JP2010080587A - Heat sink mounting structure - Google Patents

Heat sink mounting structure Download PDF

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JP2010080587A
JP2010080587A JP2008245596A JP2008245596A JP2010080587A JP 2010080587 A JP2010080587 A JP 2010080587A JP 2008245596 A JP2008245596 A JP 2008245596A JP 2008245596 A JP2008245596 A JP 2008245596A JP 2010080587 A JP2010080587 A JP 2010080587A
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heat sink
printed circuit
circuit board
elastic member
post
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JP2008245596A
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JP4821825B2 (en
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Yoichi Hirayama
洋一 平山
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Fujitsu General Ltd
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Fujitsu General Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat sink mounting structure capable of easily mounting a heat sink to a printed circuit board with a power device mounted thereon without displacement. <P>SOLUTION: The heat sink mounting structure includes a printed circuit board 2 on which a power device composed of a SMD (Surface Mount Device) 1 or a chip component 1', a heat sink 3 to be mounted to the printed circuit board 2, a plurality of posts 4 protruded from the heat sink 3, mounting portions 5 provided at the posts 4, and elastic members 6 mounted to the mounting portions 5. The printed circuit board 2 is positioned to the heat sink 2 by the posts 4 and fixed to the heat sink 3 by being pressed with the elastic members 6. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、ヒートシンクの取付構造に係わり、より詳細には、パワーデバイスを実装したプリント基板にヒートシンクを位置ずれなく容易に取付できるようにした構成に関する。   The present invention relates to a heat sink mounting structure, and more particularly to a configuration in which a heat sink can be easily mounted on a printed circuit board on which a power device is mounted without misalignment.

従来のヒートシンクの取付構造として、プリント基板のヒートシンク取付用穴位置に依存しないでヒートシンクを取付可能にしたものがある。   As a conventional heat sink mounting structure, there is one in which a heat sink can be mounted without depending on the position of the heat sink mounting hole on the printed circuit board.

具体的には、図４に示すように、ヒートシンク本体ａと取付部ｂとに分離され、更に取付部ｂは、ヒートシンク本体ａの溝部ｃに移動可能に係止する係止部材ｄと、係止部材ｄと移動可能に係合する固定部材ｅとで構成され、係止部材ｄと固定部材ｅの位置を調整して、プリント基板側の取付位置の穴に固定部材ｅのばね付クリップｆを押し付けてヒートシンク本体ａを取り付けるように構成されている（例えば、特開２００７−３１７７２３号公報参照）。   Specifically, as shown in FIG. 4, the heat sink main body a and the mounting portion b are separated, and the mounting portion b further includes a locking member d that is movably locked to the groove portion c of the heat sink main body a, and an engagement member b. The fixing member e is movably engaged with the stopper member d. The positions of the locking member d and the fixing member e are adjusted, and the spring-loaded clip f of the fixing member e is inserted into the mounting position hole on the printed circuit board side. The heat sink main body a is attached by pressing (see, for example, JP-A-2007-317723).

このものにおいては、プリント基板に対しヒートシンク本体ａを位置決めするのではなく、プリント基板の穴に、移動可能な固定部材ｅのばね付クリップｆを押し付ける構成になっており、しかも、係止部材ｄおよび固定部材ｅが移動可能とされているためプリント基板とヒートシンク本体ａとに位置ずれが生じることになる。   In this structure, the heat sink main body a is not positioned with respect to the printed circuit board, but the spring-loaded clip f of the movable fixing member e is pressed into the hole of the printed circuit board. Further, since the fixing member e is movable, the positional deviation occurs between the printed circuit board and the heat sink body a.

また、プリント基板の穴に対し、係止部材ｄおよび固定部材ｅを移動させながらばね付クリップｆを位置合わせする必要があるため、こうしたプリント基板にヒートシンクの位置合わせをしたのちに取り付けるという作業が容易に行えなかった。
特開２００７−３１７７２３号公報 In addition, since it is necessary to align the spring-loaded clip f while moving the locking member d and the fixing member e with respect to the hole in the printed circuit board, the work of attaching the heat sink to the printed circuit board after the alignment is performed. It was not easy.
JP 2007-317723 A

そこで、本発明は上述した課題を解決するためになされたものであって、その目的は、パワーデバイスを実装したプリント基板にヒートシンクを位置ずれなく容易に取付できるようにしたヒートシンクの取付構造を提供することにある。   Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a heat sink mounting structure that allows a heat sink to be easily mounted on a printed circuit board on which a power device is mounted without misalignment. There is to do.

上述した目的を達成できるように構成するため、本発明は以下に示す特徴を備えている。   In order to achieve the above-described object, the present invention has the following features.

パワーデバイスが実装されたプリント基板と、ヒートシンクと、同ヒートシンクに突設された複数のポストと、同ポストに設けられた取付部と、同取付部に取り付けられた弾性部材とからなり、
前記プリント基板は、前記ポストにて前記ヒートシンクに位置決めされるとともに、前記弾性部材にて前記ヒートシンクに押圧固定してなることを特徴としている。 It consists of a printed circuit board on which a power device is mounted, a heat sink, a plurality of posts protruding from the heat sink, an attachment portion provided on the post, and an elastic member attached to the attachment portion.
The printed circuit board is positioned on the heat sink by the post and is press-fixed to the heat sink by the elastic member.

また、前記プリント基板の各コーナには切欠部が設けられ、同切欠部に対応した位置に前記ポストが突設されてなることを特徴としている。   Each corner of the printed circuit board is provided with a notch, and the post protrudes at a position corresponding to the notch.

また、前記取付部が、前記ポストの上部に設けられ、前記弾性部材をねじ締め固定するねじ孔からなることを特徴としている。   In addition, the attachment portion is provided at an upper portion of the post and includes a screw hole for screwing and fixing the elastic member.

また、前記弾性部材の先端部に係止部が突設される一方、前記プリント基板に、前記係止部を係止する係止孔が設けられてなることを特徴としている。   In addition, a locking portion protrudes from a tip portion of the elastic member, and a locking hole for locking the locking portion is provided in the printed board.

本発明によれば、パワーデバイスを実装したプリント基板にヒートシンクを位置ずれなく容易に取付できるようにしたヒートシンクの取付構造を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, the attachment structure of the heat sink which enabled it to attach easily to a printed circuit board which mounted the power device without position shift can be provided.

次に、本発明の実施形態について図面を参照しながら説明する。   Next, embodiments of the present invention will be described with reference to the drawings.

図１は本発明によるヒートシンク取付構造の分解斜視図であり、図２は本発明によるヒートシンク取付構造の説明図で、（Ａ）は斜視図、（Ｂ）は要部断面図、（Ｃ）は図２（Ａ）に示すＢ矢視図であり、図３は本発明によるヒートシンク取付構造の他の実施例を示す要部説明図で、（Ａ）は他の実施例の第一例を示す断面図、（Ａ）’は他の実施例の第二例を示す断面図、（Ｂ）は他の実施例の第三例を示す断面図である。   FIG. 1 is an exploded perspective view of a heat sink mounting structure according to the present invention, FIG. 2 is an explanatory view of the heat sink mounting structure according to the present invention, (A) is a perspective view, (B) is a cross-sectional view of the main part, 2A is a view taken in the direction of arrow B shown in FIG. 2A, FIG. 3 is an explanatory view of a main part showing another embodiment of the heat sink mounting structure according to the present invention, and FIG. 3A shows a first example of the other embodiment. Sectional drawing, (A) ′ is a sectional view showing a second example of another embodiment, and (B) is a sectional view showing a third example of the other embodiment.

本発明によるヒートシンクの取付構造は以下に詳述するようになっている。   The heat sink mounting structure according to the present invention is described in detail below.

すなわち、図１と図２（Ａ）とに示すように、ＳＭＤ(Surface Mount Device)１や、銅材からなるヒートスプレッダ１’ａ上に設置されたチップ部品１’等からなるパワーデバイスが、熱伝動性の高いセラミック製のプリント基板２上に実装されている。   That is, as shown in FIG. 1 and FIG. 2 (A), a power device comprising an SMD (Surface Mount Device) 1 or a chip component 1 ′ installed on a heat spreader 1′a made of a copper material is heated. It is mounted on a printed circuit board 2 made of ceramic having high electrical conductivity.

そして、パワーデバイスはその電力に応じて熱を発生し、その放熱性が充分でないと熱破壊に到ることがある。また、モータ駆動回路はパワーデバイスを複数個使用したＨブリッジ回路を使用しており、個々のパワーデバイスの放熱構造を良好にして効率よく放熱させる必要がある。   And a power device generates heat according to the electric power, and if the heat dissipation property is not sufficient, it may lead to thermal destruction. The motor drive circuit uses an H-bridge circuit using a plurality of power devices, and it is necessary to efficiently dissipate heat by improving the heat dissipation structure of each power device.

そのため、パワーデバイス実装済のプリント基板２で発生する熱を空気中に放熱できるようにヒートシンク３が用いられており、また、ヒートシンク３にはプリント基板２に接合する接合面３ｂに放熱グリス３ａが塗布されることで、プリント基板２で発生した熱を更に効果的に放熱できるようになっている。   Therefore, the heat sink 3 is used so that the heat generated in the printed circuit board 2 on which the power device is mounted can be dissipated in the air, and the heat sink 3 has a heat radiation grease 3a on the joint surface 3b joined to the printed circuit board 2. By being applied, the heat generated in the printed circuit board 2 can be radiated more effectively.

また、ヒートシンク３は、図１に示すように、接合面３ｂと、接合面３ｂの側部から下方に向けた段部３ｄと、段部３ｃの下端から水平に延びる下部水平面３ｄとを有した構成で、図１に示すＡ矢視図で凸形状に形成されている。   Further, as shown in FIG. 1, the heat sink 3 has a joint surface 3b, a step portion 3d directed downward from the side portion of the joint surface 3b, and a lower horizontal surface 3d extending horizontally from the lower end of the step portion 3c. In the configuration, it is formed in a convex shape as viewed in the direction of arrow A shown in FIG.

プリント基板２の側部には、ヒートシンク３の段部３ｃに対応する位置にリードフレーム９が立設されており、このリードフレーム９は、その基端部９ａがヒートシンク３の段部３ｃに接触しないようにプリント基板２を複数のポスト４で位置決めすることで、電気的に短絡しないように構成されている。   A lead frame 9 is erected on the side of the printed circuit board 2 at a position corresponding to the step portion 3 c of the heat sink 3, and the base end portion 9 a of the lead frame 9 contacts the step portion 3 c of the heat sink 3. The printed circuit board 2 is positioned by the plurality of posts 4 so as not to cause an electrical short circuit.

セラミック製のプリント基板２上には、ＳＭＤ(Surface Mount Device)１や、ヒートスプレッダ１’ａ上に設置されたチップ部品１’が搭載されるとともに、プリント基板２の各コーナには切欠部２ａが夫々設けられている。   On the printed circuit board 2 made of ceramic, an SMD (Surface Mount Device) 1 and a chip component 1 ′ installed on the heat spreader 1 ′ a are mounted, and each corner of the printed circuit board 2 has a notch 2 a. Each is provided.

一方、ヒートシンク３の接合面３ｂには、プリント基板２の各コーナに設けた切欠部２ａに対応する位置にポスト４が立設されており、このポスト４には、プリント基板２をヒートシンク３に押圧固定する弾性部材６を取り付けるための取付部が設けられている。   On the other hand, a post 4 is erected on the joint surface 3 b of the heat sink 3 at a position corresponding to the notch 2 a provided at each corner of the printed board 2, and the printed board 2 is attached to the heat sink 3 on the post 4. An attachment portion for attaching the elastic member 6 to be pressed and fixed is provided.

なお、上述した切欠部２ａに代えて、図示はしないが、ポスト４に切欠部を設けるように構成してもよく、その場合には、ポスト４に設けられた切欠部によってプリント基板２の各コーナを位置決めできるようになる。   Although not shown, the post 4 may be provided with a notch instead of the above-described notch 2a. In that case, each of the printed circuit boards 2 is provided by the notch provided in the post 4. The corner can be positioned.

ここで、プリント基板２にヒートシンク３を容易に、且つ正確に取り付けるヒートシンクの取付構造の一実施例について、図１と、図２（Ａ）、図２（Ｂ）および図２（Ｃ）とに基づいて詳細に説明する。   Here, an embodiment of a heat sink mounting structure for easily and accurately mounting the heat sink 3 to the printed circuit board 2 will be described with reference to FIGS. 1, 2A, 2B, and 2C. This will be described in detail.

弾性部材６は板ばねからなる部材であって、図１および図２（Ｂ）に示すように、弾性部材６の平坦な基端部６ｂには固定ねじ１０を通すための通し孔６ａが設けられ、基端部６ｂから先端部６ｃにかけては逆Ｕ字状に湾曲形成され、先端部６ｃは略平坦に形成されて、弾性を有してプリント基板２を押圧固定できる形状になっている。   The elastic member 6 is a member made of a leaf spring. As shown in FIGS. 1 and 2B, a flat base end portion 6b of the elastic member 6 is provided with a through hole 6a for allowing the fixing screw 10 to pass therethrough. The base end portion 6b and the tip end portion 6c are curved in an inverted U shape, and the tip end portion 6c is formed in a substantially flat shape so that the printed circuit board 2 can be pressed and fixed with elasticity.

弾性部材６の基端部６ｂが、通し孔６ａを通した固定ねじ１０をねじ孔７からなる取付部に螺着して取り付けられることにより、図２（Ａ）および図２（Ｂ）に示すように、板ばねからなる弾性部材６の先端部６ｃで、プリント基板２はヒートシンク３に押圧固定されている。   2A and 2B, the base end portion 6b of the elastic member 6 is attached by screwing the fixing screw 10 through the through hole 6a to the attachment portion including the screw hole 7. As described above, the printed circuit board 2 is pressed and fixed to the heat sink 3 at the tip 6c of the elastic member 6 made of a leaf spring.

弾性部材６の先端部６ｃは、ポスト４の周縁部、あるいはセラミック製のプリント基板２の周縁部を押圧しないで、プリント基板２の周縁部の少許内側をヒートシンク３に向けて押圧する構成になっている。   The tip 6c of the elastic member 6 is configured to press the inner side of the peripheral edge of the printed circuit board 2 toward the heat sink 3 without pressing the peripheral edge of the post 4 or the ceramic printed circuit board 2. ing.

セラミック製のプリント基板２は、熱伝動性が高い反面硬くて割れやすいことから、弾性部材６の基端部６ｂが、ねじ孔７からなる取付部に取り付けられた際、基端部６ｂから逆Ｕ字状に形成されることで弾性を有している先端部６ｃが、ポスト４の周縁部、あるいはセラミック製のプリント基板２の周縁部を押圧しないで、プリント基板２の周縁部の少許内側をヒートシンク３に向けて押圧する構成になっている。   The printed circuit board 2 made of ceramic has high thermal conductivity, but is hard and easily cracked. Therefore, when the base end portion 6b of the elastic member 6 is attached to the attachment portion including the screw hole 7, the reverse side from the base end portion 6b. The tip 6c having elasticity by being formed in a U-shape does not press the peripheral edge of the post 4 or the peripheral edge of the printed circuit board 2 made of ceramic. Is pressed toward the heat sink 3.

これにより、例えば、セラミック製のプリント基板２と、ヒートシンク３のポスト４との間に高さ方向の段差があって、プリント基板２がポスト４の上方に突出していたとしても、板ばねからなる弾性部材６は、逆Ｕ字状に折曲形成したことでプリント基板２とヒートシンク３との境界を避けているため、先端部６ｃでプリント基板２のとくに周縁部が擦られるということがなくなるので、大きい外力が作用して該箇所が欠けてしまうといった損傷の恐れがなくなる。   Thereby, for example, even if there is a step in the height direction between the ceramic printed board 2 and the post 4 of the heat sink 3, the printed board 2 is made of a leaf spring even if it protrudes above the post 4. Since the elastic member 6 is bent in an inverted U shape to avoid the boundary between the printed circuit board 2 and the heat sink 3, the peripheral edge portion of the printed circuit board 2 is not rubbed by the tip 6 c. , There is no risk of damaging the part due to the large external force.

その際、プリント基板２の切欠部２ａと、切欠部２ａに対応する位置に設けられたポスト４との間には、図２（Ａ）および図２（Ｂ）に示すような隙間ａが設けられていることから、プリント基板２にヒートシンク３の接合面３ｂを接合する際、切欠部２ａがポスト４に接触した状態でポスト４間に挟まれることがないので、プリント基板２を変形させたり損傷させてしまうことがない。   At that time, a gap a as shown in FIGS. 2A and 2B is provided between the notch 2a of the printed circuit board 2 and the post 4 provided at a position corresponding to the notch 2a. Therefore, when the joining surface 3b of the heat sink 3 is joined to the printed board 2, the notched portion 2a is not sandwiched between the posts 4 in a state where it is in contact with the posts 4, so that the printed board 2 can be deformed. It will not be damaged.

また、切欠部２ａの動きはポスト４間で規制されることになって、ヒートシンク３はプリント基板２に対し適正に位置決めできるようにするため、次のように構成されている。   Further, the movement of the notch 2a is regulated between the posts 4, and the heat sink 3 is configured as follows in order to enable proper positioning with respect to the printed circuit board 2.

プリント基板２の側部のリードフレーム９は、図２（Ａ）および図２（Ｃ）に示すように、その基端部９ａとプリント基板２に接合したヒートシンク３の接合面３ｂの周縁部（＝段部３ｃの上端位置）との隙間ｂと、プリント基板２の切欠部２ａおよびポスト４間の隙間ａとの関係が、「隙間ａ＜隙間ｂ」となる位置に立設されている。   As shown in FIGS. 2A and 2C, the lead frame 9 on the side portion of the printed circuit board 2 has a base end portion 9a and a peripheral portion of the bonding surface 3b of the heat sink 3 bonded to the printed circuit board 2 (see FIG. = The upper end position of the stepped portion 3c) and the relationship between the notch 2a of the printed circuit board 2 and the gap a between the posts 4 are erected at a position where "gap a <gap b".

これにより、プリント基板２の切欠部２ａがポスト４に接触する位置まで移動したとしても、この移動範囲となる隙間ａに較べて、基端部９ａとヒートシンク３の接合面３ｂの周縁部（＝段部３ｃの上端位置）との隙間ｂが大きいため、切欠部２ａの動きがポスト４間で規制されたことによる副次的効果として、リードフレーム９の基端部９ａがヒートシンク３に接触してしまう恐れがなくなり、したがって、リードフレーム９の基端部がヒートシンク３に電気的に短絡することがない。   Thereby, even if the cutout portion 2a of the printed circuit board 2 moves to a position where the cutout portion 2a contacts the post 4, the peripheral portion of the joint surface 3b of the base end portion 9a and the heat sink 3 (= As a secondary effect of the movement of the notch 2a being restricted between the posts 4, the base end 9a of the lead frame 9 contacts the heat sink 3 because the gap b with the upper end position of the step 3c is large. Therefore, the base end portion of the lead frame 9 is not electrically short-circuited to the heat sink 3.

次に、プリント基板２に対するヒートシンクの取付構造の他の実施例について、他の第一例を示す図３（Ａ）と、他の第二例を示す図３（Ａ）’と、他の第三例を示す図３（Ｂ）とに基づいて詳細に説明する。   Next, regarding another embodiment of the heat sink mounting structure for the printed circuit board 2, FIG. 3 (A) showing another first example, FIG. 3 (A) ′ showing another second example, This will be described in detail with reference to FIG.

弾性部材６の基端部６ｂが、他の第一例として図３（Ａ）に示すように、ねじ孔７からなる取付部に取り付けられた際、先端部６ｃが、ポスト４の周縁部、あるいはセラミック製のプリント基板２の周縁部を押圧しないで、プリント基板２の周縁部の少許内側をヒートシンク３に向けて押圧する構成になっている。   As shown in FIG. 3A as another first example, when the base end portion 6b of the elastic member 6 is attached to the attachment portion including the screw hole 7, the distal end portion 6c is the peripheral portion of the post 4, Alternatively, the inner periphery of the peripheral edge of the printed circuit board 2 is pressed toward the heat sink 3 without pressing the peripheral edge of the ceramic printed circuit board 2.

これにより、例えば、セラミック製のプリント基板２と、ヒートシンク３のポスト４との間に高さ方向の段差があって、プリント基板２がポスト４の上方に突出していたとしても、上述した一実施例の場合と同様に、板ばねからなる弾性部材６でプリント基板２のとくに周縁部が擦られるということがなくなるので、大きい外力が作用して該箇所が欠けてしまうといった損傷の恐れがなくなる。   Thus, for example, even if there is a step in the height direction between the ceramic printed board 2 and the post 4 of the heat sink 3, even if the printed board 2 protrudes above the post 4, the above-described implementation is performed. As in the case of the example, since the peripheral portion of the printed circuit board 2 is not rubbed by the elastic member 6 made of a leaf spring, there is no risk of damage such that the portion is lost due to a large external force.

また、弾性部材６の基端部６ｂが、ねじ孔７からなる取付部に取り付けられる際、弾性部材６の基端部６ｂに設けられた係止片６ｂ’がポスト４に設けられた係止溝４ａに係止することで、取付部に対して弾性部材６の位置決めができるようにしている。   Further, when the base end portion 6 b of the elastic member 6 is attached to the attachment portion including the screw hole 7, the locking piece 6 b ′ provided at the base end portion 6 b of the elastic member 6 is locked to the post 4. By locking in the groove 4a, the elastic member 6 can be positioned with respect to the mounting portion.

これにより、取付部をなすねじ孔７に対する基端部６ｂの通し孔６ａの位置合わせがしやすくなるので、固定ねじ１０をねじ孔７に螺着して基端部６ｂをねじ締め固定する作業を容易に、且つ正確に行えるようになるとともに、弾性部材６の姿勢を規制して、プリント基板２の周縁部の少許内側の所定位置を正確に押圧できるようになる。   This facilitates the positioning of the through hole 6a of the base end portion 6b with respect to the screw hole 7 forming the mounting portion, and the fixing screw 10 is screwed into the screw hole 7 to fix the base end portion 6b by screwing. The work can be easily and accurately performed, and the posture of the elastic member 6 is regulated so that a predetermined position on the inner side of the peripheral edge of the printed circuit board 2 can be accurately pressed.

また、他の第二例として図３（Ａ）’に示すように、弾性部材６の先端部６ｃに突設された係止部６ｄが、プリント基板２の周縁部の少許内側に穿設された係止孔２ｂに係止できるようにして、該箇所（係止孔２ｂの位置）をヒートシンク３に押圧できるように構成してもよく、これによって、プリント基板２は、その周縁部と弾性部材６の先端部６ｃとが係止部６ｄと係止孔２ｂとで位置決めされた状態でヒートシンク３に押圧固定できることになる。   As another second example, as shown in FIG. 3 (A) ′, a locking portion 6d protruding from the tip portion 6c of the elastic member 6 is formed on the inner side of the marginal portion of the printed circuit board 2. The portion (position of the locking hole 2b) can be configured to be pressed against the heat sink 3 so that the printed board 2 can be elastically coupled with its peripheral edge. The tip 6c of the member 6 can be pressed and fixed to the heat sink 3 in a state where the tip 6c is positioned by the locking portion 6d and the locking hole 2b.

または、他の第三例として図３（Ｂ）に示すように、略Ｕ字状に折曲された弾性部材６の基端部６ｂが、ポスト４の側部に設けられた凹陥状の保持孔８からなる取付部に収容されて保持されることにより、先端部６ｃに突設された係止部６ｄが、プリント基板２の周縁部の少許内側に穿設された係止孔２ｂに係止できるようにして、該箇所（係止孔２ｂの位置）をヒートシンク３に押圧するように構成してもよい。   Alternatively, as shown in FIG. 3B as another third example, the base end portion 6b of the elastic member 6 bent in a substantially U shape is held in a concave shape provided on the side portion of the post 4. By being accommodated and held in the mounting portion formed of the hole 8, the locking portion 6d protruding from the tip portion 6c is engaged with the locking hole 2b drilled on the inner side of the peripheral edge of the printed circuit board 2. You may comprise so that it can stop, and this location (position of the locking hole 2b) may be pressed on the heat sink 3. FIG.

これにより、弾性部材６の基端部６ｂをねじ締めにより固定する作業を省くことができるとともに、上述した他の第二例と同様に係止部６ｄを係止孔２ｂに係止することで、プリント基板２は、その周縁部が位置決めされた状態でヒートシンク３に押圧固定できることになる。   Thereby, the work of fixing the base end portion 6b of the elastic member 6 by screwing can be omitted, and the locking portion 6d can be locked to the locking hole 2b as in the other second example described above. The printed circuit board 2 can be pressed and fixed to the heat sink 3 in a state where the peripheral edge portion is positioned.

また、弾性部材６の基端部６ｂが、保持孔８からなる取付部に収容されて保持される際、基端部６ｂに設けられた係止片６ｂ’が、ポスト４に設けられた係止溝４ａに係止することで、保持孔８からなる取付部に対して弾性部材６を位置決めできるようになる。   Further, when the base end portion 6 b of the elastic member 6 is accommodated and held in the mounting portion including the holding hole 8, the engaging piece 6 b ′ provided on the base end portion 6 b is provided on the post 4. By locking in the stop groove 4a, the elastic member 6 can be positioned with respect to the mounting portion including the holding hole 8.

これにより、弾性部材６の基端部６ｂを保持部８で保持する作業が容易に、且つ正確に行えるようになるとともに、弾性部材６の姿勢を規制して、弾性部材６の係止部６ｄをプリント基板２の係止孔２ｂに位置決めしやすくなり、該箇所（係止孔２ｂの位置）を正確に押圧できるようになる。   As a result, the operation of holding the base end portion 6b of the elastic member 6 with the holding portion 8 can be easily and accurately performed, and the posture of the elastic member 6 is regulated to lock the engaging portion 6d of the elastic member 6. Can be easily positioned in the locking hole 2b of the printed circuit board 2, and the location (the position of the locking hole 2b) can be accurately pressed.

更に、弾性部材６によってプリント基板２をヒートシンク３に押圧固定するように構成したことで、プリント基板２をヒートシンク３に固定するのに熱硬化型の接着剤を用いる必要がなくなり、汎用的な放熱グリス３ａを使用することで硬化時間を不要とするといった副次的効果を奏することになる。   Further, since the printed circuit board 2 is pressed and fixed to the heat sink 3 by the elastic member 6, it is not necessary to use a thermosetting adhesive to fix the printed circuit board 2 to the heat sink 3. By using the grease 3a, there is a secondary effect that the curing time is not required.

本発明によるヒートシンク取付構造の分解斜視図である。It is a disassembled perspective view of the heat sink attachment structure by this invention. 本発明によるヒートシンク取付構造の説明図で、（Ａ）は斜視図であり、（Ｂ）は要部断面図であり、（Ｃ）は図２（Ａ）に示すＢ矢視図である。It is explanatory drawing of the heat sink attachment structure by this invention, (A) is a perspective view, (B) is principal part sectional drawing, (C) is B arrow view shown to FIG. 2 (A). 図３は本発明によるヒートシンク取付構造の他の実施例を示す要部説明図で、（Ａ）は他の実施例の第一例を示す断面図であり、（Ａ）’は他の実施例の第二例を示す断面図であり、（Ｂ）は他の実施例の第三例を示す断面図である。FIG. 3 is an explanatory view of a main part showing another embodiment of the heat sink mounting structure according to the present invention, (A) is a sectional view showing a first example of the other embodiment, and (A) ′ is another embodiment. It is sectional drawing which shows this 2nd example, (B) is sectional drawing which shows the 3rd example of another Example. 従来例によるヒートシンク取付構造の斜視図である。It is a perspective view of the heat sink attachment structure by a prior art example.

１ ＳＭＤ(Surface Mount Device)
１’ チップ部品
１’ａ ヒートスプレッダ
２ プリント基板
２ａ 切欠部
２ｂ 係止孔
３ ヒートシンク
３ａ 放熱グリス
３ｂ 接合面
３ｃ 段部
３ｄ 下部水平面
４ ポスト
４ａ 係止溝
６ 弾性部材
６ａ 通し孔
６ｂ 基端部
６ｂ’ 係止片
６ｃ 先端部
６ｄ 係止部
７ ねじ孔
８ 保持孔
９ リードフレーム
９ａ 基端部
１０ 固定ねじ 1 SMD (Surface Mount Device)
1 'chip component 1'a heat spreader 2 printed circuit board 2a notch 2b locking hole 3 heat sink 3a heat radiation grease 3b joint surface 3c step 3d lower horizontal surface 4 post 4a locking groove 6 elastic member 6a through hole 6b base end 6b' Locking piece 6c Tip 6d Locking portion 7 Screw hole 8 Holding hole 9 Lead frame 9a Base end portion 10 Fixing screw

Claims (4)

パワーデバイスが実装されたプリント基板と、ヒートシンクと、同ヒートシンクに突設された複数のポストと、同ポストに設けられた取付部と、同取付部に取り付けられた弾性部材とからなり、
前記プリント基板は、前記ポストにて前記ヒートシンクに位置決めされるとともに、前記弾性部材にて前記ヒートシンクに押圧固定してなることを特徴とするヒートシンクの取付構造。 It consists of a printed circuit board on which a power device is mounted, a heat sink, a plurality of posts protruding from the heat sink, an attachment portion provided on the post, and an elastic member attached to the attachment portion.
The printed circuit board is positioned on the heat sink by the post, and is pressed and fixed to the heat sink by the elastic member. 前記プリント基板の各コーナには切欠部が設けられ、同切欠部に対応した位置に前記ポストが突設されてなることを特徴とする請求項１に記載のヒートシンクの取付構造。   The heat sink mounting structure according to claim 1, wherein each corner of the printed circuit board is provided with a notch, and the post protrudes at a position corresponding to the notch. 前記取付部が、前記ポストの上部に設けられ、前記弾性部材をねじ締め固定するねじ孔からなることを特徴とする請求項１に記載のヒートシンクの取付構造。   The heat sink mounting structure according to claim 1, wherein the mounting portion includes a screw hole that is provided at an upper portion of the post and fastens and fixes the elastic member. 前記弾性部材の先端部に係止部が突設される一方、前記プリント基板に、前記係止部を係止する係止孔が設けられてなることを特徴とする請求項１または請求項３に記載のヒートシンクの取付構造。   4. A locking portion for locking the locking portion is provided in the printed circuit board, while a locking portion projects from the tip of the elastic member. The heat sink mounting structure described in 1.
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