JP2017035356A5 - - Google Patents

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Publication number
JP2017035356A5
JP2017035356A5 JP2015159238A JP2015159238A JP2017035356A5 JP 2017035356 A5 JP2017035356 A5 JP 2017035356A5 JP 2015159238 A JP2015159238 A JP 2015159238A JP 2015159238 A JP2015159238 A JP 2015159238A JP 2017035356 A5 JP2017035356 A5 JP 2017035356A5
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JP
Japan
Prior art keywords
specific
substrate
mounting
soldering
mounting region
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JP2015159238A
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English (en)
Japanese (ja)
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JP2017035356A (ja
JP6376663B2 (ja
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Priority to JP2015159238A priority Critical patent/JP6376663B2/ja
Priority claimed from JP2015159238A external-priority patent/JP6376663B2/ja
Publication of JP2017035356A publication Critical patent/JP2017035356A/ja
Publication of JP2017035356A5 publication Critical patent/JP2017035356A5/ja
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Publication of JP6376663B2 publication Critical patent/JP6376663B2/ja
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JP2015159238A 2015-08-11 2015-08-11 遊技機 Active JP6376663B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015159238A JP6376663B2 (ja) 2015-08-11 2015-08-11 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015159238A JP6376663B2 (ja) 2015-08-11 2015-08-11 遊技機

Publications (3)

Publication Number Publication Date
JP2017035356A JP2017035356A (ja) 2017-02-16
JP2017035356A5 true JP2017035356A5 (enrdf_load_stackoverflow) 2017-09-07
JP6376663B2 JP6376663B2 (ja) 2018-08-22

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ID=58047348

Family Applications (1)

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JP2015159238A Active JP6376663B2 (ja) 2015-08-11 2015-08-11 遊技機

Country Status (1)

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JP (1) JP6376663B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017035357A (ja) * 2015-08-11 2017-02-16 株式会社大一商会 遊技機
JP6410360B2 (ja) * 2015-08-21 2018-10-24 株式会社大一商会 遊技機
JP6410361B2 (ja) * 2015-08-21 2018-10-24 株式会社大一商会 遊技機

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290658A (ja) * 1988-09-28 1990-03-30 Toshiba Corp 高密度実装回路装置
JPH02134893A (ja) * 1988-11-15 1990-05-23 Nec Corp ハイブリッドｉｃ
JPH0732042B2 (ja) * 1990-10-11 1995-04-10 富士通株式会社 スルーホール接続形電子デバイスとその実装方法
JP4203625B2 (ja) * 2001-10-30 2009-01-07 タイヨーエレック株式会社 制御基板装置及び遊技機
JP2012095879A (ja) * 2010-11-04 2012-05-24 Sophia Co Ltd 遊技機
JP2014239869A (ja) * 2013-05-16 2014-12-25 株式会社ソフイア 遊技機
JP2017035357A (ja) * 2015-08-11 2017-02-16 株式会社大一商会 遊技機

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