JP2017039176A5 - - Google Patents

Claims (12)

A substrate adsorption method for adsorbing a substrate to a top ring having a top ring body and an elastic film provided below the top ring body,
A plurality of areas formed concentrically between the upper surface of the elastic film and the top ring body with the lower surface of the substrate supported by a support member and the upper surface of the substrate in contact with the lower surface of the elastic film A vacuuming step of evacuating at least one area of
A flow rate measuring step for measuring a gas flow rate in an area outside the target area for vacuuming;
A determination step of determining whether or not the substrate has been adsorbed to the top ring based on the flow rate of the gas. The substrate adsorption method according to claim 1, further comprising: a separation step of separating the elastic film from which the substrate has been adsorbed and the support member after it is determined that the substrate has been adsorbed to the top ring. After the evacuation step, a pressure measurement step of measuring the pressure of at least one area of the evacuation target area,
Wherein in the determination step, in addition to the flow rate of the gas, said pressure also consider at least one area of the target area of the evacuation, it is determined whether the substrate to the top ring is adsorbed, according to claim 1 or 3. The substrate adsorption method according to 2. A pressurizing step of pressurizing at least one of the plurality of areas;
A contact step of bringing the upper surface of the substrate into contact with the lower surface of the elastic film,
The substrate suction method according to claim 1, wherein the vacuuming step is performed thereafter. The substrate suction method according to claim 4 , wherein in the pressurizing step, the area to be vacuumed is pressurized. The substrate adsorption method according to any one of claims 1 to 5 , wherein when the upper surface of the substrate and the lower surface of the elastic film are in contact with each other, an area outside the area to be vacuumed is not pressurized. The support member is a transport mechanism to pass the substrate to the top ring, the substrate adsorption method according to any one of claims 1 to 6. The support member is a polishing table for polishing a substrate held on the top ring, the substrate adsorption method according to any one of claims 1 to 7. The top ring body,
An elastic membrane provided below the top ring body, wherein a plurality of concentric areas are formed between the upper surface of the top ring body and the top ring body;
Pressure adjusting means for evacuating at least one of the plurality of areas in a state where the upper surface of the substrate whose lower surface is supported by the support member is in contact with the lower surface of the elastic film;
A flow meter for measuring the flow rate of the gas in an area outside the target area for vacuuming;
And a determination unit for determining whether or not the substrate is adsorbed on the lower surface of the elastic film based on the flow rate of the gas. Wherein the area in the outside of the target area of the evacuation, the flow meter is a flow path that is provided is connected between the said area the flow meter, the flow path is not branched, claim 9 Top ring as described in. The top ring according to claim 9 or 10 , wherein no hole is formed in the elastic film at a position where the plurality of areas are formed. The top ring according to any one of claims 9 to 11,
A transport mechanism for delivering the substrate to the top ring;
A substrate polishing apparatus comprising: a polishing table that polishes the substrate held by the top ring.