JP2017035641A - Classification method and classification apparatus of electronic component chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a classification method of an electronic component chip capable of reliably performing screening whether an outer part plating layer is properly formed or not, and to provide a classification apparatus of such an electronic component chip.SOLUTION: In a classification method of a chip resistor, a flat classification stand 1 of which the surface is roughened is arranged in an inclined state, and a first chip component 10A formed of an Sn plating layer 16b on the outermost layer and a second chip component 10B with an exposed Ni plating layer 16a, without forming the Sn plating layer 16b are mounted on the neighborhood of a center of the classification stand 1 to which vibrations are applied and, thereby, the first chip component 10A and the second chip component 10B are set so as to move along the surface of the classification stand 1 in vertically opposite direction in accordance with a difference of surface states of the first and second chip resistors 10A, 10B.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component chip sorting method for sorting electronic component chips such as chip resistors and chip capacitors into non-defective products and defective products, and an electronic device chip sorting apparatus.

  A chip resistor, which is an example of an electronic component chip, includes a rectangular parallelepiped insulating substrate, a pair of front electrodes disposed opposite to each other on the surface of the insulating substrate at a predetermined interval, and a resistor that bridges the front electrodes A protective layer covering the resistor, a pair of back electrodes opposed to each other on the back surface of the insulating substrate at a predetermined interval, and provided on both end surfaces of the insulating substrate so as to bridge the front electrode and the back electrode The pair of end face electrodes and a pair of external electrodes formed by plating the outer surfaces of these end face electrodes are mainly configured.

  Since this type of chip resistor is often surface-mounted by mounting a back electrode on a land provided on a circuit board and soldering, the external electrode soldered to the land is usually soldered. The outer layer side Sn plating layer with good wettability and the inner layer side Ni plating layer functioning as a barrier layer for preventing solder erosion have a two-layer structure. These Ni plating layer and Sn plating layer are formed by using electrolytic plating called a barrel method, and a large number of products placed in the barrel are subjected to plating treatment collectively.

  However, when applying such electrolytic plating to a large number of products placed in a barrel, it is not always possible to form good external electrodes on all products. Due to factors such as lifting, products with poor plating may be mixed. Therefore, in order to prevent a chip resistor with poor plating from being mounted on the circuit board, it is necessary to select a good product and a defective product for all products after the plating process.

  Therefore, as described in Patent Document 1, a sorting apparatus has been proposed in which a non-defective product and a defective product are separated using the magnetic force of a Ni plating layer that is a magnetic material. Such a conventional sorting apparatus includes a magnet drum in which a plurality of magnets are arranged along a peripheral surface, a belt wound between the magnet drum and a tension roller, and a conveyor that circulates below the belt. When the chip component mounted on the transfer surface of the conveyor passes below the magnet drum, only the non-defective product on which the Ni plating layer made of a magnetic material is formed is adsorbed to the magnet drum and taken out from the conveyor. A defective product that is not formed at all or has an insufficient thickness is mounted on a conveyor as it is and conveyed by another route.

JP-A-9-38521

  However, since the prior art described in Patent Document 1 is a method of separating non-defective products and defective products using the magnetic force of the Ni plating layer, which is a magnetic material, the external electrode composed of the Ni plating layer and the Sn plating layer. When it is applied to an electronic component chip having, it is impossible to select whether or not an Sn plating layer that is not a magnetic material is properly formed. That is, if the Ni plating layer on the inner layer side is properly formed, it is determined as a good product regardless of the presence or absence of the Sn plating layer on the outer layer side. It will be sorted out. Even when a magnetic material is used instead of Sn as the plating layer on the outer layer side, it is impossible to distinguish between the magnetic force due to the plating layer of this magnetic material and the magnetic force due to the Ni plating layer on the inner layer side. It becomes difficult to sort.

  The present invention has been made in view of such a state of the prior art, and a first object of the present invention is an electronic component capable of reliably selecting whether or not an external plating layer is properly formed. A second object of the present invention is to provide a chip sorting method, and a second object is to provide such an electronic component chip sorting apparatus.

  In order to achieve the first object, an electronic component chip sorting method according to the present invention includes a first chip component in which an external plating layer is formed on a surface of an end surface electrode provided on an end surface of a square chip body. A sorting method for sorting into a second chip component in which an external plating layer is not formed on the surface of the end face electrode, and a flat sorting table whose surface is roughened is disposed in an inclined state. Then, the first chip component and the second chip component are applied by applying vibration to the sorting table in a state where the first chip component and the second chip component are mounted on the sorting table. It was made to move upside down.

  A flat sorting table whose surface is roughened in this way is placed in an inclined state, and vibration is applied to the sorting table with the first chip component and the second chip component mounted on the sorting table. Then, according to the difference in the surface state between the first chip component having the external plating layer and the second chip component on which the external plating is not formed, the first chip component and the second chip component are separated from each other. Since the surface is moved upside down, the first chip component which is a non-defective product and the second chip component which is a defective product can be reliably separated.

  In order to achieve the second object, an electronic component chip sorting apparatus according to the present invention is a first chip in which an external plating layer is formed on the surface of an end face electrode provided on an end face of a square chip body. A separation device for separating a component from a second chip component having no external plating layer formed on the surface of the end face electrode, wherein the surface is roughened and disposed flat. And a hopper for supplying the first chip component and the second chip component to the center of the surface of the sorting table. A non-rough surface portion with a smooth surface roughness is formed on the lower end side of the surface

  In the electronic component chip sorting apparatus configured as described above, the sorting table whose surface is roughened is installed obliquely, and vibration is applied to the sorting table. When the first chip component and the second chip component are supplied near the center of the table, the first chip component and the second chip component are sorted according to the difference in the surface state depending on the presence or absence of the external plating layer. The first chip component which is a non-defective product and the second chip component which is a defective product can be reliably separated. At this time, since the non-rough surface portion having a smooth surface roughness is formed on the lower end side of the sorting table, one chip component descending on the sorting table can fall without staying at the lower end portion.

  According to the electronic component chip sorting method according to the present invention, it is possible to reliably perform selection as to whether or not the external plating layer is properly formed. Further, according to the electronic component chip sorting apparatus according to the present invention, it is possible to reliably perform the selection as to whether or not the external plating layer is properly formed and to reliably collect the components after the selection. it can.

It is a perspective view of the sorting device concerning the example of an embodiment of the present invention. It is a side view of this sorter. It is sectional drawing which shows the chip resistor of the good product which is a classification | category object, and a defective product.

  DESCRIPTION OF EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. A sorting apparatus according to an embodiment of the present invention is applied in a manufacturing process of a chip resistor which is an example of an electronic component chip. Is used to remove defective plating products generated when the external electrodes of the chip resistors are plated, and to select only good chip resistors.

  As shown in FIG. 1 and FIG. 2, this sorting apparatus includes a flat sorting table 1 on which chip resistors to be sorted are mounted, a vibration device 2 that applies vibration to the sorting table 1, and a sorting table 1. , A transfer belt 4 connected to the upper end position of the sorting table 1, and a collection box 5 arranged at the lower end position of the sorting table 1. It is installed at an inclination angle of ° to 12 °.

  Most of the surface of the sorting table 1 is a rough surface portion 1a, and this rough surface portion 1a is a surface having a rough surface which is blasted with, for example, # 60 (grain size). Further, the lower end side of the sorting table 1 is a non-rough surface portion 1b having a smaller surface roughness than the rough surface portion 1a, and the non-rough surface portion 1b has a smooth surface roughness without being blasted. It is. A vibration of 45 kHz to 50 kHz is applied to the sorting table 1 from the vibration device 2 disposed below.

  The hopper 3 stores the first and second chip resistors 10A and 10B to be separated in a mixed state, and these chip resistors 10A and 10B are located near the center of the sorting table 1 from the discharge port 3a of the hopper 3. To be supplied sequentially.

  The products to be separated will be described. FIG. 3A is a cross-sectional view of the first chip resistor 10A, and FIG. 3B is a cross-sectional view of the second chip resistor 10B. These first chips The difference between the resistor 10A and the second chip resistor 10B is whether or not the external plating layer is properly formed.

  That is, as shown in FIG. 3A, the first chip resistor 10A includes a rectangular parallelepiped insulating substrate 11, a pair of front electrodes 12 provided at both longitudinal ends of the surface of the insulating substrate 11, A rectangular resistor 13 provided so as to be connected to the surface electrodes 12, an insulating protective layer 14 covering a part of both the surface electrodes 12 and the entire surface of the resistor 13, and both longitudinal ends of the insulating substrate 11 A pair of end face electrodes 15 provided in the part and a pair of external electrodes 16 attached to the surface of these end face electrodes 15. The external electrode 16 has a two-layer structure of a barrier layer and an external connection layer, of which the barrier layer is a Ni plating layer 16a formed by electrolytic plating, and the external connection layer is a Sn plating layer 16b formed by electrolytic plating. . On the other hand, as shown in FIG. 3B, the Sn chip layer 16b is not formed on the second chip resistor 10B due to defective plating, and the Ni plating layer 16a is exposed in the outermost layer. . That is, the first chip resistor 10A is a non-defective product having an appropriate external plating layer, while the second chip resistor 10B is a defective product in which the Sn plating layer 16b is not formed.

  As described above, the sorting apparatus according to the present embodiment is used to sort the chip resistors after plating of the external electrodes into non-defective products and defective products, and the first device as shown in FIG. The chip resistor 10 </ b> A and the second chip resistor 10 </ b> B are housed in a mixed state in the hopper 3. In addition, since the Ni plating layer 16a on the inner layer side may not be formed by the plating process of the external electrode 16, it is a magnetic substance in the previous step of housing the first and second chip resistors 10A and 10B in the hopper 3. Using the magnetic force of the Ni plating layer 16a, defective products without the Ni plating layer 16a are removed. That is, the non-defective first chip resistor 10A in which the Ni plating layer 16a and the Sn plating layer 16b are appropriately formed and the Ni plating layer 16a only and the Sn plating layer 16b is not provided in the hopper 3. A non-defective second chip resistor 10B is accommodated.

  These chip resistors 10A and 10B are sequentially supplied from the discharge port 3a of the hopper 3 toward the vicinity of the center of the sorting table 1, but the surface of the sorting table 1 installed obliquely has a roughened surface portion 1a. Since the vibration is applied from the vibration exciter 2 to the sorting table 1, the first chip resistor 10A and the first chip resistor 10A are changed according to the difference in the surface state of the external electrode in contact with the rough surface portion 1a. The second chip resistor 10 </ b> B moves upside down on the rough surface portion 1 a of the sorting table 1.

  That is, when comparing the surface state of the Sn plating layer 16b exposed to the external electrode of the first chip resistor 10A and the Ni plating layer 16a exposed to the external electrode of the second chip resistor 10B, the Sn plating layer 16b Since the first chip resistor 10A travels upward (in the direction of arrow A in FIG. 2) of the sorting table 1, the first chip resistor 10A is transferred from the upper end of the sorting table 1 to the transfer belt 4. The On the other hand, since the surface state of the Ni plating layer 16a is smooth and hard, the second chip resistor 10B proceeds downward (in the direction of arrow B in FIG. 2) of the sorting table 1 and then the lower end of the sorting table 1 And is stored in the collection box 5. At this time, since the lower end side of the sorting table 1 is a non-rough surface portion 1b having a smaller surface roughness than the rough surface portion 1a, the second chip resistor 10B descending on the rough surface portion 1a of the sorting table 1 is provided. It is possible to prevent stagnation at the non-rough surface portion 1b, and the second chip resistor 10B can be smoothly recovered as a defective product.

  As described above, in the chip resistor sorting method according to this embodiment, the flat sorting table 1 whose surface is roughened is disposed in an inclined state, and vibration is applied to the sorting table 1. When the chip resistor is mounted in the state, the first chip component 10A in which the Sn plating layer 16b is formed on the outermost layer and the second chip component 10B in which the Ni plating layer 16a is exposed without forming the Sn plating layer 16b. The first chip component 10A and the second chip component 10B move upside down on the surface of the sorting table 1 according to the difference in surface state between the first chip component 10A and the non-defective first chip component 10A. The non-defective second chip component 10B can be reliably separated.

  In the chip resistor separation device according to this embodiment, the separation table 1 whose surface is roughened is installed obliquely, and vibration is applied to the separation table 1 from the vibration device 2. When the first chip component 10A and the second chip component 10B are supplied from the hopper 3 to the vicinity of the center of the sorting table 1, the difference in surface state due to the presence or absence of the external plating layer (Sn plating layer 16b) Accordingly, since the first chip component 10A and the second chip component 10B move upside down on the surface of the sorting table 1, the first chip component 10A which is a non-defective product and the second chip component which is a defective product. 10B can be reliably separated. Moreover, since the non-rough surface portion 1b having a smooth surface roughness is formed on the lower end side of the sorting table 1, the second chip resistor 10B descending on the rough surface portion 1a of the sorting table 1 is replaced with the non-rough surface portion 1b. The second chip resistor 10B can be smoothly recovered as a defective product.

  In the above embodiment, the chip resistor having the Sn plating layer 16b formed on the outermost layer of the external electrode 16 has been described as an object of separation, but an Au plating layer or a Cu plating layer is formed instead of the Sn plating layer. The chip resistor can also be applied. In this case as well, the first resistor is formed according to the difference in the surface state between the outer plating layer made of Au, Cu, or the like and the inner plating layer made of Ni, Cr, or the like. The chip component and the second chip component can be made to move upside down on the sorting table 1.

  In the above embodiment, the chip resistor is exemplified as the product to be sorted. However, the sorting method and sorting device according to the present invention can be applied to other electronic component chips such as a chip capacitor. .

DESCRIPTION OF SYMBOLS 1 Sorting table 1a Rough surface part 1b Non-rough surface part 2 Excitation apparatus 3 Hopper 4 Transfer belt 5 Recovery box 10A 1st chip resistor 10B 2nd chip resistor 11 Insulating substrate 12 Surface electrode 13 Resistor 14 Protective layer 15 End surface Electrode 16 External electrode 16a Ni plating layer 16b Sn plating layer

Claims (2)

A first chip component in which an external plating layer is formed on the surface of the end surface electrode provided on the end surface of the square chip body, and a second chip component in which the external plating layer is not formed on the surface of the end surface electrode. A sorting method for sorting,
A flat sorting table whose surface is roughened is disposed in an inclined state, and vibration is applied to the sorting table with the first chip component and the second chip component mounted on the sorting table. By doing so, the first chip component and the second chip component are transported in the upside down direction. A first chip component in which an external plating layer is formed on the surface of the end surface electrode provided on the end surface of the square chip body, and a second chip component in which the external plating layer is not formed on the surface of the end surface electrode. A sorting device for sorting,
A flat separation table whose surface is roughened and disposed in an inclined state, a vibration device for applying vibration to the separation table, the first chip component and the above-mentioned at the center of the surface of the separation table An electronic component chip sorting apparatus, comprising: a hopper for supplying a second chip component, wherein a non-rough surface portion having a smooth surface roughness is formed on a lower end side of the surface of the sorting table.