JP2017037096A - Method for manufacturing scintillator array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing capable of highly accurately and efficiently manufacturing a scintillator array by suppressing inter-cell misalignment.SOLUTION: A method of manufacturing a scintillator array includes steps of: fixing a scintillator substrate onto a support plate with a double-sided adhesive sheet (at least an adhesive surface on the scintillator substrate side is of an ultraviolet peeling type); forming a plurality of scintillator cells by forming grid-like grooves on the scintillator substrate; filling the gaps between the scintillator cells with curable liquid resin for reflective materials, and thermally curing the curable liquid resin for reflective materials to form a scintillator cell resin-cured body; and passing the ultraviolet rays through the support plate, and irradiating the double-sided adhesive sheet with the ultraviolet rays so as to peel off the double-sided adhesive sheet from the scintillator cell resin-cured body.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for efficiently and efficiently manufacturing a scintillator array used in a radiation detector or the like.

  One of the radiation examination apparatuses is a computed tomography apparatus (Computed Tomography (CT) apparatus). The CT apparatus has an X-ray tube that emits an X-ray fan beam and a radiation detector that is provided with a large number of radiation detection elements. The X-ray tube and the radiation detector are arranged so as to face each other with the measurement object as the center. The X-ray fan beam emitted from the X-ray tube passes through the measurement object and is detected by the radiation detector. Collect X-ray absorption data by changing the irradiation angle for each irradiation, calculate the X-ray absorption rate at each position on the tomographic plane to be measured by computer analysis, and construct an image according to the X-ray absorption rate To do. As a radiation detector, a detector combining a scintillator array and a silicon photodiode, or a detector combining a scintillator array and a photomultiplier tube is used.

  As a method for manufacturing such a scintillator array, Japanese Patent Laid-Open No. 2000-241554 discloses that a light emitting part is placed on an adhesive sheet, a mold is provided on the adhesive sheet so as to surround the light emitting part, and a rutile type titanium oxide powder is used. Pour the resin for light reflection layer made of epoxy resin into the mold and coat the light emitting part with resin, cure the resin by UV irradiation, remove the adhesive sheet and mold, and then machine the predetermined shape A method of making a scintillator array is disclosed. However, since a melting step and a washing step are required to peel off the pressure-sensitive adhesive sheet, there is a problem that the number of steps is large.

  Japanese Patent Application Laid-Open No. 2004-3970 discloses a method of forming a light reflecting material by coating a comb-like scintillator wafer with a polyester resin containing rutile-type titanium oxide and then curing the resin by ultraviolet irradiation. A weir is provided around the scintillator wafer so that the resin does not flow out. However, this method does not use an adhesive sheet for fixing the comb-like scintillator wafer.

  Japanese Patent Laid-Open No. 4-273087 discloses that a scintillator substrate is disposed on a pressure-sensitive adhesive sheet in a mold with a predetermined gap, and a liquid resin for a light reflecting material is placed in the mold to provide a liquid resin for a light reflecting material in the gap of the scintillator substrate. And a scintillator array manufacturing method in which the adhesive sheet is removed after the liquid resin is cured. However, when the resin is cured on the pressure-sensitive adhesive sheet, there is a problem that a peeling process and a washing process are required for peeling off the pressure-sensitive adhesive sheet, which increases the number of steps.

  Japanese Patent Laid-Open No. 2000-98041 discloses that a light emitting layer is attached to a first UV-sensitive adhesive film, a lattice-like groove reaching the adhesive film is formed in the light emitting layer by a laser, and light emission on the side opposite to the first adhesive film Since the second adhesive film is attached to the surface of the layer, the first adhesive film is removed by ultraviolet rays, and surface treatment is performed on at least one surface of the light emitting layer to improve light transmission to the photodetector. The manufacturing method of the following radiation detector is disclosed. However, this method does not have a member for supporting the second adhesive film. When the second adhesive film is bent, the light emitting layer separated by the groove is likely to be displaced before the resin coating step.

  Japanese Patent Application Laid-Open No. 2003-14852 is a method of manufacturing a multi-channel radiation detector in which a plurality of radiation detectors in which a scintillator and a semiconductor light detection element are stacked, and one surface of the scintillator wafer is attached to a holding sheet. Slicing the scintillator wafer to a predetermined width while being attached to the holding sheet, providing a gap, pouring a white mixture containing rutile titanium oxide and resin on the sliced scintillator, and filling around the gap and the scintillator, Resin is cured, multiple scintillators are integrated with a white mixture, multiple integrated scintillators are processed to the specified dimensions, and a light-reflective layer composed of rutile titanium oxide and resin is applied to one side, opposite A method of attaching a semiconductor photodetecting element to the side surface is disclosed. A foam sheet is used as the holding sheet. However, when the resin is cured on the foamed sheet, there is a problem that a peeling process and a cleaning process are required for peeling off the pressure-sensitive adhesive sheet, which increases the number of steps.

JP 2000-241554 A JP 2004-003970 A JP-A-4-230787 JP 2000-098041 A JP 2003-14852 A

  Accordingly, an object of the present invention is to provide a method for manufacturing a scintillator array with high accuracy and efficiency.

  The scintillator array manufacturing method of the present invention fixes a scintillator substrate to a support plate through a double-sided pressure-sensitive adhesive sheet that has at least an adhesive separation surface with the scintillator substrate, and forms lattice-like grooves in the scintillator substrate. A scintillator cell resin cured body is formed by forming a lattice-shaped grooved scintillator substrate having a plurality of scintillator cells, filling the lattice-shaped grooves with a liquid curable resin for a reflective material, and heat-curing the liquid curable resin. And then peeling the double-sided pressure-sensitive adhesive sheet from the cured scintillator cell resin by ultraviolet irradiation.

  In the method of manufacturing a scintillator array according to the first embodiment of the present invention, a scintillator substrate is fixed to a support plate via a double-sided pressure-sensitive adhesive sheet that has at least an adhesive surface with the scintillator substrate, and is attached to the scintillator substrate. A lattice-shaped through groove reaching the double-sided pressure-sensitive adhesive sheet is formed to form a through-grooved scintillator substrate having a plurality of scintillator cells, and the liquid curable resin for reflective material is filled in the through-groove, and the liquid curable resin It is characterized by having a step of forming a scintillator cell resin cured body by heat curing and then peeling the double-sided pressure-sensitive adhesive sheet from the cured scintillator cell resin by ultraviolet irradiation.

  The scintillator array manufacturing method according to the second embodiment of the present invention fixes a scintillator substrate to a support plate through a double-sided adhesive sheet having an ultraviolet peeling type adhesive surface with at least the scintillator substrate, and attaches the scintillator substrate to the scintillator substrate. By forming a grid-like non-penetrating groove, a scintillator substrate with a grid-like non-penetrating groove having a shape in which a plurality of scintillator cells are integrated by a connecting portion remaining on the scintillator substrate is formed, and a reflecting material is formed in the non-penetrating groove It is characterized by having a step of filling the liquid curable resin for use and removing the connecting part after heat curing of the liquid curable resin filled in the lattice grooves.

  In the second embodiment, after peeling the scintillator substrate with lattice-shaped non-penetrating grooves from the support plate and performing an annealing treatment, the adhesive surface with at least the scintillator substrate is again passed through a double-sided pressure-sensitive adhesive sheet having an ultraviolet release type. It is preferable to fix to the support plate.

  A method of manufacturing a scintillator array according to a third embodiment of the present invention includes a lattice-shaped non-penetrating groove having a shape in which a plurality of scintillator cells are integrated at a connecting portion by forming a lattice-shaped non-penetrating groove on a scintillator substrate. A scintillator substrate having a grid-like through groove is formed by fixing a scintillator substrate with a support plate via a double-sided pressure-sensitive adhesive sheet having at least an adhesion surface with the scintillator substrate being an ultraviolet peeling type, and removing the connecting portion The lattice-shaped through grooves are filled with a liquid curable resin for a reflector, and the liquid curable resin is heated and cured to form a cured scintillator cell resin, and then the scintillator cell resin is cured by ultraviolet irradiation. It has the process of peeling the said double-sided adhesive sheet from a body, It is characterized by the above-mentioned.

  In the third embodiment, it is preferable that an annealing process is performed after the scintillator substrate with grid-like non-penetrating grooves is formed.

  In a third embodiment, a jig having an opening having a size for fixing the scintillator substrate with grid-like non-penetrating grooves in the surface direction of the support plate is attached to the outer periphery of the upper surface of the support plate, It is preferable that after the scintillator substrate with grid-like non-penetrating grooves is bonded to the double-sided pressure-sensitive adhesive sheet in the opening, the connecting part is removed from the scintillator substrate with grid-like non-penetrating grooves by grinding.

  The adhesive sheet is extended above the support plate by affixing the UV peelable adhesive surface of the adhesive sheet to the entire periphery of the side surface of the support plate to which the scintillator substrate is fixed, and the upper extension portion of the adhesive sheet It is preferable that the liquid curable resin is caused to flow into the formed frame so that the liquid curable resin is filled in the gaps of the scintillator cells. Further, a frame formed of an adhesive sheet may be attached to the double-sided adhesive sheet attached to the support plate so as to surround the scintillator substrate, and the liquid curable resin may be allowed to flow into the frame. Of the pressure-sensitive adhesive sheet forming the frame, the pressure-sensitive adhesive surface on the side in contact with the liquid curable resin is preferably an ultraviolet peeling type.

  In any of the embodiments, the scintillator cell resin is cured on both sides to form a scintillator cell array in which the scintillator cell is exposed, and the scintillator cell array is formed on a double-sided pressure-sensitive adhesive sheet (at least the adhesion surface with the scintillator substrate is an ultraviolet ray). The scintillator cell array is covered with a liquid curable resin for a reflector, and the liquid curable resin is heated and cured to form a scintillator cell array resin cured body, It is preferable to expose the scintillator cell by grinding one surface of the scintillator cell array resin cured body.

The support plate is preferably UV transmissive. More preferably, it is possible to irradiate ultraviolet rays with an irradiation amount of 100 mJ / mm ² or more on the ultraviolet peelable pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet on the side in contact with the liquid curable resin.

  The surface roughness Ra of the support plate is preferably 10 μm or less, more preferably 0.01 to 10 μm, and most preferably 0.1 to 2 μm.

  The variation in the height of the support plate is preferably 100 μm or less, more preferably 0.01 to 100 μm, and most preferably 0.1 to 20 μm.

  The aspect ratio of the scintillator cell is preferably 5 or less, more preferably 0.2 to 5.

  According to the method of the present invention, a scintillator array for constituting a radiation detector used in a medical CT apparatus, a baggage inspection CT apparatus, or the like can be manufactured with high accuracy and efficiency.

It is a flowchart which shows the manufacturing method of the scintillator array by 1st embodiment of this invention. It is a perspective view which shows the scintillator board | substrate fixed to the support plate through the double-sided adhesive sheet. It is a perspective view which shows a mode that a grid | lattice-like through-groove is formed in the scintillator board | substrate of FIG. It is a perspective view which shows filling and hardening of resin by step A5. It is a perspective view which shows an example of the frame formed with the adhesive sheet. It is a perspective view which shows another example of the frame formed with the adhesive sheet. It is a perspective view which shows the scintillator cell resin hardening body obtained by step A7. It is a perspective view which shows the cell array obtained by step A8. It is a perspective view which shows filling and hardening of resin by step A12. It is a perspective view which shows the cell array resin hardening body obtained by step A14. It is a perspective view which shows the cell array resin coating obtained by step A15. It is a perspective view which shows the surface side of the cell array resin coating body of FIG. It is a perspective view which shows an example of the scintillator array obtained by step A16. It is a perspective view which shows another example of a scintillator array. It is a flowchart which shows the manufacturing method of the scintillator array by 2nd embodiment of this invention. It is a perspective view which shows a mode that a grid | lattice-like non-penetrating groove | channel is formed in the scintillator board | substrate fixed to the support plate. It is a perspective view which shows a mode that a scintillator board | substrate with a grid | lattice-like non-penetrating groove | channel is coat | covered with a liquid curable resin, and is hardened. It is a perspective view which shows the scintillator cell resin hardening body containing the scintillator board | substrate with a grid | lattice non-through-groove. It is AA sectional drawing of Fig.17 (a). It is a flowchart which shows the manufacturing method of the scintillator array by 3rd embodiment of this invention. It is a perspective view which shows the scintillator board | substrate with a grid | lattice non-penetrating groove | channel fixed to the support plate through the ultraviolet peeling type double-sided adhesive sheet with a connection part up. It is a perspective view which shows the scintillator board | substrate with a grid | lattice through groove | channel obtained by removing a connection part from the scintillator board | substrate with a grid | lattice non-through-groove shown in FIG. It is a perspective view which shows the jig | tool engaged with the upper surface outer peripheral part of the support plate which adhere | attached the ultraviolet peeling type double-sided adhesive sheet in order to fix the scintillator board | substrate with a grid | lattice non-through-groove in the surface direction of a support plate. It is a perspective view which shows a mode that the scintillator board | substrate with a lattice-shaped non-penetrating groove | channel was fixed to the opening part of the jig | tool with the connection part facing up. It is BB sectional drawing of Fig.22 (a). It is a top view which shows a radiation detector. It is CC sectional drawing of Fig.23 (a).

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings, but the present invention is not limited thereto. The description of each embodiment is applicable to other embodiments unless otherwise specified.

Examples of the scintillator used in the present invention include a scintillator made of gadolinium oxysulfide (GOS) or gadolinium-aluminum-gallium garnet (GGAG). GOS has a composition of Gd ₂ O ₂ S activated by at least one selected from Pr, Ce and Tb, for example. GGAG is activated with at least one selected from, for example, Ce, Pr, etc. (Gd _1-x Lu _x ) _{3 + a} (Ga _u Al _1-u ) _5-a O ₁₂ (x = 0 to 0.5, u = 0.2-0.6, and a = -0.05-0.15). However, the present invention is not limited to a specific scintillator composition.

[1] Manufacturing Method of Scintillator Array (1) First Embodiment FIG. 1 is a flowchart showing a manufacturing method of the first embodiment. First, a first and second adhesive surfaces are provided on both sides of a base film, at least a second adhesive surface is an ultraviolet peelable adhesive layer, and an ultraviolet peelable double sided adhesive sheet in which each adhesive layer is coated with a separator is prepared. To do. The ultraviolet peelable pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer that is foamed when exposed to a predetermined irradiation amount of ultraviolet light, and has a reduced adhesive strength and is easily peeled off. The first pressure-sensitive adhesive surface is also preferably a UV-peelable pressure-sensitive adhesive layer that foams at the same dose as the second pressure-sensitive adhesive surface.

  As shown in FIG. 2, the separator is peeled from the first adhesive surface of the UV peelable double-sided pressure-sensitive adhesive sheet 30 a covering the upper surface of the support plate 30, and the exposed first adhesive surface is placed on the upper surface of the support plate 30. Paste (step A1). Next, the separator is peeled off from the second adhesive surface of the ultraviolet peelable double-sided pressure-sensitive adhesive sheet 30a, and the bottom face Fa of the rectangular scintillator substrate 10 is attached to the second adhesive surface Fs (step A2). In this way, the scintillator substrate 10 is fixed to the support plate 30 via the ultraviolet peelable double-sided pressure-sensitive adhesive sheet 30a.

  The arithmetic average roughness Ra (JIS B0601-1994) of the upper surface of the support plate 30 (the surface on which the adhesive sheet 30a is attached) is preferably 10 μm or less. When Ra is more than 10 μm, the distance between each scintillator cell and the support plate 30 varies greatly, and the amount of grinding for making the thickness t of the scintillator cell uniform must be increased. The lower limit of Ra may be about 0.01 μm. Therefore, the surface roughness Ra of the support plate 30 is preferably 10 μm or less, practically more preferably 0.01 to 10 μm, and most preferably 0.1 to 2 μm. Further, it is preferable to use a plate that transmits ultraviolet rays as the support plate. Borosilicate glass or quartz glass can be used as long as the material transmits ultraviolet light to some extent. In particular, quartz glass is most preferred from the viewpoint of high transmittance at a wavelength of 200 to 450 nm and surface roughness.

In order to make the thickness t of the scintillator cell uniform, it is preferable that the support plate 30 has as small a variation in height as possible. For the variation in height, the support plate 30 is placed on a flat surface plate serving as a reference surface, and the heights H ₁ , H ₂ , H from the reference surface to the upper surface of the support plate 30 at any of five points. ₃ , H ₄ , H ₅ were measured with a dial gauge, and when the average height Hav was determined, the difference between each height H ₁ , H ₂ , H ₃ , H ₄ , H ₅ and the average height Hav It is defined as the maximum difference ΔHmax among ΔH ₁ , ΔH ₂ , ΔH ₃ , ΔH ₄ , ΔH ₅ . You may measure with the three-dimensional measuring device which used the laser instead of the dial gauge.

  The variation in the height of the support plate 30 is preferably 100 μm or less. When the variation in height is more than 100 μm, the distance between each scintillator cell and the support plate 30 varies greatly, and the amount of grinding for ensuring the uniformity of the thickness t of the scintillator cell increases. Practically, the variation in the height of the support plate 30 is more preferably 0.01 to 100 μm, and most preferably 0.1 to 20 μm.

  As shown in FIG. 3, using a cutting grindstone (for example, a diamond grindstone) 19, a plurality of parallel grooves 13 b reaching the pressure-sensitive adhesive sheet 30 a are formed in a lattice shape so as to be orthogonal to each other in the scintillator substrate 10. Form (Step A3). The scintillator substrate is separated into M × N scintillator cells 12b (M and N are each a natural number of 2 or more) by the groove 13b, leaving the end 15b. Since the scintillator substrate 11b with the through groove is fixed to the support plate 30 via the ultraviolet peeling type double-sided pressure-sensitive adhesive sheet 30a, the distance between them does not shift. Both end portions 15b and 15b of the through-grooved scintillator substrate 11b are cut off in a later step. The x-axis shown in FIG. 3 indicates the thickness direction of the scintillator substrate 10, and the y-axis and z-axis indicate the direction of the groove 13b.

  In each scintillator cell 12b, the shorter one of the dimensions in the Y-axis direction and the Z-axis direction is the width w, and the dimension in the X-axis direction is the height t. The aspect ratio (expressed in w / t) of each scintillator cell 12b is preferably 5 or less from the viewpoint of the resolution of the CT apparatus. If the aspect ratio is less than 0.2, it is difficult to hold the scintillator cell 12b by the adhesive sheet 30a. Therefore, the aspect ratio w / t is more preferably 0.2 to 5.

  Four UV peelable double-sided pressure-sensitive adhesive sheets 31F, 31R, 31B, 31L are attached to the entire circumference of the side surface of the support plate 30, and the double-sided pressure sensitive adhesive sheets 31F, 31R, 31B, 31L are placed above the support plate 30. Is partially extended. A square frame for forming a space for blocking the liquid curable resin for forming a resin layer functioning as a reflecting material is formed by the upwardly extending portions of the double-sided pressure-sensitive adhesive sheets 31F, 31R, 31B, 31L (step) A4). The pressure-sensitive adhesive sheets 31F, 31R, 31B, and 31L may be UV peelable single-sided pressure-sensitive adhesive sheets. Instead of using four UV peelable double-sided pressure-sensitive adhesive sheets, as shown in FIG. 5 (a), a single belt-like pressure-sensitive adhesive sheet is wrapped around the side surface of the support plate, and one end of the belt is stacked on the other end. A square frame may be formed. Moreover, as shown in FIG.5 (b), four adhesive sheets may be affixed in order on the side surface of a support plate, and the edge part of an adjacent adhesive sheet may be adhere | attached. In the case of FIG. 5 (a) and FIG.5 (b), an ultraviolet-releasable single-sided adhesive sheet can be used instead of an ultraviolet-releasable double-sided adhesive sheet. In any case, leakage of the resin can be reliably prevented by the frame formed of the ultraviolet peelable double-sided or single-sided adhesive sheet.

  Moreover, instead of sticking a double-sided pressure-sensitive adhesive sheet to the entire periphery of the side surface of the support plate 30, the double-sided pressure-sensitive adhesive sheets 31F, 31R, 31B, 31L attached to the support plate 30 surround the scintillator substrate 11b with a through groove. A frame formed in (1) may be attached. Also with this frame, resin leakage can be reliably prevented.

  As shown in FIG. 4, when the reflective liquid curable resin 32 is poured into the square frame, the groove 13b is filled with the liquid curable resin 32, and the scintillator cell 12b is covered with the liquid curable resin 32 (step A5). . As the liquid curable resin 32 that functions as a reflective material after curing, for example, an epoxy resin containing white titanium oxide particles can be used. The amount of the liquid curable resin 32 poured into the frame is preferably set so that the thickness after curing can be adjusted in a subsequent step.

  The liquid curable resin 32 poured into the frame is heated to a predetermined temperature and cured (step A6). When the liquid curable resin 32 is cured, the M × N scintillator cells are integrated with the cured resin 32 ′. Although the predetermined temperature heated in order to harden | cure depends on the kind of resin, Preferably it is 50-150 degreeC. The heating time of the liquid curable resin 32 may be 1 to 6 hours, preferably 1 to 3 hours, depending on the amount of the resin.

  After the liquid curable resin 32 is cured, the UV irradiating double-sided PSA sheet 30a and the UV-Peeling double-sided PSA sheets 31F, 31R, 31B, and 31L are irradiated with ultraviolet rays that are equal to or greater than the foaming start irradiation amount. Since the ultraviolet peelable pressure-sensitive adhesive layer is foamed by UV irradiation and the adhesive strength is reduced, the ultraviolet peelable double-sided pressure-sensitive adhesive sheet can be easily peeled off. Thereby, the scintillator cell resin hardening body 33 shown in FIG. 6 is obtained (step A7). The reference numerals of the members in the scintillator cell resin cured body 33 corresponding to the members constituting the through-grooved scintillator substrate 11b are the same numerals with “c” instead of “b”.

The amount of ultraviolet irradiation depends on the material of the adhesive layer, but is preferably 100 mJ / mm ² or more. In order to ensure a predetermined irradiation amount, each surface of the double-sided pressure-sensitive adhesive sheet 30a and the pressure-sensitive adhesive sheets 31F, 31R, 31B, 31L is irradiated from the direction perpendicular to the entire surface, or directional from the direction parallel to the surface. Irradiation may be performed using a high ultraviolet ray source. The base film and separator of the pressure-sensitive adhesive sheet are preferably made of a material that transmits ultraviolet light so that a sufficient amount of ultraviolet light is irradiated to the UV-peelable pressure-sensitive adhesive layer. Organic materials such as fluoroethylene. When an ultraviolet peelable pressure-sensitive adhesive sheet is used, only a small pressure-sensitive adhesive layer remains even after ultraviolet light peeling, so that the cleaning and removal thereof is easy, and it is not necessary to remove the entire ultraviolet light peelable pressure-sensitive adhesive sheet with a solvent.

  In the scintillator cell resin cured body 33 obtained in this way, the scintillator cells 12b are arranged with high accuracy. Moreover, since the ultraviolet peeling type adhesive sheet is used for fixing the scintillator substrate to the support plate, it can be easily peeled off only by heating, and the scintillator array can be manufactured efficiently.

  The back surface Bc and the surface Fc of the scintillator cell resin cured body 33 are ground or polished so that the scintillator cell 12b is exposed, and the scintillator cell 12d, the resin layer 13d, and the end 15d are uniformly exposed as shown in FIG. A scintillator cell array 36 having a thickness h1 is formed (step A8). The reference numbers of the members in the scintillator cell array 36 corresponding to the members constituting the scintillator cell resin cured body 33 are given “d” instead of “c” after the same numerals. In the scintillator cell array 36, the scintillator cell 12 d, the resin layer 13 d, and the end 15 d are surrounded by the resin outer peripheral portion 35.

  The separator is peeled off from the first pressure-sensitive adhesive surface of the same UV peelable double-sided pressure-sensitive adhesive sheet 60a as that of the pressure-sensitive adhesive sheet 30a, and the first pressure-sensitive adhesive surface is attached to the upper surface of the support plate 60 (step A9). The separator is peeled off from the second adhesive surface of the adhesive sheet 60a, and the scintillator cell array 36 is attached to the exposed second adhesive surface (step A10). Thereby, the scintillator cell array 36 is fixed to the support plate 60.

  As shown in FIG. 8, the same four UV peelable double-sided pressure-sensitive adhesive sheets 61F, 61R, 61B, 61L as used in step A4 are attached to the side surface of the support plate 60, and the liquid curable resin for the reflector is stored. A frame is formed (step A11). The both ends of the four adhesive sheets 61F, 61R, 61B, 61L are bonded to form a square frame. When the same liquid curable resin for reflecting material 62 as in step A5 is poured into the square frame, the back surface of the scintillator cell array 36 is covered with the liquid curable resin 62 (step A12).

  When the liquid curable resin 62 poured into the frame is heated to the predetermined temperature and cured, the back surface of the scintillator cell array 36 is covered with the cured resin 62 '(step A13). After the liquid curable resin 62 is cured, when the ultraviolet ray of a predetermined irradiation amount or more is irradiated, the adhesive strength of the ultraviolet peelable double-sided adhesive sheets 61F, 61R, 61B, 61L and the ultraviolet peelable double-sided adhesive sheet 60a is reduced and easily Can be peeled off. Thereby, the scintillator cell resin hardening body 73 shown in FIG. 9 is obtained (step A14). After peeling off the adhesive sheet, the scintillator cell resin cured body 73 is washed as necessary. The reference numbers of the members in the scintillator cell resin cured body 73 corresponding to the members constituting the scintillator cell array 36 are the same numerals, but “e” is appended instead of “d”.

  The back surface Be of the scintillator cell resin cured body 73 is surface-ground so that the thickness of the resin layer 72f is h2, and the scintillator cell array resin coating 76 shown in FIG. 10 is obtained (step A15). FIG. 11 shows the surface Ff side of the scintillator cell array resin coating 76 of FIG. A plurality of scintillator cells 12 d are exposed on the surface Ff of the scintillator cell array resin coating 76. The reference numerals of the members in the scintillator cell array resin covering 76 corresponding to the members constituting the scintillator cell resin cured body 73 have “f” instead of “e” after the same numerals.

  The outer periphery of the scintillator cell array resin coating 76 is removed by a rotating grindstone (not shown) to obtain a scintillator array 76f having a predetermined size shown in FIG. 12 (step A16). The scintillator array 76f has a reflective resin layer 13d between the scintillator cells 12d, and has a reflective resin layer 75 on the outer periphery and back surface. These reflective resin layers 13d and 75 function as reflective materials. M × N scintillator cells 12d are exposed on the surface of the scintillator array 76f, and the exposed surface of each scintillator cell 12d is a light emitting surface.

  The scintillator array can also be manufactured by the same steps as in the first embodiment after the end portion 15b is cut and removed in step A3 (FIG. 3). However, as shown in FIG. 13, in the outer periphery cutting corresponding to step A16, the reflecting material resin layer 75g on the side surface is processed to a predetermined size by cutting or grinding. Even in this method, it is possible to obtain a scintillator array 76g in which a plurality of scintillator cells 12d are arranged via the reflective resin layer 13d.

  The heating for curing the liquid curable resin and the ultraviolet irradiation for separating the UV-peelable pressure-sensitive adhesive sheet can be performed by a continuous device. The continuous device includes a belt conveyor passing through the heating region and the ultraviolet irradiation region, and the article (shown in FIGS. 4 and 8) placed on the belt conveyor is a liquid curable resin while passing through the heating region. Is cured, and then ultraviolet rays are irradiated onto the ultraviolet peelable pressure-sensitive adhesive sheet while passing through the ultraviolet irradiation region. In the article exiting the continuous device, the UV peelable pressure-sensitive adhesive sheet can be easily peeled off. This method is efficient because the curing of the liquid curable resin and the peeling of the UV peelable adhesive sheet can be performed continuously.

(4) Second Embodiment The method of the second embodiment is characterized in that a non-penetrating groove is formed instead of the penetrating groove. As shown in FIG. 14, steps B1 and B2 until the scintillator substrate 10 is fixed on the support plate 30 via the ultraviolet-ray-peeling double-sided pressure-sensitive adhesive sheet 30a are the same as steps A1 and A2 in the first embodiment.

  As shown in FIG. 15, using a cutting grindstone 19, a plurality of (M × N) parallel pieces having a depth that does not reach the ultraviolet-removable double-sided pressure-sensitive adhesive sheet 30 a while leaving both end portions 15 b and 15 b on the scintillator substrate 10. The non-penetrating grooves 13b ′ are formed in a lattice shape so as to be orthogonal to each other (step B3). The portion of the scintillator substrate 10 that remains due to the formation of the non-penetrating groove 13b 'supports each scintillator cell 12b as a connecting portion 11c. The thickness of the connecting portion 11c is appropriately set so that the scintillator cell does not crack when the liquid curable resin is heat-cured in the subsequent steps. The end 15b of the lattice-shaped non-penetrating groove scintillator substrate 11b 'may or may not be cut off in a later step. When the end 15b is cut off, the scintillator array 76g shown in FIG. 13 is obtained, and when the end 15b is not cut off, the scintillator array 76f shown in FIG. 12 is obtained.

  The support plate 30 to which the lattice-shaped non-penetrating grooved scintillator substrate 11b ′ is attached is irradiated with ultraviolet rays to foam the ultraviolet peelable double-sided adhesive sheet 30a, and the lattice-shaped non-penetrating grooved scintillator substrate 11b ′ is peeled from the support plate 30. (Step B4). In order to relieve the distortion accumulated in the grooving process, an annealing process is performed on the scintillator substrate 11b 'with lattice-shaped non-penetrating grooves (step B5). The annealing temperature is preferably 1000 to 1400 ° C, for example.

  The annealed scintillator substrate 11b 'with lattice-shaped non-penetrating grooves is fixed on the support plate 30 via the ultraviolet-peelable double-sided pressure-sensitive adhesive sheet 30a (step B6). Films 31F, 31R, 31B, and 31L are attached to the side surfaces of the support plate 30 to form a frame for storing the liquid curable resin (step B7). As shown in FIG. 16, when the liquid curable resin 32 is put into the space of the frame, the liquid curable resin 32 is filled in the lattice-shaped grooves (step B8).

  When the liquid curable resin 32 is heated to a predetermined temperature and cured, the M × N scintillator cells are integrated with the cured resin (step B9). The curing conditions for the liquid curable resin 32 may be the same as those in the first embodiment.

  After the liquid curable resin 32 is cured, the ultraviolet peelable double-sided pressure-sensitive adhesive sheet 30a and the ultraviolet peelable double-sided pressure sensitive adhesive sheets 31F, 31R, 31B, and 31L are peeled off by ultraviolet irradiation (step B10). As a result, a scintillator cell resin cured body 33 ′ with a connecting portion shown in FIGS. 17A and 17B is obtained. As shown in FIG. 17 (b), in order to remove the connecting portion 11c and to expose both surfaces of the scintillator cell, the surface Fc and the back surface Bc side of the scintillator cell resin cured body 33 ′ are ground to obtain a uniform thickness. A scintillator cell array having a height h1 is formed (step B11). This scintillator cell array is the same as the scintillator cell array 36 shown in FIG. After step B11, a scintillator array is obtained by the same steps as steps A9 to A16 of the first embodiment.

(4) Third Embodiment The method according to the third embodiment is the second embodiment in which the direction (vertical direction) of the scintillator substrate with grid-like non-penetrating grooves fixed to the support plate via the ultraviolet peelable double-sided adhesive sheet is the second embodiment. Different from the method of form. Accordingly, as shown in FIG. 18, steps C1 to C4 until the scintillator substrate 11b ′ with grid-shaped non-penetrating grooves is peeled off from the ultraviolet peelable double-sided pressure-sensitive adhesive sheet 30a on the support plate 30 by ultraviolet irradiation are the second implementation. This is the same as steps B1 to B4 in the embodiment. In addition, after forming the lattice-shaped non-penetrating grooves in the fixed scintillator substrate 10, it is not necessary to fill the resin for the reflecting material as it is, so there is no need to use an ultraviolet-releasable double-sided adhesive sheet for fixing the scintillator substrate 10, A pressure-sensitive adhesive sheet, an adhesive, a pressure-sensitive adhesive, or the like other than the ultraviolet peelable double-sided pressure-sensitive adhesive sheet may be used.

  As shown in FIG. 19, the lattice-shaped non-penetrating grooved scintillator substrate 11b ′ is bonded to the upper surface Fs of the ultraviolet peelable double-sided pressure-sensitive adhesive sheet 30a bonded to the support plate 30 with the connecting portion 11c facing upward (step C6). . The upper surface Fa side of the scintillator substrate 11b ′ with a grid-like non-penetrating groove is ground to the depth of an alternate long and short dash line P by a vertical grinding machine, a surface grinding machine, a lapping machine, a cutting machine, etc., and as shown in FIG. The connecting portion 11c is removed from the through-grooved scintillator substrate 11b ′, and the non-through groove is used as a through groove (step C7). In this way, the same through-grooved scintillator substrate 11b as shown in FIG. 3 is obtained. After step C7, a scintillator array is obtained by the same steps as steps A4 to A16 of the first embodiment.

  Each scintillator cell 12b preferably has an aspect ratio w / t of 0.2 to 5 in order to prevent the individual scintillator cells 12b from being displaced when the connecting portion 11c is removed by grinding.

  Since the liquid curable resin 32 that has entered the groove 13b shrinks when cured by heating to a predetermined temperature, a large stress is applied to the scintillator cell 12b. However, by separating the scintillator cells 12b before coating with the liquid curable resin 32, the stress due to the curing shrinkage of the liquid curable resin 32 is equally applied to the individual scintillator cells 12b. Therefore, it is possible to reliably prevent cracks from occurring in the scintillator cell 12b.

  A jig may be used to reliably prevent the individual scintillator cells 12b from being displaced when the connecting portion 11c is removed by grinding. For example, as shown in FIG. 21, a rectangular opening 51 having a rectangular outer shape surrounding the outer peripheral portion of the upper surface of the support plate 30 to which the ultraviolet peeling type double-sided pressure-sensitive adhesive sheet 30 a is bonded, and having a size capable of holding the scintillator substrate 10. And the jig | tool 50 which has the lower flange part 52 which contact | connects the side surface of the support plate 30 is used. In order to prevent the jig 50 from adhering to the ultraviolet peelable double-sided pressure-sensitive adhesive sheet 30a, at least the surface in contact with the pressure-sensitive adhesive sheet 30a needs to have releasability. For this purpose, for example, a release layer may be provided on the contact surface with the pressure-sensitive adhesive sheet 30a. Further, the entire jig 50 may be formed of a releasable material such as a fluororesin such as polytetrafluoroethylene.

  First, the jig 50 is fixed to the upper surface of the support plate 30 to which the ultraviolet peelable double-sided pressure-sensitive adhesive sheet 30a is bonded. Then, as shown in FIG. 11c is faced up and bonded to the upper surface Fs of the ultraviolet-releasable double-sided pressure-sensitive adhesive sheet 30a in the opening 51 of the jig 50. FIG. 22B shows a scintillator substrate 11 b ′ with grid-shaped non-penetrating grooves fixed in the yz direction by the jig 50. In this state, the upper surface Fa side of the scintillator substrate 11b 'with the lattice-shaped non-through grooves is ground to remove the connecting portion 11c. Since the movement of the scintillator cell 12b in the yz direction during grinding is restricted by the jig 50, it is possible to prevent the scintillator cell 12b from being displaced or peeled off from the UV-release type double-sided pressure-sensitive adhesive sheet 30a. After removing the connecting portion 11c, the jig 50 having releasability can be easily detached from the support plate 30.

[2] Radiation Detector As shown in FIGS. 23A and 23B, the radiation detector 100 includes a scintillator array 110 including a plurality (M × N) of scintillator cells 111 arranged in a flat plate shape. And a photodiode array 120 including a plurality (N × M) of photodiodes 121 arranged in a flat plate so as to be aligned with the scintillator cell 111 via the optical resin layer 130, and formed around the scintillator cell 111. And reflective layers 112, 113, and 114 (made of a resin for reflecting material containing white titanium oxide particles). Each scintillator cell 111 emits light by incident radiation, and the light is guided to the reflection layers 112, 113, and 114, enters each corresponding photodiode 121, and is converted into an electric signal by each photodiode 121. The scintillator array 110 is formed by the method of the present invention.

  The present invention will be described in more detail by the following examples, but the present invention is not limited thereto.

Example 1
The scintillator array shown in FIG. 13 was produced by the method of the first embodiment. First, an ultraviolet detachable type in which an ultraviolet ray irradiation amount required for detachment is 100 mJ / mm ² or more on the upper surface (Ra = 0.1 μm and height variation = 50 μm) of a support plate made of plate-like quartz glass. After bonding the double-sided PSA sheet, a scintillator substrate having a composition of Gd ₂ O ₂ S: Ce, Pr was bonded to the PSA sheet. Next, a resin for a reflector made of an epoxy resin containing rutile-type titanium oxide powder was used, the curing temperature was 80 ° C., and the heating time was 3 hours. The aspect ratio w / t of the scintillator cell was 1.0. As a result, a highly accurate scintillator array could be manufactured efficiently. The scintillator array and the photodiode array were joined via an optical adhesive to produce a radiation detector.

Example 2
A scintillator array was produced in the same manner as in Example 1 except that an ultraviolet peelable double-sided pressure-sensitive adhesive sheet having an ultraviolet irradiation amount necessary for peeling of 120 mJ / mm ² or more was used. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 3
A scintillator array was produced in the same manner as in Example 1 except that an ultraviolet peelable double-sided pressure-sensitive adhesive sheet having an ultraviolet ray irradiation amount of 150 mJ / mm ² or more required for peeling was used. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Comparative Example 1
A scintillator array was produced in the same manner as in Example 1 except that a pressure-sensitive adhesive sheet having no ultraviolet peeling function was used and the ultraviolet irradiation step was omitted. The use of the pressure-sensitive adhesive sheet required the dissolution step and the washing step, and therefore required a longer production time than Example 1 and was not efficient.

Example 4
A scintillator array was produced in the same manner as in Example 2 except that the curing temperature of the reflecting resin resin was 100 ° C. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 5
A scintillator array was produced in the same manner as in Example 3 except that the curing temperature of the resin for reflecting material was 100 ° C. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 6
As shown in FIG. 5 (a), a scintillator array was produced in the same manner as in Example 1 except that a belt-like UV-detachable double-sided pressure-sensitive adhesive sheet was wound around a support plate by an automatic winding device. As a result, it was possible to complete the adhesion of the pressure-sensitive adhesive sheet with a shorter man-hour than Example 1.

Example 7
A scintillator array was produced in the same manner as in Example 1 except that the aspect ratio of the scintillator cell was changed to w / t = 0.2 (w = 0.5 mm, t = 2.5 mm). The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 8
A scintillator array was produced in the same manner as in Example 1 except that the aspect ratio of the scintillator cell was changed to w / t = 0.6 (w = 0.8 mm, t = 1.4 mm). The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 9
A scintillator array was produced in the same manner as in Example 1 except that the aspect ratio of the scintillator cell was changed to w / t = 5.0 (w = 5.0 mm, t = 1.0 mm). The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Comparative Example 2
A scintillator array was produced in the same manner as in Example 1 except that the aspect ratio of the scintillator cell was changed to w / t = 0.1 (w = 0.1 mm, t = 1.0 mm). Since it was difficult to hold the scintillator cell, the scintillator array was processed at a low load. As a result, it took a longer time to manufacture the scintillator array than in Example 1, and it was not efficient.

Example 10
A scintillator array was produced in the same manner as in Example 1 except that the surface roughness Ra of the support plate was changed to 2 μm. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 11
A scintillator array was produced in the same manner as in Example 1 except that the surface roughness Ra of the support plate was changed to 0.01 μm. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 12
A scintillator array was produced in the same manner as in Example 1 except that the surface roughness Ra of the support plate was changed to 10 μm. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 13
A scintillator array was produced in the same manner as in Example 1 except that the variation in the height of the support plate was changed to 100 μm. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 14
A scintillator array was produced in the same manner as in Example 1 except that the variation in the height of the support plate was changed to 0.01 mm. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Example 15
A scintillator array was produced in the same manner as in Example 1 except that the variation in the height of the support plate was changed to 1 μm. The scintillator array obtained was highly accurate and the manufacturing process was efficient.

Claims (5)

A fixing step of fixing the scintillator substrate to a support plate through a double-sided pressure-sensitive adhesive sheet whose adhesion surface with at least the scintillator substrate is an ultraviolet peeling type;
A processing step of forming a lattice-shaped grooved scintillator substrate having a plurality of scintillator cells by forming a lattice-shaped groove in the scintillator substrate;
A curing step of forming a scintillator cell resin cured body by filling the lattice-shaped grooves with a liquid curable resin for a reflecting material and heat curing the liquid curable resin;
A scintillator array comprising a peeling step of peeling the double-sided pressure-sensitive adhesive sheet from the cured scintillator cell resin by irradiating the double-sided pressure-sensitive adhesive sheet with ultraviolet light transmitted through the support plate after the curing step. Production method. In the peeling step, the support plate is applied to the UV peelable pressure-sensitive adhesive surface of the double-sided pressure-sensitive adhesive sheet on the side in contact with the liquid curable resin by irradiating the support plate with the ultraviolet ray at an irradiation amount of 100 mJ / mm ² or more. 2. The method of manufacturing a scintillator array according to claim 1, wherein the transmitted ultraviolet rays are irradiated.   3. The scintillator array according to claim 1, wherein the support plate is made of quartz glass and has a support plate preparation step with a surface roughness Ra of 0.01 to 10 μm before the fixing step. 4. Manufacturing method.   3. The scintillator array according to claim 1, further comprising a support plate preparation step in which the support plate is made of quartz glass and has a height variation of 0.01 to 100 μm before the fixing step. 4. Manufacturing method. The method of manufacturing a scintillator array according to any one of claims 1 to 4, wherein the curing step and the peeling step are continuously performed.

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