JP2017045893A - Conveyance case - Google Patents

Conveyance case Download PDF

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JP2017045893A
JP2017045893A JP2015168072A JP2015168072A JP2017045893A JP 2017045893 A JP2017045893 A JP 2017045893A JP 2015168072 A JP2015168072 A JP 2015168072A JP 2015168072 A JP2015168072 A JP 2015168072A JP 2017045893 A JP2017045893 A JP 2017045893A
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plate
contact
spring
sandwiching
tabular object
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一弘 久保田
Kazuhiro Kubota
一弘 久保田
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a conveyance case capable of preventing breakdown of a tabular object to be conveyed.SOLUTION: A conveyance case (2) for housing a tabular object (11) at the time of conveyance includes a box (4) consisting of a bottom plate (6), a ceiling plate (10) and a sidewall (8), and having a tabular object housing chamber (4a) formed internally, a pair of clamp plates (12, 14) provided, respectively, with contact surfaces (12a, 14a) coming into contact with the tabular object, and housed in the housing chamber while clamping the tabular object, and springs (16) installed on the surfaces (12b, 14b) of the clamp plates on the opposite side to the contact surface. When the clamp plates are housed in the housing chamber while clamping the tabular object, the springs press the clamp plates in an expandable/contractable state and protect the tabular object against impact.SELECTED DRAWING: Figure 1

Description

本発明は、板状の被搬送物を搬送時に収容する搬送ケースに関する。   The present invention relates to a transport case that accommodates a plate-shaped object to be transported during transport.

近年、小型軽量なデバイスチップを実現するために、半導体やセラミック、樹脂等の材料でなる基板を薄く加工する機会が増えている。これらの基板は、例えば、表面の分割予定ライン(ストリート)で区画される各領域にIC等のデバイスが形成された後、裏面側を研削されることで薄化される。   In recent years, in order to realize a small and light device chip, there are increasing opportunities to thinly process a substrate made of a material such as a semiconductor, ceramic, or resin. For example, these substrates are thinned by grinding the back side after devices such as ICs are formed in each region defined by the division lines (streets) on the surface.

薄化後の基板は、分割予定ラインに沿って切削装置やレーザー加工装置等で加工され、各デバイスに対応する複数のデバイスチップへと分割される(例えば、特許文献1参照)。分割後のデバイスチップは、携帯電話機やパーソナルコンピュータをはじめとする各種の電子機器に組み込まれる。   The thinned substrate is processed by a cutting device, a laser processing device, or the like along the division line, and is divided into a plurality of device chips corresponding to each device (for example, see Patent Document 1). The divided device chip is incorporated into various electronic devices such as a mobile phone and a personal computer.

このような基板を工程間でまとめて搬送する場合等には、通常、複数の基板を収容可能なカセットが使用される。一方で、薄化された1又は少数の基板を販売促進用の資料等として持ち運びたいこともある。この場合には、搬送時の衝撃等による基板の破損を防ぐために、スポンジ等の緩衝材で基板を挟んで搬送用のケースに収容していた。   When such substrates are transported collectively between processes, a cassette that can accommodate a plurality of substrates is usually used. On the other hand, there is a case where one or a small number of thinned substrates are desired to be carried as sales promotion materials. In this case, in order to prevent damage to the substrate due to impact during transportation, the substrate is sandwiched between cushioning materials such as sponges and accommodated in a transportation case.

特開2002−359211号公報JP 2002-359111 A

しかしながら、上述のような緩衝材で基板を挟んだとしても、搬送時の衝撃を必ずしも十分には軽減できないという問題がある。例えば、剛性を保てるように中央部のみが薄化され周縁部の厚みが維持された基板を搬送する際には、応力の影響を受け易い中央部と周縁部との境界において基板が破損し易かった。   However, even if the substrate is sandwiched between the buffer materials as described above, there is a problem that the impact during transportation cannot always be sufficiently reduced. For example, when transporting a substrate in which only the central portion is thinned and the thickness of the peripheral portion is maintained so as to maintain rigidity, the substrate is easily damaged at the boundary between the central portion and the peripheral portion, which is susceptible to stress. It was.

本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、板状の被搬送物の破損を防ぐことができる搬送ケースを提供することである。   This invention is made | formed in view of this problem, The place made into the objective is to provide the conveyance case which can prevent damage to a plate-shaped to-be-conveyed object.

本発明によれば、板状物を搬送時に収容する搬送ケースであって、底板と天井板と側壁とからなり、内部に板状物を収容する収容室が形成された箱体と、板状物に接する接触面をそれぞれ備え、板状物を挟持した状態で該収容室に収容される一対の挟持板と、該挟持板の該接触面とは反対側の面に設置されるばねと、を備え、板状物を挟持した状態の該挟持板が該収容室に収容されると、該ばねが伸縮可能な状態で該挟持板を押圧して衝撃から板状物を保護することを特徴とする搬送ケースが提供される。   According to the present invention, there is a transport case for storing a plate-shaped object during transport, which is composed of a bottom plate, a ceiling plate, and a side wall, and a box body in which a storage chamber for storing the plate-shaped object is formed. Each having a contact surface in contact with an object, a pair of sandwiching plates housed in the housing chamber in a state of sandwiching a plate-like object, and a spring installed on a surface opposite to the contact surface of the sandwiching plate, When the holding plate in a state of holding the plate-like object is accommodated in the accommodation chamber, the plate-like object is protected from an impact by pressing the holding plate in a state where the spring can be expanded and contracted. A transport case is provided.

本発明に係る搬送ケースは、搬送対象の板状物を挟持する一対の挟持板と、伸縮可能な状態で挟持板を押圧するばねとを備えるので、搬送時の衝撃をばねの伸縮によって緩和できるとともに、搬送時の衝撃を挟持板によって板状物の全体に分散できる。つまり、本発明に係る搬送ケースでは、局所的な強い衝撃を加わり難くして、板状物の破損を防ぐことができる。   The transport case according to the present invention includes a pair of sandwiching plates that sandwich the plate-like object to be transported and a spring that presses the sandwiching plate in a stretchable state, so that the impact during transportation can be mitigated by expansion and contraction of the spring. At the same time, the impact during conveyance can be distributed to the entire plate-like object by the sandwiching plate. That is, in the transport case according to the present invention, it is difficult to apply a strong local impact, and damage to the plate-like object can be prevented.

搬送ケースの構成例を模式的に示す分解斜視図である。It is a disassembled perspective view which shows the structural example of a conveyance case typically. 図2(A)は、被搬送物を収容した状態の搬送ケースを模式的に示す一部断面側面図であり、図2(B)は、衝撃が加えられた状態の搬送ケースを模式的に示す一部断面側面図である。FIG. 2A is a partial cross-sectional side view schematically illustrating a transport case in which a transported object is accommodated, and FIG. 2B schematically illustrates the transport case in a state where an impact is applied. It is a partial cross section side view shown.

添付図面を参照して、本発明の実施形態について説明する。図1は、本実施形態に係る搬送ケースの構成例を模式的に示す分解斜視図である。なお、図1では、搬送ケースに収容される板状の被搬送物(板状物)を合わせて示している。   Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is an exploded perspective view schematically showing a configuration example of a transport case according to the present embodiment. In addition, in FIG. 1, the plate-shaped to-be-conveyed object (plate-shaped object) accommodated in a conveyance case is shown collectively.

図1に示すように、搬送ケース2は、板状の被搬送物(板状物)11を収容する直方体状の箱体4を備えている。箱体4は、概ね平坦な矩形状の底板6と、底板6の周縁部に固定された4つの側壁8と、側壁8の1つに対して蝶番(不図示)等で連結され、開閉自在な蓋として機能する天井板10とを含む。この箱体4(底板6、側壁8及び天井板10)は、例えば、樹脂や繊維(紙)、金属等の材料で形成される。   As shown in FIG. 1, the transport case 2 includes a rectangular parallelepiped box 4 that houses a plate-shaped object (plate-shaped object) 11. The box 4 is connected to a substantially flat rectangular bottom plate 6, four side walls 8 fixed to the peripheral edge of the bottom plate 6, and one of the side walls 8 with a hinge (not shown) or the like, and can be opened and closed. And ceiling plate 10 functioning as a lid. The box 4 (the bottom plate 6, the side wall 8, and the ceiling plate 10) is formed of a material such as resin, fiber (paper), or metal.

箱体4の内部には、被搬送物11を収容可能な収容室4aが形成されている。すなわち、収容室4aは、天井板10を閉じた状態で、底板6、側壁8及び天井板10で囲まれる領域に相当する。なお、天井板10の先端部には、差し込み部10aが設けられており、この差し込み部10aを収容室4aに差し込むことで、天井板10は閉じた状態に維持される。   Inside the box 4, a storage chamber 4 a that can store the transported object 11 is formed. That is, the storage chamber 4 a corresponds to a region surrounded by the bottom plate 6, the side wall 8, and the ceiling plate 10 with the ceiling plate 10 closed. In addition, the insertion part 10a is provided in the front-end | tip part of the ceiling board 10, and the ceiling board 10 is maintained in the closed state by inserting this insertion part 10a in the storage chamber 4a.

搬送ケース2は、被搬送物11を挟持する一対の挟持板12,14を更に備えている。各挟持板12,14は、被搬送物11に接触する接触面12a,14aを有しており、例えば、接触面12aを被搬送物11の下面側(表面側)に接触させ、接触面14aを被搬送物11の上面側(裏面側)に接触させることで、被搬送物11を挟持できる。   The transport case 2 further includes a pair of sandwiching plates 12 and 14 that sandwich the transported object 11. Each sandwiching plate 12, 14 has contact surfaces 12 a, 14 a that come into contact with the object to be transported 11. For example, the contact surface 12 a is brought into contact with the lower surface side (front surface side) of the object to be transported 11 to contact the contact surface 14 a. Is brought into contact with the upper surface side (back surface side) of the object 11 to be conveyed, so that the object 11 to be conveyed can be sandwiched.

この一対の挟持板12,14は、収容室4aに収容可能な大きさに形成されている。具体的には、挟持板12,14の輪郭が、4つの側壁8によって規定される収容室4aの輪郭より僅かに小さくなっている。一対の挟持板12,14は、被搬送物11を挟持した状態で収容室4aに収容される。   The pair of sandwiching plates 12 and 14 are formed in a size that can be accommodated in the accommodation chamber 4a. Specifically, the contours of the sandwiching plates 12 and 14 are slightly smaller than the contour of the storage chamber 4 a defined by the four side walls 8. The pair of sandwiching plates 12 and 14 are accommodated in the accommodation chamber 4a in a state where the transported object 11 is sandwiched.

各挟持板12,14の接触面12a,14aとは反対の非接触面12b,14bには、それぞれ、圧縮コイルばね(押しばね)等のばね16が設置されている。ばね16の長さ(自然長)は、被搬送物11を挟持した一対の挟持板12,14を収容室4aに収容して天井板10を閉じた状態において、各ばね16が底板6又は天井板10と接触する範囲に調整される。   On the non-contact surfaces 12b and 14b opposite to the contact surfaces 12a and 14a of the sandwiching plates 12 and 14, springs 16 such as compression coil springs (push springs) are respectively installed. The length of the spring 16 (natural length) is such that each spring 16 has a bottom plate 6 or a ceiling in a state where the pair of sandwiching plates 12 and 14 sandwiching the object to be transported 11 are accommodated in the accommodating chamber 4a and the ceiling plate 10 is closed. The range of contact with the plate 10 is adjusted.

よって、被搬送物11を挟持した一対の挟持板12,14を収容室4aに収容して天井板10を閉じると、挟持板12に設けられたばね16は、底板6に接触して縮み、挟持板12を下方から押圧する。また、挟持板14に設けられたばね16は、天井板10に接触して縮み、挟持板14を上方から押圧する。その結果、被搬送物11は、一対の挟持板12,14に挟持された状態で、搬送室4a内の所定の位置に保持される。   Therefore, when the pair of sandwiching plates 12 and 14 sandwiching the object to be transported 11 are accommodated in the accommodating chamber 4a and the ceiling plate 10 is closed, the spring 16 provided on the sandwiching plate 12 is brought into contact with the bottom plate 6 to be contracted and sandwiched. The plate 12 is pressed from below. Further, the spring 16 provided on the sandwiching plate 14 contracts by contacting the ceiling plate 10 and presses the sandwiching plate 14 from above. As a result, the conveyed object 11 is held at a predetermined position in the transfer chamber 4a while being held between the pair of holding plates 12 and 14.

なお、本実施形態では、各挟持板12,14の対応する位置に複数(本実施形態では、4つ)のばね16を設置している。この場合、上下の対応するばね16によって被搬送物11に加わる衝撃を適切に緩和できる。ただし、ばね16の数、大きさ、配置、ばね定数等の条件は、被搬送物11を所定の位置に保持し、かつ、衝撃を適切に緩和できる範囲において任意に設定、変更できる。   In the present embodiment, a plurality of (four in the present embodiment) springs 16 are provided at corresponding positions of the sandwiching plates 12 and 14. In this case, the impact applied to the conveyed object 11 by the upper and lower corresponding springs 16 can be appropriately mitigated. However, conditions such as the number, size, arrangement, and spring constant of the springs 16 can be arbitrarily set and changed within a range in which the object to be transported 11 is held at a predetermined position and an impact can be appropriately mitigated.

被搬送物11は、例えば、シリコン等の半導体でなる円盤状のウェーハであり、径方向中央側のデバイス領域(中央部)13と、デバイス領域13を囲む外周余剰領域(周縁部)15とに分けられている。デバイス領域13は、格子状に配列された分割予定ライン(ストリート)で更に複数の領域に区画されており、各領域の表面側(下面側)には、IC、LSI等のデバイス17が形成されている。   The transported object 11 is, for example, a disk-shaped wafer made of a semiconductor such as silicon, and includes a device region (center portion) 13 on the radial center side and an outer peripheral surplus region (peripheral portion) 15 surrounding the device region 13. It is divided. The device region 13 is further divided into a plurality of regions by division lines (streets) arranged in a grid pattern, and devices 17 such as IC and LSI are formed on the surface side (lower surface side) of each region. ing.

このデバイス領域13は、裏面側(上面側)を研削されることによって薄化されている。一方で、外周余剰領域15の厚みは維持されており、被搬送物11の剛性が保たれている。なお、本実施形態では、中央部のみが薄化されて周縁部の厚みが維持された被搬送物11を例示しているが、被搬送物11の態様に制限はない。   The device region 13 is thinned by grinding the back surface side (upper surface side). On the other hand, the thickness of the outer peripheral surplus area 15 is maintained, and the rigidity of the conveyed object 11 is maintained. In addition, in this embodiment, although the to-be-conveyed object 11 in which only the center part was thinned and the thickness of the peripheral part was maintained is illustrated, the aspect of the to-be-conveyed object 11 has no restriction | limiting.

例えば、全体を薄化した半導体ウェーハや薄化前の半導体ウェーハ等を被搬送物11としても良い。また、粘着テープを介して環状のフレームに支持された半導体ウェーハ等を被搬送物11とすることもできる。被搬送物11の材質、形状等にも制限はない。例えば、セラミック、樹脂、金属等の材料でなる基板を被搬送物11として用いることができる。   For example, it is good also as the to-be-conveyed object 11 the semiconductor wafer which thinned the whole, the semiconductor wafer before thinning, etc. Moreover, the semiconductor wafer etc. which were supported by the cyclic | annular flame | frame via the adhesive tape can also be used as the to-be-conveyed object 11. FIG. There is no restriction | limiting also in the material of the to-be-conveyed object 11, a shape, etc. For example, a substrate made of a material such as ceramic, resin, or metal can be used as the transported object 11.

次に、被搬送物11を搬送する際の搬送ケース2の状態について説明する。図2(A)は、被搬送物11を収容した状態の搬送ケース2を模式的に示す一部断面側面図であり、図2(B)は、衝撃が加えられた状態の搬送ケース2を模式的に示す一部断面側面図である。   Next, the state of the transport case 2 when transporting the transported object 11 will be described. FIG. 2A is a partial cross-sectional side view schematically showing the transport case 2 in a state in which the article 11 is accommodated, and FIG. 2B shows the transport case 2 in a state where an impact is applied. It is a partial section side view showing typically.

被搬送物11を搬送ケース2に収容する際には、上述のように、まず、挟持板12の接触面12aを被搬送物11の下面側(表面側)に接触させるとともに、挟持板14の接触面14aを被搬送物11の上面側(裏面側)に接触させる。これにより、被搬送物11は、一対の挟持板12,14によって挟持される。   When the transported object 11 is accommodated in the transport case 2, as described above, first, the contact surface 12 a of the sandwiching plate 12 is brought into contact with the lower surface side (front surface side) of the transported object 11, and The contact surface 14a is brought into contact with the upper surface side (back surface side) of the object 11 to be conveyed. Thereby, the conveyed object 11 is clamped by the pair of clamping plates 12 and 14.

次に、被搬送物11を挟持した一対の挟持板12,14を搬送ケース2の収容室4aに収容し、天井板10を閉じる。上述のように、ばね16の長さ(自然長)は、被搬送物11を挟持した一対の挟持板12,14を収容室4aに収容して天井板10を閉じた状態で、各ばね16が底板6又は天井板10と接触する範囲に調整されている。   Next, the pair of sandwiching plates 12 and 14 that sandwich the object to be transported 11 are housed in the housing chamber 4a of the transport case 2, and the ceiling plate 10 is closed. As described above, the length (natural length) of the spring 16 is such that the pair of sandwiching plates 12 and 14 sandwiching the object to be transported 11 are accommodated in the accommodating chamber 4a and the ceiling plate 10 is closed, and each spring 16 Is adjusted to a range in contact with the bottom plate 6 or the ceiling plate 10.

よって、被搬送物11を挟持した一対の挟持板12,14を収容室4aに収容して天井板10を閉じると、各ばね16は、底板6又は天井板10に接触して縮み、挟持板12又は挟持板14を下方又は上方から押圧する。その結果、被搬送物11は、図2(A)に示すように、各要素に作用する重力等と、各ばね16の復元力とが釣り合う所定の位置に保持される。   Therefore, when the pair of sandwiching plates 12 and 14 sandwiching the object to be conveyed 11 are accommodated in the accommodation chamber 4a and the ceiling plate 10 is closed, each spring 16 contracts in contact with the bottom plate 6 or the ceiling plate 10, and the sandwiching plate. 12 or the clamping plate 14 is pressed from below or above. As a result, the transported object 11 is held at a predetermined position where the gravity acting on each element and the restoring force of each spring 16 are balanced, as shown in FIG.

例えば、被搬送物11を収容した搬送ケース2に対して衝撃が加わり、図2(B)に示すような下向きの力Fが瞬間的に発生した場合を想定する。この場合には、箱体4が力Fによって下向きに移動する一方で、挟持板14側のばね16が縮み、挟持板12側のばね16が伸びるので、被搬送物11に加わる瞬間的な力は大幅に軽減される。   For example, it is assumed that an impact is applied to the transport case 2 that houses the object 11 to be transported, and a downward force F as shown in FIG. In this case, the box 4 is moved downward by the force F, while the spring 16 on the clamping plate 14 side is contracted and the spring 16 on the clamping plate 12 side is expanded, so that an instantaneous force applied to the conveyed object 11 Is greatly reduced.

また、被搬送物11は、一対の挟持板12,14で挟持されており、被搬送物11の下面側及び上面側には、それぞれ、挟持板12の接触面12a及び接触面14aが接触しているので、ばね16を介して箱体4から伝わる力は、被搬送物11の全体に分散される。つまり、被加工物11に局所的な力が加わることはない。   Further, the transported object 11 is sandwiched between a pair of sandwiching plates 12 and 14, and the contact surface 12a and the contact surface 14a of the sandwiching plate 12 are in contact with the lower surface side and the upper surface side of the transported object 11, respectively. Therefore, the force transmitted from the box 4 via the spring 16 is distributed over the entire transported object 11. That is, no local force is applied to the workpiece 11.

このように、本実施形態に係る搬送ケース2は、板状の被搬送物(板状物)11を挟持する一対の挟持板12,14と、伸縮可能な状態で挟持板を押圧するばね16とを備えるので、搬送時の衝撃をばね16の伸縮によって緩和できるとともに、搬送時の衝撃を挟持板12,14によって被搬送物11の全体に分散できる。つまり、本実施形態に係る搬送ケース2では、局所的な強い衝撃を加わり難くして、被搬送物11の破損を防ぐことができる。   As described above, the transport case 2 according to the present embodiment includes a pair of sandwiching plates 12 and 14 that sandwich the plate-shaped transported object (plate-like object) 11 and a spring 16 that presses the sandwiching plate in a stretchable state. Therefore, the impact during transportation can be reduced by the expansion and contraction of the spring 16, and the impact during transportation can be distributed to the entire transported object 11 by the sandwiching plates 12 and 14. That is, in the transport case 2 according to the present embodiment, it is difficult to apply a strong local impact and damage to the transported object 11 can be prevented.

なお、本発明は上記実施形態の記載に限定されず、種々変更して実施可能である。例えば、上記実施形態では、一対の挟持板12,14(具体的には、非接触面12b,14b)に、ばね16を設置しているが、箱体4側(すなわち、底板6及び天井板10)に、ばね16を設置してもよい。   In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, the spring 16 is installed on the pair of sandwiching plates 12 and 14 (specifically, the non-contact surfaces 12b and 14b), but the box 4 side (that is, the bottom plate 6 and the ceiling plate). 10), a spring 16 may be installed.

また、側方からの衝撃が問題となる場合等には、挟持板12,14や被搬送物11等と側壁8との間に、スポンジ等の緩衝材を配置しても良い。さらに、挟持板12,14と側壁8との間に、ばね16を設置することもできる。この場合、例えば、挟持板12,14と側壁8との間に広めの隙間を形成し、この隙間にばね16を設ける。これにより、搬送ケース2の側方からの衝撃を大幅に緩和できる。   In addition, when impact from the side becomes a problem, a cushioning material such as sponge may be disposed between the sandwiching plates 12, 14, the conveyed object 11, and the side wall 8. Further, a spring 16 can be installed between the sandwiching plates 12 and 14 and the side wall 8. In this case, for example, a wide gap is formed between the sandwiching plates 12 and 14 and the side wall 8, and the spring 16 is provided in this gap. Thereby, the impact from the side of the conveyance case 2 can be relieved significantly.

その他、上記実施形態に係る構成、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。   In addition, the configurations, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 搬送ケース
4 箱体
4a 収容室
6 底板
8 側壁
10 天井板
10a 差し込み部
12,14 挟持板
12a,14a 接触面
12b,14b 非接触面
16 ばね
11 被搬送物(板状物)
13 デバイス領域(中央部)
15 外周余剰領域(周縁部)
17 デバイス
F 力
2 Transport case 4 Box 4a Storage chamber 6 Bottom plate 8 Side wall 10 Ceiling plate 10a Insertion part 12, 14 Holding plate 12a, 14a Contact surface 12b, 14b Non-contact surface 16 Spring 11 Conveyed object (plate-like object)
13 Device area (central part)
15 Peripheral surplus area (periphery)
17 Device F force

Claims (1)

板状物を搬送時に収容する搬送ケースであって、
底板と天井板と側壁とからなり、内部に板状物を収容する収容室が形成された箱体と、
板状物に接する接触面をそれぞれ備え、該接触面に板状物を接触させて板状物を挟持した状態で該収容室に収容される一対の挟持板と、
該挟持板の該接触面とは反対側の面に設置されるばねと、を備え、
板状物を挟持した状態の該挟持板が該収容室に収容されると、該ばねが伸縮可能な状態で該挟持板を押圧して衝撃から板状物を保護することを特徴とする搬送ケース。
A transport case for storing a plate-shaped object during transport,
A box body including a bottom plate, a ceiling plate, and a side wall, in which a storage chamber for storing a plate-like object is formed;
A pair of clamping plates each having a contact surface in contact with the plate-like object, and being accommodated in the accommodation chamber in a state where the plate-like object is held in contact with the contact surface;
A spring installed on a surface opposite to the contact surface of the sandwich plate,
When the holding plate in a state of holding a plate-like object is accommodated in the accommodation chamber, the conveyance is characterized in that the plate-like object is protected from an impact by pressing the holding plate in a state where the spring can be expanded and contracted. Case.
JP2015168072A 2015-08-27 2015-08-27 Conveyance case Pending JP2017045893A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114249007A (en) * 2021-12-27 2022-03-29 江苏东方滤袋股份有限公司 Dust removal filter bag cage skeleton storage device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008531416A (en) * 2005-02-27 2008-08-14 インテグリス・インコーポレーテッド Reticle pod with insulation system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008531416A (en) * 2005-02-27 2008-08-14 インテグリス・インコーポレーテッド Reticle pod with insulation system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114249007A (en) * 2021-12-27 2022-03-29 江苏东方滤袋股份有限公司 Dust removal filter bag cage skeleton storage device

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