JP6789619B2 - Sockets for electronic components and how to attach electronic components - Google Patents

Description

One aspect of the present invention relates to a socket for an electronic component and a method for mounting the electronic component.

Conventionally, sockets for electrically connecting electronic components to circuit boards have been known. This socket includes a holding portion for detachably holding an electronic component and is mounted on a circuit board. Such sockets are used, for example, to inspect the performance of electronic components.

For example, Patent Document 1 below describes a burn-in socket for fixing a semiconductor package on a pedestal when performing a burn-in test. The burn-in socket has a first package guide having an end that presses against the two sides of the semiconductor package and a second having an end that is located on the pedestal and presses against the other two sides of the semiconductor package. The package guide, the first clamp that moves the first package guide away from the position where the semiconductor package is fixed on the pedestal, and the second package guide that moves away from the position where the semiconductor package is fixed on the pedestal. It is provided with a second clamp to be moved.

Japanese Unexamined Patent Publication No. 2002-25732

With the burn-in socket described above, the first and second package guides and the first and second clamps are located above the semiconductor package. Such a package guide and clamp configuration may cause inconvenience when the burn-in socket is applied to other types of electronic components. For example, when an image sensor that is desirable to have nothing to block on the main surface side during operation or inspection is attached to the burn-in socket, the package guide or clamp is located on the main surface side of the image sensor. Therefore, the light is blocked in the area or direction where the package guide or clamp is located, and the image sensor cannot receive the light from that area or direction. Similarly, when the light emitting diode is attached to the burn-in socket described above, a part of the emitted light is blocked by the package guide or the clamp.

As one means of eliminating such inconvenience, it is conceivable to solder electronic components onto a circuit board without using a socket. However, if an electronic component is soldered for inspection, the terminals of the electronic component become dirty with solder, so that the electronic component cannot be reused after the inspection and the electronic component is thrown away.

Therefore, a socket for electrically connecting the electronic component to the circuit board without blocking the main surface side of the electronic component is desired.

The socket according to one aspect of the present invention is a socket that holds electronic components in a state of being electrically connectable to a circuit board, and is provided at one end of the socket and has a frame into which electronic components are inserted and an inner wall of the frame. Provided with at least one holding portion that is provided in the above and can move along a direction intersecting the inner wall, and the at least one holding portion moves along the direction of at least one side surface of the electronic component in the frame. By abutting against, the electronic component is held in the frame without covering the main surface of the electronic component.

In such a side surface, the holding portion provided on the inner wall of the frame abuts on the side surface of the electronic component, so that the electronic component is held without covering the main surface of the electronic component. Therefore, the electronic component can be electrically connected to the circuit board without blocking the main surface side of the electronic component.

According to one aspect of the present invention, the electronic component can be electrically connected to the circuit board without blocking the main surface side of the electronic component.

It is a perspective view which shows the use example of the socket which concerns on 1st Embodiment. It is an exploded perspective view corresponding to FIG. It is a perspective view of the socket which concerns on 1st Embodiment. It is a perspective view of a shaft member. It is a top view of the shaft member. It is a partially enlarged view which shows the frame before the electronic component is inserted. It is a plan view and a partially enlarged view which shows the frame in which an electronic component is inserted. It is a partially enlarged view which shows the state which the holding part holds an electronic component. It is a partially enlarged view which shows the state which the holding part holds an electronic component. It is a top view and a partially enlarged view which shows the frame which held the electronic component. It is a perspective view which shows the socket which concerns on 1st Embodiment holding an electronic component. It is a side view corresponding to FIG. It is a perspective view which shows the use example of the socket which concerns on 2nd Embodiment. It is an exploded perspective view corresponding to FIG. It is an exploded perspective view of the socket which concerns on 2nd Embodiment. It is a perspective view which shows the usage method of the socket which concerns on 2nd Embodiment. It is a side view which shows the socket which concerns on 2nd Embodiment which held the electronic component.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are designated by the same reference numerals, and duplicate description will be omitted.

(First Embodiment)
The configuration of the socket 1 according to the first embodiment will be described with reference to FIGS. 1 to 5. A socket is an article for electrically connecting an electronic component to a circuit board. Electronic components are components used in electrical products. The purpose of use of the socket 1 is not limited. For example, the socket 1 may be used to inspect the performance of an electronic product, may be used as a component for incorporating an electronic component into an electrical product, or may be used to achieve both of these purposes. You may. The electronic components connected to the circuit board via the socket 1 are also not limited. For example, the electronic component may have a function of emitting or receiving light (for example, a light emitting diode or an image sensor), or may not have such a function. Alternatively, the electronic component may have other functions. Other examples of electronic components include various sensors such as pressure sensors, temperature sensors, and barometric pressure sensors.

As shown in FIGS. 1 and 2, the socket 1 is attached to the main surface of the circuit board 70. In the examples shown in these figures, a backup plate 80 is arranged on the opposite side of the circuit board 70 from the socket 1, and the socket 1 and the backup plate 80 use bolts 81 (nuts may be further used). It is fixed to the substrate 70. The backup plate 80 is a component prepared to prevent the circuit board 70 from warping due to the pressure from the socket 1 by attaching the socket 1 to the circuit board 70. An insulating sheet (not shown) is arranged or processed for insulation on the side of the backup plate 80 in contact with the back surface (the surface opposite to the main surface) of the circuit board 70. The backup plate 80 is not an essential component when using the socket 1. For example, if there is no risk of the circuit board 70 warping, the backup plate 80 can be omitted.

As shown in FIGS. 1 to 3, the socket 1 exhibits a two-layer structure including a probe holder 10 for accommodating a plurality of conductive probes 11 and a frame 20 for accommodating electronic components. The electronic component held by the frame 20 is electrically connected to the circuit board 70 via a plurality of probes 11 in the probe holder 10. How the plurality of probes 11 are arranged in the probe holder 10 is determined according to the arrangement of the terminals of the electronic component to be inserted into the socket 1. In the present embodiment, the probe holder 10 and the frame 20 are integrated by bolts 81, but the method of integration is not limited to this. For example, another structure such as a latch mechanism may be used, or the probe holder 10 and the frame 20 may be integrally molded. In the present specification, the side of the probe holder 10 in contact with the circuit board 70 is defined as the lower side of the socket 1, and the side of the frame 20 is defined as the upper side of the socket 1.

A recess 22 into which an electronic component is inserted is formed in the end surface 21 of the frame 20. The end face 21 can also be said to be the end face or the upper surface of the socket 1. In the present embodiment, the shape of the outer edge of the recess 22 is rectangular, but the shape may be arbitrarily determined as long as it does not interfere with the insertion and holding of the electronic component. One ends of the plurality of probes 11 are exposed from the bottom of the recess 22.

The socket 1 does not include a component that covers the main surface of the electronic component inserted into the recess 22. Here, the "main surface of the electronic component" is a surface that faces upward when the electronic component is inserted into the recess 22, and can also be said to be a surface that can be visually recognized from above the socket 1 when the electronic component is inserted. .. "The main surface of an electronic component is not covered" means that at least when the socket 1 is looked down from directly above the socket 1 (when the angle between the line of sight and the main surface of the electronic component is a right angle), the electronic component is electronic. It means that the entire main surface of the component can be visually recognized without being blocked by anything.

The depth of the recess 22 is not limited. In the present embodiment, the depth of the recess 22 is such that the main surface of the inserted electronic component and the upper side of each side surface of the electronic component (the portion of each side surface that connects to the main surface of the electronic component) are the frame 20. It is set to be exposed from (or socket 1). When the inserted electronic component is exposed from the frame or socket, it means that a part of the electronic component can be seen when the socket is viewed from the side. Of course, the depth of the recess 22 may be set so that the electronic components cannot be visually recognized when the socket is viewed from the side.

The inner wall 23 of the frame 20 forming the recess 22 is provided with a holding portion (guide) 30 that can move along the direction intersecting the inner wall 23. In the present embodiment, four holding portions 30 are provided corresponding to the four sides forming the recess 22. As shown in FIG. 3, each holding portion 30 includes an elongated contact portion 31 extending along the inner wall 23, and L-shaped flanges 32 formed at both ends of the contact portion 31. While the abutting portion 31 is exposed from the inner wall 23, the flange 32 is housed in the frame 20 to prevent the holding portion 30 from popping out into the recess 22.

In the frame 20, a shaft member (guide roller) 40 for moving the holding portion 30 along the direction intersecting the inner wall 23 is provided on the outside of each holding portion 30. As shown in FIGS. 3 and 4, the shaft member 40 is a columnar member extending along the vertical direction of the frame 20. As shown in FIG. 4, a notch 41 for receiving a tool (for example, a screwdriver) for turning the shaft member 40 is formed at the upper end of the shaft member 40. The central portion of the shaft member 40 is processed so that the cross section orthogonal to the axial direction of the shaft member 40 exhibits an elliptical shape, and functions as a contact portion 42 in contact with the holding portion 30. Since the cross section of the contact portion 42 has an elliptical shape, the contact portion 42 has at least a first diameter D1 and a second diameter D2 larger than the first diameter D1 as shown in FIG. In the present embodiment, the first diameter D1 is the minor diameter of the contact portion 42, and the second diameter D2 is the major diameter of the contact portion 42. Each shaft member 40 is attached to the frame 20 by being inserted into a hole formed in the frame 20 having a diameter substantially the same as that of the shaft member 40. Therefore, each shaft member 40 rotates in the hole without substantially moving the shaft.

Next, a method of attaching the electronic component to the socket 1 will be described with reference to FIGS. 6 to 12. First, the user prepares the electronic component 90 and the socket 1. The socket 1 may or may not be already mounted on the circuit board 70.

Subsequently, the user adjusts the position of each holding portion 30 so that the electronic component 90 can be inserted into the frame 20 (more specifically, the recess 22). This adjustment is an operation for sufficiently ensuring a sufficient distance between the two holding portions 30 facing each other, whereby the user can easily insert the electronic component 90 into the frame 20 (recessed portion 22). Specifically, the user turns each shaft member 40 with a screwdriver or the like to make the diameter of the contact portion 42 along the direction orthogonal to the inner wall 23 smaller than the second diameter D2, so that the individual holding portions The 30 is displaced toward the inner wall 23 (that is, toward the outside of the frame 20). As shown in FIG. 6, the user turns the shaft member 40 so that the diameter R of the contact portion 42 along the direction orthogonal to the inner wall 23 becomes the first diameter D1 to obtain the corresponding holding portion 30 most. It may be shifted to the outer position. This diameter R can also be said to be the diameter of the contact portion 42 starting from the position of the contact portion 42 in contact with the holding portion 30. Alternatively, the user may shift the corresponding holding portion 30 outward by turning the shaft member 40 so that the diameter R is larger than the first diameter D1 and smaller than the second diameter D2.

After adjusting the position of the individual holding portions 30, the user inserts the electronic component 90 into the frame 20 (more specifically, the recess 22). At this point, as shown in FIG. 7, a gap C is formed between at least one holding portion 30 and the electronic component 90.

Subsequently, the user shifts the individual holding portions 30 toward the center of the frame 20 by turning the individual shaft members 40, and the individual holding portions 30 (more specifically) so that the electronic component 90 does not move in the frame 20. Each contact portion 31) is applied to the side surface of the electronic component 90. It can be said that this operation is for the user to shift the individual holding portions 30 toward the center of the recess 22. Alternatively, it can be said that the operation is for the user to shift the individual holding portions 30 in the direction away from the inner wall 23. As shown in FIG. 8, the user turns the shaft member 40 so that the diameter R of the contact portion 42 along the direction orthogonal to the inner wall 23 becomes the second diameter D2, thereby maximizing the corresponding holding portion 30. It may be shifted to the inner position. Alternatively, as shown in FIG. 9, the user turns the shaft member 40 so that its diameter R is larger than the first diameter D1 and smaller than the second diameter D2, so that the corresponding holding portion 30 is moved inward. You may shift it. In any case, by this operation, as shown in FIG. 10, each holding portion 30 (more specifically, each contact portion 31) presses the electronic component 90 from the side, so that the electronic component 90 is held in the frame 20. Will be done.

As shown in FIG. 11, the socket 1 holds the electronic component 90 in the frame 20 only by each holding portion 30, and does not have a structure that covers the main surface 91 of the electronic component 90. This means that nothing is provided on the end face 21 of the frame 20. As shown in FIG. 12, the electronic component 90 held by the frame 20 is exposed from the frame 20 (or socket 1). Therefore, as shown in FIG. 12, when the socket 1 is mounted on the circuit board 70, the maximum length La from the circuit board 70 to the end face 21 of the frame 20 is held in the frame 20 from the circuit board 70. It is shorter than the minimum length Lb up to the main surface 91 of the electronic component 90. However, as described above, the depth of the recess 22 may be set so that the electronic components cannot be seen when the socket is viewed from the side. In this case, the maximum length La becomes the minimum length Lb or more. ..

If necessary, the user can remove the electronic component 90 from the socket 1 by turning the shaft member 40 and shifting the holding portion 30 toward the inner wall 23.

(Second Embodiment)
The configuration of the socket 100 according to the second embodiment will be described with reference to FIGS. 13 to 15. The difference between the second embodiment and the first embodiment is a mechanism for shifting the holding portion. In the following, the differences from the first embodiment will be particularly described, and the same or equivalent matters as those in the first embodiment will be omitted.

As shown in FIGS. 13 and 14, the socket 100 is attached to the main surface of the circuit board 70. In the examples shown in these figures, the backup plate 80 is arranged on the side opposite to the socket 100 with the circuit board 70 interposed therebetween, and the socket 100 and the backup plate 80 are fixed to the circuit board 70 by using fasteners 181 such as bolts. .. However, as in the first embodiment, the backup plate 80 may not be used.

As shown in FIGS. 13 to 15, the socket 100 exhibits a two-layer structure including a probe holder 110 that houses a plurality of conductive probes 111 and a frame 120 that holds electronic components. In the present embodiment, the probe holder 110 and the frame 120 are integrated by the latch mechanism 190, but the method of integrating the probe holder 110 and the frame 120 is not limited as in the first embodiment. In the present specification, the side of the probe holder 110 in contact with the circuit board 70 is defined as the lower side of the socket 100, and the side of the frame 120 is defined as the upper side of the socket 100.

A recess 122 into which an electronic component is inserted is formed in the end surface 121 of the frame 120. The end face 121 can also be said to be the end face or the upper surface of the socket 100. Similar to the first embodiment, the shape of the recess 122 is not limited. From the bottom of the recess 122, one end of a plurality of probes 111 connected to terminals of electronic components is exposed.

Similar to the first embodiment, the socket 100 does not include a component that covers the main surface of the electronic component inserted into the recess 122.

The depth of the recess 122 is not limited. In the present embodiment, the depth of the recess 122 is such that the main surface of the inserted electronic component and the upper side of each side surface of the electronic component (the portion of each side surface that connects to the main surface of the electronic component) are the frame 120. It is set to be exposed from (or socket 100). Of course, the depth of the recess 122 may be set so that the electronic components cannot be visually recognized when the socket is viewed from the side.

The inner wall 123 of the frame 120 forming the recess 122 is provided with a holding portion (guide) 130 that can move along the direction intersecting the inner wall 123. In the present embodiment, four holding portions 130 are provided corresponding to the four sides forming the recess 122. As shown in FIG. 15, each holding portion 130 includes an elongated contact portion 131 extending along the inner wall 123, an L-shaped flange 132 formed at both ends of the contact portion 131, and the contact portion 131. It is provided with an annular portion 133 provided on the back side (the side accommodated in the frame 120). The annular portion 133 forms a through hole 134 extending along the vertical direction of the frame 120. The abutting portion 131 is exposed from the inner wall 123, whereas the flange 132 and the annular portion 133 are housed in the frame 120. The flange 132 prevents the holding portion 130 from popping out into the recess 122. In the present embodiment, a space (recess) is formed between the flange 132 and the annular portion 133, and the elastic member 135 is provided in the space. The elastic member 135 is arranged so as to expand and contract along the direction intersecting the inner wall 123 of the frame 120. In the present embodiment, the elastic member 135 is a compression spring, and when no external pressure is applied to the holding portion 130, the holding portion 130 is pushed out toward the center of the recess 122 (in the direction away from the inner wall 123).

An insertion port 124 corresponding to the through hole 134 of the holding portion 130 is formed in the end surface 121 of the frame 120. More specifically, the insertion port 124 is formed above the through hole 134 so that one insertion port 124 and one corresponding through hole 134 are connected along the vertical direction of the frame 120.

Next, a method of attaching the electronic component to the socket 100 will be described with reference to FIGS. 16 and 17.

First, the user prepares the electronic component 90 and the socket 100. The socket 100 may or may not already be mounted on the circuit board 70.

Subsequently, as shown in FIG. 16, the user inserts a wedge 200 into each insertion slot 124 to shift the corresponding holding portion 130 toward the inner wall 123 (ie, outward of the frame 120). The wedge 200 is a rod-shaped member having a tip portion 201 formed in a tapered shape. The wedge 200 is not a component of the socket 100, but may be provided with the socket 100. When the user inserts the wedge 200 into the insertion port 124 until the tip portion 201 reaches the through hole 134 of the holding portion 130, the annular portion 133 is pushed toward the outside of the frame 120 by the tip portion 201, so that the holding portion 130 Moves in that direction. When the user inserts the wedge 200 from each insertion port 124, a space for inserting the electronic component 90 is formed in the recess 122. At this time, each elastic member 135 is compressed, and elastic energy is generated there.

Subsequently, the user inserts the electronic component 90 into the frame 120 (more specifically, the recess 122) and then pulls out the individual wedges 200. Then, each holding portion 130 moves toward the center of the recess 122 (frame 120) due to the elastic force of the corresponding elastic member 135, and hits the side surface of the electronic component 90. More specifically, each contact portion 131 hits the side surface of the electronic component 90. It can be said that this operation is that the user moves the individual holding portions 130 toward the center of the recess 122, or that the user moves the individual holding portions 130 in a direction away from the inner wall 123.

The socket 100 holds the electronic component 90 in the frame 120 only by each holding portion 130, and does not have a structure that covers the main surface of the electronic component 90. This means that nothing is provided on the end face 121 of the frame 120. As shown in FIG. 17, the electronic component 90 held by the frame 120 is exposed from the frame 120 (or socket 100). Therefore, as shown in FIG. 17, when the socket 100 is mounted on the circuit board 70, the maximum length La from the circuit board 70 to the end face 121 of the frame 120 is held in the frame 120 from the circuit board 70. It is shorter than the minimum length Lb up to the main surface 91 of the electronic component 90. However, as described above, the depth of the recess 122 may be set so that the electronic components cannot be seen when the socket is viewed from the side. In this case, the maximum length La becomes the minimum length Lb or more. ..

If necessary, the user can remove the electronic component 90 from the socket 100 by inserting a wedge 200 into each insertion slot 124 and shifting the holding portion 130 toward the inner wall 123.

As described above, the socket according to one aspect of the present invention is a socket that holds an electronic component in a state of being electrically connectable to a circuit board, and is provided at one end of the socket into which the electronic component is inserted. It comprises a frame and at least one holding portion provided on the inner wall of the frame and movable along a direction intersecting the inner wall, and the at least one holding portion moves along the direction of electrons in the frame. By abutting at least one side surface of the component, the electronic component is held in the frame without covering the main surface of the electronic component.

The method of attaching an electronic component according to one aspect of the present invention includes a step of preparing the socket and the electronic component, a step of inserting the electronic component into the frame, and a direction in which at least one holding portion intersects the inner wall. It includes a step of holding the electronic component inserted in the frame by moving the electronic component.

In such a side surface, the holding portion provided on the inner wall of the frame abuts on the side surface of the electronic component, so that the electronic component is held without covering the main surface of the electronic component. Therefore, the electronic component can be electrically connected to the circuit board without blocking the main surface side of the electronic component. In the past, the only way to achieve such an electrical connection was to solder electronic components to the circuit board. However, by using the socket according to one aspect of the present invention, it is possible to remove and reuse the electronic component attached to the socket.

In sockets with other sides, the maximum length from the circuit board to the end face of the frame may be shorter than the minimum length from the circuit board to the main surface of the electronic component held in the frame. In this case, the main surface and some side surfaces of the electronic component are completely exposed from the frame. Therefore, the electronic component can be attached to the socket so that the main surface of the electronic component is not obstructed at all including its surroundings.

The socket according to the other side surface further comprises at least one shaft member corresponding to at least one holding portion, each shaft member having a contact portion in contact with the corresponding holding portion, and the contact portion is at least first. By having a diameter and a second diameter larger than the first diameter, the shaft member rotates, and the diameter of the contact portion changes from the position of the contact portion in contact with the corresponding holding portion as a base point. The corresponding holding portion may move along a direction intersecting the inner wall. The position of the holding portion can be easily adjusted by turning the shaft member having at least two diameters to change the position of the holding portion.

In the socket according to the other side surface, at least one insertion port into which a member for moving at least one holding portion is inserted may be formed on the end surface of the frame. In this case, the user can easily adjust the position of the holding portion by inserting an arbitrary member into the insertion port.

In the socket according to the other side surface, each holding portion may have an elastic member that expands and contracts along a direction intersecting the inner wall. In this case, since the holding portion can move due to the elastic force of the elastic member, the user does not have to adjust the position of the holding portion. Therefore, the position of the holding portion can be easily set.

In the socket according to the other side surface, the electronic component may have a function of emitting light or receiving light. Since the main surface and some sides of the electronic component held by the socket are not covered by the frame, the light emitted or received by the electronic component is not blocked by the socket. Therefore, the function of emitting or receiving light from the electronic component is not hindered. For example, the socket does not block the light emitted from the light emitting diode right beside it, nor does it block the light incident right beside the main surface of the image sensor.

The present invention has been described in detail above based on the embodiment. However, the present invention is not limited to the above embodiment. The present invention can be modified in various ways without departing from the gist thereof.

In the first embodiment, the cross section of the contact portion 42 of the shaft member 40 has an elliptical shape, but the cross section of the shaft member may have another shape as long as it has at least two diameters. For example, the cross-sectional shape of the shaft member may be a polygon such as a quadrangle or a hexagon.

In the second embodiment, the holding portion 130 has a compression spring as the elastic member 135, but the type of the elastic member is not limited. For example, a tension spring may be used, or an elastic member other than the spring may be used. The place where the elastic member is installed is not limited, and can be determined according to the function or type of the elastic member. Alternatively, in order to adjust the position of the holding portion in the second embodiment, the holding portion may have another means such as an adjuster instead of the elastic member.

1 ... Socket, 10 ... Probe holder, 11 ... Probe, 20 ... Frame, 21 ... Frame end face, 22 ... Recession, 23 ... Inner wall, 30 ... Holding part, 40 ... Shaft member, 42 ... Contact part, 70 ... Circuit board , 80 ... backup plate, 90 ... electronic component, 91 ... main surface of electronic component, 100 ... socket, 110 ... probe holder, 111 ... probe, 120 ... frame, 121 ... frame end face, 122 ... recess, 123 ... inner wall, 124 ... insertion port, 130 ... holding part, 133 ... annular part, 134 ... through hole, 135 ... elastic member, 200 ... wedge, D1 ... first diameter, D2 ... second diameter.

Claims (6)

A socket that holds electronic components in a state where they can be electrically connected to a circuit board.
A frame provided at one end of the socket into which the electronic component is inserted,
At least one holding portion provided on the inner wall of the frame and movable along a direction intersecting the inner wall .
A shaft member and at least one corresponding to the at least one holding portion are provided.
When the at least one holding portion moves along the direction and abuts on at least one side surface of the electronic component in the frame, the electronic component can be subjected to the electronic component without covering the main surface of the electronic component. The socket, which is held within the frame and does not have a structure covering the main surface, allows the electronic component to be electrically connected to the circuit board without covering the main surface .
Each shaft member has a contact portion in contact with the corresponding holding portion.
The contact portion has at least a first diameter and a second diameter larger than the first diameter.
The shaft member rotates and the diameter of the contact portion with respect to the position of the contact portion in contact with the corresponding holding portion changes, so that the corresponding holding portion moves along the direction intersecting with the inner wall. To do,
socket. A socket that holds electronic components in a state where they can be electrically connected to a circuit board.
A frame provided at one end of the socket into which the electronic component is inserted,
With at least one holding portion provided on the inner wall of the frame and movable along a direction intersecting the inner wall.
With
When the at least one holding portion moves along the direction and abuts on at least one side surface of the electronic component in the frame, the electronic component can be subjected to the electronic component without covering the main surface of the electronic component. The socket, which is held within the frame and does not have a structure covering the main surface, allows the electronic component to be electrically connected to the circuit board without covering the main surface.
At least one insertion slot into which a member for moving the at least one holding portion is inserted is formed on the end surface of the frame.
socket. Each holding portion has an elastic member that expands and contracts along a direction intersecting the inner wall.
The socket according to claim 2 . The maximum length from the circuit board to the end face of the frame is shorter than the minimum length from the circuit board to the main surface of the electronic component held in the frame.
The socket according to any one of claims 1 to 3 . The electronic component has a function of emitting light or receiving light.
The socket according to any one of claims 1 to 4 . The step of preparing the socket according to any one of claims 1 to 5 and the electronic component, and
The process of inserting the electronic component into the frame and
A method for attaching an electronic component, which includes a step of holding the electronic component inserted into the frame by moving the at least one holding portion along a direction intersecting the inner wall.

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