality of electronic components,
A method of fixing an electronic component, comprising: removing the positioning jig after fixing a plurality of electronic components to a fixing surface with a fixing member.   2. The electronic component fixing method according to claim 1, wherein the positioning jig includes a plurality of foot members arranged at a distance from each other, and the plurality of positioning portions are formed by the foot members.   A plurality of electronic components are arranged in a predetermined direction on the fixed surface by the positioning jig, and the holding pin is inserted into the pin hole of the fixed surface by a position defining jig formed integrally with the holding pin. The electronic component fixing method according to claim 1 or 2, wherein positions of a plurality of electronic components on a fixing surface in a direction perpendicular to the predetermined direction are sometimes defined.   The fixing method of the electronic component according to any one of claims 1 to 3, wherein the position of the sheet member on the fixing surface is fixed using the plurality of holding pins and the plurality of pin holes corresponding to each other in positional relationship. .   The fixing method of the electronic component as described in any one of Claims 1-4 which uses an insulating sheet, a thermal radiation sheet, or an impact absorption sheet as a sheet | seat member.   The manufacturing method of the electronic device containing the fixing method of the electronic component as described in any one of Claims 1-5.   The method of manufacturing an electronic device according to claim 6, wherein the plurality of electronic components are each fixed to a fixing surface with screws and the positioning jig is removed, and then the plurality of electronic components are soldered to the substrate.

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