JP6699177B2 - Resin composition, molding film provided with coat layer using the same, molding film, and resin molded article - Google Patents

Description

  The present invention has a resin composition capable of forming a coat layer having high adhesion to a film substrate and also having excellent heat resistance, solvent resistance, and the like, and a molding provided with the coat layer using the resin composition. Film, a molding film having the molding film adhered to the surface thereof, and a resin molded product.

  Conventionally, a polyolefin resin modified with maleic anhydride (hereinafter referred to as a maleic anhydride-modified polyolefin resin) has excellent adhesiveness not only to polar substrates such as PET and polycarbonate, but also to nonpolar substrates such as polyolefin. Therefore, it is known to be used as a resin composition for forming a coat layer on the surface of a film product or a resin product. An example of this type of resin composition is Patent Document 1.

  By the way, this type of coat layer is not only formed directly on the surface of a film product or a resin product, but also separately produced as a molding film which is an intermediate product in which the coat layer is laminated on one surface of the film substrate. The molding film may be attached (molded) to the surface of a film product or a resin product. In this case, the molding film, which is the intermediate product, is stored and transported alone (before being attached to the film product or the like) in a state where the coat layer is cured. However, when the molding film is stored alone, it is often stored in a warehouse without temperature control (air conditioning) for a long period of time in order to reduce management costs. This is also the case in a container for shipping by sea.

  In this case, the molding film having a coat layer made of a resin composition containing a maleic anhydride-modified polyolefin resin as a main component, when exposed to a high temperature atmosphere during transportation by sea or during storage in a warehouse in the summer, the coating layer is Tackiness (adhesiveness) is developed on the surface, and the surface becomes sticky. However, a molding film having such a coat layer, for example, when stored by being wound in a roll shape, or when exposed to high temperature in the case of laminating and storing in a sheet shape, one film in the molding films which are overlapped with each other. There arises a problem that the base material and the other coat layer are blocked (bonded). Therefore, the coat layer containing a maleic anhydride-modified polyolefin resin as a main component is required to have heat resistance that does not exhibit tackiness on the surface even in a high temperature atmosphere and does not block.

  Further, the maleic anhydride-modified polyolefin resin has an olefin moiety which is a non-polar group and a maleic anhydride moiety which is a polar group, and therefore has solvent resistance to both a non-polar solvent and a polar solvent. Inferior Therefore, in the coat layer containing a maleic anhydride-modified polyolefin resin as a main component, there is a problem that the coat layer and the film base material are separated from each other when exposed to either a nonpolar solvent or a polar solvent.

  Further, when the coating layer containing a maleic anhydride-modified polyolefin resin as a main component is exposed to a high-humidity atmosphere, the maleic anhydride ring is opened by the infiltrated water to generate a carboxylic acid. In this case, since the composition becomes more hydrophilic due to the generated carboxylic acid, a vicious cycle occurs in which water is more likely to enter.

  Moreover, the coating layer containing a maleic anhydride-modified polyolefin resin as a main component has a problem that when exposed to a high-humidity atmosphere, the coating layer deteriorates due to infiltrating water and the film base material peels off, Moisture resistance is poor. That is, the maleic anhydride-modified polyolefin resin has excellent adhesion to the film base material, but is poor in heat resistance, solvent resistance, and moisture resistance adhesion as described above.

Japanese Patent Laid-Open No. 11-217537

  Therefore, the present invention has been accomplished in view of the above circumstances, and an object thereof is to provide a coating layer having high adhesion to a film substrate, and also having excellent heat resistance, solvent resistance, and moisture resistance adhesion. It is intended to provide a resin composition which can be formed, a molding film including a coat layer using the resin composition, a molding film having the molding film adhered to the surface thereof, and a resin molded article.

As a means for that purpose, the present invention adopts the following means.
(1) 5 to 35 parts by mass of the polyfunctional ene compound (B) and 0.01 to 10 parts by mass of the (C) photopolymerization initiator are contained with respect to 100 parts by mass of the (A) maleic anhydride-modified polyolefin resin. Resin composition.
(2) The component (A) is a maleic anhydride graft-modified resin of a (co)polymer of an α-olefin having 2 to 4 carbon atoms, that is, a (co)polymer of an α-olefin having 2 to 4 carbon atoms. The resin composition according to (1), which is a resin obtained by graft-modifying the above with maleic anhydride. In the present invention, the "(co)polymer" means a polymer obtained by homopolymerizing only one kind of monomer or a copolymer obtained by copolymerizing a plurality of kinds of monomers.
(3) The component (A) is a maleic anhydride graft-modified resin of a copolymer of an α-olefin having 2 to 4 carbon atoms and maleic anhydride, that is, an α-olefin having 2 to 4 carbon atoms and maleic anhydride. The resin composition according to (1), which is a resin obtained by graft-modifying a copolymer with an acid with maleic anhydride.
(4) A molding film having an uncured coat layer made of the resin composition according to any one of (1) to (3) on one surface of the film substrate.
(5) The molding film according to (4), wherein the uncured coating layer is photocured.
(6) A molding film in which the molding film according to (4) or (5) is attached to a film product via the coat layer.
(7) A resin molded product, wherein the molding film according to (4) or (5) is attached to the surface of the resin product via the coat layer.

  In addition, the invention described in (5) is, in other words, "a molding having a coating layer obtained by photocuring the resin composition according to any one of (1) to (3) on one surface of a film substrate. It can also be said to be a film for use. Alternatively, it can also be said that "a molding film having a coating layer formed on one surface of the film substrate, the coating layer being a photocurable layer of the resin composition according to any one of (1) to (3)". Further, it can be said that "the molding film according to (4), in which the uncured coat layer is photo-cured".

  In the present invention, “XX to XX” indicating a numerical range means “XX or more and XX or less” unless otherwise specified.

  The resin composition of the present invention contains (B) a polyfunctional ene and (C) a photopolymerization initiator in a well-balanced proportion with respect to the (A) maleic anhydride-modified polyolefin resin. This makes it possible to form a coat layer that has high adhesion to the film substrate and is also excellent in heat resistance, solvent resistance, and moisture resistance adhesion when it is stored and transported as a molding film. This also improves the moisture barrier property. Therefore, even if the coat layer is exposed to a high-humidity atmosphere, ring opening of the maleic anhydride ring due to infiltration of water can be suppressed. Further, even if a part of the maleic anhydride ring is opened to generate a carboxylic acid, the generated carboxylic acid is incorporated into the crosslinked network, so that the deterioration of the coat layer is suppressed. Further, since the carboxylic acid incorporated in the crosslinked network contributes to the improvement of the adhesiveness, the adhesiveness to the substrate does not decrease.

  The present invention will be described in detail below. The resin composition of the present invention is a resin composition containing the following components (A), (B) and (C) as essential components.

<(A) Maleic anhydride modified polyolefin resin>
As the maleic anhydride-modified polyolefin resin, a maleic anhydride graft-modified resin of a C 2-4 α-olefin (co)polymer, that is, a C 2-4 α-olefin (co)polymer is used. A resin graft-modified with maleic anhydride can be used. Further, a maleic anhydride graft-modified resin of a copolymer of an α-olefin having 2 to 4 carbon atoms and maleic anhydride, that is, a copolymer of an α-olefin having 2 to 4 carbon atoms and maleic anhydride, A resin graft-modified with maleic anhydride can also be used.

  The graft weight of maleic anhydride in the maleic anhydride-modified polyolefin resin is preferably 0.1 to 20% by weight, more preferably 1.5 to 20% by weight. The content of maleic anhydride in the copolymer of α-olefin and maleic anhydride may be 0.1 to 50% by weight.

  The weight average molecular weight of the maleic anhydride-modified polyolefin resin is preferably 10,000 to 200,000. When the weight average molecular weight of the maleic anhydride modified polyolefin resin is less than 10,000, tackiness at high temperature tends to be easily exhibited. On the other hand, when the weight average molecular weight is more than 200,000, the solubility for other components may be low.

<(B) Polyfunctional ene compound>
Examples of the polyfunctional ene compound include polyfunctional (meth)acrylate, polyfunctional allyl, and polyfunctional vinyl ether.

（式１）
（式中のaは２〜８の整数であり、Ｒ^１は炭素数２〜２０の炭化水素基、エーテル酸素（−Ｏ−）と炭素数２〜４０の炭化水素基のみからなる基、又はイソシアヌレート環若しくはイソシアヌレート環と炭化水素基のみからなる基であり、Ｒ^２は水素原子またはメチル基である。） The polyfunctional (meth)acrylate as the component (B) has a (meth)acryloxy group at the terminal, and a preferable example thereof is a compound represented by the following (formula 1). In addition, the polyfunctional (meth)acrylate which is a (B) component can also be used individually by 1 type, and can also mix and use 2 or more types.

(Equation 1)
(A in the formula is an integer of 2 to 8, R ¹ is a hydrocarbon group having 2 to 20 carbon atoms, a group consisting of only ether oxygen (-O-) and a hydrocarbon group having 2 to 40 carbon atoms, or (Isocyanurate ring or a group consisting of an isocyanurate ring and a hydrocarbon group only, and R ² is a hydrogen atom or a methyl group.)

  The (meth)acrylate equivalent of the polyfunctional (meth)acrylate is preferably 80 to 400 g/mol. When the (meth)acrylate equivalent is less than 80 g/mol, the curing shrinkage becomes large when photocured, and the adhesiveness may decrease. On the other hand, when the (meth)acrylate equivalent is more than 400 g/mol, the crosslink density is lowered, so that the toughness of the adhesive layer may be lowered and the adhesiveness may be lowered.

（式２）
（式中のbは２〜８の整数であり、Ｒ³は炭素数２〜２０の炭化水素基、エーテル酸素（−Ｏ−）と炭素数２〜４０の炭化水素基のみからなる基、またはイソシアヌレート環若しくはイソシアヌレート環と炭化水素基のみからなる基である。） The polyfunctional allyl which is the component (B) has an allyl group at the terminal, and a preferable example thereof is a compound represented by the following (formula 2). The polyfunctional allyl which is the component (B) may be used alone or in combination of two or more.

(Formula 2)
(In the formula, b is an integer of 2 to 8, R ³ is a hydrocarbon group having 2 to 20 carbon atoms, a group consisting of ether oxygen (—O—) and a hydrocarbon group having 2 to 40 carbon atoms, or A group consisting of an isocyanurate ring or an isocyanurate ring and a hydrocarbon group.)

  The allyl equivalent of the polyfunctional allyl is preferably 80 to 200 g/mol. If the allyl equivalent is less than 80 g/mol, the curing shrinkage becomes large when photocured, and the adhesiveness may decrease. On the other hand, when the allyl equivalent is more than 200 g/mol, the crosslink density is lowered, so that the toughness of the adhesive layer may be lowered and the adhesiveness may be lowered.

（式３）
（式中のcは２〜８の整数であり、Ｒ^４は炭素数２〜２０の炭化水素基、エーテル酸素（−Ｏ−）と炭素数２〜４０の炭化水素基のみからなる基、またはイソシアヌレート環若しくはイソシアヌレート環と炭化水素基のみからなる基である。） The polyfunctional vinyl ether as the component (B) has a vinyl ether group at the terminal, and a preferable example thereof is a compound represented by the following (formula 3). The polyfunctional vinyl ether as the component (B) may be used alone or in combination of two or more.

(Formula 3)
(C in the formula is an integer of 2 to 8, R ⁴ is a hydrocarbon group having 2 to 20 carbon atoms, a group consisting only of ether oxygen (-O-) and a hydrocarbon group having 2 to 40 carbon atoms, or Isocyanurate ring or a group consisting of an isocyanurate ring and a hydrocarbon group only.)

  The vinyl ether equivalent of the polyfunctional vinyl ether is preferably 60 to 200 g/mol. When the vinyl ether equivalent is less than 60 g/mol, the curing shrinkage becomes large when photocured, and the adhesiveness may decrease. On the other hand, when the vinyl ether equivalent is more than 200 g/mol, the toughness of the adhesive layer may be decreased due to the decrease in the crosslink density, and the adhesiveness may be decreased.

  The weight average molecular weight of the polyfunctional ene is preferably 100 to 1,000. Even if the weight average molecular weight of the polyfunctional ene is less than 100, there is no problem in terms of adhesion, but the volatility tends to be high and the odor tends to be strong. On the other hand, when the weight average molecular weight is more than 1,000, there is no problem in adhesion, but the solubility in other components may be low.

<(C) Photopolymerization initiator>
Examples of the photopolymerization initiator include a photoradical polymerization initiator, a photocationic polymerization initiator and a photoanionic polymerization initiator. The photoradical polymerization initiator is preferably used when shortening the reaction time, the photocationic polymerization initiator is preferably used when reducing the curing shrinkage, and the photoanionic polymerization initiator is used in the field of electronic circuits and the like. It is preferable to use it when imparting the adhesiveness in 1. Note that the heating of the thermal polymerization initiator can accelerate the curing of the resin composition, but this is not preferable because the storage stability may be reduced.

  Examples of the photoradical polymerization initiator include 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propane. -1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2 -Hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methyl-propan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one , Bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and the like.

  Examples of the cationic photopolymerization initiator include bis(4-tert-butylphenyl)iodonium hexafluorophosphate, bis(4-tert-butylphenyl)iodonium trifluoromethanesulfonate, cyclopropyldiphenylsulfonium tetrafluoroborate, and diphenyl. Iodonium hexafluorophosphate, diphenyliodonium hexafluoroarsenate, 2-(3,4-dimethoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, triphenylsulfonium tetrafluoroborate, Examples thereof include triphenylsulfonium bromide, tri-p-tolylsulfonium hexafluorophosphate, tri-p-tolylsulfonium trifluoromethanesulfonate.

  Examples of the photoanionic polymerization initiator include acetophenone o-benzoyloxime, nifedipine, and 1,5,7-triazabicyclo[4,4,0]decadecanoate 2-(9-oxoxanthen-2-yl)propionate. 5-ene, 2-nitrophenylmethyl 4-methacryloyloxypiperidine-1-carboxylate, 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidinium 2-(3-benzoylphenyl)propionate, 1,2 -Dicyclohexyl-4,4,5,5-tetramethylbiguanidinium n-butyltriphenylborate and the like.

<Composition ratio of resin composition (blending balance)>
The resin composition contains 5 to 35 parts by mass of the (B) polyfunctional ene compound and 0.01 to 10 parts by mass of the (C) photopolymerization initiator with respect to 100 parts by mass of the maleic anhydride-modified polyolefin resin (A). To be mixed. When the blending amount of the polyfunctional ene compound (B) is less than 5 parts by mass or more than 35 parts by mass, the heat resistance, solvent resistance, and moisture resistance of the obtained coat layer tend to be poor. Further, if the amount of the (C) photopolymerization initiator is less than 0.01 parts by mass, the polymerization of the enes does not sufficiently occur, or if it exceeds 10 parts by mass, the crosslinking density becomes low, and the heat resistance of the obtained coat layer, The solvent resistance may decrease.

  The resin composition can be cured by irradiating it with light. Examples of the light to be applied include active energy rays such as UV (ultraviolet ray) and EB (electron beam).

  The resin composition may be used by diluting it with an organic solvent in order to make the reaction system uniform and facilitate coating. Examples of such organic solvents include alcohol solvents, aromatic hydrocarbon solvents, ether solvents, ester solvents, ether ester solvents, ketone solvents, and phosphate ester solvents. It is preferable to control the amount of these organic solvents to be less than 10,000 parts by mass with respect to 100 parts by mass of the resin composition. It does not significantly affect the physical properties of the coated layer.

<Molding film>
The resin composition is an intermediate product that is applied to one side of a film base material and is left as it is as an uncured coating layer or a photo-cured coating layer to be attached to an attachment target such as a film product or a resin product. The film for molding can be However, a molding film with an uncured coat layer is to be attached to an object to be attached immediately after the uncured coat layer is applied and formed, and if the coat layer is not photocured, it can be stored or transported independently. I can't. On the other hand, a large number of molding films having a photo-cured coat layer can be stacked and rolled in a rolled or unrolled state, and can be stored and transported independently.

  The film substrate is not particularly limited, and not only polar substrates such as polyethylene terephthalate (PET) film and polycarbonate (PC) film but also nonpolar substrates such as polyolefin film can be used.

<Molded film and resin molded products>
To attach (mold) the molding film to an object to be attached such as a film product or a resin product, with the coat layer on the surface of the object to be attached, at a temperature of about 90°C for several minutes. You can heat press. Even a molding film having an uncured coat layer can be attached (molded) by hot pressing while the coat layer is uncured. This makes it possible to obtain a molded film or a resin molded product in which the molding film is attached to the film product via the coat layer. That is, it is possible to obtain a molded film or resin molded product having a coat layer on the surface. Examples of film products include optical films applied to liquid crystal display devices.

<Production of component A>
(Production of A-1)
In a four-necked flask made of stainless steel equipped with a stirrer with an internal volume of 10 liters, 100 parts by mass of polypropylene (weight average molecular weight 10,000), 3 parts by mass of maleic anhydride, and 5 parts by mass of di-t-butyl peroxide were mixed. Then, the mixture was kneaded at 230° C. for 3 minutes using a biaxial kneading extruder. The polymer taken out was cooled and made into pellets, which were then heated in an equal weight of xylene to 140° C. and dissolved until the solid matter could not be visually confirmed. The pellet solution after heating and dissolution was cooled to room temperature, and twice the weight of acetone was added to xylene as a solvent to obtain a suspension in which a maleic anhydride-modified polyolefin resin was deposited. This suspension was filtered, and the reprecipitated maleic anhydride modified polyolefin resin was dried under reduced pressure until the weight change disappeared to obtain 101.7 parts by mass of maleic anhydride modified polyolefin resin (A-1). It was The weight average molecular weight of this maleic anhydride-modified polyolefin resin (A-1) was 10,000, and the graft weight of maleic anhydride was 1.7% by weight.

(Production of A-2)
In a four-necked flask made of stainless steel equipped with a stirrer with an internal volume of 10 liters, 100 parts by mass of a propylene-ethylene copolymer (propylene/ethylene=92/8 mol%, weight average molecular weight 55,000), maleic anhydride 20 Part by mass and 5 parts by mass of di-t-butyl peroxide were mixed and kneaded at 230° C. for 3 minutes using a twin-screw kneading extruder. The polymer taken out was cooled and made into pellets, which were then heated in an equal weight of xylene to 140° C. and dissolved until the solid matter could not be visually confirmed. The pellet solution after heating and dissolution was cooled to room temperature, and twice the weight of acetone was added to xylene as a solvent to obtain a suspension in which a maleic anhydride-modified polyolefin resin was deposited. This suspension was filtered, and the reprecipitated maleic anhydride-modified polyolefin resin was dried under reduced pressure until the weight change disappeared, and 116.1 parts by mass of maleic anhydride-modified polyolefin resin (A-2) was obtained. It was The weight average molecular weight of this maleic anhydride-modified polyolefin resin (A-2) was 55,000, and the graft weight of maleic anhydride was 13.9% by weight.

(Production of A-3)
In a four-necked flask made of stainless steel equipped with an agitator with an internal volume of 10 liters, 100 mass of propylene-butene-ethylene copolymer (propylene/butene/ethylene=68/20/12 mol%, weight average molecular weight 200,000) Parts, 30 parts by mass of maleic anhydride, and 5 parts by mass of di-t-butyl peroxide were mixed and kneaded at 230° C. for 3 minutes using a twin-screw kneading extruder. The polymer taken out was cooled and made into pellets, which were then heated in an equal weight of xylene to 140° C. and dissolved until the solid matter could not be visually confirmed. The pellet solution after heating and dissolution was cooled to room temperature, and twice the weight of acetone was added to xylene as a solvent to obtain a suspension in which a maleic anhydride-modified polyolefin resin was deposited. This suspension is filtered, and the reprecipitated maleic anhydride-modified polyolefin resin is dried under reduced pressure until there is no change in weight, to obtain 125.0 parts by mass of maleic anhydride-modified polyolefin resin (A-3). It was The weight average molecular weight of this maleic anhydride-modified polyolefin resin (A-3) was 200,000, and the graft weight of maleic anhydride was 20% by weight.

(Production of A-4)
In a four-necked flask made of stainless steel equipped with a stirrer with an internal volume of 10 liters, 100 parts by mass of ethylene-maleic anhydride copolymer (ethylene/maleic anhydride = 87/13 mol%, weight average molecular weight 30,000), 20 parts by mass of maleic anhydride and 5 parts by mass of di-t-butyl peroxide were mixed and kneaded at 230° C. for 3 minutes using a twin-screw kneading extruder. The polymer taken out was cooled and made into pellets, which were then heated in an equal weight of xylene to 140° C. and dissolved until the solid matter could not be visually confirmed. The pellet solution after heating and dissolution was cooled to room temperature, and twice the weight of acetone was added to xylene as a solvent to obtain a suspension in which a maleic anhydride-modified polyolefin resin was deposited. This suspension was filtered, and the reprecipitated maleic anhydride-modified polyolefin resin was dried under reduced pressure until there was no change in weight, to obtain 114.4 parts by mass of maleic anhydride-modified polyolefin resin (A-4). It was The weight average molecular weight of this maleic anhydride-modified polyolefin resin (A-4) was 30,000, and the graft weight of maleic anhydride was 12.6% by weight.

The graft weight of maleic anhydride of A-1 to A-3 was calculated by the following calculation formula.

On the other hand, the graft weight of maleic anhydride of A-4 was calculated by the following formula.

  The weight of maleic anhydride in the maleic anhydride-modified polyolefin resin and the weight of maleic anhydride in the olefin-maleic anhydride copolymer were calculated by the alkali dropping method using a potassium hydroxide-ethanol solution. The weight average molecular weight of the maleic anhydride-modified polyolefin resin was measured by gel permeation chromatography using tetrahydrofuran as a solvent. Conversion to the weight average molecular weight was calculated based on a polystyrene calibration curve.

The compositions of A-1 to A-4 are summarized in Table 1.

(Examples 1 to 19)
The respective components shown in Table 2 were blended in the blending ratios shown in Table 2, melted and kneaded in a pressure kneader to obtain a resin composition.

(Comparative Examples 1 to 13)
The components shown in Table 3 were blended at the blending ratios shown in Table 3, melted and kneaded in a pressure kneader to obtain a resin composition.

The components shown in Tables 2 to 3 are as follows.
B-1: dimethylol-tricyclodecane diacrylate B-2: dipentaerythritol hexaacrylate B-3: ethoxylated isocyanuric acid triacrylate B-4: EO adduct of bisphenol A dimethacrylate B-5: trimethylolpropane triacrylate Methacrylate B-6:1,6-hexanediol dimethacrylate B-7:1,3-diallyl-5-methyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione B -8: Triallyl isocyanurate B-9: Pentaerythritol triallyl ether B-10: 1,4-Butanediol divinyl ether B-11: Cyclohexanedimethanol divinyl ether C-1: 2-hydroxy-2-methyl-1 -Phenyl-propan-1-one A'-1: Phenoxy resin ("PKHC" manufactured by Union Carbide Co., average molecular weight 45,000)
A′-2: Polyurethane resin (“Elactolane E390PNAT” manufactured by Tosoh Corporation)
A'-3: Ethylene-methacrylic acid copolymer resin ("Nucrel N1525" manufactured by Mitsui DuPont Polychemical Co., Ltd.)
B'-1: Isobornyl acrylate B'-2: 2-Ethylhexyl methacrylate B'-3: Allyl ethyl ether B'-4: Cyclohexyl vinyl ether

[Evaluation of storage stability]
The storage stability of each of the obtained resin compositions of Examples and Comparative Examples was evaluated as follows. It was dissolved in methylcyclohexane to prepare a 20% solution, and the initial viscosity was measured. Separately, the resin composition for an adhesive layer was left in a closed container at 50° C. for 60 days, and after 60 days, dissolved in methylcyclohexane to prepare a 20% solution, and the viscosity was measured. The value of viscosity/initial viscosity after 60 days was calculated and evaluated. The evaluation results are also shown in Tables 2 and 3.
○: (viscosity after 60 days/initial viscosity) value is less than 1.50 ×: (viscosity after 60 days/initial viscosity) value is 1.50 or more

<Production of film>
The resin composition of each Example and Comparative Example melted by a tank hot melt applicator was applied on a film substrate with a die coater to a thickness of 50 μm, and UV irradiation was performed to obtain a film having a coat layer. As the film base material, a PET film of "Lumirror U46-100" manufactured by Toray Industries, Inc. was used. For UV irradiation, a UV lamp system "Light Hammer 6" manufactured by Heraeus Noble Light Fusion UBU Co., Ltd. was used, and an H bulb was used as a lamp bulb. The coating layer of each obtained film was measured and evaluated for adhesion, heat resistance, solvent resistance, and moist heat resistance by the following methods. The results are also shown in Tables 2 and 3.

[Evaluation of adhesion]
In accordance with JIS K 5600-5-6:1999 "General test method for paints-Part 5: Mechanical properties of coating film-Section 6: Adhesion (cross-cut method)" for samples after UV irradiation of 100 mJ/cm ² UV Then, the adhesion was evaluated. In order to serve the purpose of the present invention, an evaluation of 100/100 is necessary.
○: 25/25 or more ×: less than 25/25

[Evaluation of heat resistance]
A PET film as a counter substrate was superimposed on the sample after UV irradiation of 100 mJ/cm ² and heat-pressed at 40° C., 15 Kg/cm ² and 100 hours using a heat press machine. After hot pressing, the sample was air-cooled to room temperature and subjected to a 90° peeling test (peeling speed 100 mm/min, 23°C/50% environment), and the adhesion was measured and evaluated as follows. In order to serve the purpose of the present invention, an evaluation of ◯ or higher is required.
◯: Adhesive force is less than 5 mN/25 mm ×: Adhesive force is 5 mN/25 mm or more

[Evaluation of solvent resistance]
The sample after 100 mJ/cm ² UV irradiation was immersed in the following solvent for 30 minutes. After that, the sample is taken out and dried, and then it conforms to JIS K 5600-5-6:1999 "General Test Method for Paint-Part 5: Mechanical Properties of Coating Film-Section 6: Adhesion (Crosscut Method)". Then, the adhesiveness was evaluated, and the appearance after taking out was observed. In order to serve the purpose of the present invention, an evaluation of ◯ or higher is required.
Solvent: Acetone, Isopropyl alcohol, Hexane ○: Adhesiveness equivalent to that before immersion in all solvents ×: Adhesiveness decreased in some solvents compared to before immersion

[Evaluation of moisture resistance adhesion]
The sample after UV irradiation of 100 mJ/cm ² was allowed to stand in a constant temperature and humidity bath at 60° C. and 90% for 100 hours. Thereafter, the adhesion was evaluated in accordance with JIS K 5600-5-6:1999 "General paint test method-Part 5: Mechanical properties of coating film-Section 6: Adhesion (cross-cut method)". .. In order to be used for the purpose of the present invention, the evaluation needs to be ◯.
○: 25/25 or more ×: less than 25/25

  From the results of Table 2, the resin compositions of Examples 1 to 19 showed high adhesion, heat resistance, solvent resistance, and moist heat resistance.

Claims (7)

(A) With respect to 100 parts by mass of the maleic anhydride-modified polyolefin resin,
(B) 5 to 35 parts by mass of a polyfunctional ene compound ,
(C) A resin composition containing 0.01 to 10 parts by mass of a photopolymerization initiator (however, the resin composition contains 5 parts of a polyfunctional thiol based on 100 parts by mass of (A) a maleic anhydride-modified polyolefin resin). Exclude the resin composition containing 25 parts by mass . The resin composition according to claim 1, wherein the component (A) is a maleic anhydride graft-modified resin of a (co)polymer of an α-olefin having 2 to 4 carbon atoms. The resin composition according to claim 1, wherein the component (A) is a maleic anhydride graft-modified resin of a copolymer of an α-olefin having 2 to 4 carbon atoms and maleic anhydride. A molding film having an uncured coat layer made of the resin composition according to claim 1 on one surface of the film substrate. The molding film according to claim 4, wherein the uncured coat layer is photocured. A molding film, wherein the molding film according to claim 4 or 5 is attached to a film product via the coat layer. A resin molded product, wherein the molding film according to claim 4 or 5 is attached to the surface of a resin product via the coat layer.