JP4251013B2 - Chip type electronic component sorting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-type electronic component sorting device, and more particularly to a chip-type electronic component sorting device for judging the coplanarity of a chip-type electronic component and sorting the quality of the chip-type electronic component.
[0002]
[Prior art and issues]
In general, chip-type electronic components, particularly chip-type electronic components having a relatively large size, have a coplanarity (electronic component) on the bottom surface (mounting surface) of the chip-type electronic component in order to ensure solderability to the wiring board to be mounted. It is necessary to determine whether the chip-type electronic component is non-defective or defective by determining the warping or unevenness of the element body or the flatness of the bottom surface due to the difference in the thickness of the external electrode.
[0003]
Conventionally, in order to determine the coplanarity of a chip-type electronic component, a contact-type surface roughness meter or a non-contact-type surface roughness meter using a laser has been used. However, when this type of surface roughness meter is used, it takes about 5 minutes for one measurement itself, and about 3 minutes to process the measured data. It was extremely inefficient to sort.
[0004]
In addition, as an example using other detection devices, for example, Patent Document 1 discloses that the quality of a coplanarity of an electronic component with a lead terminal is detected by imaging the tip of the lead terminal with a camera for detection. Yes.
[0005]
[Patent Document 1]
JP 2002-176300 JP
Accordingly, an object of the present invention is to provide a chip-type electronic component sorting device that can easily and efficiently determine the quality of a coplanarity of a chip-type electronic component in a short time and sort out good or defective chip-type electronic components. Is to provide.
[0007]
[Means and Actions for Solving the Problems]
In order to achieve the above object, a chip-type electronic component sorting apparatus according to the present invention is installed at a predetermined height between at least two contact determination electrodes installed at a predetermined height and the contact determination electrodes. Whether the external electrode of the chip-type electronic component contacts the two contact determination electrodes at the same time when the insulating reference member and the chip-type electronic component are disposed on the contact determination electrode and the reference member. And a determination circuit for determining whether or not.
[0008]
In the chip-type electronic component sorting apparatus according to the present invention, at least two contact determination electrodes are installed at the same height, and the reference member is installed at a position higher or lower than the contact determination electrode. Yes.
[0009]
In the chip-type electronic component sorting apparatus according to the present invention, when the chip-type electronic component to be sorted is disposed on the contact determination electrode and the reference member, for example, the reference member is installed at a high position. When the bottom surface of the chip-type electronic component has a good coplanarity, even if one external electrode of the chip-type electronic component contacts one of the contact determination electrodes, the substantially central portion of the bottom surface of the chip-type electronic component Does not contact the reference member and the other external electrode does not contact the other contact determination electrode. Further, when the bottom surface of the chip-type electronic component is warped more than necessary, the two external electrodes come into contact with the two contact determination electrodes at the same time even though the reference member protrudes.
[0010]
On the other hand, when the reference member is installed at a low position, the bottom surface of the chip-type electronic component has good coplanarity when the chip-type electronic component to be selected is disposed on the contact determination electrode and the reference member. In this case, since the reference member is retracted downward, both external electrodes of the chip-type electronic component are in contact with the two contact determination electrodes. In addition, when the bottom surface of the chip-type electronic component is warped more than necessary, even if one external electrode contacts one of the contact determination electrodes, the substantially central portion of the bottom surface of the chip-type electronic component serves as the reference member. The other external electrode does not come into contact with the other contact determination electrode.
[0011]
As described above, in the chip-type electronic component sorting apparatus according to the present invention, it is only necessary to determine whether or not the external electrode of the chip-type electronic component is in contact with the two contact determination electrodes at the same time. It can be easily and efficiently determined and selected in a short time.
[0012]
In the chip-type electronic component sorting apparatus according to the present invention, the determination circuit preferably determines contact or non-contact based on the resistance value between the two contact determination electrodes, and the chip-type electronic that contacts the contact determination electrode. The external electrode of the component is preferably a ground electrode. The presence or absence of contact can be easily determined based on the resistance value. In addition, since the ground electrode is held at the same potential, the presence or absence of contact can be easily determined.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, an embodiment of a chip type electronic component sorting apparatus according to the present invention will be described with reference to the accompanying drawings. In each attached drawing, hatched portions are electrodes.
[0014]
(Chip type electronic components to be selected, see Fig. 1)
1A and 1B show bottom surfaces (mounting surfaces) of chip-type electronic components 1 and 2 to be selected by the chip-type electronic component sorting apparatus according to the present invention. This type of chip-type electronic component 1, 2 is formed by forming a capacitor pattern, an inductor pattern, a resistor pattern, etc. (not shown) on a ceramic green sheet, and laminating these sheets to incorporate a predetermined circuit element. The built-in circuit element is electrically connected by a via hole or the like. In addition, you may mount another chip-type electronic component and metal case on the upper surface of a laminated body as needed. The size of the chip-type electronic component is as follows: length L: 3.5 to 5.5 mm (typical value 5.0 mm), width W: 3.0 to 4.5 mm (typical value 4.0 mm), height T: 1 .5 to 2.5 mm (typical value 1.8 mm). In such a relatively large chip-type electronic component, it is necessary to pay particular attention to coplanarity.
[0015]
Further, the individual external electrodes 5 connected to the built-in circuit elements are formed on the bottom surfaces of the chip-type electronic components 1 and 2 by a thick film method such as a dip method, and the chip type shown in FIG. In the electronic component, ground external electrodes 6 and 7 are formed at the left and right ends. In the chip-type electronic component shown in FIG. 8 is formed. The individual external electrode 5 or the ground external electrodes 6 and 7 may be formed not only on the bottom surface of the multilayer body but also around the side surface or top surface of the multilayer body.
[0016]
(See the first embodiment, FIG. 2)
As shown in FIG. 2, the sorting device for chip-type electronic components as the first embodiment includes two contact determination electrodes 11 and 12, and an insulating reference member 14 installed between the electrodes 11 and 12. , And a tester 15 for determination.
[0017]
The two contact determination electrodes 11 and 12 are installed so that the surfaces thereof have the same height. The reference member 14 is installed at a position slightly higher than the electrodes 11 and 12. The protrusion amount D, which is the difference in height, is set based on the standard of coplanarity required for the chip-type electronic component 1. As a specific example, the protrusion amount D is 50 to 150 μm or less (the coplanarity is 50 or less). ˜150 μm or less). In consideration of the fact that the element body of the chip-type electronic component 1 is a ceramic sintered body and that the external electrode is formed by a thick film method, the thickness is preferably 100 ± 10 μm or less. The tester 15 is electrically connected to the contact determination electrodes 11 and 12, measures the resistance value between the electrodes 11 and 12, and determines whether or not there is electrical conduction between them.
[0018]
The first embodiment is exclusively for determining whether the coplanarity of the bottom surface of the chip-type electronic component 1 shown in FIG. That is, when the bottom surface of the chip-type electronic component 1 to be selected is warped more than necessary as shown in FIG. 2A, the chip-type electronic component 1 is connected to the contact determination electrodes 11 and 12 and the reference. When disposed on the member 14, both the ground external electrodes 6 and 7 are simultaneously in contact with the two contact determination electrodes 11 and 12 even though the reference member 14 protrudes from the electrodes 11 and 12. . In this case, continuity between the electrodes 11 and 12 is confirmed by the tester 15, and the bottom surface of the chip-type electronic component is warped upward, and it is determined that the coplanarity is bad. In order to improve the contact between the ground external electrodes 6 and 7 and the electrodes 11 and 12 of the chip-type electronic component 1, it is preferable to press the chip-type electronic component 1 appropriately from above.
[0019]
On the other hand, when the bottom surface of the chip-type electronic component 1 has good coplanarity, even if one external electrode 6 or 7 of the chip-type electronic component 1 contacts one contact determination electrode 11 or 12, The substantially central portion does not contact the reference member 14 and the other external electrode 7 or 6 does not contact the other contact determination electrode 12 or 11. In this case, no current flows through the tester 15 (infinite resistance value), the bottom surface of the chip-type electronic component is not warped more than necessary, and it is determined that the coplanarity is good.
[0020]
In the first embodiment, the reference member 14 is projected slightly higher than the electrodes 11 and 12 to determine the coplanarity related to the warpage of the bottom surface of the chip-type electronic component 1 toward the upper surface. By simply disposing the chip type electronic component 1 to be placed on the contact determination electrodes 11 and 12 and the reference member 14, it is possible to immediately determine whether the coplanarity is good or bad.
[0021]
(Refer to a modification of the first embodiment, FIG. 3 and FIG. 4)
In the first embodiment, in order to achieve the same object, the contact determination electrodes 11 and 12 and the reference member 14 can be changed to various shapes.
[0022]
For example, FIG. 3 shows a configuration in which the reference member 14 is provided in the center portion and is surrounded by the electrodes 11 and 12 so that a circular non-electrode portion is formed around the reference member 14. FIG. 4 shows a combination of the electrodes 11 and 12 so that semicircular non-electrode portions are formed around the reference members 14 and 14 provided at two places.
[0023]
(See the second embodiment, FIG. 5)
As shown in FIG. 5, the sorting device for chip-type electronic components as the second embodiment includes two contact determination electrodes 21 and 22, and an insulating reference member 24 installed between the electrodes 21 and 22. , And a tester 25 for determination.
[0024]
The two contact determination electrodes 21 and 22 are installed so that the surfaces thereof have the same height. The reference member 24 is installed at a position slightly lower than the electrodes 21 and 22. The tester 25 is electrically connected to the contact determination electrodes 21 and 22, measures the resistance value between the electrodes 21 and 22, and determines whether or not there is electrical conduction between them.
[0025]
The second embodiment is for determining whether the coplanarity of the bottom surface of the chip-type electronic component 1 shown in FIG. That is, when the bottom surface of the chip-type electronic component 1 to be selected has good coplanarity as shown in FIG. 5A, the chip-type electronic component 1 is connected to the contact determination electrodes 21 and 22 and the reference member. Since the reference member 24 is retracted (retracted) downward, the grounding external electrodes 6 and 7 are in contact with the two contact determination electrodes 21 and 22 at the same time. In this case, continuity between the electrodes 21 and 22 is confirmed by the tester 25, and it is determined that the bottom surface of the chip-type electronic component 1 is not warped more than necessary and the coplanarity of the bottom surface is good.
[0026]
On the other hand, when the bottom surface of the chip-type electronic component 1 is warped more than necessary, even if one external electrode 6 or 7 of the chip-type electronic component 1 contacts one contact determination electrode 21 or 22, the bottom surface Is not in contact with the reference member 24, and the other external electrode 7 or 6 does not contact the other contact determination electrode 22 or 21. In this case, no current flows through the tester 25 (resistance value is infinite), and the bottom surface of the chip-type electronic component is warped more than necessary to determine that the coplanarity is poor.
[0027]
In the second embodiment, the reference member 24 is retracted slightly below the electrodes 21 and 22 to determine the coplanarity related to the warping of the bottom surface of the chip-type electronic component 1 toward the bottom surface. By simply disposing the chip type electronic component 1 to be disposed on the contact determination electrodes 21 and 22 and the reference member 24, the quality of the coplanarity can be immediately determined. When the coplanarity determination criterion is 100 μm, the retraction amount T of the reference member 24 with respect to the contact determination electrodes 21 and 22 is suitably 100 μm.
[0028]
In the second embodiment, the contact determination electrodes 21 and 22 and the reference member 24 can be changed to various shapes as shown in FIG. 3 or FIG. 4 in order to achieve the same purpose. .
[0029]
(Refer to the third embodiment, FIG. 6)
As shown in FIG. 6, the chip-type electronic component sorting apparatus according to the third embodiment is installed between the three contact determination electrodes 31, 32, 33 and between the electrodes 31, 32 and between the electrodes 32, 33. Insulating reference members 34a and 34b and determination testers 35a and 35b.
[0030]
The three contact determination electrodes 31, 32, 33 are installed so that the surfaces thereof have the same height. The reference member 34 a is installed at a position slightly higher than the electrodes 31, 32, 33, and the reference member 34 b is installed at a position relatively lower than the electrodes 31, 32, 33. The tester 35a is electrically connected to the contact determination electrodes 31 and 32, and the tester 35b is electrically connected to the contact determination electrodes 32 and 33, and the resistance between the electrodes 31 and 32 and between the electrodes 32 and 33, respectively. Measure the value and determine if there is electrical continuity between them.
[0031]
That is, the third embodiment is a combination of the first embodiment and the second embodiment, and is used exclusively for determining the quality of the coplanarity of the bottom surface of the chip-type electronic component 2 shown in FIG. The coplanarity is determined by the combination of the electrodes 31, 32 and the reference member 34a as in the first embodiment, and the coplanarity is determined by the combination of the electrodes 32, 33 and the reference member 34b as in the second embodiment.
[0032]
(Other embodiments)
The sorting device for chip-type electronic components according to the present invention is not limited to the above embodiment, and can be variously modified within the scope of the gist thereof.
[0033]
In particular, the details of the shape and arrangement of the contact determination electrode and the reference member are arbitrary, and various types of chip-type electronic components to be selected exist.
[0034]
【The invention's effect】
As is apparent from the above description, according to the present invention, at least two contact determination electrodes installed at a predetermined height, an insulating reference member installed at a predetermined height, and a chip-type electronic component And the determination circuit for determining whether or not the external electrode of the chip-type electronic component is in contact with the two contact determination electrodes at the same time when disposed on the contact determination electrode and the reference member, Only by disposing the chip-type electronic component on the two contact determination electrodes and the reference member, the quality of the coplanarity of the bottom surface of the chip-type electronic component can be easily and efficiently determined.
[Brief description of the drawings]
FIG. 1 is a bottom view showing chip-type electronic components selected according to the present invention.
FIG. 2 shows a schematic configuration of a first embodiment of a sorting apparatus according to the present invention, where (A) is a front view and (B) is a plan view.
FIG. 3 is a plan view showing a schematic configuration of a modification of the first embodiment.
FIG. 4 is a plan view showing a schematic configuration of another modification of the first embodiment.
5A and 5B show a schematic configuration of a second embodiment of the sorting apparatus according to the present invention, where FIG. 5A is a front view and FIG. 5B is a plan view.
6A and 6B show a schematic configuration of a third embodiment of the sorting apparatus according to the present invention, where FIG. 6A is a front view and FIG. 6B is a plan view.
[Explanation of symbols]
1, 2, ... Chip-type electronic components 6, 7, 8 ... Ground external electrodes 11, 12, 21, 22, 31, 32, 33 ... Contact determination electrodes 14, 24, 34a, 34b ... Reference members 15, 25, 35a , 35b ... Tester

Claims (5)

At least two contact determination electrodes installed at a predetermined height;
An insulating reference member installed at a predetermined height between the contact determination electrodes;
A determination circuit for determining whether or not an external electrode of the chip-type electronic component is in contact with the two contact determination electrodes simultaneously when the chip-type electronic component is disposed on the contact determination electrode and the reference member; ,
A sorting apparatus for chip-type electronic components, comprising: 2. The chip-type electronic component according to claim 1, wherein the at least two contact determination electrodes are installed at the same height, and the reference member is installed at a position higher than the contact determination electrode. Sorting device. 2. The chip-type electronic component according to claim 1, wherein the at least two contact determination electrodes are installed at the same height, and the reference member is installed at a position lower than the contact determination electrode. Sorting device. 4. The chip-type electronic component sorting apparatus according to claim 1, wherein the determination circuit determines contact or non-contact based on a resistance value between two contact determination electrodes. 5. 5. The chip type electronic component sorting apparatus according to claim 1, wherein the external electrode of the chip type electronic component that is in contact with the contact determination electrode is a ground electrode.

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