JP2017052905A - Resin composition, and molding film comprising coat layer prepared therefrom, molded film, and resin molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition which can form a coat layer having high adhesion to a film substrate and also excellent heat resistance, solvent resistance, and moisture-resistant adhesion.SOLUTION: The resin composition has, with respect to (A) thermoplastic resin 100 pts.mass, (B) polyfunctional thiol compound 5-25 pts.mass and (C) polyfunctional ene compound 5-35 pts.mass.SELECTED DRAWING: None

Description

  The present invention provides a resin composition capable of forming a coating layer having high adhesion to a film substrate and having excellent heat resistance, solvent resistance, and the like, and a molding comprising a coating layer using the resin composition The present invention relates to a film for molding, and a molded film and a resin molded product in which the molding film is attached to the surface.

  Conventionally, it is known that a thermoplastic resin is used as a resin composition for forming a coat layer on the surface of a film product or a resin product because it exhibits high adhesion to a film substrate. An example of this type of resin composition is Patent Document 1.

  By the way, this type of coating layer is not only applied directly to the surface of film products and resin products, but also manufactured separately as a molding film, which is an intermediate product in which a coating layer is laminated on one side of a film substrate. The molding film may be attached (molded) to the surface of a film product or resin product. In this case, the molding film as the intermediate product is stored and transported alone (in a state before being attached to a film product or the like) in a state where the coat layer is cured. However, in recent years, when a film for molding is stored alone, it is frequently stored in a warehouse where temperature is not adjusted (air-conditioning) in order to reduce management costs. This is the same also in the container in the shipping service.

  In this case, a molding film having a coating layer composed of a resin composition mainly composed of a thermoplastic resin is tacked to the surface of the coating layer when exposed to a high temperature atmosphere such as during shipping or storage in the warehouse in the summer. Property (adhesiveness) appears and the surface becomes sticky. However, when a film for forming having such a coating layer is wound and stored, for example, in the form of a roll, or in the case of being stacked and stored in the form of a sheet, when exposed to a high temperature, one of the overlapping forming films is a film. There arises a problem that the base material and the other coat layer are blocked (bonded). Therefore, the coating layer containing a thermoplastic resin as a main component is required to have heat resistance that does not exhibit tackiness on the surface even in a high temperature atmosphere and does not block.

  Thermoplastic resins generally have poor solvent resistance to solvents. Therefore, in the coat layer containing a thermoplastic resin as a main component, there arises a problem that the coat layer and the film substrate are peeled even when exposed to a solvent.

  Furthermore, when the coat layer mainly composed of a thermoplastic resin is exposed to a high-temperature and high-humidity atmosphere, the coating layer and the film base The problem of peeling occurs, and the moisture resistance adhesion is poor. That is, the thermoplastic resin has excellent adhesion to the film substrate, but is inferior in heat resistance, solvent resistance, and moisture resistance adhesion as described above.

JP-A-6-066553

  Therefore, the present invention has been accomplished in view of the above circumstances, and its purpose is to provide a coating layer having high adhesion to a film substrate and excellent in heat resistance, solvent resistance, and moisture resistance adhesion. It is in providing the resin composition which can be formed, the molding film provided with the coating layer which uses the said resin composition, the molding film which stuck the said film for molding on the surface, and the resin molded product.

（式中のａは２〜３の整数であり、ｂは０又は１であり、ｃは１〜２の整数であり、ａとｂとｃの和は４である。Ｒ^１は、メチレン基、エチレン基又はイソプロピレン基である。Ｒ^２は、下記（式２）又は（式３）で表される２価の官能基である。Ｒ^３は、メチル基又はエチル基である。Ｒ^４は、炭素数が１〜１２の炭化水素基である。）

（Ｒ^５は水素原子又はメチル基である。）

（Ｒ^５は水素原子又はメチル基である。）
（３）前記（Ｂ）成分が、下記（式４）示される多官能チオール化合物である、（１）に記載の樹脂組成物。

（式中のｄは２〜５の整数であり、ｅは０〜２の整数であり、ｆは１〜４の整数であり、ｄとｅとｆの和は６である。Ｒ^１は、メチレン基、エチレン基又はイソプロピレン基である。Ｒ^２は、下記（式２）又は（式３）で表される２価の官能基である。Ｒ^３は、メチル基又はエチル基である。Ｒ^４は、炭素数が１〜１２の炭化水素基である。Ｒ^６は下記（式５）で表される６価の官能基である。）

（Ｒ^５は水素原子又はメチル基である。）

（Ｒ^５は水素原子又はメチル基である。）

（４）前記（Ｂ）成分が、下記（式６）示される多官能チオール化合物である、（１）に記載の樹脂組成物。

（式中のｇは１であり、ｈは２である。Ｒ^７は下記（式７）で表される３価の基であり、Ｒ^８は下記（式２）又は下記（式３）で表される２価の基である。Ｒ^９は炭素数が１〜１２の炭化水素基である。）

（式中のＲ^１０は−ＣＨ_２−、−ＣＨ_２ＣＨ_２−、又はＣＨ_２ＣＨ（ＣＨ_３）−である。）

（Ｒ^５は水素原子又はメチル基である。）

（Ｒ^５は水素原子又はメチル基である。）
（５）前記（Ａ）成分１００質量部に対し、さらに（Ｄ）光重合開始剤を０．０１〜１０質量部含有する、（１）ないし（４）のいずれかに記載の樹脂組成物。
（６）フィルム基材の一方面に、（１）ないし（５）のいずれかに記載の樹脂組成物からなる未硬化のコート層を有する、成形用フィルム。
（７）前記未硬化のコート層を光硬化した、（６）に記載の成形用フィルム。
（８）（６）又は（７）に記載の成形用フィルムが、前記コート層を介してフィルム製品に貼着されている、成形フィルム。
（９）（６）又は（７）に記載の成形用フィルムが、前記コート層を介して樹脂製品の表面に貼着されている、樹脂成形品。 For this purpose, the present invention adopts the following means.
(1) A resin composition containing 5 to 25 parts by mass of (B) polyfunctional thiol compound and (C) 5 to 35 parts by mass of polyfunctional ene compound with respect to 100 parts by mass of (A) thermoplastic resin.
(2) The resin composition according to (1), wherein the component (B) is a polyfunctional thiol compound represented by the following (formula 1).

(In the formula, a is an integer of 2 to 3, b is 0 or 1, c is an integer of 1 to 2, and the sum of a, b and c is 4. R ¹ is a methylene group. R ² is a divalent functional group represented by the following (formula 2) or (formula 3), R ³ is a methyl group or an ethyl group, and R ⁴ is an ethylene group or an isopropylene group. Is a hydrocarbon group having 1 to 12 carbon atoms.)

(R ⁵ is a hydrogen atom or a methyl group.)

(R ⁵ is a hydrogen atom or a methyl group.)
(3) The resin composition according to (1), wherein the component (B) is a polyfunctional thiol compound represented by the following (formula 4).

(In the formula, d is an integer of 2 to 5, e is an integer of 0 to 2, f is an integer of 1 to 4, and the sum of d, e, and f is 6. R ¹ is methylene group, an ethylene group or an isopropylene group .R ² is .R ³ is a divalent functional group represented by the following (equation 2) or (formula 3) is a methyl group or an ethyl group. R ⁴ is a hydrocarbon group having 1 to 12 carbon atoms, and R ⁶ is a hexavalent functional group represented by the following (formula 5).

(R ⁵ is a hydrogen atom or a methyl group.)

(R ⁵ is a hydrogen atom or a methyl group.)

(4) The resin composition according to (1), wherein the component (B) is a polyfunctional thiol compound represented by the following (formula 6).

(In the formula, g is 1 and h is 2. R ⁷ is a trivalent group represented by the following (Formula 7), and R ⁸ is the following (Formula 2) or the following (Formula 3). R ⁹ is a hydrocarbon group having 1 to 12 carbon atoms.)

_(-CH 2 ^{R 10} in the formula _{-, - CH 2 CH 2 -} , or _CH 2 _{CH (CH 3)} - and is.)

(R ⁵ is a hydrogen atom or a methyl group.)

(R ⁵ is a hydrogen atom or a methyl group.)
(5) The resin composition according to any one of (1) to (4), further containing 0.01 to 10 parts by mass of (D) a photopolymerization initiator with respect to 100 parts by mass of the component (A).
(6) A forming film having an uncured coat layer made of the resin composition according to any one of (1) to (5) on one surface of a film substrate.
(7) The forming film according to (6), wherein the uncured coat layer is photocured.
(8) A molded film in which the molding film according to (6) or (7) is attached to a film product via the coat layer.
(9) A resin molded product, wherein the molding film according to (6) or (7) is adhered to the surface of the resin product via the coat layer.

  In addition, the invention described in (7), in other words, “a molding having a coating layer obtained by photocuring the resin composition according to any one of (1) to (5) on one surface of a film base material. It can be said to be a film for use. Alternatively, it can also be said to be “a film for molding having a coating layer comprising a photocured layer of the resin composition according to any one of (1) to (5) on one surface of a film base”. Furthermore, it can be said that “the molding film according to (6), wherein the uncured coat layer is photocured”.

  In the present invention, “XX to XX” indicating a numerical range means “XX or more and XX or less” unless otherwise specified.

  In the resin composition of the present invention, (B) a polyfunctional thiol compound and (C) a polyfunctional ene are blended in a well-balanced manner with respect to (A) the thermoplastic resin. Thereby, when storing and transporting as a forming film, it is possible to form a coat layer having high adhesion to the film substrate and excellent in heat resistance, solvent resistance, and moisture resistance adhesion. This is because a precise cross-linking network is formed by addition reaction of polyfunctional thiol and polyfunctional ene. Thereby, a moisture barrier property is also improved.

  On the other hand, the thioether bond produced by the thiol-ene reaction can be flexibly changed in bond angle and bond length as compared with bonds at atoms such as C, O, and N, so that there is little curing shrinkage and adhesion to the substrate is not lowered.

  The present invention is described in detail below. The resin composition of the present invention is a resin composition containing the following components (A), (B) and (C) as essential components, and optionally further containing a component (D).

<(A) Thermoplastic resin>
As a thermoplastic resin, the thermoplastic resin illustrated by patent document 1 is mentioned. Specific examples include a polyester resin, a polyamide resin, and a polymethacrylic resin. In addition, polyethylene, ethylene-vinyl acetate copolymer (EVA), modified EVA polymers such as saponified EVA and graft-modified EVA, ethylene / (meth) acrylate copolymers such as ethylene / (meth) ethyl acrylate (EEA), Ionomer resin obtained by partially neutralizing ethylene / (meth) acrylic acid copolymer, ethylene / propylene copolymer, ethylene / propylene / (meth) acrylic acid terpolymer, propylene polymer, vinyl aromatic compound and conjugated diene Examples thereof include a copolymer comprising a compound and a hydrogenated product thereof. Other polymers include vinyl acetate copolymer polymer, vinyl acetate-crotonic acid copolymer polymer, vinyl acetate-phthalic anhydride copolymer polymer, vinyl acetate-vinyl pyrrolidone polymer, cellulose derivative polymer, polyvinyl ether. Examples thereof include a polymer, a polyurethane polymer, a thermosetting resin polymer, a syndioctacic polypropylene, and an ethylene-propylene polymer.

  The weight average molecular weight of the thermoplastic resin is preferably 10,000 to 200,000. If the weight average molecular weight of the thermoplastic resin is smaller than 10,000, tackiness at high temperatures tends to be easily developed. On the other hand, if the weight average molecular weight is larger than 200,000, the solubility in other components may be lowered.

<(B) Polyfunctional thiol compound>
The polyfunctional thiol compound has a thiol group at the terminal. Especially, the thioether containing (meth) acrylate derivative represented by the following (Formula 1), (Formula 4), or (Formula 6) is mentioned. In addition, (meth) acrylate means an acrylate or a methacrylate. The polyfunctional thiol compound can be used alone or in combination of two or more.

（式中のａは２〜３の整数であり、ｂは０又は１であり、ｃは１〜２の整数であり、ａとｂとｃの和は４である。Ｒ^１は、メチレン基、エチレン基又はイソプロピレン基である。Ｒ^２は、下記（式２）又は（式３）で表される２価の官能基である。Ｒ^３は、メチル基又はエチル基である。Ｒ^４は、炭素数が１〜１２の炭化水素基である。）

(In the formula, a is an integer of 2 to 3, b is 0 or 1, c is an integer of 1 to 2, and the sum of a, b and c is 4. R ¹ is a methylene group. R ² is a divalent functional group represented by the following (formula 2) or (formula 3), R ³ is a methyl group or an ethyl group, and R ⁴ is an ethylene group or an isopropylene group. Is a hydrocarbon group having 1 to 12 carbon atoms.)

（式中のｄは２〜５の整数であり、ｅは０〜２の整数であり、ｆは１〜４の整数であり、ｄとｅとｆの和は６である。Ｒ^１は、メチレン基、エチレン基又はイソプロピレン基である。Ｒ^２は、下記（式２）又は（式３）で表される２価の官能基である。Ｒ^３は、メチル基又はエチル基である。Ｒ^４は、炭素数が１〜１２の炭化水素基である。Ｒ^６は下記（式５）で表される６価の官能基である。）

(In the formula, d is an integer of 2 to 5, e is an integer of 0 to 2, f is an integer of 1 to 4, and the sum of d, e, and f is 6. R ¹ is methylene group, an ethylene group or an isopropylene group .R ² is .R ³ is a divalent functional group represented by the following (equation 2) or (formula 3) is a methyl group or an ethyl group. R ⁴ is a hydrocarbon group having 1 to 12 carbon atoms, and R ⁶ is a hexavalent functional group represented by the following (formula 5).

（式中のｇは１であり、ｈは２である。Ｒ^７は下記（式７）で表される３価の基であり、Ｒ^８は下記（式２）又は下記（式３）で表される２価の基である。Ｒ^９は炭素数が１〜１２の炭化水素基である。）

(In the formula, g is 1 and h is 2. R ⁷ is a trivalent group represented by the following (Formula 7), and R ⁸ is the following (Formula 2) or the following (Formula 3). R ⁹ is a hydrocarbon group having 1 to 12 carbon atoms.)

（Ｒ^５は水素原子又はメチル基である。）

（Ｒ^５は水素原子又はメチル基である。）

（式中のＲ^１０は−ＣＨ_２−、−ＣＨ_２ＣＨ_２−、又はＣＨ_２ＣＨ（ＣＨ_３）−である。）

(R ⁵ is a hydrogen atom or a methyl group.)

(R ⁵ is a hydrogen atom or a methyl group.)

_(-CH 2 ^{R 10} in the formula _{-, - CH 2 CH 2 -} , or _CH 2 _{CH (CH 3)} - and is.)

  The thioether-containing (meth) acrylate derivatives represented by (Formula 1), (Formula 4), and (Formula 6) are modified with a part of thiol group to reduce the polarity more than the thiol group, thereby providing a highly polar site. Therefore, the compatibility with various thermoplastic resins (A) is improved. Thereby, it is easy to form a crosslinked network in the whole resin composition, and shows better blocking resistance, solvent resistance, and wet heat resistance. Further, a thiol compound having a functionality of 5 or less is more preferable. In the case of a thiol compound having 6 or more functional groups, the adhesive strength may be reduced due to a high crosslinking density and an increase in curing shrinkage.

  The weight average molecular weight of the polyfunctional thiol compound is preferably 350 to 1,500. Even if the weight average molecular weight of the polyfunctional thiol compound is smaller than 350, there is no problem with the adhesion, but the volatility tends to increase and the odor tends to increase. On the other hand, if the weight average molecular weight is larger than 1,500, there is no problem with the adhesion, but the solubility in other components may be lowered.

<(C) Polyfunctional ene compound>
Examples of the polyfunctional ene compound include polyfunctional (meth) acrylate, polyfunctional allyl, and polyfunctional vinyl ether.

（式中のｉは２〜８の整数であり、Ｒ^１１は炭素数２〜２０の炭化水素基、炭素数２〜４０のエーテル酸素（−Ｏ−）と炭化水素基のみからなる基、又はイソシアヌレート環若しくはイソシアヌレート環と炭化水素基のみからなる基であり、Ｒ^１２は水素原子またはメチル基である。） The polyfunctional (meth) acrylate as the component (C) has a (meth) acryloxy group at the terminal, and a preferred example thereof includes a compound represented by the following (formula 8). In addition, the polyfunctional (meth) acrylate which is (C) component can also be used individually by 1 type, and 2 or more types can also be mixed and used for it.

(Wherein i is an integer of 2 to 8 and R ¹¹ is a hydrocarbon group having 2 to 20 carbon atoms, a group consisting of ether oxygen (—O—) having 2 to 40 carbon atoms and a hydrocarbon group, or (Isocyanurate ring or a group consisting of an isocyanurate ring and a hydrocarbon group alone, and R ¹² is a hydrogen atom or a methyl group.)

  The (meth) acrylate equivalent of the polyfunctional (meth) acrylate is preferably 80 to 400 g / mol. When the (meth) acrylate equivalent is less than 80 g / mol, the (meth) acryloxy group per unit volume becomes excessive, and a large amount of (B) polyfunctional thiol compound thiol group and unreacted (meth) acryloxy group remain. By doing, the toughness of the contact bonding layer which hardened | cured the resin composition falls, and there exists a possibility that adhesiveness may fall. On the other hand, when the (meth) acrylate equivalent is greater than 400 g / mol, the (meth) acryloxy group concentration is extremely low, and the reaction efficiency with the thiol group of the (B) polyfunctional thiol compound is reduced. May decrease and adhesiveness may decrease.

（式中のｊは２〜８の整数であり、Ｒ^１３は炭素数２〜２０の炭化水素基、炭素数２〜４０のエーテル酸素（−Ｏ−）と炭化水素基のみからなる基、またはイソシアヌレート環若しくはイソシアヌレート環と炭化水素基のみからなる基である。） The polyfunctional allyl which is the component (C) has an allyl group at the terminal, and a preferred example thereof is a compound represented by the following (formula 9). In addition, the polyfunctional allyl which is (C) component can also be used individually by 1 type, and 2 or more types can also be mixed and used for it.

(In the formula, j is an integer of 2 to 8, and R ¹³ is a hydrocarbon group having 2 to 20 carbon atoms, a group consisting only of C 2 to 40 ether oxygen (—O—) and a hydrocarbon group, or This is a group consisting of an isocyanurate ring or an isocyanurate ring and a hydrocarbon group only.)

  The allyl equivalent of the polyfunctional allyl is preferably 80 to 200 g / mol. When the allyl equivalent is less than 80 g / mol, the allyl group per unit volume becomes excessive and (B) the thiol group of the polyfunctional thiol compound and a large amount of unreacted allyl group remain, whereby the resin composition for the adhesive layer There is a possibility that the toughness of the adhesive layer obtained by curing the product is lowered and the adhesiveness is lowered. On the other hand, when the allyl equivalent is greater than 200 g / mol, the allyl group concentration is extremely low, so that the reaction efficiency with the thiol group of the (B) polyfunctional thiol compound decreases, and the toughness of the adhesive layer decreases, and the adhesiveness May decrease.

（式中のｋは２〜８の整数であり、Ｒ^１４は炭素数２〜２０の炭化水素基、炭素数２〜４０のエーテル酸素（−Ｏ−）と炭化水素基のみからなる基、またはイソシアヌレート環若しくはイソシアヌレート環と炭化水素基のみからなる基である。） The polyfunctional vinyl ether which is the component (C) has a vinyl ether group at the terminal, and preferred examples thereof include compounds represented by the following (formula 10). In addition, the polyfunctional vinyl ether which is (C) component can also be used individually by 1 type, and 2 or more types can also be mixed and used for it.

(In the formula, k is an integer of 2 to 8 and R ¹⁴ is a hydrocarbon group having 2 to 20 carbon atoms, a group consisting of ether oxygen (—O—) having 2 to 40 carbon atoms and a hydrocarbon group, or This is a group consisting of an isocyanurate ring or an isocyanurate ring and a hydrocarbon group only.)

The vinyl ether equivalent of the polyfunctional vinyl ether is preferably 60 to 200 g / mol. When the vinyl ether equivalent is less than 60 g / mol, the vinyl ether group per unit volume becomes excessive, and (B) the thiol group of the polyfunctional thiol compound and a large amount of unreacted vinyl ether group remain, whereby the resin composition for the adhesive layer There is a possibility that the toughness of the adhesive layer obtained by curing the product is lowered and the adhesiveness is lowered. On the other hand, when the vinyl ether equivalent is larger than 200 g / mol, the vinyl ether group concentration is remarkably low, so that the reaction efficiency with the thiol group of the (B) polyfunctional thiol compound is lowered, so that the toughness of the adhesive layer is lowered, and the adhesiveness May decrease.

  The weight average molecular weight of the polyfunctional ene is preferably 100 to 1,000. Even if the weight average molecular weight of the polyfunctional ene is less than 100, there is no problem with the adhesion, but the volatility tends to increase and the odor tends to increase. On the other hand, when the weight average molecular weight is larger than 1,000, there is no problem with the adhesion, but the solubility in other components may be lowered.

<(D) Photopolymerization initiator>
The photopolymerization initiator is optionally added to promote the reaction between the thiol group and the vinyl group, and can reduce the light irradiation necessary for curing the resin composition, thereby reducing the tact time of the light irradiation time. It can be shortened. Examples of the photopolymerization initiator include a photoradical polymerization initiator, a photocationic polymerization initiator, and a photoanionic polymerization initiator. The photoradical polymerization initiator is preferably used for shortening the reaction time, the photocationic polymerization initiator is preferably used for reducing curing shrinkage, and the photoanionic polymerization initiator is used in the field of electronic circuits and the like. It is preferable to use it when imparting adhesiveness. In addition, although it can accelerate | stimulate hardening of a resin composition by heating also in a thermal-polymerization initiator, since storage stability may fall, it is unpreferable.

  Examples of the radical photopolymerization initiator include 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, and 2-hydroxy-2-methyl-1-phenyl-propane. -1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2 -Hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methyl-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc. It is.

  Examples of the cationic photopolymerization initiator include bis (4-tert-butylphenyl) iodonium hexafluorophosphate, bis (4-tert-butylphenyl) iodonium trifluoromethanesulfonate, cyclopropyldiphenylsulfonium tetrafluoroborate, and diphenyl. Iodonium hexafluorophosphate, diphenyliodonium hexafluoroarsenate, 2- (3,4-dimethoxystyryl) -4,6-bis (trichloromethyl) -1,3,5-triazine, triphenylsulfonium tetrafluoroborate, Examples include triphenylsulfonium bromide, tri-p-tolylsulfonium hexafluorophosphate, tri-p-tolylsulfonium trifluoromethanesulfonate, and the like.

  Examples of the photoanionic polymerization initiator include acetophenone o-benzoyloxime, nifedipine, 2- (9-oxoxanthen-2-yl) propionic acid 1,5,7-triazabicyclo [4,4,0] deca- 5-ene, 2-nitrophenylmethyl 4-methacryloyloxypiperidine-1-carboxylate, 1,2-diisopropyl-3- [bis (dimethylamino) methylene] guanidinium 2- (3-benzoylphenyl) propionate, 1,2 -Dicyclohexyl-4,4,5,5-tetramethylbiguanidinium n-butyltriphenylborate and the like.

<Composition ratio of resin composition (mixing balance)>
The resin composition is blended such that (B) the polyfunctional thiol compound is 5 to 25 parts by mass and (C) the polyfunctional ene compound is 5 to 35 parts by mass with respect to (A) 100 parts by mass of the thermoplastic resin. . (B) When the compounding quantity of a polyfunctional thiol compound is less than 5 mass parts or exceeds 25 mass parts, it exists in the tendency for the heat resistance of the obtained coating layer, solvent resistance, and moisture resistance to be inferior. Moreover, when the compounding quantity of (C) polyfunctional ene compound is less than 5 mass parts or exceeds 35 mass parts, it exists in the tendency for heat resistance, solvent resistance, and moisture resistance to be inferior.

  (D) When mix | blending a photoinitiator as an arbitrary component, 0.01-10 mass parts of (D) photoinitiator is preferable with respect to 100 mass parts of (A) thermoplastic resins, Preferably it is 0.1-0.1. It mix | blends so that it may become 5 mass parts. When the blending amount of the component (D) is less than 0.01 parts by mass with respect to 100 parts by mass of the component (A), a large amount of integrated light is required for the reaction between the thiol group and the vinyl group to proceed. On the other hand, when it exceeds 10 parts by mass, the crosslinking density is lowered, and the heat resistance and solvent resistance of the resulting coating layer may be lowered.

The resin composition can be cured by irradiating light. Examples of the light to be irradiated include active energy rays such as UV (ultraviolet rays) and EB (electron beams). When the resin composition comprising the component (D), the amount of light irradiation to be usually 2,500 mJ / cm ² about required, it is possible to reduce to about 100 mJ / cm ^2.

  The resin composition may be used by diluting with an organic solvent in order to make the reaction system uniform and facilitate coating. Examples of such organic solvents include alcohol solvents, aromatic hydrocarbon solvents, ether solvents, ester solvents, ether ester solvents, ketone solvents, and phosphate ester solvents. These organic solvents are preferably suppressed to a blending amount of less than 10,000 parts by weight with respect to 100 parts by weight of the resin composition, but basically the solvent is volatilized when it becomes a cured film. The physical properties of the coated layer are not greatly affected.

<Film for molding>
A resin composition is an intermediate product that is applied to one surface of a film base material, and is used as it is as an uncured coat layer or a photocured coat layer, to be adhered to an object to be adhered such as a film product or a resin product. It can be set as the film for shaping | molding which is. However, a molding film having an uncured coat layer is applied to an object to be adhered immediately after the uncured coat layer is applied and formed, and if the coat layer is not photocured, it can be stored and transported alone. I can't. On the other hand, a molding film having a photo-cured coating layer can be stored and transported alone by rolling or laminating a large number of sheets in a developed state.

  The film substrate is not particularly limited, and not only a polar substrate such as a polyethylene terephthalate (PET) film or a polycarbonate (PC) film but also a nonpolar substrate such as a polyolefin film can be used.

<Molded film and resin molded product>
In order to attach (mold) a molding film to an object to be adhered such as a film product or a resin product, the coating layer is placed on the surface of the object to be adhered, and the temperature is around 90 ° C. for several minutes. What is necessary is just to heat press. Even a molding film having an uncured coating layer can be stuck (molded) by hot pressing while the coating layer is uncured. Thereby, the shaping | molding film and the resin molded product by which the film for shaping | molding is affixed on the film product via the coat layer can be obtained. That is, a molded film or a resin molded product having a coating layer on the surface can be obtained. In addition, as a film product, the optical film etc. which are applied to a liquid crystal display device, for example are mentioned.

(Examples 1-1 to 1-23)
Each component shown in Table 1 was blended at the blending ratio shown in Table 1, and melted and kneaded with a pressure kneader to obtain a resin composition.

(Examples 2-1 to 2-23)
Each component shown in Table 2 was blended at a blending ratio shown in Table 2, and melted and kneaded with a pressure kneader to obtain a resin composition.

(Comparative Examples 1-1 to 1-15)
Each component shown in Table 3 was blended at a blending ratio shown in Table 3, and melted and kneaded with a pressure kneader to obtain a resin composition.

(Comparative Examples 2-1 to 2-15)
Each component shown in Table 4 was blended at a blending ratio shown in Table 4, and melted and kneaded with a pressure kneader to obtain a resin composition.

Ｂ−５：チオエーテル含有アクリレート誘導体；下記（式１２）

Ｂ−６：チオエーテル含有アクリレート誘導体；下記（式１３）

Ｃ−１：ジメチロール-トリシクロデカンジアクリレート
Ｃ−２：ジペンタエリスリトールヘキサアクリレート
Ｃ−３：エトキシ化イソシアヌル酸トリアクリレート
Ｃ−４：ビスフェノールＡのＥＯ付加物ジメタクリレート
Ｃ−５：トリメチロールプロパントリメタクリレート
Ｃ−６：１，６−ヘキサンジオールジメタクリレート
Ｃ−７：１，３−ジアリル−５−メチル−１，３，５−トリアジン−２，４，６（１Ｈ，３Ｈ，５Ｈ）−トリオン
Ｃ−８：トリアリルイソシアヌレート
Ｃ−９：ペンタエリスリトールトリアリルエーテル
Ｃ−１０：１，４−ブタンジオールジビニルエーテル
Ｃ−１１：シクロヘキサンジメタノールジビニルエーテル
Ｄ−１：２−ヒドロキシ−２−メチル−１−フェニル−プロパン−１−オン
Ｂ’−１：１−オクタンチオール
Ｃ’−１：イソボルニルアクリレート
Ｃ’−２：２−エチルヘキシルメタクリレート
Ｃ’−３：アリルエチルエーテル
Ｃ’−４：シクロヘキシルビニルエーテル In addition, each component shown to Tables 1-4 is as follows.
A-1: Styrene / isoprene / styrene block polymer “Califlex TR-1107” manufactured by Shell Chemicals Japan, which is a copolymer comprising a vinyl aromatic compound and a conjugated diene compound
A-2: Polyester resin “Ester Resin 200” manufactured by Toyobo Co., Ltd.
A-3: Polyamide resin “Macromelt 6801” manufactured by Henkl
A-4: Polymethacrylic resin “DEGALAN P24” manufactured by EVONIC INDUSTRIES
B-1: Trimethylolpropane tris (3-mercaptopropionate); TMMP
B-2: Dipentaerythritol hexakis (3-mercaptopropionate); DPMP
B-3: Tris-[(3-mercaptopropionyloxy) -ethyl] -isocyanurate; TEMPIC
B-4: Thioether-containing acrylate derivative;

B-5: Thioether-containing acrylate derivative;

B-6: Thioether-containing acrylate derivative;

C-1: Dimethylol-tricyclodecane diacrylate C-2: Dipentaerythritol hexaacrylate C-3: Ethoxylated isocyanuric acid triacrylate C-4: EO adduct dimethacrylate of bisphenol A C-5: Trimethylolpropane tri Methacrylate C-6: 1,6-hexanediol dimethacrylate C-7: 1,3-diallyl-5-methyl-1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione C -8: triallyl isocyanurate C-9: pentaerythritol triallyl ether C-10: 1,4-butanediol divinyl ether C-11: cyclohexanedimethanol divinyl ether D-1: 2-hydroxy-2-methyl-1 -Phenyl-propan-1-one B'-1: 1- Kutanchioru C'-1: isobornyl acrylate C'-2: 2-ethylhexyl methacrylate C'-3: Allyl ether C'-4: cyclohexyl vinyl ether

[Evaluation of storage stability]
About the obtained resin composition of each Example and a comparative example, the storage stability was evaluated as follows. A 20% solution was prepared by dissolving in tetrahydroxyfuran, and the initial viscosity was measured. Separately, the adhesive layer resin composition was allowed to stand at 50 ° C. for 60 days in a sealed container, and after 60 days, dissolved in tetrahydroxyfuran to prepare a 20% solution, and the viscosity was measured. The value of viscosity / initial viscosity after 60 days was calculated and evaluated. The evaluation results are also shown in Tables 1 and 2.
A: (viscosity after 60 days / initial viscosity) less than 1.02 ○: (viscosity after 60 days / initial viscosity) of 1.02 or more and less than 1.50 x: (after 60 days) (Viscosity / initial viscosity) value of 1.50 or more

<Production of film>
The resin composition of each Example and Comparative Example melted with a tank-type hot melt applicator was applied to a thickness of 50 μm on a film substrate with a die coater, and UV-irradiated to obtain a film having a coating layer. In addition, as a film base material, Toray Co., Ltd. product, "Lumirror U46-100" PET film was used. For UV irradiation, a UV lamp system “Light Hammer 6” manufactured by Heraeus Noblelight Fusion Ubuy Co., Ltd. was used, and an H bulb was used as the lamp bulb. About the obtained coating layer of each film, adhesiveness, heat resistance, solvent resistance, and wet heat resistance were measured and evaluated by the following methods. The results are also shown in Tables 1 and 2.

[Evaluation of adhesion 1 (high dose)]
Samples after 2500 mJ / cm ² UV irradiation conform to JIS K 5600-5-6: 1999 “Paint General Test Methods—Part 5: Mechanical Properties of Coating Film—Section 6: Adhesion (Cross Cut Method)” The adhesion was evaluated. In order to serve the purpose of the present invention, the evaluation requires 100/100.
A: 100/100
○: 100/100, but lacked edge ×: less than 100/100

[Evaluation of adhesion 2 (low dose)]
Sample after 100 mJ / cm ² UV irradiation compliant with JIS K 5600-5-6: 1999 “General test methods for coating materials – Part 5: Mechanical properties of coating films – Section 6: Adhesion (cross-cut method)” The adhesion was evaluated. In order to serve the purpose of the present invention, the evaluation requires 100/100.
A: 100/100
○: 100/100, but lacked edge ×: less than 100/100

[Evaluation of heat resistance]
A PET film as an opposing substrate was overlaid on the sample after 2500 mJ / cm ² UV irradiation, and was hot-pressed at 50 ° C., 15 kg / cm ² for 200 hours using a hot press machine. After hot pressing, the sample was air-cooled to room temperature, a 90 ° peel test (peel rate 100 mm / min, 23 °, 50% environment) was performed, and the adhesion was measured and evaluated as follows. In order to serve the object of the present invention, the evaluation needs to be better than ○.
A: No contact at all (PET of the opposite substrate falls over)
○: The counter substrate does not fall over, but the adhesion is less than 5 mN / 25 mm. Δ: The adhesion is 5 mN / 25 mm or more and less than 50 mN / 25 mm. X: The adhesion is 50 mN / 25 mm or more.

[Evaluation of solvent resistance]
The sample after 2500 mJ / cm ² UV irradiation was immersed in the following solvent for 30 minutes. Then, after taking out the sample and drying it, it conforms to JISK 5600-5-6: 1999 “Paint General Test Method-Part 5: Mechanical Properties of Coating Film—Section 6: Adhesion (Crosscut Method)” Evaluation of adhesion and appearance after taking out were observed. In order to serve the object of the present invention, the evaluation needs to be better than ○.
Solvent: Toluene, xylene, tetrachloroethylene, gasoline, acetone, isopropyl alcohol, hexane ◎: All solvents showed the same adhesion as before immersion ○: All solvents showed the same adhesion as before immersion , Whitening was confirmed immediately after the sample was taken out from the solvent with some solvent. Δ: Some solvent with lower adhesion than before dipping. ×: Peeling during immersion with some solvent. What

[Evaluation of moisture adhesion]
The sample after 2500 mJ / cm ² UV irradiation was allowed to stand for 100 hours in a constant temperature and humidity chamber at 85 ° C. and 85%. Thereafter, the adhesion was evaluated in accordance with JIS K 5600-5-6: 1999 “Paint General Test Method—Part 5: Mechanical Properties of Coating Film—Section 6: Adhesion (Crosscut Method)”. . In order to serve the purpose of the present invention, the evaluation needs to be ○.
A: 100/100
○: 100/100, but the edge was missing Δ: Less than 100/100 90/100 or more ×: Less than 90/100

  From the results in Table 1, the curable resin compositions of Examples 1-1 to 1-5 exhibited high adhesion, heat resistance, solvent resistance, and moist heat resistance. Furthermore, the curable resin composition of Examples 1-6 to 1-23 is more excellent in heat resistance and good solvent resistance than Examples 1-1 to 1-5 by using the more preferable component (B). Sex was confirmed. Further, from the results of Table 2, since Examples 2-1 to 2-4 and 2-6 to 2-23 contain a photoinitiator, adhesion evaluation 2 (low irradiation amount) was good. It was.

  On the other hand, from the results of Tables 3 and 4, since Comparative Examples 1-1 and 2-1 did not contain the essential component (B) and component (C), the heat resistance, solvent resistance, and moist heat resistance were poor.

  Since Comparative Examples 1-2 and 2-2 did not contain the essential component (C), the heat resistance, solvent resistance, and moist heat resistance were poor.

  Since Comparative Examples 1-3, 1-4, 2-3, and 2-4 do not contain the essential component (B), adhesion, heat resistance, solvent resistance, and moist heat resistance were inferior.

  In Comparative Examples 1-5 to 1-8 and 2-5 to 2-8, since the component (C) is not a polyfunctional ene compound, the heat resistance, solvent resistance, and moist heat resistance were inferior.

  In Comparative Examples 1-9 and 2-9, the component (B) was not a polyfunctional thiol compound, and thus the adhesion, heat resistance, solvent resistance, and moist heat resistance were poor.

  Since Comparative Example 1-10 and 2-10 had few compounding quantities of (B) component, adhesiveness, heat resistance, solvent resistance, and heat-and-moisture resistance were inferior.

  Since Comparative Examples 1-11 and 2-11 contained a large amount of the component (B), the heat resistance, solvent resistance, and moist heat resistance were inferior.

  In Comparative Examples 1-12 and 2-12, since the blending amount of the component (C) was small, the heat resistance, solvent resistance, and moist heat resistance were inferior.

  Since Comparative Examples 1-13 and 2-13 contained a large amount of the component (C), the adhesion, heat resistance, solvent resistance and wet heat resistance were poor.

  Since Comparative Examples 1-14 and 2-14 did not contain the essential component (A) and component (B), the adhesion, heat resistance, solvent resistance, and moist heat resistance were poor.

Since Comparative Examples 1-15 and 2-15 did not contain the essential component (A), the adhesion and wet heat resistance were inferior.

Claims (9)

(A) For 100 parts by mass of thermoplastic resin,
(B) 5 to 25 parts by mass of a polyfunctional thiol compound,
(C) A resin composition containing 5 to 35 parts by mass of a polyfunctional ene compound. The resin composition according to claim 1, wherein the component (B) is a polyfunctional thiol compound represented by the following (formula 1).

(In the formula, a is an integer of 2 to 3, b is 0 or 1, c is an integer of 1 to 2, and the sum of a, b and c is 4. R ¹ is a methylene group. R ² is a divalent functional group represented by the following (formula 2) or (formula 3), R ³ is a methyl group or an ethyl group, and R ⁴ is an ethylene group or an isopropylene group. Is a hydrocarbon group having 1 to 12 carbon atoms.)

(R ⁵ is a hydrogen atom or a methyl group.)

(R ⁵ is a hydrogen atom or a methyl group.) The resin composition according to claim 1, wherein the component (B) is a polyfunctional thiol compound represented by the following (formula 4).

(In the formula, d is an integer of 2 to 5, e is an integer of 0 to 2, f is an integer of 1 to 4, and the sum of d, e, and f is 6. R ¹ is methylene group, an ethylene group or an isopropylene group .R ² is .R ³ is a divalent functional group represented by the following (equation 2) or (formula 3) is a methyl group or an ethyl group. R ⁴ is a hydrocarbon group having 1 to 12 carbon atoms, and R ⁶ is a hexavalent functional group represented by the following (formula 5).

(R ⁵ is a hydrogen atom or a methyl group.)

(R ⁵ is a hydrogen atom or a methyl group.)

The resin composition according to claim 1, wherein the component (B) is a polyfunctional thiol compound represented by the following (formula 6).

(In the formula, g is 1 and h is 2. R ⁷ is a trivalent group represented by the following (Formula 7), and R ⁸ is the following (Formula 2) or the following (Formula 3). R ⁹ is a hydrocarbon group having 1 to 12 carbon atoms.)

_(-CH 2 ^{R 10} in the formula _{-, - CH 2 CH 2 -} , or _CH 2 _{CH (CH 3)} - and is.)

(R ⁵ is a hydrogen atom or a methyl group.)

(R ⁵ is a hydrogen atom or a methyl group.)   The resin composition according to any one of claims 1 to 4, further comprising 0.01 to 10 parts by mass of (D) a photopolymerization initiator with respect to 100 parts by mass of the component (A).   A molding film having an uncured coating layer comprising the resin composition according to any one of claims 1 to 5 on one surface of a film substrate.   The molding film according to claim 6, wherein the uncured coat layer is photocured.   A molded film, wherein the molding film according to claim 6 or 7 is attached to a film product via the coat layer.   A resin molded product, wherein the molding film according to claim 6 or 7 is adhered to the surface of the resin product via the coat layer.