JP2017034241A - Wiring circuit board and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring circuit board which reduces a transmission loss of an electric signal even in a high frequency band while preventing corrosion of a conductor pattern, and a manufacturing method thereof.SOLUTION: A conductor pattern 61 is formed on a base insulation layer 41. The conductor pattern 61 includes two terminal parts 61a and one wiring part 61b. The wiring part 61b is formed to connect the two terminal parts 61a and extend from the terminal parts 61a. A metal covering layer 15 is formed to cover the terminal parts 61a and the wiring part 61b of the conductor pattern 61 and continuously extend from surfaces of the terminal parts 61a onto a surface of the wiring part 61b. The metal covering layer 15 consists of a metal having lower magnetism than magnetism of nickel, for example, consists of gold. A cover insulation layer 43 is formed on the base insulation layer 41 in such a manner that a portion covering the wiring part 61b is covered and a portion covering the terminal parts 61a is not covered in the metal covering layer 15 formed on the conductor pattern 61.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a printed circuit board and a method for manufacturing the same.

  Conventionally, printed circuit boards have been used in various electric devices or electronic devices. Patent Document 1 discloses a suspension board with circuit as a printed circuit board used for positioning a magnetic head in a magnetic disk device.

  In the printed circuit board of Patent Document 1, an insulating base layer is formed on a conductive support substrate. A conductor pattern is formed on the base layer. A metal film is formed on the surface of the conductor pattern by electroless nickel plating. A cover layer is formed so as to cover the conductor pattern on which the metal film is formed. A connection terminal is formed at the end of the conductor circuit pattern so as to be exposed from the cover layer.

JP 2012-2335013 A

  In the printed circuit board, the adhesion between the conductor pattern and the cover layer is improved by forming a metal film on the surface of the conductor pattern. Thereby, corrosion of the conductor pattern is prevented. However, the printed circuit board of Patent Document 1 has a high transmission loss of electric signals in a high frequency band.

  An object of the present invention is to provide a printed circuit board in which the transmission loss of an electric signal is reduced even in a high frequency band while preventing corrosion of a conductor pattern, and a method for manufacturing the same.

  As a result of various experiments and examinations, the present inventor has found that the portion of the conductor pattern constituting the wiring (hereinafter referred to as the wiring portion) and the insulating layer covering the wiring portion are more than the magnetism of nickel. It has been found that the absence of a magnetic metal layer can reduce electrical signal transmission loss in a high frequency band, and the following first, second, fourth and fifth inventions have been conceived.

  In addition, the present inventor has determined that the ratio of the length of the metal layer to the total length of the wiring portion even when a metal layer having magnetism higher than that of nickel exists between the wiring portion and the insulating layer covering the wiring portion. Is set to 40% or less, it has been found that the transmission loss of electric signals can be reduced in a high frequency band, and the following third and sixth inventions have been conceived.

  (1) A printed circuit board according to a first aspect of the invention includes a first insulating layer, a conductor pattern formed on the first insulating layer and having a terminal portion and a wiring portion extending from the terminal portion, a wiring portion, A first metal coating layer that covers the terminal portion and extends continuously from the surface of the terminal portion to the surface of the wiring portion, and covers a portion of the first metal coating layer that covers the wiring portion. A second insulating layer provided on the first insulating layer so as not to cover a portion of the first metal coating layer covering the terminal portion, the first metal coating layer is in contact with the wiring portion, The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion, and the first metal coating layer has a magnetism lower than that of nickel.

  In the printed circuit board, a first metal coating layer is provided so as to cover the wiring portion, and a second insulating layer is provided so as to cover a portion of the first metal coating layer that covers the wiring portion. The first metal coating layer is in contact with the wiring portion, and the second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion. In this case, there is no layer having magnetism higher than that of nickel between the wiring portion and the second insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  In addition, when the second insulating layer comes into contact with the portion of the first metal coating layer that covers the wiring portion, the adhesion between the second insulating layer and the wiring portion is improved. Furthermore, the first metal coating layer is formed so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion. This prevents fluid such as air, water, or a chemical solution from entering the first metal coating layer from the outside of the second insulating layer. Therefore, corrosion is prevented from occurring at the boundary between the terminal portion and the wiring portion in the conductor pattern and in the vicinity thereof.

  (2) A wired circuit board according to a second aspect of the present invention includes a first insulating layer, a conductor pattern formed on the first insulating layer, having a terminal portion and a wiring portion extending from the terminal portion, and a wiring portion A first metal coating layer that covers a part and the terminal portion and extends continuously from the surface of the terminal portion to the surface of the wiring portion, and a part of the wiring portion of the first metal coating layer On the first insulating layer so as to cover the portion covering the terminal portion and the other portion of the wiring portion not covered by the first metal coating layer and not covering the portion of the first metal coating layer covering the terminal portion. And the first metal coating layer is in contact with a part of the wiring part and at least 3 μm away from the position on the boundary between the terminal part and the wiring part on the surface of the wiring part. The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion. Both in contact with the other part of the wiring part, the first metal coating layer has a lower magnetic than the magnetic nickel.

  In the wired circuit board, the first metal coating layer is provided so as to cover a part of the wiring part and the terminal part, and the part of the first metal coating layer covering the part of the wiring part and the wiring part A second insulating layer is provided so as to cover other portions not covered by the first metal coating layer. The first metal coating layer is in contact with a part of the wiring part, and the second insulating layer is in contact with a part of the first metal coating layer that covers the wiring part and is in contact with another part of the wiring part. In this case, there is no layer having magnetism higher than that of nickel between the wiring portion and the second insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion, and the first metal coating layer is located on the surface of the wiring portion from a position on the boundary between the terminal portion and the wiring portion. It extends to a position separated by 3 μm or more. Thereby, the adhesion between the second insulating layer and the wiring portion is improved in the vicinity of the boundary between the terminal portion and the wiring portion in the conductor pattern. Furthermore, the first metal coating layer is formed so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion. This prevents fluid such as air, water, or a chemical solution from entering the first metal coating layer from the outside of the second insulating layer. Therefore, corrosion is prevented from occurring at the boundary between the terminal portion and the wiring portion in the conductor pattern and in the vicinity thereof.

  (3) A printed circuit board according to a third aspect of the present invention includes a first insulating layer, a conductor pattern formed on the first insulating layer and having a terminal portion and a wiring portion extending from the terminal portion; A first metal coating layer that covers a part and the terminal portion and extends continuously from the surface of the terminal portion to the surface of the wiring portion, and a part of the wiring portion of the first metal coating layer On the first insulating layer so as to cover the portion covering the terminal portion and the other portion of the wiring portion not covered by the first metal coating layer and not covering the portion of the first metal coating layer covering the terminal portion. And the first metal coating layer is in contact with a part of the wiring part and at least 3 μm away from the position on the boundary between the terminal part and the wiring part on the surface of the wiring part. The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion. Both in contact with the other part of the wiring portion, the length ratio of the first metal coating layer covering a part of the wiring portion of the total length of the wiring portion is 40% or less.

  In the wired circuit board, the first metal coating layer is provided so as to cover a part of the wiring part and the terminal part, and the part of the first metal coating layer covering the part of the wiring part and the wiring part A second insulating layer is provided so as to cover other portions not covered by the first metal coating layer. The first metal coating layer is in contact with a part of the wiring part, and the second insulating layer is in contact with a part of the first metal coating layer that covers the wiring part and is in contact with another part of the wiring part.

  Here, the ratio of the length of the 1st metal coating layer which covers a part of wiring part with respect to the full length of a wiring part is 40% or less. In this case, in the range of 60% or more of the total length of the wiring portion, there is no layer having magnetism higher than that of nickel between the wiring portion and the second insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion, and the first metal coating layer is located on the surface of the wiring portion from a position on the boundary between the terminal portion and the wiring portion. It extends to a position separated by 3 μm or more. Thereby, the adhesion between the second insulating layer and the wiring portion is improved in the vicinity of the boundary between the terminal portion and the wiring portion in the conductor pattern. Furthermore, the first metal coating layer is formed so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion. This prevents fluid such as air, water, or a chemical solution from entering the first metal coating layer from the outside of the second insulating layer. Therefore, corrosion is prevented from occurring at the boundary between the terminal portion and the wiring portion in the conductor pattern and in the vicinity thereof.

  (4) The first metal coating layer may extend from the position on the boundary between the terminal portion and the wiring portion to a position separated by 5 μm or more on the surface of the wiring portion.

  In this case, the adhesion between the second insulating layer and the wiring portion is further improved in the vicinity of the boundary between the terminal portion and the wiring portion in the conductor pattern.

  (5) The first metal coating layer may include at least one metal among gold, silver, chromium, tin, and platinum.

  In this case, a more suitable metal can be used as the first metal coating layer depending on the use of the printed circuit board.

  (6) The first metal coating layer may contain at least one metal selected from nickel, gold, silver, chromium, tin, and platinum.

  In this case, a more suitable metal can be used as the first metal coating layer depending on the use of the printed circuit board.

  (7) The printed circuit board may further include a second metal coating layer that covers a portion of the first metal coating layer that covers the terminal portion.

  In this case, the connection terminal can be formed by the terminal portion of the conductor pattern, the first metal coating layer, and the second metal coating layer. Thereby, the surface state of the connection terminal can be adjusted by the second metal coating layer.

  (8) At least a part of the first metal coating layer may be composed of the first and second metal layers laminated together.

  In this case, the freedom degree of a structure of the 1st metal coating layer in a wired circuit board improves.

  (9) The printed circuit board further includes a terminal barrier layer that covers a portion of the first metal coating layer that covers the terminal portion, and a terminal surface layer that covers the terminal barrier layer, the conductor pattern includes copper, The surface layer may include gold and the terminal barrier layer may include nickel or palladium.

  In this case, the diffusion of the copper component from the conductor pattern to the terminal surface layer is suppressed by the terminal barrier layer. Thereby, the deterioration of the corrosion resistance and wettability of the terminal surface layer due to the diffusion of the copper component into the gold of the terminal surface layer is suppressed.

  (10) The printed circuit board further includes a terminal surface layer formed so as to cover a portion of the first metal coating layer covering the terminal portion and not to contact the conductor pattern, and the conductor pattern includes copper. The terminal surface layer may include gold, and the first metal coating layer may include nickel.

  In this case, the diffusion of the copper component from the conductor pattern to the terminal surface layer is suppressed by the first metal coating layer. Thereby, the deterioration of the corrosion resistance and wettability of the terminal surface layer due to the diffusion of the copper component into the gold of the terminal surface layer is suppressed.

  (11) The printed circuit board may further include an upper conductor pattern formed on the second insulating layer, and at least a part of the upper conductor pattern may overlap the conductor pattern. Thereby, since the conductor pattern and at least a part of the upper conductor pattern are stacked one above the other, the size of the wiring circuit board can be reduced and the degree of freedom in designing the wiring circuit board can be improved.

  (12) The printed circuit board is formed on the second insulating layer, and includes an upper conductor pattern having an upper terminal portion and an upper wiring portion extending from the upper terminal portion, and a part of the upper wiring portion and the upper terminal portion. An upper metal coating layer that covers and extends continuously from the surface of the upper terminal portion to the surface of the upper wiring portion; a portion of the upper metal coating layer that covers a portion of the upper wiring portion; and an upper wiring portion A third insulating layer provided on the second insulating layer so as to cover other portions not covered by the upper metal coating layer and not to cover portions of the upper metal coating layer covering the upper terminal portion. And at least part of the upper conductor pattern overlaps the conductor pattern, and the upper metal coating layer is in contact with a part of the upper wiring part and on the surface of the upper wiring part on the boundary between the upper terminal part and the upper wiring part. 3 μm or more from the position The third insulating layer is in contact with the portion of the upper metal coating layer that covers the upper wiring portion and the other portion of the upper wiring portion, and the third insulating layer contacts the other portion of the upper wiring portion. The ratio of the length of the upper metal coating layer covering a part may be 40% or less.

  In this case, in the range of 60% or more of the total length of the upper wiring portion, there is no layer having magnetism higher than that of nickel between the upper wiring portion and the third insulating layer. Thereby, regarding the conductor pattern and the upper conductor pattern, it is possible to reduce the transmission loss of the electric signal even in a high frequency band.

  The third insulating layer is in contact with a portion of the upper metal coating layer that covers the upper wiring portion. The upper metal coating layer continuously extends from the surface of the upper terminal portion to the surface of the upper wiring portion, and at least 3 μm away from the position on the boundary between the upper terminal portion and the upper wiring portion on the surface of the upper wiring portion. It extends to the position. Thereby, it is possible to prevent corrosion from occurring at and near the boundary between the upper terminal portion and the upper wiring portion in the upper conductor pattern.

  Furthermore, since the conductor pattern and at least a part of the upper conductor pattern are stacked one above the other, the wiring circuit board can be miniaturized and the design flexibility of the wiring circuit board can be improved.

  (13) The printed circuit board is formed on the second insulating layer and covers the upper conductor pattern having the upper terminal portion and the upper wiring portion extending from the upper terminal portion, and the upper wiring portion and the upper terminal portion. An upper metal coating layer provided so as to continuously extend from the surface of the terminal portion to the surface of the upper wiring portion; and an upper terminal of the upper metal coating layer that covers a portion of the upper metal coating layer that covers the upper wiring portion. And a third insulating layer provided on the second insulating layer so as not to cover the portion covering the portion, at least a part of the upper conductor pattern overlaps the conductor pattern, and the upper metal coating layer is formed by the upper wiring. The third insulating layer may be in contact with a portion of the upper metal coating layer that covers the upper wiring portion, and the upper metal coating layer may have magnetism lower than that of nickel.

  In this case, there is no layer having magnetism higher than that of nickel between the upper wiring portion and the third insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  The third insulating layer contacts the portion of the upper metal coating layer that covers the upper wiring portion, and the upper metal coating layer continuously extends from the surface of the upper terminal portion to the surface of the upper wiring portion. Thereby, it is possible to prevent corrosion from occurring at and near the boundary between the upper terminal portion and the upper wiring portion in the upper conductor pattern.

  Furthermore, since the conductor pattern and at least a part of the upper conductor pattern are stacked one above the other, the wiring circuit board can be miniaturized and the design flexibility of the wiring circuit board can be improved.

  (14) The printed circuit board is formed on the second insulating layer, and includes an upper conductor pattern having an upper terminal portion and an upper wiring portion extending from the upper terminal portion, and a part of the upper wiring portion and the upper terminal portion. An upper metal coating layer that covers and extends continuously from the surface of the upper terminal portion to the surface of the upper wiring portion; a portion of the upper metal coating layer that covers a portion of the upper wiring portion; and an upper wiring portion A third insulating layer provided on the second insulating layer so as to cover other portions not covered by the upper metal coating layer and not to cover portions of the upper metal coating layer covering the upper terminal portion. And at least part of the upper conductor pattern overlaps the conductor pattern, and the upper metal coating layer is in contact with a part of the upper wiring part and on the surface of the upper wiring part on the boundary between the upper terminal part and the upper wiring part. 3 μm or more from the position The third insulating layer is in contact with the portion of the upper metal coating layer that covers the upper wiring portion and the other portion of the upper wiring portion, and the upper metal coating layer is made of nickel magnetism. May have low magnetism.

  In this case, there is no layer having magnetism higher than that of nickel between the upper wiring portion and the third insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  The third insulating layer is in contact with a portion of the upper metal coating layer that covers the upper wiring portion. The upper metal coating layer continuously extends from the surface of the upper wiring portion to the surface of the upper wiring portion, and at least 3 μm away from the position on the boundary between the upper terminal portion and the upper wiring portion on the surface of the upper wiring portion. It extends to the position. Thereby, it is possible to prevent corrosion from occurring at and near the boundary between the upper terminal portion and the upper wiring portion in the upper conductor pattern.

  Furthermore, since the conductor pattern and at least a part of the upper conductor pattern are stacked one above the other, the wiring circuit board can be miniaturized and the design flexibility of the wiring circuit board can be improved.

  (15) The wired circuit board further includes a lower insulating layer and a lower conductor pattern formed on the lower insulating layer, and the first insulating layer covers the at least part of the lower conductor pattern. The conductor pattern may be formed at least partially overlapping the lower conductor pattern. Thereby, since the conductor pattern and at least a part of the lower conductor pattern are stacked one above the other, the wiring circuit board can be reduced in size and the degree of freedom in designing the wiring circuit board can be improved.

  (16) A method for manufacturing a printed circuit board according to a fourth invention includes a step of forming a conductor pattern having a terminal portion and a wiring portion extending from the terminal portion on the first insulating layer, and the wiring portion and the terminal portion. Forming a metal coating layer using a metal having a magnetic property lower than that of nickel so as to cover the wire and continuously extend from the surface of the terminal portion to the surface of the wiring portion and in contact with the wiring portion And covering the portion of the metal coating layer that covers the wiring portion and not covering the portion of the metal coating layer that covers the terminal portion and contacting the portion of the metal coating layer that covers the wiring portion. Forming a second insulating layer on the layer.

  In the method for manufacturing the printed circuit board, a metal coating layer is provided so as to cover the wiring portion, and a second insulating layer is provided so as to cover a portion of the metal coating layer that covers the wiring portion. The metal coating layer is in contact with the wiring portion, and the second insulating layer is in contact with a portion of the metal coating layer that covers the wiring portion. In this case, there is no layer having magnetism higher than that of nickel between the wiring portion and the second insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  In addition, when the second insulating layer comes into contact with the portion of the metal coating layer that covers the wiring portion, the adhesion between the second insulating layer and the wiring portion is improved. Further, the metal coating layer is formed so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion. This prevents fluid such as air, water, or a chemical solution from entering the metal coating layer from the outside of the second insulating layer. Therefore, corrosion is prevented from occurring at the boundary between the terminal portion and the wiring portion in the conductor pattern and in the vicinity thereof.

  (17) According to a fifth aspect of the present invention, there is provided a printed circuit board manufacturing method comprising: forming a conductor pattern having a terminal portion and a wiring portion extending from the terminal portion on the first insulating layer; Metal using a metal having a magnetic property lower than that of nickel so as to cover the terminal portion and continuously extend from the surface of the terminal portion to the surface of the wiring portion and to contact a part of the wiring portion A step of forming a covering layer, a portion of the metal covering layer that covers a part of the wiring portion, and a portion of the wiring portion that is not covered by the metal covering layer and a portion of the metal covering layer that covers the terminal portion Forming a second insulating layer on the first insulating layer so as to be in contact with the portion of the metal coating layer that covers the wiring portion and in contact with the other portion of the wiring portion. In the process of forming the metal coating layer, the metal coating It is formed so as to extend from a position on the boundary between the wiring portion terminal portion to 3μm or more away on the surface of the wiring portion.

  In the method of manufacturing the wired circuit board, a metal coating layer is provided so as to cover a part of the wiring part and the terminal part, and a part of the metal coating layer that covers a part of the wiring part and a metal coating of the wiring part A second insulating layer is provided so as to cover other parts not covered by the layer. The metal coating layer is in contact with a part of the wiring part, and the second insulating layer is in contact with a part of the metal coating layer that covers the wiring part and is in contact with another part of the wiring part. In this case, there is no layer having magnetism higher than that of nickel between the wiring portion and the second insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  The second insulating layer is in contact with the portion of the metal coating layer that covers the wiring portion, and the metal coating layer is on the surface of the wiring portion up to a position 3 μm or more away from the position on the boundary between the terminal portion and the wiring portion. Extend. Thereby, the adhesion between the second insulating layer and the wiring portion is improved in the vicinity of the boundary between the terminal portion and the wiring portion in the conductor pattern. Further, the metal coating layer is formed so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion. This prevents fluid such as air, water, or a chemical solution from entering the metal coating layer from the outside of the second insulating layer. Therefore, corrosion is prevented from occurring at the boundary between the terminal portion and the wiring portion in the conductor pattern and in the vicinity thereof.

  (18) A method for manufacturing a printed circuit board according to a sixth aspect of the invention includes a step of forming a conductor pattern having a terminal portion and a wiring portion extending from the terminal portion on the first insulating layer, and a part of the wiring portion. A step of forming a metal coating layer so as to cover the terminal portion and continuously extend from the surface of the terminal portion to the surface of the wiring portion and to be in contact with a part of the wiring portion; Cover the part covering the part and the other part of the wiring part that is not covered by the metal coating layer, and cover the wiring part of the metal coating layer so as not to cover the part of the metal coating layer that covers the terminal part. Forming a second insulating layer on the first insulating layer so as to be in contact with the covered portion and in contact with another portion of the wiring portion, and in the step of forming the metal covering layer, the metal covering layer Is on the boundary between the terminal part and the wiring part on the surface of the wiring part. 3μm is formed so as to extend to over away from the location, the ratio of the total length of the length of the wiring portion of the metal coating layer covering a part of the wiring portion is set to 40% or less.

  In the method of manufacturing the wired circuit board, a metal coating layer is provided so as to cover a part of the wiring part and the terminal part, and a part of the metal coating layer that covers a part of the wiring part and a metal coating of the wiring part A second insulating layer is provided so as to cover other parts not covered by the layer. The metal coating layer is in contact with a part of the wiring part, and the second insulating layer is in contact with a part of the metal coating layer that covers the wiring part and is in contact with another part of the wiring part.

  Here, the ratio of the length of the metal coating layer covering a part of the wiring part to the entire length of the wiring part is 40% or less. In this case, in the length of 60% or more with respect to the entire length of the wiring portion, there is no layer having magnetism higher than that of nickel between the wiring portion and the second insulating layer. Thereby, the transmission loss of an electric signal can be reduced even in a high frequency band.

  The second insulating layer is in contact with the portion of the metal coating layer that covers the wiring portion, and the metal coating layer is on the surface of the wiring portion up to a position 3 μm or more away from the position on the boundary between the terminal portion and the wiring portion. Extend. Thereby, the adhesion between the second insulating layer and the wiring portion is improved in the vicinity of the boundary between the terminal portion and the wiring portion in the conductor pattern. Further, the metal coating layer is formed so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion. This prevents fluid such as air, water, or a chemical solution from entering the metal coating layer from the outside of the second insulating layer. Therefore, corrosion is prevented from occurring at the boundary between the terminal portion and the wiring portion in the conductor pattern and in the vicinity thereof.

  According to the present invention, it is possible to realize a printed circuit board in which loss of electric signals is reduced even in a high frequency band while preventing corrosion of the conductor pattern.

1 is a plan view of a suspension board according to a first embodiment. It is a top view of a connecting terminal and its peripheral part. It is a top view of a connecting terminal and its peripheral part. It is a top view of a connecting terminal and its peripheral part. It is sectional drawing of a connection terminal and its peripheral part. FIG. 2 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 1. FIG. 2 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 1. FIG. 2 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 1. FIG. 2 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 1. It is the top view and sectional view which show a part of suspension board concerning a 2nd embodiment. It is the top view and sectional view showing a part of suspension board concerning a 3rd embodiment. It is the top view and sectional view which show a part of suspension board concerning a 4th embodiment. It is a top view which shows the other example of the suspension board based on 4th Embodiment. It is the top view and sectional drawing which show a part of suspension board concerning a 5th embodiment. It is the top view and sectional drawing which show the other structural example of the connection terminal in the suspension board which concerns on 1st Embodiment. It is the top view and sectional drawing which show the other structural example of the connection terminal in the suspension board which concerns on 2nd Embodiment. It is the top view and sectional drawing which show the other structural example of the connection terminal in the suspension board which concerns on 5th Embodiment. It is the top view and sectional drawing which show the other structural example of the connecting terminal in the suspension board which concerns on 4th Embodiment. It is the top view and sectional drawing which show the further another structural example of the connection terminal in the suspension board concerning 4th Embodiment. It is the top view and sectional drawing which show the further another structural example of the connection terminal in the suspension board based on 5th Embodiment. It is a top view of the suspension board concerning other embodiments. FIG. 22 is a plan view of connection terminals of the suspension board of FIG. 21 and peripheral portions thereof. FIG. 22 is a cross-sectional view of the connection terminal of the suspension board of FIG. 21 and its peripheral portion. FIG. 22 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 21. FIG. 22 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 21. FIG. 22 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 21. FIG. 22 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 21. FIG. 22 is a schematic process diagram showing a manufacturing process of the suspension board of FIG. 21. It is a figure which shows the example in which the opening part was formed in a part of base insulating layer in the suspension board | substrate of FIG. It is a figure which shows the example in which the opening part was formed in a part of base insulating layer in the suspension board | substrate of FIG. FIG. 31 is a diagram showing a state where a portion of the seed layer exposed in the suspension board of FIG. 30 is removed. It is sectional drawing which shows the 1st structural example of two conductor patterns laminated | stacked up and down, and two connection terminals corresponding to them. It is sectional drawing which shows the 2nd structural example of two conductor patterns laminated | stacked up and down and two connection terminals corresponding to them. It is sectional drawing which shows the 3rd structural example of two conductor patterns laminated | stacked up and down and two connection terminals corresponding to them. It is sectional drawing which shows the 4th structural example of two conductor patterns laminated | stacked up and down and two connection terminals corresponding to them. It is sectional drawing which shows the 5th structural example of two conductor patterns laminated | stacked up and down and two connection terminals corresponding to them. It is sectional drawing which shows the 6th structural example of two conductor patterns laminated | stacked up and down and two connection terminals corresponding to them. 6 is a plan view and a cross-sectional view showing a part of a suspension board of Comparative Example 2. FIG. It is a figure which shows the measurement result of parameter SDD21 about Example 10, 11, 12 and the comparative example 2. FIG.

  Hereinafter, a printed circuit board and a manufacturing method thereof according to embodiments of the present invention will be described with reference to the drawings. As a wired circuit board according to an embodiment of the present invention, a suspension board with circuit (hereinafter abbreviated as a suspension board) used for an actuator of a hard disk drive device will be described.

[1] First Embodiment (1) Structure of Suspension Board FIG. 1 is a plan view of a suspension board according to the first embodiment. In FIG. 1, the direction in which the arrow heads is called the front, and the opposite direction is called the rear. As shown in FIG. 1, the suspension board 1 includes a suspension body 100 formed by a long metal support board 10 (see FIG. 5). In FIG. 1, the suspension main body 100 extends substantially in the front-rear direction.

  The suspension board 1 is supported by a long support plate 50. On the upper surface of the suspension body 100, as shown by dotted lines, write wiring patterns W1, W2, read wiring patterns R1, R2, and power supply wiring patterns P1, P2 are formed.

  A magnetic head mounting portion (hereinafter referred to as a tongue portion) 12 is provided by forming a U-shaped opening 11 at the distal end portion of the suspension main body portion 100. The tongue portion 12 is bent at a location indicated by a broken line R so as to form a predetermined angle with respect to the suspension main body portion 100.

  Four connection terminals 21, 22, 23, and 24 are formed on the upper surface of the tongue 12 at one end of the suspension body 100. Further, two connection terminals 25 and 26 are formed on both side portions in the vicinity of the central portion in the direction in which the suspension main body 100 extends. A head slider (not shown) having a magnetic head is mounted on the upper surface of the tongue portion 12. The terminals of the magnetic head of the head slider are connected to the connection terminals 21 to 24 of the tongue 12. The connection terminals 25 and 26 are connected to two piezoelectric elements 91 and 92 provided on the support plate 50, respectively.

  Six connection terminals 31, 32, 33, 34, 35, and 36 are formed on the upper surface of the other end of the suspension body 100. An electronic circuit such as a preamplifier is connected to the connection terminals 31 to 34. A power supply circuit for the piezoelectric elements 91 and 92 is connected to the connection terminals 35 and 36. The connection terminals 21 to 26 and the connection terminals 31 to 36 are electrically connected by write wiring patterns W1, W2, read wiring patterns R1, R2, and power supply wiring patterns P1, P2, respectively. In addition, the suspension body 100 is formed with a plurality of holes H.

  The support plate 50 has a front end region 51, a rear end region 52, and a central region 53. The rear end region 52 has a rectangular shape. The front end region 51 has a trapezoidal shape, and its width gradually decreases from the rear toward the front. The central region 53 has a rectangular shape extending in the front-rear direction, and is disposed between the front end region 51 and the rear end region 52. In a state where the suspension board 1 is supported on the upper surface of the support plate 50, the end portion of the suspension board 1 including the connection terminals 31 to 36 protrudes rearward from the rear end region 52.

  A piezoelectric element mounting region 54 is provided in a part of the central region 53. The piezoelectric element mounting region 54 overlaps with the connection terminals 25 and 26 of the suspension board 1. Both side portions of the piezoelectric element mounting region 54 protrude so as to curve outward. Further, in the piezoelectric element mounting region 54, a through hole 54h extending in the width direction (direction orthogonal to the front-rear direction) is formed. According to this configuration, the piezoelectric element mounting region 54 of the support plate 50 has elasticity in the front-rear direction.

  Piezoelectric elements 91 and 92 are mounted on the lower surface of the piezoelectric element mounting region 54 so as to straddle the through hole 54h. The piezoelectric elements 91 and 92 are located on both sides of the suspension board 1, respectively. The piezoelectric elements 91 and 92 are connected to the connection terminals 25 and 26 of the suspension board 1 through the through holes 54h, respectively.

  A voltage is applied to the piezoelectric element 91 via the connection terminals 25 and 35 and the power supply wiring pattern P1, and a voltage is applied to the piezoelectric element 92 via the connection terminals 26 and 36 and the power supply wiring pattern P2. Thereby, the support plate 50 expands and contracts in the front-rear direction as the piezoelectric elements 91 and 92 expand and contract. By controlling the voltage applied to the piezoelectric elements 91 and 92, the magnetic head of the head slider on the suspension board 1 can be finely aligned.

  The suspension board 1 supported by the support plate 50 is provided in the hard disk device. When writing information to the magnetic disk, a current flows through the pair of write wiring patterns W1, W2. The write wiring pattern W1 and the write wiring pattern W2 constitute a differential signal line pair that transmits a differential write signal. Further, when reading information from the magnetic disk, a current flows through the pair of read wiring patterns R1, R2. The read wiring pattern R1 and the read wiring pattern R2 constitute a differential signal line pair that transmits a differential read signal.

(2) Configuration of Connection Terminal and its Peripheral Part Next, the connection terminals 21 to 26 and 31 to 36 of the suspension board 1 and their peripheral parts will be described in detail. 2 to 4 are plan views of the connection terminals 21 to 26 and 31 to 36 and their peripheral portions. FIG. 5 is a cross-sectional view of the connection terminals 21 to 26 and 31 to 36 and their peripheral portions. The scales of FIGS. 2A to 2C are different from each other, the scales of FIGS. 3A to 3C are different from each other, the scales of FIGS. 4A to 4C are different from each other, and FIG. The scales of (c) are different from each other.

  2 (a), 3 (a) and 4 (a) show the connection terminals 21 to 24 and their peripheral parts in FIG. 1, and FIG. 2 (b), FIG. 3 (b) and FIG. 4 (b). 1 shows the connection terminal 25 of FIG. 1 and its peripheral part, and FIGS. 2C, 3C and 4C show the connection terminals 31 and 32 of FIG. 1 and their peripheral part. 2A to 2C, illustration of the metal coating layer 15 (see FIG. 5) and the cover insulating layer 43 (see FIG. 5) is omitted. 3A to 3C, the insulating cover layer 43 (see FIG. 5) is not shown. The connection terminal 26 has the same configuration as the connection terminal 25, and the connection terminals 33 to 36 have the same configuration as the connection terminals 31 and 32.

  5A to 5C are an AA line enlarged sectional view of FIG. 2A, an BB line enlarged sectional view of FIG. 2B, and a CC line enlarged view of FIG. Cross-sectional views are shown respectively. 2 (a) to (c), FIGS. 3 (a) to (c) and FIGS. 4 (a) to (c) are illustrated in FIG. The hatching or dot pattern same as the hatching or dot pattern given to each member of the sectional views of (c) to (c) is given. The same applies to FIGS. 6 to 12, 14, and 38 described later.

  As shown in FIGS. 5A to 5C, a base insulating layer 41 made of, for example, polyimide is formed on a metal support substrate 10 made of, for example, stainless steel. As shown in FIGS. 2A to 2C, a plurality (six in this example) of conductor patterns 61 made of, for example, copper are formed on the base insulating layer 41. Each conductor pattern 61 includes two terminal portions 61a and one wiring portion 61b. The wiring part 61b is formed so as to connect the two terminal parts 61a and extend from each terminal part 61a. The wiring portions 61b of the six conductor patterns 61 constitute the above-described writing wiring patterns W1, W2, reading wiring patterns R1, R2, and power supply wiring patterns P1, P2, respectively. A seed layer (not shown) is formed between each conductor pattern 61 and the base insulating layer 41.

  As shown in FIGS. 5A to 5C, the metal coating layer 15 is formed so as to cover the entire conductor pattern 61. Specifically, the metal coating layer 15 is formed so as to cover the terminal portion 61a and the wiring portion 61b of each conductor pattern 61 and continuously extend from the surface of the terminal portion 61a to the surface of the wiring portion 61b. In the present embodiment, the metal coating layer 15 is mainly made of a metal having a magnetic property lower than that of nickel (for example, a non-magnetic metal), and has a magnetic property lower than that of nickel. Specifically, the metal coating layer 15 is made of, for example, gold.

  By forming the metal coating layer 15 on the two terminal portions 61a of the plurality of conductor patterns 61, as shown in FIG. 3A, the write wiring patterns W1, W2 and the read wiring patterns R1, R2 The connection terminals 21 to 24 are formed at one end of each. As shown in FIG. 3B, a connection terminal 25 is formed at one end of the power supply wiring pattern P1. Similarly, a connection terminal 26 (FIG. 1) is formed at one end of the power wiring pattern P2 (FIG. 1). As shown in FIG. 3C, connection terminals 31 and 32 are formed at the other end portions of the write wiring patterns W1 and W2, respectively. Similarly, connection terminals 33 to 36 (FIG. 1) are formed at the other end portions of the read wiring patterns R1, R2 (FIG. 1) and the power supply wiring patterns P1, P2 (FIG. 1).

  As shown in FIGS. 4A to 4C, the base is formed so as to cover a portion covering the wiring portion 61b and not covering a portion covering the terminal portion 61a in the metal coating layer 15 formed in each conductor pattern 61. A cover insulating layer 43 is formed on the insulating layer 41. The insulating cover layer 43 is made of polyimide, for example.

  In the above configuration, the metal coating layer 15 contacts the wiring portion 61b and the terminal portion 61a, and the cover insulating layer 43 contacts a portion of the metal coating layer 15 that covers the wiring portion 61b. Moreover, the edge part of the cover insulating layer 43 located in the vicinity of the connection terminals 21-24 and 33-36 is located on the boundary 61c (refer FIG. 5) of the terminal part 61a of each conductor pattern 61 and the wiring part 61b. .

  As shown in FIGS. 5A to 5C, in the present embodiment, the metal coating layer 15 is at least from the position on the boundary 61c between the terminal portion 61a and the wiring portion 61b on the surface of the wiring portion 61b. It is formed to extend to a position separated by distance L0. The distance L0 is 3 μm or more.

(3) Method for Manufacturing Suspension Board Hereinafter, a method for manufacturing the suspension board 1 will be described. 6 to 9 are schematic process diagrams showing the manufacturing process of the suspension board 1 of FIG. 6 and 7 are plan views of the connection terminals 21 to 24 and portions corresponding to the periphery thereof. 8 and 9 show sectional views taken along the line D-D in FIGS. 6 and 7.

  First, as shown in FIGS. 6A and 8A, a base insulating layer 41 made of, for example, polyimide is formed on a support layer 10a made of, for example, stainless steel. The thickness of the support layer 10a is, for example, 10 μm or more and 50 μm or less. The insulating base layer 41 has a thickness of, for example, 5 μm or more and 15 μm or less. Here, the insulating base layer 41 is formed in the same shape as that of the suspension board 1 of FIG.

  Next, as shown in FIGS. 6B and 8B, a plurality of (six in this example) conductor patterns 61 made of, for example, copper are formed on the base insulating layer 41 through a seed layer (not shown). To do. The seed layer is made of, for example, a laminated film of chromium and copper or a single layer film of chromium, and can be formed by a method such as sputtering, electroless plating, or vapor deposition. The thickness of each conductor pattern 61 is, for example, not less than 1 μm and not more than 20 μm. The wiring portions 61b of the six conductor patterns 61 form the write wiring patterns W1, W2, the read wiring patterns R1, R2, and the power supply wiring patterns P1, P2 on the base insulating layer 41.

  The spacing between the write wiring patterns W1, W2 and the spacing between the read wiring patterns R1, R2 are, for example, 5 μm or more and 100 μm or less, respectively. Similarly, the distance between the write wiring pattern W1 and the power supply wiring pattern P1 and the distance between the read wiring pattern R2 and the power supply wiring pattern P2 are, for example, 5 μm or more and 100 μm or less, respectively. The widths of the write wiring patterns W1, W2, the read wiring patterns R1, R2, and the power supply wiring patterns P1, P2 are, for example, not less than 5 μm and not more than 200 μm.

  Subsequently, as shown in FIG. 6C and FIG. 8C, the terminal portions 61a and the wiring portions 61b of the respective conductor patterns 61 are covered and continuously from the surface of the terminal portion 61a to the surface of the wiring portion 61b. The metal coating layer 15 is formed to extend. The connection terminals 21 to 26 and 31 to 36 shown in FIG. 1 are formed by the terminal portions 61a of the six conductor patterns 61 and the metal coating layer 15 covering the terminal portions 61a.

  The metal coating layer 15 is made of a metal having a magnetic property lower than that of nickel, and is formed by, for example, electrolytic plating. The metal coating layer 15 can also be formed by electroless plating or sputtering. For example, gold is used as the material of the metal coating layer 15. In addition, any of silver, chromium, tin, and platinum can be used as the material of the metal coating layer 15. The thickness of the metal coating layer 15 is, for example, 0.005 μm or more and 5 μm or less, and preferably 0.01 μm or more and 3 μm or less.

  Thereafter, as shown in FIG. 7A and FIG. 9A, on the base insulating layer 41 so as to cover a portion of the metal coating layer 15 covering the wiring portion 61b and not to cover a portion covering the terminal portion 61a. Then, a cover insulating layer 43 made of polyimide, for example, is formed. Accordingly, the connection terminals 21 to 26 and 31 to 36 are exposed from the cover insulating layer 43. The insulating cover layer 43 has a thickness of, for example, 2 μm or more and 10 μm or less.

  Thereafter, as shown in FIGS. 7B and 9B, the support layer 10 a is processed so that the portion of the support layer 10 a that overlaps the insulating base layer 41 remains, thereby forming the support substrate 10. The support layer 10a is processed by etching, for example. Thereby, the suspension board 1 is completed.

(4) Effects of First Embodiment In the suspension board 1 according to the present embodiment, the metal coating layer 15 is provided so as to cover the wiring portions 61 b of the respective conductor patterns 61, and the wiring of the metal coating layers 15 is provided. The insulating cover layer 43 is provided so as to cover the portion covering the portion 61b. The metal coating layer 15 is in contact with the wiring portion 61b, and the cover insulating layer 43 is in contact with a portion of the metal coating layer 15 that covers the wiring portion 61b. In this case, there is no metal layer (for example, a layer made of a ferromagnetic metal) having a magnetism higher than that of nickel between the wiring portion 61b and the cover insulating layer 43. As a result of the experiments and examinations of the present inventors, there is no metal layer having magnetism higher than that of nickel between the wiring portion 61b and the cover insulating layer 43 covering the wiring portion 61b. It was found that the transmission loss can be reduced. Therefore, according to the suspension board 1 described above, transmission loss of electric signals in a high frequency band can be reduced.

  Further, in the above configuration, the cover insulating layer 43 is in contact with a portion of the metal coating layer 15 that covers the wiring portion 61b, so that the cover insulating layer 43 is in comparison with the case where the cover insulating layer 43 and the wiring portion 61b are in contact. Adhesion between 43 and the wiring part 61b is improved. Therefore, a large gap is less likely to be generated between the insulating cover layer 43 and the metal cover layer 15. Furthermore, the metal coating layer 15 is formed so as to continuously extend from the surface of the terminal portion 61a to the surface of the wiring portion 61b. This prevents fluid such as air, water, or a chemical solution from entering the inside of the metal coating layer 15 from the outside of the insulating cover layer 43. Therefore, corrosion is prevented from occurring at the boundary 61c between the terminal portion 61a and the wiring portion 61b and the vicinity thereof in the conductor pattern 61.

  In the above manufacturing method of the suspension board 1, the metal coating layer 15 for preventing the occurrence of corrosion is formed on the wiring portion 61b, and at the same time, for the connection terminals 21 to 26, 31 to 36 on the terminal portion 61a. The metal coating layer 15 is formed. In this case, since it is not necessary to separately form the metal coating layer 15 on the wiring portion 61b and the metal coating layer 15 on the terminal portion 61a, the number of manufacturing steps of the suspension board 1 is reduced.

[2] Second Embodiment A suspension board according to a second embodiment will be described while referring to differences from the suspension board 1 according to the first embodiment. FIG. 10 is a plan view and a cross-sectional view showing a part of the suspension board according to the second embodiment. 10A and 10B are a plan view and a cross-sectional view, respectively. The plan view of FIG. 10A corresponds to the plan view of FIG. 3A of the first embodiment. The sectional view of FIG. 10B shows an enlarged sectional view taken along line EE of FIG. 10A, and corresponds to the sectional view of FIG. 5A of the first embodiment.

  Also in the suspension board according to the present embodiment, the base insulating layer 41 is formed on the support substrate 10 as in the first embodiment, and a plurality of conductors are formed on the base insulating layer 41 via a seed layer (not shown). A pattern 61 is formed. A cover insulating layer 43 is formed on the base insulating layer 41 so as to cover the wiring portions 61b of the plurality of conductor patterns 61 (see FIG. 4A). In FIG. 10A, the cover insulating layer 43 is not shown.

  As shown in FIGS. 10A and 10B, in this embodiment, a part of the wiring part 61b of each conductor pattern 61 and the terminal part 61a are covered and the wiring part 61b is covered from the surface of the terminal part 61a. A metal coating layer 15 is provided so as to continuously extend on the surface. Furthermore, the metal coating layer 15 extends from the position on the boundary 61c between the terminal portion 61a and the wiring portion 61b to a position separated by a distance L1 on the surface of the wiring portion 61b.

  In the suspension board according to the present embodiment, the metal coating layer 15 is provided so as to cover a part of the wiring portion 61 b of each conductor pattern 61. Further, the cover insulating layer 43 is provided so as to cover a portion of the metal coating layer 15 that covers the wiring portion 61b and another portion of the wiring portion 61b that is not covered by the metal coating layer 15. The metal coating layer 15 contacts a part of the wiring part 61b, and the cover insulating layer 43 contacts the part of the metal coating layer 15 that covers the wiring part 61b and the other part of the wiring part 61b. In this case, there is no metal layer having magnetism higher than that of nickel between the wiring portion 61b and the cover insulating layer 43. Therefore, also in this embodiment, transmission loss of electric signals in a high frequency band can be reduced.

  In the present embodiment, the distance L1 is set to 3 μm or more. In this case, in the vicinity of the boundary 61c between the terminal portion 61a and the wiring portion 61b in the conductor pattern 61, the adhesion between the cover insulating layer 43 and the wiring portion 61b is improved by the metal coating layer 15. As a result, as in the first embodiment, fluid such as air, water, or a chemical solution is prevented from entering the inside of the metal cover layer 15 from the outside of the insulating cover layer 43. Therefore, corrosion is prevented from occurring at the boundary 61c between the terminal portion 61a and the wiring portion 61b and the vicinity thereof in the conductor pattern 61.

  The distance L1 is preferably set to 5 μm or more. In this case, in the vicinity of the boundary 61c between the terminal portion 61a and the wiring portion 61b in the conductor pattern 61, the adhesion between the cover insulating layer 43 and the wiring portion 61b is further improved. Accordingly, a large gap is less likely to occur between the insulating cover layer 43 and the metal cover layer 15. As a result, the occurrence of corrosion in the conductor pattern 61 is further prevented.

[3] Third Embodiment A suspension board according to a third embodiment will be described while referring to differences from the suspension board according to the second embodiment. FIG. 11 is a plan view and a cross-sectional view showing a part of the suspension board according to the third embodiment. FIGS. 11A and 11B are a plan view and a cross-sectional view, respectively. The plan view of FIG. 11A corresponds to the plan view of FIG. 10A of the second embodiment. The sectional view of FIG. 11B shows an enlarged sectional view taken along line FF of FIG. 11A and corresponds to the sectional view of FIG. 10B of the second embodiment. Similar to the example of FIG. 10A, the cover insulating layer 43 is not shown in FIG. 11A.

  As shown in FIGS. 11A and 11B, in the present embodiment, a metal made of, for example, gold so as to cover a portion covering the terminal portion 61a in the metal coating layer 15 formed in each conductor pattern 61. A covering layer 16 is formed. The thickness of the metal coating layer 16 is, for example, 0.005 μm or more and 5 μm or less, and preferably 0.01 μm or more and 3 μm or less.

  In the manufacturing method of the suspension board according to the present embodiment, after the insulating cover layer 43 is formed (see FIGS. 7A and 9A), the exposed metal coating layer 15 is coated with metal by, for example, electrolytic plating. Layer 16 is formed. In this case, the connection terminals 21 to 26 and 31 to 36 in FIG. 1 are formed by the terminal portions 61 a of the conductor pattern 61, the metal coating layer 15, and the metal coating layer 16.

  According to the above configuration, even when the surface state of the metal coating layer 15 becomes unstable during the manufacturing process of the suspension board, the surface of the metal coating layer 15 in the terminal portion 61 a is covered with the metal coating layer 16. Thereby, the surface states of the connection terminals 21 to 26 and 31 to 36 can be adjusted.

  In the present embodiment, gold is used as the material of the metal coating layer 16. Not limited to the above example, any of nickel, silver, chromium, tin and platinum can be used as the material of the metal coating layer 16.

[4] Fourth Embodiment A suspension board according to a fourth embodiment will be described while referring to differences from the suspension board according to the second embodiment. FIG. 12 is a plan view and a sectional view showing a part of the suspension board according to the fourth embodiment. FIGS. 12A and 12B are a plan view and a cross-sectional view, respectively. The plan view of FIG. 12A corresponds to the plan view of FIG. 10A of the second embodiment. The sectional view of FIG. 12B shows an enlarged sectional view taken along the line GG of FIG. 12A and corresponds to the sectional view of FIG. 10B of the second embodiment. Similar to the example of FIG. 10A, the cover insulating layer 43 is not shown in FIG.

  As shown in FIGS. 12A and 12B, in the present embodiment, a metal coating layer 17 made of nickel, for example, is provided instead of the metal coating layer 15 of FIG. In the present embodiment, the metal coating layer 17 is mainly made of a metal having magnetism higher than that of nickel, and is formed by, for example, electrolytic plating, electroless plating, or sputtering. The thickness of the metal coating layer 17 is, for example, 0.005 μm or more and 5 μm or less, and preferably 0.01 μm or more and 3 μm or less.

  The metal coating layer 17 extends from the position on the boundary 61c between the terminal portion 61a and the wiring portion 61b to a position separated by a distance L2 on the surface of the wiring portion 61b. The distance L2 is set to 3 μm or more. As a result, as in the second embodiment, in the vicinity of the boundary 61c between the terminal portion 61a and the wiring portion 61b in the conductor pattern 61, the metal cover layer 17 adheres between the cover insulating layer 43 and the wiring portion 61b. Improves. Therefore, corrosion is prevented from occurring at the boundary 61c between the terminal portion 61a and the wiring portion 61b and the vicinity thereof in the conductor pattern 61.

  FIG. 13 is a plan view showing another example of the suspension board according to the fourth embodiment. In FIG. 13, portions where the metal coating layer 17 is formed in the write wiring patterns W1, W2, the read wiring patterns R1, R2, and the power supply wiring patterns P1, P2 are indicated by thick solid lines. In the suspension board of FIG. 13, the distance L2 of the metal coating layer 17 is longer than the example of FIGS. 12 (a) and 12 (b).

  Here, in each of the plurality of conductor patterns 61 constituting the write wiring patterns W1, W2, the read wiring patterns R1, R2, and the power supply wiring patterns P1, P2, one terminal along the axis of the wiring portion 61b. The distance between the part 61a and the other terminal part 61a is called the total length of the wiring part 61b.

  In this case, the distance L2 is set so that the ratio of the length of all the metal coating layers 17 covering the wiring part 61b to the entire length of the wiring part 61b is 40% or less.

  In the above configuration, the metal coating layer 17 is provided so as to cover a part of the wiring part 61b and the terminal part 61a, and the part of the metal coating layer 17 that covers a part of the wiring part 61b and the wiring part 61b A cover insulating layer 43 is provided so as to cover other portions not covered by the metal coating layer 17. The metal coating layer 17 contacts a part of the wiring part 61b, and the cover insulating layer 43 contacts a part of the metal coating layer 17 that covers the wiring part 61b and also contacts the other part of the wiring part 61b.

  In this case, in the range of 60% or more of the total length of the wiring part 61b, no metal layer having magnetism higher than that of nickel exists between the wiring part 61b and the cover insulating layer 43. As a result of the inventor's experiment and examination, even when a metal layer having magnetism higher than that of nickel exists between the wiring portion 61b and the cover insulating layer 43 covering the wiring portion 61b, the total length of the wiring portion 61b is determined. It was found that the transmission loss of the electric signal can be reduced in a high frequency band by setting the length ratio of the metal layer to 40% or less. Thereby, also in this Embodiment, the transmission loss of the electrical signal in a high frequency band can be reduced.

[5] Fifth Embodiment A suspension board according to the fifth embodiment will be described while referring to differences from the suspension board according to the fourth embodiment. FIG. 14 is a plan view and a cross-sectional view showing a part of the suspension board according to the fifth embodiment. 14A and 14B are a plan view and a cross-sectional view, respectively. The plan view of FIG. 14A corresponds to the plan view of FIG. 12A of the fourth embodiment. The sectional view of FIG. 14B shows an enlarged sectional view taken along line JJ of FIG. 14A and corresponds to the sectional view of FIG. 12B of the fourth embodiment. As in the example of FIG. 12A, the cover insulating layer 43 is not shown in FIG.

  As shown in FIGS. 14A and 14B, in the present embodiment, a metal coating layer 18 is formed so as to cover the entire metal coating layer 17 of FIG. The thickness of the metal coating layer 18 is, for example, 0.005 μm or more and 5 μm or less, and preferably 0.01 μm or more and 3 μm or less. For example, gold is used as the material of the metal coating layer 18. Moreover, any of nickel, silver, chromium, tin, and platinum can be used as the material of the metal coating layer 18.

  In the method for manufacturing a suspension board according to the fifth embodiment, a plurality of conductor patterns 61 are formed on a base insulating layer 41 via a seed layer (not shown), and then a metal coating layer is formed on a part of each conductor pattern 61. 17 and the metal coating layer 18 are sequentially laminated. The metal coating layer 17 is formed by, for example, electroless plating or sputtering, and the metal coating layer 18 is formed by, for example, electrolytic plating. Thereafter, a cover insulating layer 43 is formed on the base insulating layer 41 so as to cover the portion of the metal coating layer 18 that covers the wiring portion 61b and the other portion of the wiring portion 61b that is not covered by the metal coating layers 17 and 18. Is done.

  In the present embodiment, the insulating cover layer 43 contacts the portion of the metal coating layer 18 that covers the wiring portion 61b. The metal coating layer 18 extends from the position on the boundary 61c between the terminal portion 61a and the wiring portion 61b to a position separated by a distance L2 on the surface of the wiring portion 61b. The distance L2 is set to 3 μm or more. Thereby, as in the fourth embodiment, in the vicinity of the boundary 61c between the terminal portion 61a and the wiring portion 61b in the conductor pattern 61, the metal cover layer 18 adheres between the cover insulating layer 43 and the wiring portion 61b. Improves. Therefore, corrosion is prevented from occurring at the boundary 61c between the terminal portion 61a and the wiring portion 61b and the vicinity thereof in the conductor pattern 61.

[6] Other Embodiments (1) In the suspension board 1 according to the first embodiment, the connection terminals 21 to 24 may have the following configurations instead of the configurations of FIGS. Good. FIG. 15 is a plan view and a cross-sectional view illustrating another configuration example of the connection terminals 21 to 24 in the suspension board 1 according to the first embodiment. FIGS. 15A and 15B show a plan view and a cross-sectional view, respectively. The plan view of FIG. 15A corresponds to the plan view of FIG. 3A of the first embodiment. The sectional view of FIG. 15B shows an enlarged sectional view taken along line A1-A1 of FIG. 15A, and corresponds to the sectional view of FIG. 5A of the first embodiment. As in the example of FIG. 3A, the cover insulating layer 43 is not shown in FIG. 15A.

  As shown in FIGS. 15A and 15B, a barrier layer 70 is formed so as to cover a portion of the metal coating layer 15 formed in each conductor pattern 61 that covers the terminal portion 61a. Further, a gold layer 71 is formed so as to cover the barrier layer 70. In this case, the connection terminals 21 to 24 are formed by the terminal portion 61 a of the conductor pattern 61, the metal coating layer 15, the barrier layer 70, and the gold layer 71.

  The thickness of the barrier layer 70 is, for example, not less than 0.2 μm and not more than 4.0 μm, and preferably not less than 0.5 μm and not more than 3.0 μm. The thickness of the gold layer 71 is, for example, 0.02 μm or more and 1.5 μm or less, and preferably 0.05 μm or more and 1.0 μm or less.

  Here, the barrier layer 70 has a function of suppressing further diffusion of the copper component diffusing from the surface of the conductor pattern 61 into the metal coating layer 15 into the gold layer 71. In order to realize such a function, nickel is used as the material of the barrier layer 70 in this example. As the barrier layer 70, palladium can be used instead of nickel.

  According to said structure, in the connection terminals 21-24, the copper component of the conductor pattern 61 does not spread | diffuse in the gold | metal layer 71 exposed outside. Thereby, the deterioration of the corrosion resistance and wettability of the gold layer 71 due to the diffusion of the copper component into the gold layer 71 is suppressed. Therefore, the connection terminals 21 to 24 having good corrosion resistance and wettability are realized.

  Also in the connection terminals 25, 26, and 31 to 36, the barrier layer 70 and the gold layer 71 may be provided similarly to the connection terminals 21 to 24 in FIG. Thereby, the connection terminals 25, 26, 31 to 36 having good corrosion resistance and wettability are realized.

  (2) In the suspension board according to the second embodiment, the connection terminals 21 to 24 may have the following configuration instead of the configuration of FIG. FIG. 16 is a plan view and a cross-sectional view showing another configuration example of the connection terminals 21 to 24 in the suspension board according to the second embodiment. FIGS. 16A and 16B are a plan view and a cross-sectional view, respectively. The plan view of FIG. 16A corresponds to the plan view of FIG. 10A of the second embodiment. The cross-sectional view of FIG. 16B is an enlarged cross-sectional view taken along line A2-A2 of FIG. 16A, and corresponds to the cross-sectional view of FIG. 10B of the second embodiment. As in the example of FIG. 10A, the cover insulating layer 43 is not shown in FIG.

  As shown in FIGS. 16A and 16B, in this example, as in the example of FIG. 15, the portion covering the terminal portion 61 a in the metal coating layer 15 formed in each conductor pattern 61 is covered. A barrier layer 70 is formed. Further, a gold layer 71 is formed so as to cover the barrier layer 70. Thereby, the deterioration of the corrosion resistance and wettability of the gold layer 71 due to the diffusion of the copper component of the conductor pattern 61 into the gold layer 71 is suppressed. Therefore, the connection terminals 21 to 24 having good corrosion resistance and wettability are realized.

  Also in the connection terminals 25, 26, and 31 to 36, the barrier layer 70 and the gold layer 71 may be provided similarly to the connection terminals 21 to 24 in FIG. Thereby, the connection terminals 25, 26, 31 to 36 having good corrosion resistance and wettability are realized.

  (3) In the suspension board according to the fifth embodiment, the connection terminals 21 to 24 may have the following configuration instead of the configuration of FIG. FIG. 17 is a plan view and a cross-sectional view illustrating another configuration example of the connection terminals 21 to 24 in the suspension board according to the fifth embodiment. 17A and 17B are a plan view and a sectional view, respectively. The plan view of FIG. 17A corresponds to the plan view of FIG. 14A of the fifth embodiment. The sectional view of FIG. 17B shows an enlarged sectional view taken along line A3-A3 of FIG. 17A, and corresponds to the sectional view of FIG. 14B of the fifth embodiment. As in the example of FIG. 14A, the cover insulating layer 43 is not shown in FIG.

  As shown in FIGS. 17A and 17B, the metal coating layers 17 and 18 formed in the respective conductor patterns 61 are similar to the examples of FIGS. 15 and 16 so as to cover the portion covering the terminal portion 61a. The barrier layer 70 is formed. Further, a gold layer 71 is formed so as to cover the barrier layer 70. In this case, the connection terminals 21 to 24 are formed by the terminal portion 61 a of the conductor pattern 61, the metal coating layers 17 and 18, the barrier layer 70, and the gold layer 71.

  The barrier layer 70 of this example has a function of suppressing the diffusion of the copper component that diffuses from the surface of the conductor pattern 61 into the metal coating layers 17 and 18 into the gold layer 71. Thereby, the deterioration of the corrosion resistance and wettability of the gold layer 71 due to the diffusion of the copper component of the conductor pattern 61 into the gold layer 71 is suppressed. Therefore, the connection terminals 21 to 24 having good corrosion resistance and wettability are realized.

  Also in the connection terminals 25, 26, and 31 to 36, the barrier layer 70 and the gold layer 71 may be provided in the same manner as the connection terminals 21 to 24 in FIG. Thereby, the connection terminals 25, 26, 31 to 36 having good corrosion resistance and wettability are realized.

  (4) In the suspension board according to the fourth embodiment, the connection terminals 21 to 24 may have the following configuration instead of the configuration of FIG. FIG. 18 is a plan view and a cross-sectional view showing another configuration example of the connection terminals 21 to 24 in the suspension board according to the fourth embodiment. 18A and 18B are a plan view and a cross-sectional view, respectively. The plan view of FIG. 18A corresponds to the plan view of FIG. 12A of the fourth embodiment. The sectional view of FIG. 18B shows an enlarged sectional view taken along line A4-A4 of FIG. 18A and corresponds to the sectional view of FIG. 12B of the fourth embodiment. As in the example of FIG. 12A, the cover insulating layer 43 is not shown in FIG.

  In this example, nickel is used as the material of the metal coating layer 17. As shown in FIGS. 18A and 18B, a barrier layer 70 made of nickel is formed so as to cover a portion of the metal coating layer 17 formed on each conductor pattern 61 so as to cover the terminal portion 61a. . Further, a gold layer 71 is formed so as to cover the barrier layer 70. In this case, the connection terminals 21 to 24 are formed by the terminal portion 61 a of the conductor pattern 61, the metal coating layer 17, the barrier layer 70, and the gold layer 71.

  In the manufacturing process of the suspension board of this example, the base insulating layer 41 is formed on the support layer 10a, and the metal coating layer 17 is formed on a part of the conductor pattern 61 formed on the base insulating layer 41. A cover insulating layer 43 is formed so as to overlap the wiring portion 61b of the conductor pattern 61, and the opening 11 and the hole H of FIG. 1 are formed in the support layer 10a. Thereafter, the barrier layer 70 and the gold layer 71 are sequentially formed in the portion of the metal coating layer 17 covering the terminal portion 61a, and the support layer 10a is processed so that the outer shape of the support substrate 10 is formed.

  In the above manufacturing process, between the formation of the cover insulating layer 43 and the formation of the gold layer 71, for example, metal that is not covered by the cover insulating layer 43 by soft etching or the like for removing the seed layer The surface state of the coating layer 17 may become unstable. Even in such a case, the portion of the metal coating layer 17 that is not covered with the insulating cover layer 43 in the subsequent process is covered with the barrier layer 70. Therefore, the gold layer 71 can be continuously formed on the barrier layer 70 whose surface state is adjusted.

  Thereby, the diffusion of the copper component from the conductor pattern 61 to the gold layer 71 due to the nickel of the metal coating layer 17 and the barrier layer 70 is sufficiently suppressed. Therefore, deterioration of the corrosion resistance and wettability of the gold layer 71 due to the diffusion of the copper component of the conductor pattern 61 into the gold layer 71 is suppressed. As a result, the connection terminals 21 to 24 having good corrosion resistance and wettability are realized.

  Also in the connection terminals 25, 26, and 31 to 36, the barrier layer 70 and the gold layer 71 may be provided similarly to the connection terminals 21 to 24 in FIG. Thereby, the connection terminals 25, 26, 31 to 36 having good corrosion resistance and wettability are realized.

  In the above manufacturing process, when the surface state of the metal coating layer 17 does not become unstable between the formation of the insulating cover layer 43 and the formation of the gold layer 71, the barrier layer 70 is It may not be provided. The gold layer 71 may be formed on the portion of the metal coating layer 17 that covers the terminal portion 61a.

  (5) In the suspension board according to the fourth embodiment, the connection terminals 21 to 24 may have the following configuration instead of the configuration of FIG. FIG. 19 is a plan view and a cross-sectional view showing still another configuration example of the connection terminals 21 to 24 in the suspension board according to the fourth embodiment. FIGS. 19A and 19B are a plan view and a cross-sectional view, respectively. The plan view of FIG. 19A corresponds to the plan view of FIG. 12A of the fourth embodiment. The cross-sectional view of FIG. 19B shows an enlarged cross-sectional view taken along line A5-A5 of FIG. 19A, and corresponds to the cross-sectional view of FIG. 12B of the fourth embodiment. As in the example of FIG. 12A, the cover insulating layer 43 is not shown in FIG. 19A.

  In this example, nickel is used as the material of the metal coating layer 17 as in the example of FIG. As shown in FIGS. 19A and 19B, the metal coating layer 17 is formed so as to cover a part of the wiring part 61 b excluding the boundary 61 c and the vicinity thereof in the conductor pattern 61. A barrier layer 70 is formed so as to cover the boundary 61c and the vicinity thereof of the conductor pattern 61 that is not covered with the metal coating layer 17 and the terminal portion 61a. The barrier layer 70 in this example is made of the same material as the metal coating layer 17. A gold layer 71 is formed so as to cover a portion of the barrier layer 70 that covers the terminal portion 61a. In this case, the connection terminals 21 to 24 are formed by the terminal portion 61 a of the conductor pattern 61, the barrier layer 70, and the gold layer 71.

  In the manufacturing process of the suspension board of this example, the base insulating layer 41 is formed on the support layer 10a, and the metal coating layer 17 is formed on a part of the conductor pattern 61 formed on the base insulating layer 41. After the insulating cover layer 43 is formed so as to overlap the wiring portion 61b of the conductor pattern 61, the portion of the metal coating layer 17 that is not covered by the insulating cover layer 43 is removed by etching. At this time, the portion of the metal coating layer 17 located in the vicinity of the boundary 61c is also removed. Subsequently, the opening 11 and the hole H of FIG. 1 are formed in the support layer 10a. Thereafter, the barrier layer 70 and the gold layer 71 are formed so as to cover the boundary 61c of the exposed conductor pattern 61 and the vicinity thereof and the terminal portion 61a, and the support layer 10a is processed so that the outer shape of the support substrate 10 is formed. Is done.

  In the above manufacturing process, the metal covering layer 17 covering the boundary 61c and the vicinity of the conductor pattern 61 and the terminal portion 61a is removed after the insulating cover layer 43 is formed and before the barrier layer 70 is formed. Has been. Thereafter, the barrier layer 70 and the gold layer 71 are sequentially formed on the portion of the conductor pattern 61 where the barrier layer 70 and the gold layer 71 are exposed. In this case, the gold layer 71 can be continuously formed on the barrier layer 70 whose surface state is adjusted. Therefore, the diffusion of the copper component from the conductor pattern 61 to the gold layer 71 due to the nickel of the barrier layer 70 is sufficiently suppressed. Thereby, the deterioration of the corrosion resistance and wettability of the gold layer 71 due to the diffusion of the copper component of the conductor pattern 61 into the gold layer 71 is suppressed. Therefore, the connection terminals 21 to 24 having good corrosion resistance and wettability are realized.

  In the example of FIG. 19, the metal coating layer 17 and the barrier layer 70 formed on the conductor pattern 61 are made of the same nickel and are integrally formed. The barrier layer 70 covering the terminal portion 61a functions as a part of the metal coating layer 17. The metal coating layer 17 and the barrier layer 70 continuously cover the boundary 61c of the conductor pattern 61 and the vicinity thereof. Thereby, also in this example, fluid such as air, water, or a chemical solution from the outside of the insulating cover layer 43 is prevented from entering the inside of the metal coating layer 17.

  The connection terminals 25, 26, 31 to 36 may have the same configuration as the connection terminals 21 to 24 in FIG. Thereby, the connection terminals 25, 26, 31 to 36 having good corrosion resistance and wettability are realized.

  (6) In the suspension board according to the fifth embodiment, the connection terminals 21 to 24 may have the following configuration instead of the configuration of FIG. FIG. 20 is a plan view and a cross-sectional view illustrating still another configuration example of the connection terminals 21 to 24 in the suspension board according to the fifth embodiment. 20A and 20B are a plan view and a sectional view, respectively. The plan view of FIG. 20A corresponds to the plan view of FIG. 14A of the fifth embodiment. The cross-sectional view of FIG. 20B shows an enlarged cross-sectional view taken along line A6-A6 of FIG. 20A, and corresponds to the cross-sectional view of FIG. 14B of the fifth embodiment. As in the example of FIG. 14A, the cover insulating layer 43 is not shown in FIG.

  In this example, nickel is used as the material of the metal coating layer 17 and gold is used as the material of the metal coating layer 18. As shown in FIG. 20B, the metal coating layer 18 is formed so as not to contact the conductor pattern 61. In this case, the metal coating layer 17 made of nickel prevents the copper component of the conductor pattern 61 from diffusing into the metal coating layer 18.

  As a result, the corrosion resistance and wettability of the metal coating layer 18 due to the diffusion of the copper component of the conductor pattern 61 into the metal coating layer 18 are suppressed. Therefore, the connection terminals 21 to 24 having good corrosion resistance and wettability are realized.

  In the manufacturing process of the suspension board of this example, after forming the metal coating layer 17 on a part of the conductor pattern 61, the metal coating layer 18 is covered with the end surface of the metal coating layer 17 and the metal coating layer 17 when the metal coating layer 18 is formed. A mask is formed on the surface portion of the conductor pattern 61 that has not been formed. In this state, the metal coating layer 18 is formed so as to cover the metal coating layer 17. Thereafter, the mask is removed. Thereby, the metal coating layer 18 can be formed so that the metal coating layer 18 and the conductor pattern 61 do not contact.

  The connection terminals 25, 26, 31 to 36 may have the same configuration as the connection terminals 21 to 24 in FIG. Thereby, the connection terminals 25, 26, 31 to 36 having good corrosion resistance and wettability are realized.

  (7) In the suspension boards according to the first to fifth embodiments, the portion of the support board 10 where the connection terminals 21 to 26 and 31 to 36 overlap has a certain thickness. It is not limited. An opening may be formed in the portion of the support substrate 10 where any one of the connection terminals 21 to 26 and 31 to 36 overlaps. In the suspension boards according to the first to fifth embodiments, the portion of the base insulating layer 41 where the connection terminals 21 to 26 and 31 to 36 overlap has a certain thickness. It is not limited. A recess may be formed in the portion of the base insulating layer 41 where any one of the connection terminals 21 to 26 and 31 to 36 overlaps.

  FIG. 21 is a plan view of a suspension board according to another embodiment. The suspension board of FIG. 21 basically has the same configuration as the suspension board according to the fifth embodiment. In FIG. 21, the portions where the metal coating layer 18 is formed of the write wiring patterns W1 and W2, the read wiring patterns R1 and R2, and the power supply wiring patterns P1 and P2 are indicated by thick solid lines. Hereinafter, the difference between the suspension board of FIG. 21 and the suspension board according to the fifth embodiment will be described.

  FIG. 22 is a plan view of the connection terminals 21 to 26 and 31 to 36 and their peripheral portions. FIG. 23 is a cross-sectional view of the connection terminals 21 to 26 and 31 to 36 and their peripheral portions. The scales of FIGS. 22A to 22C are different from each other, and the scales of FIGS. 23A to 23C are different from each other.

  22A shows the connection terminals 21 to 24 and their peripheral parts in FIG. 21, FIG. 22B shows the connection terminal 25 and their peripheral parts in FIG. 21, and FIG. 22C shows the connection in FIG. The terminals 31, 32 and their peripheral parts are shown. 22A to 22C, the insulating cover layer 43 (see FIG. 23) is not shown. The connection terminal 26 has the same configuration as the connection terminal 25, and the connection terminals 33 to 36 have the same configuration as the connection terminals 31 and 32. FIGS. 23A to 23C are an enlarged sectional view taken along line B1-B1 in FIG. 22A, an enlarged sectional view taken along line B2-B2 in FIG. 22B, and an enlarged sectional view taken along line B3-B3 in FIG. Cross-sectional views are shown respectively.

  As shown in FIGS. 22A and 23A, the configuration of the connection terminals 21 to 24 and their peripheral portions is the same as the configuration of the connection terminals 21 to 24 and their peripheral portions according to the fifth embodiment. (See FIG. 14).

  As shown in FIGS. 22B and 23B, the connection terminal 25 is formed so as to be exposed upward through a circular opening 43x (FIG. 23B) formed in the insulating cover layer 43. Yes. The connection terminal 25 is formed by the terminal portion 61 a of the conductor pattern 61 and the metal coating layers 17 and 18. The terminal portion 61a constituting the connection terminal 25 of this example has an annular shape. Moreover, the metal coating layers 17 and 18 are formed so that the inner peripheral surface and upper surface of the terminal part 61a may be covered. A circular recess 41 u corresponding to the boundary 61 c of the conductor pattern 61 is formed in a portion of the base insulating layer 41 that overlaps the terminal portion 61 a. A circular opening 10 x corresponding to the boundary 61 c of the conductor pattern 61 is formed in a portion of the support substrate 10 that overlaps the terminal portion 61 a.

  As shown in FIGS. 22 (c) and 23 (c), in the connection terminal 31 and its peripheral portion, a recess 41v is formed in a part of the rectangular region of the base insulating layer 41 that overlaps the terminal portion 61a. Yes. A rectangular opening 10y is formed in a portion of the support substrate 10 that overlaps the terminal portion 61a.

  A method for manufacturing the suspension board of FIG. 21 will be described. 24 to 28 are schematic process diagrams showing the manufacturing process of the suspension board 1 of FIG. 24 (a), FIG. 25 (a), FIG. 26 (a), FIG. 27 (a), and FIG. 28 (a) correspond to the B1-B1 line enlarged sectional view of FIG. b), FIG. 25 (b), FIG. 26 (b), FIG. 27 (b) and FIG. 28 (b) correspond to the B2-B2 line enlarged sectional view of FIG. 22 (b), and FIG. FIG. 25C, FIG. 26C, FIG. 27C, and FIG. 28C correspond to the B3-B3 line enlarged sectional view of FIG.

  First, as shown in FIGS. 24A to 24C, by forming a base insulating layer 41 made of polyimide on a support layer 10a made of stainless steel, two layers made of a support layer 10a and a base insulating layer 41 are formed. A substrate is formed. Further, as shown in FIGS. 24B and 24C, recesses 41u and 41v are formed in predetermined regions of the base insulating layer 41 that overlap with the connection terminals 25, 26, and 31 to 36, respectively. The concave portions 41u and 41v can be formed using, for example, a gradation exposure technique, a laser processing technique, or an etching technique.

  Next, as shown in FIGS. 25A to 25C, a plurality of conductor patterns 61 made of copper are formed on the insulating base layer 41 through a seed layer (not shown). The wiring portions 61b of the six conductor patterns 61 form the write wiring patterns W1, W2, the read wiring patterns R1, R2, and the power supply wiring patterns P1, P2 on the base insulating layer 41.

  Next, as shown in FIGS. 26A to 26C, the terminal portion 61a and the wiring portion 61b of each conductor pattern 61 are covered and continuous from the surface of the terminal portion 61a to a part of the surface of the wiring portion 61b. Then, a metal coating layer 17 made of nickel is formed so as to extend. Further, a metal coating layer 18 made of gold is formed so as to cover the metal coating layer 17. Thereby, the connection terminals 21 to 26 and 31 to 36 are formed.

  Next, as shown in FIGS. 27A to 27C, the base insulating layer 41 is formed so as to cover a portion covering the wiring portion 61 b and not covering a portion covering the terminal portion 61 a in the metal coating layers 17 and 18. A cover insulating layer 43 made of polyimide, for example, is formed thereon.

  Thereafter, as shown in FIGS. 28A to 28C, the opening 11 and the hole H of FIG. 1 are formed in the support layer 10a, and at the same time, a predetermined portion of the support layer 10a that overlaps the terminal portion 61a is formed. Openings 10x and 10y are formed.

  Finally, the support substrate 10 is formed by processing the support layer 10a so that the portion of the support layer 10a that overlaps the base insulating layer 41 remains. Thereby, the suspension board is completed.

  In the suspension board of FIG. 21 described above, the metal coating layer 18 may be formed so as not to contact the conductor pattern 61. Thereby, like the example of FIG. 20, the connection terminals 21-26 and 31-36 which have favorable corrosion resistance and wettability are implement | achieved. Further, in the suspension board of FIG. 21 described above, the connection terminals 21 to 26 and 31 to 36 are completed in a process before the cover insulating layer 43 is formed. Accordingly, it is not necessary to perform plating for terminals before the step of processing the support layer 10a and forming the support substrate 10 after the steps of FIGS. Therefore, an increase in the number of manufacturing processes is suppressed.

  Furthermore, the connection terminals 21 to 26 and 31 to 36 of this example have a simple structure in which two metal coating layers 17 and 18 are laminated on the conductor pattern 61. Therefore, even when the suspension board is cleaned using ultrasonic waves, each of the connection terminals 21 to 26 and 31 to 36 is not easily damaged by the impact of ultrasonic waves.

  In the suspension board of FIG. 21 described above, an opening may be formed in the portion of the base insulating layer 41 where any of the connection terminals 21 to 26 and 31 to 36 overlaps instead of the recesses 41u and 41v. 29 and 30 are diagrams showing an example in which an opening is formed in part of the base insulating layer 41 in the suspension board of FIG.

  The plan views of FIGS. 29A to 29C correspond to the plan views of FIGS. 22A to 22C, respectively. 30 (a) to 30 (c) correspond to the enlarged sectional views of FIGS. 23 (a) to 23 (c), respectively.

  As shown in FIGS. 29 (a) and 30 (a), the configuration of the connection terminals 21 to 24 and their peripheral portions is the same as the configuration of the connection terminals 21 to 24 and their peripheral portions according to the fifth embodiment. (See FIG. 14). As shown in FIGS. 29B and 30B, in this example, a circular opening 41x corresponding to the boundary 61c of the conductor pattern 61 is formed in a portion of the base insulating layer 41 that overlaps the terminal portion 61a. Has been. In addition, as shown in FIG. 29C and FIG. 30C, in the connection terminal 31 and its peripheral part, an opening 41y is formed in a part of the rectangular region of the base insulating layer 41 that overlaps the terminal part 61a. Is formed. For example, the openings 41x and 41y of the base insulating layer 41 are formed after the step of FIG. 28 and before the step of forming the support substrate 10 by processing the support layer 10a.

  30A to 30C, the seed layer formed on the base insulating layer 41 as the base of the conductor pattern 61 is indicated by a thick solid line. In this case, as shown in FIGS. 29B and 29C, in the connection terminals 25, 26, and 31 to 36, the seed layer formed on the lower surface of the conductor pattern 61 is the opening 41 x of the base insulating layer 41. , 41y and the openings 10x, 10y of the support substrate 10 are exposed downward. Thereby, the terminal etc. of an electronic device can be connected to the said exposed part.

  Here, in the configuration of FIG. 30, a portion of the seed layer exposed downward may be removed. FIG. 31 is a diagram showing a state where a portion of the seed layer exposed in the suspension substrate of FIG. 30 is removed. FIGS. 31A to 31C correspond to enlarged cross-sectional views of FIGS. 30A to 30C, respectively. As shown in FIGS. 31B and 31C, in this example, the lower surface of the conductor pattern 61 is exposed downward through the openings 41 x and 41 y of the base insulating layer 41 and the openings 10 x and 10 y of the support substrate 10. Thereby, the terminal etc. of an electronic device can be connected to the said exposed part. The part of the seed layer located in the openings 41x and 41y of the base insulating layer 41 can be removed after the openings 41x and 41y of the base insulating layer 41 are formed, for example.

  (8) The suspension board according to the above embodiment basically has a configuration in which the base insulating layer 41, the conductor pattern 61, and the cover insulating layer 43 are laminated on the support substrate 10 in this order. It is not limited to this. A plurality of insulating base layers 41 and a plurality of conductor patterns 61 may be alternately stacked on the support substrate 10. A configuration example of a plurality of conductor patterns 61 that overlap vertically and a plurality of connection terminals corresponding to them will be described.

  FIG. 32 is a cross-sectional view showing a first configuration example of two conductor patterns stacked one above the other and two connection terminals corresponding to them. FIG. 32A shows a longitudinal sectional view of the two connection terminals of the two conductor patterns 61A and 61B and their peripheral members. FIG. 32B shows a longitudinal sectional view taken along line C1-C1 of FIG.

  In the first configuration example of FIG. 32, an insulating layer 41 </ b> A is formed on the support substrate 10. A conductor pattern 61A made of copper is formed on the insulating layer 41A. The conductor pattern 61A includes a terminal portion 61a and a wiring portion 61b. Of the conductor pattern 61A, a part of the wiring part 61b and the terminal part 61a protrude from the end of the insulating layer 41A.

  A metal coating layer 17 made of nickel is formed so as to cover a part of the wiring portion 61b of the conductor pattern 61A. The metal coating layer 17 extends to a position 3 μm or more away from the boundary 61c of the conductor pattern 61A on the upper surface and both side surfaces of the conductor pattern 61A. A barrier layer 70 made of the same material as that of the metal coating layer 17 is formed so as to cover the terminal portion 61a of the conductor pattern 61A. The barrier layer 70 extends from the end of the conductor pattern 61A to the position of the end of the insulating layer 41A on the lower surface of the conductor pattern 61A. The ratio of the length of all the metal coating layers 17 covering the wiring part 61b to the entire length of the wiring part 61b of the conductor pattern 61A is set to be 40% or less. Note that the length from the end of the conductor pattern 61A to the position of the end of the insulating layer 41A is extremely smaller than the total length of the wiring portion 61b of the conductor pattern 61A.

  An insulating layer 41B is formed on the insulating layer 41A so as to cover the metal coating layer 17 and other portions of the wiring portion 61b of the conductor pattern 61A that are not covered by the metal coating layer 17 and not to cover the barrier layer 70. . A conductor pattern 61B made of copper is formed on the insulating layer 41B. The conductor pattern 61B includes a terminal portion 61a and a wiring portion 61b. A part of the conductor pattern 61B overlaps the conductor pattern 61A. A metal coating layer 17 made of nickel is formed so as to cover the entire wiring portion 61b of the conductor pattern 61B. A barrier layer 70 made of the same material as that of the metal coating layer 17 is formed so as to cover the terminal portion 61a of the conductor pattern 61B. A cover insulating layer 43 is formed on the insulating layer 41B so as to overlap the wiring portion 61b of the conductor pattern 61B and cover the metal coating layer 17.

  A gold layer 71 is formed so as to cover the barrier layer 70 provided on the conductor pattern 61A located below. Thereby, a connection terminal TA having a flying structure is formed. A gold layer 71 is formed so as to cover the barrier layer 70 provided on the conductor pattern 61B located above. Thereby, the connection terminal TB is formed.

  As described above, the ratio of the length of all the metal coating layers 17 covering the wiring part 61b to the entire length of the wiring part 61b of the conductor pattern 61A positioned below is set to be 40% or less. Thereby, in the wiring part 61b of the conductor pattern 61A, the transmission loss of the electric signal in a high frequency band can be reduced as in the fourth embodiment. Therefore, the wiring part 61b of the conductor pattern 61A can be effectively used as a transmission line for high-frequency signals.

  Moreover, in said structure, the metal coating layer 17 and the barrier layer 70 consist of the same nickel, and the metal coating layer 17 and the barrier layer 70 are comprised integrally. The barrier layer 70 functions as a part of the metal coating layer 17. The metal coating layer 17 and the barrier layer 70 continuously cover the boundary 61c of the conductor patterns 61A and 61B and the vicinity thereof. This prevents fluid such as air, water, or a chemical solution from entering the inside of the metal coating layer 17 from the outside of the insulating cover layer 43. Therefore, occurrence of corrosion at the boundary 61c between the conductor patterns 61A and 61B and in the vicinity thereof is prevented.

  Since the metal coating layer 17 made of nickel is formed so as to cover the entire wiring portion 61b of the conductor pattern 61B located above, the adhesion between the conductor pattern 61B and the cover insulating layer 43 is improved. The wiring portion 61b of the conductor pattern 61B is preferably used as, for example, a low-frequency signal transmission line, a ground conductor layer, or a shield layer.

  In the first configuration example of FIG. 32, the metal coating layer 17 may be formed between the terminal portions 61a of the conductor patterns 61A and 61B and the barrier layer 70 as in the example of FIG.

  FIG. 33 is a cross-sectional view showing a second configuration example of two conductor patterns stacked one above the other and two connection terminals corresponding to them. FIG. 33A shows a longitudinal sectional view of the two connection terminals of the two conductor patterns 61A and 61B and their peripheral members. FIG. 33B shows a longitudinal sectional view taken along line C2-C2 of FIG. Hereinafter, the second configuration example will be described while referring to differences from the first configuration example of FIG.

  In the second configuration example of FIG. 33, the metal coating layer 15 is formed so as to cover the entire wiring portion 61b of the conductor pattern 61A and the terminal portion 61a. The metal coating layer 15 is mainly made of a metal having a magnetic property lower than that of nickel (for example, a non-magnetic metal), and has a magnetic property lower than that of nickel. In this example, gold or silver is used as the material of the metal coating layer 15. A barrier layer 70 made of nickel is formed so as to cover the portion of the metal coating layer 15 covering the terminal portion 61a. The barrier layer 70 extends from the end of the conductor pattern 61A to the position of the end of the insulating layer 41A on the lower surface of the conductor pattern 61A.

  An insulating layer 41B is formed on the insulating layer 41A so as to cover the portion of the metal coating layer 15 covering the wiring portion 61b of the conductor pattern 61A and not cover the other portion of the metal coating layer 15 covering the terminal portion 61a. A conductor pattern 61B made of copper is formed on the insulating layer 41B. In the conductor pattern 61B, similarly to the first configuration example of FIG. 32, the metal coating layer 17 and the barrier layer 70 made of nickel are formed.

  A gold layer 71 is formed so as to cover the barrier layer 70 provided on the conductor pattern 61A located below. Thereby, a connection terminal TA having a flying structure is formed. A gold layer 71 is formed so as to cover the barrier layer 70 provided on the conductor pattern 61B located above. Thereby, the connection terminal TB is formed.

  In the above configuration, there is no metal layer having magnetism higher than that of nickel between the wiring portion 61b of the underlying conductor pattern 61A and the insulating layer 41B. Thereby, in the wiring part 61b of the conductor pattern 61A, the transmission loss of the electric signal in the high frequency band can be reduced as in the first embodiment. Therefore, the wiring part 61b of the conductor pattern 61A can be effectively used as a transmission line for high-frequency signals. Further, since the boundary 61c of the conductor pattern 61A and the vicinity thereof are continuously covered by the metal coating layer 15, a fluid such as air, water, or a chemical solution enters the inside of the metal coating layer 15 from the outside of the insulating cover layer 43. It is prevented. Therefore, the occurrence of corrosion at the boundary 61c of the conductor pattern 61A and its vicinity is prevented.

  Since the metal coating layer 17 made of nickel is formed so as to cover the entire wiring portion 61b of the conductor pattern 61B located above, the adhesion between the conductor pattern 61B and the cover insulating layer 43 is improved. The wiring portion 61b of the conductor pattern 61B is preferably used as, for example, a low-frequency signal transmission line, a ground conductor layer, or a shield layer.

  In the second configuration example of FIG. 33, as in the example of the second embodiment of FIG. 10, not the entire conductor pattern 61A but a part of the wiring portion 61b of the conductor pattern 61A and the terminal portion 61a. The metal coating layer 15 may be formed so as to cover. Similarly to the example of FIG. 18, the metal coating layer 17 may be formed between the terminal portion 61 a of the conductor pattern 61 </ b> B and the barrier layer 70.

  FIG. 34 is a cross-sectional view showing a third configuration example of two conductor patterns stacked one above the other and two connection terminals corresponding to them. FIG. 34A shows a longitudinal sectional view of the two connection terminals of the two conductor patterns 61A and 61B and their peripheral members. FIG. 34 (b) shows a longitudinal sectional view taken along line C3-C3 of FIG. 34 (a). Hereinafter, the third configuration example will be described while referring to differences from the first configuration example of FIG.

  In the third configuration example of FIG. 34, the metal coating layer 17 made of nickel is formed so as to cover the entire wiring portion 61b of the conductor pattern 61A. A barrier layer 70 made of nickel is formed so as to cover the terminal portion 61a of the conductor pattern 61A. The barrier layer 70 extends from the end of the conductor pattern 61A to the position of the end of the insulating layer 41A on the lower surface of the conductor pattern 61A.

  An insulating layer 41B is formed on the insulating layer 41A so as to overlap the wiring portion 61b of the conductor pattern 61A and cover the metal coating layer 17. A conductor pattern 61B made of copper is formed on the insulating layer 41B. A metal coating layer 17 made of nickel is formed so as to cover a part of the wiring part 61b of the conductor pattern 61B. The metal coating layer 17 extends to a position away from the boundary 61c of the conductor pattern 61B by 3 μm or more. A barrier layer 70 made of the same material as that of the metal coating layer 17 is formed so as to cover the terminal portion 61a of the conductor pattern 61B. The ratio of the length of all the metal coating layers 17 covering the wiring portion 61b to the entire length of the wiring portion 61b of the conductor pattern 61B is set to be 40% or less.

  A gold layer 71 is formed so as to cover the barrier layer 70 provided on the conductor pattern 61A located below. Thereby, a connection terminal TA having a flying structure is formed. A gold layer 71 is formed so as to cover the barrier layer 70 provided on the conductor pattern 61B located above. Thereby, the connection terminal TB is formed.

  As described above, the ratio of the length of all the metal coating layers 17 covering the wiring part 61b to the entire length of the wiring part 61b of the conductor pattern 61B positioned above is set to be 40% or less. Thereby, in the wiring part 61b of the conductor pattern 61B, the transmission loss of the electric signal in a high frequency band can be reduced as in the fourth embodiment. Therefore, the wiring part 61b of the conductor pattern 61B can be effectively used as a transmission line for high-frequency signals.

  Moreover, in said structure, the metal coating layer 17 and the barrier layer 70 consist of the same nickel, and the metal coating layer 17 and the barrier layer 70 are comprised integrally. The barrier layer 70 functions as a part of the metal coating layer 17. The metal coating layer 17 and the barrier layer 70 continuously cover the boundary 61c of the conductor patterns 61A and 61B and the vicinity thereof. This prevents fluid such as air, water, or a chemical solution from entering the inside of the metal coating layer 17 from the outside of the insulating cover layer 43. Therefore, occurrence of corrosion at the boundary 61c between the conductor patterns 61A and 61B and in the vicinity thereof is prevented.

  Since the metal coating layer 17 made of nickel is formed so as to cover the entire wiring portion 61b of the conductor pattern 61A located below, the adhesion between the conductor pattern 61A and the insulating layer 41B is improved. The wiring portion 61b of the conductor pattern 61A is preferably used as, for example, a low-frequency signal transmission line, a ground conductor layer, or a shield layer.

  In the third configuration example of FIG. 34, the metal coating layer 17 may be formed between the terminal portions 61a of the conductor patterns 61A and 61B and the barrier layer 70, as in the example of FIG.

  FIG. 35 is a cross-sectional view showing a fourth configuration example of two conductor patterns stacked one above the other and two connection terminals corresponding to them. FIG. 35A shows a longitudinal sectional view of the two connection terminals of the two conductor patterns 61A and 61B and their peripheral members. FIG. 35B shows a longitudinal sectional view taken along line C4-C4 of FIG. Hereinafter, the fourth configuration example will be described while referring to differences from the first configuration example of FIG.

  In the fourth configuration example of FIG. 35, as in the first configuration example of FIG. 32, the metal coating layer 17 made of nickel is formed so as to cover a part of the wiring portion 61b of the conductor pattern 61A located below. Has been. The ratio of the length of all the metal coating layers 17 covering the wiring part 61b to the entire length of the wiring part 61b of the conductor pattern 61A is set to be 40% or less.

  Further, in the fourth configuration example of FIG. 35, similarly to the third configuration example of FIG. 34, the metal coating layer 17 made of nickel so as to cover a part of the wiring portion 61b of the conductor pattern 61B located above. Is formed. The ratio of the length of all the metal coating layers 17 covering the wiring portion 61b to the entire length of the wiring portion 61b of the conductor pattern 61B is set to be 40% or less.

  From these, in the wiring part 61b of the conductor patterns 61A and 61B, the transmission loss of the electric signal in the high frequency band can be reduced as in the fourth embodiment. Therefore, the wiring part 61b of the conductor patterns 61A and 61B can be effectively used as a transmission line for high-frequency signals.

  In the fourth configuration example of FIG. 35, the metal coating layer 17 may be formed between the terminal portions 61a of the conductor patterns 61A and 61B and the barrier layer 70, as in the example of FIG.

  FIG. 36 is a cross-sectional view showing a fifth configuration example of two conductor patterns stacked one above the other and two connection terminals corresponding to them. FIG. 36A shows a longitudinal sectional view of the two connection terminals of the two conductor patterns 61A and 61B and their peripheral members. FIG. 36B shows a longitudinal sectional view taken along line C5-C5 of FIG. Hereinafter, the fifth configuration example will be described while referring to differences from the third configuration example of FIG.

  In the fifth configuration example of FIG. 36, similarly to the third configuration example of FIG. 34, the metal coating layer 17 made of nickel is formed so as to cover the entire wiring portion 61b of the conductor pattern 61A located below. ing.

  On the other hand, with respect to the conductor pattern 61B located on the upper side, the metal coating layer 15 is formed so as to cover the entire wiring portion 61b and the terminal portion 61a. The metal coating layer 15 is mainly made of a metal having a magnetic property lower than that of nickel (for example, a non-magnetic metal), and has a magnetic property lower than that of nickel. In this example, gold or silver is used as the material of the metal coating layer 15.

  A cover insulating layer 43 is formed on the insulating layer 41B so as to cover the portion of the metal coating layer 15 covering the wiring portion 61b of the conductor pattern 61B and not cover the other portion of the metal coating layer 15 covering the terminal portion 61a. . A barrier layer 70 made of nickel is formed so as to cover the portion of the metal coating layer 15 covering the terminal portion 61a. A gold layer 71 is formed so as to cover the barrier layer 70. Thereby, the connection terminal TB is formed.

  In the above configuration, there is no metal layer having magnetism higher than that of nickel between the wiring portion 61b of the conductor pattern 61B positioned above and the cover insulating layer 43. Thereby, in the wiring part 61b of the conductor pattern 61B, the transmission loss of the electric signal in a high frequency band can be reduced as in the first embodiment. Therefore, the wiring part 61b of the conductor pattern 61B can be effectively used as a transmission line for high-frequency signals. Further, since the boundary 61c of the conductor pattern 61B and the vicinity thereof are continuously covered by the metal coating layer 15, a fluid such as air, water, or a chemical solution enters the inside of the metal coating layer 15 from the outside of the insulating cover layer 43. It is prevented. Therefore, the occurrence of corrosion at the boundary 61c of the conductor pattern 61B and its vicinity is prevented.

  In the fifth configuration example of FIG. 36, as in the example of the second embodiment of FIG. 10, not the entire conductor pattern 61B but a part of the wiring portion 61b of the conductor pattern 61B and the terminal portion 61a. The metal coating layer 15 may be formed so as to cover. Similarly to the example of FIG. 18, the metal coating layer 17 may be formed between the terminal portion 61 a of the conductor pattern 61 </ b> A and the barrier layer 70.

  FIG. 37 is a cross-sectional view showing a sixth configuration example of two conductor patterns stacked one above the other and two connection terminals corresponding to them. FIG. 37A shows a longitudinal sectional view of the two connection terminals of the two conductor patterns 61A and 61B and their peripheral members. FIG. 37B shows a longitudinal sectional view taken along line C6-C6 of FIG. Hereinafter, the sixth configuration example will be described while referring to differences from the second configuration example of FIG.

  In the sixth configuration example of FIG. 37, as in the second configuration example of FIG. 33, the metal coating layer 15 is formed so as to cover the entire wiring portion 61b of the conductor pattern 61A located below and the terminal portion 61a. Has been. As described above, the metal coating layer 15 has magnetism lower than that of nickel.

  In the sixth configuration example of FIG. 37, similarly to the fifth configuration example of FIG. 36, the metal coating layer 15 is formed so as to cover the entire wiring portion 61b and the terminal portion 61a of the conductor pattern 61B located above. Is formed.

  From these, in the wiring part 61b of the conductor patterns 61A and 61B, the transmission loss of the electric signal in the high frequency band can be reduced as in the first embodiment. Therefore, the wiring part 61b of the conductor patterns 61A and 61B can be effectively used as a transmission line for high-frequency signals. Further, since the metal coating layer 15 continuously covers the boundary 61c of the conductor patterns 61A and 61B and the vicinity thereof, the occurrence of corrosion at the boundary 61c of the conductor patterns 61A and 61B and the vicinity thereof is prevented.

  In the sixth configuration example of FIG. 37, as in the example of the second embodiment of FIG. 10, not the entire conductor pattern 61A but a part of the wiring portion 61b of the conductor pattern 61A and the terminal portion 61a. The metal coating layer 15 may be formed so as to cover. Moreover, the metal coating layer 15 may be formed so as to cover not the entire conductor pattern 61B but a part of the wiring part 61b of the conductor pattern 61B and the terminal part 61a.

  (9) In the above embodiment, the printed circuit board is the suspension board 1 including the support board 10, but the present invention is not limited to this. The printed circuit board may be, for example, a flexible printed circuit board that does not include the support substrate 10.

  (10) In the above embodiment, the metal coating layers 15 and 17 are formed by, for example, electrolytic plating, electroless plating or sputtering, but the present invention is not limited to this. The metal coating layers 15 and 17 may be formed using other methods such as a semi-additive method or a subtractive method.

  Moreover, in the said embodiment, although the metal coating layers 16 and 18 are formed by electrolytic plating, this invention is not limited to this. The metal coating layers 16 and 18 may be formed using other methods such as electroless plating, sputtering, a semi-additive method, or a subtractive method.

  (11) In the first embodiment, as in the third embodiment, the metal coating layer 16 of FIG. 11 is formed on the portion of the metal coating layer 15 that covers the terminal portion 61a of the conductor pattern 61. Also good. Further, in the fourth embodiment, similarly to the third embodiment, even if the metal coating layer 16 of FIG. 11 is formed on the portion of the metal coating layer 17 that covers the terminal portion 61a of the conductor pattern 61. Good. Furthermore, in the fifth embodiment, similarly to the third embodiment, even if the metal coating layer 16 of FIG. 11 is formed on the portion of the metal coating layer 18 that covers the terminal portion 61a of the conductor pattern 61. Good. In these cases, the surface states of the connection terminals 21 to 26 and 31 to 36 are adjusted.

  (12) In the first to third embodiments, similarly to the fifth embodiment, the metal coating layer 18 of FIG. 14 may be formed so as to cover the entire metal coating layer 15. In this case, as the material of the metal coating layer 18, a metal having a magnetic property lower than that of nickel is used.

  (13) In the fourth embodiment, the metal coating layer 17 is formed so as to extend from both ends of the wiring portions 61b of the plurality of conductor patterns 61, but the present invention is not limited to the above example. If the ratio of the length of the metal coating layer 17 covering the wiring portion 61b to the total length of the wiring portion 61b is 40% or less, a part of the metal coating layer 17 is a metal located at both ends of the wiring portion 61b. It may be formed separately from the coating layer 17 portion. For example, a part of the metal coating layer 17 may be formed in the central part of the wiring part 61b.

  (14) In the suspension boards according to the first to fifth embodiments, basically, the base insulating layer 41, the conductor pattern 61, and the cover insulating layer 43 are laminated in this order on the metal support board 10. However, the present invention is not limited to this. In addition to the above-described configuration, the suspension board may further include other insulating layers and other conductor patterns provided between the support substrate 10 and the base insulating layer 41 (first to first in FIGS. 32 to 37). (Refer to the sixth configuration example). The suspension board basically has a configuration in which another insulating layer, another conductor pattern, a base insulating layer 41, a conductor pattern 61, and a cover insulating layer 43 are laminated in this order on a metal support board 10. Have. In this case, as for the other conductor patterns, any of the metal coating layers 15, 17 and 18 may be formed so that at least a part of the wiring portion and the terminal portion are covered, as in the above embodiment. Good. Further, the base insulating layer 41 may be formed on another insulating layer so as to cover the wiring portions of other conductor patterns. Thereby, the effect similar to the said embodiment can be acquired also about another conductor pattern.

[7] Correspondence relationship between each constituent element of claim and each part of embodiment The following describes an example of the correspondence between each constituent element of the claim and each part of the embodiment. It is not limited.

  In the above embodiment, the base insulating layer 41 and the insulating layers 41A and 41B are examples of the first insulating layer, the conductor patterns 61, 61A and 61B are examples of the conductor pattern, and the terminal portion 61a is an example of the terminal portion. The wiring part 61b is an example of the wiring part, the metal coating layers 15, 17, 18 and the barrier layer 70 made of the same material as the metal coating layer 17 are examples of the first metal coating layer, and the cover insulating layer 43 and the insulating layer 41B are examples of the second insulating layer, the metal coating layer 16 is an example of the second metal coating layer, the metal coating layer 17 is an example of the first metal layer, and the metal coating layer 18 is an example of a second metal layer, and the suspension board 1 is an example of a printed circuit board.

  The barrier layer 70 is an example of a terminal barrier layer, the gold layer 71 is an example of a terminal surface layer, the conductor pattern 61B is an example of an upper conductor pattern, and the terminal portion 61a of the conductor pattern 61B is an upper terminal portion. The wiring portion 61b of the conductor pattern 61B is an example of the upper wiring portion, the barrier layer 70 made of the same material as the metal coating layers 15 and 17 and the metal coating layer 17 is an example of the upper metal coating layer, The insulating layer 43 is an example of a third insulating layer, the insulating layer 41A is an example of a lower insulating layer, and the conductor pattern 61A is an example of a lower conductor pattern.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

[8] Example and Comparative Example The inventor created a suspension board having the same configuration as that of the suspension board 1 according to the first embodiment (see FIGS. 1 and 5) as Example 1, and Example 2 was made. , 3, 4, and 5, suspension boards having the same configuration as the suspension board according to the second embodiment (see FIG. 10) were prepared. In Examples 2, 3, 4, and 5, the distance L1 in FIG. 10B was set to 3 μm, 5 μm, 10 μm, and 50 μm, respectively.

  Further, the inventor created a suspension board having the same configuration as the suspension board according to the third embodiment (see FIG. 11) as Example 6. In Example 6, the distance L1 in FIG. 11B was set to 5 μm.

  Further, the inventors created suspension boards (see FIG. 14) having the same configuration as the suspension board according to the fifth embodiment as Examples 7, 8, 9, 10, 11, and 12. In Examples 7, 8, 9, 10, 11, and 12, the distance L2 in FIG. 14B was set to 5 μm, 10 μm, 50 μm, 950 μm, 3800 μm, and 7600 μm, respectively.

  In Examples 7 to 12, the total length of the four wiring portions 61b constituting the writing wiring patterns W1, W2 and the reading wiring patterns R1, R2 was set to 38 mm. The ratio of the length of the portion covered with the metal coating layer 17 to the entire length of the wiring portion 61b is called the ferromagnetic coating layer occupancy rate. In this case, with respect to the write wiring traces W1 and W2 and the read wiring traces R1 and R2, the ferromagnetic coating layer occupancy rates of Examples 7, 8, 9, 10, 11, and 12 are 0.03% and 0%, respectively. .05%, 0.26%, 5%, 20% and 40%. On the other hand, the ferromagnetic coating layer occupation ratios of Examples 1 to 6 are all 0%.

  In addition, as a comparative example 1, the present inventor created a suspension board having basically the same configuration as the suspension board according to the second embodiment except for the set value of the distance L1 in FIG. In the suspension board of Comparative Example 1, the distance L1 in FIG. 10B was set to 1 μm.

  In addition, the inventor created a suspension board having the following configuration as Comparative Example 2. 38 is a plan view and a cross-sectional view showing a part of the suspension board of Comparative Example 2. FIG. 38A and 38B are a plan view and a sectional view, respectively. The plan view of FIG. 38A corresponds to the plan view of FIG. 3A of the first embodiment. The cross-sectional view of FIG. 38B shows an enlarged cross-sectional view taken along the line KK of FIG. 38A, and corresponds to the cross-sectional view of FIG. 5A of the first embodiment.

  Also in the suspension board of Comparative Example 2, the base insulating layer 41 is formed on the support substrate 10 and the plurality of conductor patterns 61 are formed on the base insulating layer 41 as in the first embodiment. A cover insulating layer 43 is formed on the base insulating layer 41 so as to cover the wiring portions 61b of the plurality of conductor patterns 61 (see FIG. 4A). In FIG. 38A, the cover insulating layer 43 is not shown.

  As shown in FIGS. 38A and 38B, the metal coating layer 17 is formed so as to cover the entire wiring part 61b in each conductor pattern 61 and not to cover the terminal part 61a. Metal coating layer 19 is formed so as to cover terminal portion 61a. Thus, in the suspension board of Comparative Example 2, each of the metal coating layers 17 and 19 is not formed so as to continuously extend from the surface of the terminal portion 61a to the surface of the wiring portion 61b. The boundary between the metal coating layer 17 and the metal coating layer 19 is positioned so as to overlap the boundary 61 c between the terminal portion 61 a and the wiring portion 61 b in the conductor pattern 61. In Comparative Example 2, since the metal coating layer 17 covers the entire wiring portion 61b, the ferromagnetic coating layer occupation ratio is 100%.

  In the suspension boards of Examples 1 to 12 and Comparative Examples 1 and 2, stainless steel is used as the material of the support board 10, polyimide is used as the material of the base insulating layer 41 and the cover insulating layer 43, and the conductive pattern 61 is formed. Copper was used as the material. Further, gold was used as a material for the metal coating layer 15 of Examples 1 to 6 and Comparative Example 1, the metal coating layer 16 of Example 6, and the metal coating layer 18 of Examples 7 to 12. Further, nickel was used as the material of the metal coating layer 17 of Examples 7 to 12 and Comparative Example 2, and gold was used as the material of the metal coating layer 19 of Comparative Example 2.

  In order to evaluate the electrical characteristics of Examples 1 to 12 and Comparative Examples 1 and 2, the inventor has parameters indicating transmission characteristics when electrical signals are transmitted by the write wiring patterns W1 and W2. SDD21 was measured. The parameter SDD21 indicates the amount of attenuation at the differential mode input and the differential mode output.

  FIG. 39 is a diagram illustrating measurement results of the parameter SDD21 for Examples 10, 11, 12 and Comparative Example 2. In FIG. 39, the vertical axis represents the parameter SDD21 [dB], and the horizontal axis represents the frequency [GHz] of the electric signal. In FIG. 39, the measurement results for Examples 10, 11, and 12 are indicated by a solid line, an alternate long and short dash line, and a thick solid line, respectively, and the measurement results for Comparative Example 2 are indicated by a dotted line.

  According to the measurement results of FIG. 39, the suspension boards of Examples 10, 11, and 12 have the parameter SDD21 (attenuation amount) of −3 dB (50%) or more even when a signal having a frequency of 4.5 GHz or more is transmitted. It can be seen that the attenuation in the high frequency band is small. On the other hand, the suspension board of Comparative Example 2 has a parameter SDD21 (attenuation amount) lower than −3 dB (50%) when a signal having a frequency of 4.5 GHz or higher is transmitted. You can see that it ’s big.

  As a result of performing the above measurements on Examples 1 to 12 and Comparative Example 1, the parameter SDD21 is maintained at -3 dB or higher when a signal having a frequency of 4.5 GHz or higher is transmitted on any suspension board. I understood. That is, it was found that the transmission loss of electric signals in the high frequency band is reduced. On the other hand, in Comparative Example 2, it was found that the parameter SDD21 is lower than −3 dB when a signal having a frequency of 4.5 GHz or higher is transmitted. That is, it was found that the transmission loss of the electric signal is high in the high frequency band.

  The suspension substrates of Examples 1 to 12 and Comparative Example 1 have a ferromagnetic coating layer occupation ratio of 40% or less. Therefore, it has been found that the transmission loss of the electric signal is reduced by the absence of nickel between the wiring portion 61b and the cover insulating layer 43 in a range of at least 60% or more of the entire length of the wiring portion 61b.

  As a result of the above measurement, in Examples 1 to 11 and Comparative Example 1, the parameter SDD21 is maintained at -3 dB or higher when a signal having a frequency of 5 GHz or higher is transmitted on any suspension board. I understood. That is, it was found that the transmission loss of electric signals in the high frequency band is further reduced. Therefore, the ferromagnetic coating layer occupancy is preferably set to 20% or less.

  The inventor evaluated the adhesion between the insulating cover layer 43 and the wiring part 61 b of the conductor pattern 61 in Examples 1 to 12 and Comparative Examples 1 and 2. Specifically, the inventor does not generate a large gap between the end portion of the insulating cover layer 43 and the conductor pattern 61 in the vicinity of the boundary 61c between the terminal portion 61a and the wiring portion 61b in the conductor pattern 61. I confirmed about it.

  As a result, in Examples 1 to 12 and Comparative Example 2, no large gap was generated between the end of the insulating cover layer 43 and the wiring part 61b. On the other hand, in Comparative Example 1, a large gap was generated between the end portion of the insulating cover layer 43 and the conductor pattern 61. As a result, any one of the metal coating layers 15, 17, and 18 is formed on the wiring portion 61 b so as to extend to a position separated by 3 μm or more from the position on the boundary 61 c of the conductor pattern 61, whereby the insulating cover layer 43 It was found that the adhesion between the wiring part 61b and the wiring part 61b is improved.

  The inventor confirmed the presence or absence of corrosion at the boundary 61c between the terminal portion 61a and the wiring portion 61b of each conductor pattern 61 and the vicinity thereof in Examples 1 to 12 and Comparative Examples 1 and 2.

  As a result, in Examples 1 to 12, no corrosion occurred in the conductor pattern 61. On the other hand, in Comparative Examples 1 and 2, the conductor pattern 61 was corroded. In the suspension board of Comparative Example 1, it is considered that a fluid such as air, water, or a chemical solution has entered the inside of the insulating cover layer 43 through the gap formed between the insulating cover layer 43 and the conductor pattern 61. On the other hand, in the suspension board of Comparative Example 2, it is considered that a fluid such as air, water, or a chemical solution has entered the metal coating layers 17 and 19 through the boundary between the metal coating layers 17 and 19.

  As a result, any one of the metal coating layers 15, 17, and 18 covering the wiring portion 61b is formed to extend to a position 3 μm or more away from the position on the boundary 61c, and the metal coating layers 15, 17, and 18 It has been found that the occurrence of corrosion in the conductor pattern 61 can be prevented by forming one of them so as to continuously extend from the surface of the terminal portion 61a to the surface of the wiring portion 61b.

  Table 1 below shows evaluation results of electrical characteristics, adhesion evaluation results, and confirmation results of the presence or absence of corrosion for Examples 1 to 12 and Comparative Examples 1 and 2. In addition, in Table 1, the length (distance from the boundary 61c) of the metal coating layers 15, 17, and 18 covering one end of the wiring part 61b is shown together with each evaluation result. In addition, it is indicated whether or not the metal coating layers 15, 17, and 18 that are in contact with the insulating cover layer 43 continuously extend from the surface of the terminal portion 61a to the surface of the wiring portion 61b. Further, in Table 1, the ferromagnetic coating layer occupation ratio is also shown.

  In the evaluation results of the electrical characteristics in Table 1, the suspension board whose frequency when the parameter SDD21 indicates -3 dB (50%) is 5.0 GHz or more is represented by “◎”. In addition, a suspension board whose frequency when the parameter SDD21 indicates -3 dB (50%) is 4.5 GHz or more and less than 5.0 GHz is represented by “◯”, and when the parameter SDD21 indicates -3 dB (50%). A suspension board having a frequency of less than 4.5 GHz is represented by “x”.

  In the evaluation results of the adhesion of the insulating cover layer 43 in Table 1, the suspension board in which no large gap was generated between the insulating cover layer 43 and the conductor pattern 61 is indicated by “◯”, and a large gap was generated. The suspended suspension board is indicated by “x”.

  In the reliability evaluation result of the conductor pattern 61 in Table 1, the suspension board where the conductor pattern 61 did not corrode is represented by “◯”, and the suspension board where the corrosion occurred is represented by “x”.

  The present invention can be effectively used for various printed circuit boards.

DESCRIPTION OF SYMBOLS 1 Suspension board 10 Support board 10a Support layer 10x, 10y, 11, 41x, 41y, 43x Opening part 12 Tongue part 15, 16, 17, 18, 19 Metal coating layer 21, 22, 23, 24, 25, 26, 31 , 32, 33, 34, 35, 36 Connection terminal 41 Base insulating layer 41A, 41B Insulating layer 41u, 41v Recess 43 Cover insulating layer 50 Support plate 51 Front end region 52 Rear end region 53 Central region 54 Piezoelectric element mounting region 54h Through hole 61, 61A, 61B Conductor pattern 61a Terminal portion 61b Wiring portion 61c Boundary 70 Barrier layer 71 Gold layer 91, 92 Piezoelectric element 100 Suspension body portion H Hole portion P1, P2 Power supply wiring pattern R1, R2 Reading wiring pattern W1, W2 Write wiring pattern

The third insulating layer is in contact with a portion of the upper metal coating layer that covers the upper wiring portion. The upper metallization layer, extends continuously from the surface of the upper terminal portion on the surface of the upper wiring portion, separated by more than 3μm on the surface of the upper wiring section from the position on the boundary between the upper terminal unit and the upper wiring portion It extends to the position. Thereby, it is possible to prevent corrosion from occurring at and near the boundary between the upper terminal portion and the upper wiring portion in the upper conductor pattern.

As shown in FIG. 22 (c) and FIG. 23 (c), the in the connection terminal 31 and its peripheral portion, the heavy Do that rectangle area in the terminal portion 61a of the insulating base layer 41, the recess 41v is formed Yes. A rectangular opening 10y is formed in a portion of the support substrate 10 that overlaps the terminal portion 61a.

A method for manufacturing the suspension board of FIG. 21 will be described. 24 to 28 are schematic process diagrams showing steps of manufacturing the suspension board of FIG. 21. 24 (a), FIG. 25 (a), FIG. 26 (a), FIG. 27 (a), and FIG. 28 (a) correspond to the B1-B1 line enlarged sectional view of FIG. b), FIG. 25 (b), FIG. 26 (b), FIG. 27 (b) and FIG. 28 (b) correspond to the B2-B2 line enlarged sectional view of FIG. 22 (b), and FIG. FIG. 25C, FIG. 26C, FIG. 27C, and FIG. 28C correspond to the B3-B3 line enlarged sectional view of FIG.

30A to 30C, the seed layer formed on the base insulating layer 41 as the base of the conductor pattern 61 is indicated by a thick solid line. In this case, as shown in FIG. 30 (b), (c) , in the connecting terminal 25,26,31～36, opening of the seed layer is a base insulating layer 41 formed on the lower surface of the conductive pattern 61 41x , 41y and the openings 10x, 10y of the support substrate 10 are exposed downward. Thereby, the terminal etc. of an electronic device can be connected to the said exposed part.

Moreover, in said structure, the metal coating layer 17 and the barrier layer 70 consist of the same nickel, and the metal coating layer 17 and the barrier layer 70 are comprised integrally. The barrier layer 70 functions as a part of the metal coating layer 17. The metal coating layer 17 and the barrier layer 70 continuously cover the boundary 61c of the conductor patterns 61A and 61B and the vicinity thereof. This prevents fluid such as air, water, or a chemical solution from entering the inside of the metal cover layer 17 and the barrier layer 70 from the outside of the insulating cover layer 43. Therefore, occurrence of corrosion at the boundary 61c between the conductor patterns 61A and 61B and in the vicinity thereof is prevented.

Moreover, in said structure, the metal coating layer 17 and the barrier layer 70 consist of the same nickel, and the metal coating layer 17 and the barrier layer 70 are comprised integrally. The barrier layer 70 functions as a part of the metal coating layer 17. The metal coating layer 17 and the barrier layer 70 continuously cover the boundary 61c of the conductor patterns 61A and 61B and the vicinity thereof. This prevents fluid such as air, water, or a chemical solution from entering the inside of the metal cover layer 17 and the barrier layer 70 from the outside of the insulating cover layer 43. Therefore, occurrence of corrosion at the boundary 61c between the conductor patterns 61A and 61B and in the vicinity thereof is prevented.

Claims (18)

A first insulating layer;
A conductor pattern formed on the first insulating layer and having a terminal portion and a wiring portion extending from the terminal portion;
A first metal coating layer that covers the wiring portion and the terminal portion and is provided so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion;
The second metal coating layer is provided on the first insulating layer so as to cover a portion of the first metal coating layer covering the wiring portion and not to cover a portion of the first metal coating layer covering the terminal portion. With an insulating layer,
The first metal coating layer is in contact with the wiring portion;
The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion,
The first metal coating layer is a printed circuit board having a magnetic property lower than that of nickel. A first insulating layer;
A conductor pattern formed on the first insulating layer and having a terminal portion and a wiring portion extending from the terminal portion;
A first metal coating layer that covers a part of the wiring portion and the terminal portion and is provided so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion;
The first metal coating layer covers a portion of the first metal coating layer that covers the part of the wiring portion and another portion of the wiring portion that is not covered by the first metal coating layer, and the first metal coating layer. And a second insulating layer provided on the first insulating layer so as not to cover a portion covering the terminal portion,
The first metal coating layer is in contact with the part of the wiring part and extends to a position 3 μm or more away from a position on the boundary between the terminal part and the wiring part on the surface of the wiring part,
The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion and in contact with the other portion of the wiring portion,
The first metal coating layer is a printed circuit board having a magnetic property lower than that of nickel. A first insulating layer;
A conductor pattern formed on the first insulating layer and having a terminal portion and a wiring portion extending from the terminal portion;
A first metal coating layer that covers a part of the wiring portion and the terminal portion and is provided so as to continuously extend from the surface of the terminal portion to the surface of the wiring portion;
The first metal coating layer covers a portion of the first metal coating layer that covers the part of the wiring portion and another portion of the wiring portion that is not covered by the first metal coating layer, and the first metal coating layer. And a second insulating layer provided on the first insulating layer so as not to cover a portion covering the terminal portion,
The first metal coating layer is in contact with the part of the wiring part and extends to a position 3 μm or more away from a position on the boundary between the terminal part and the wiring part on the surface of the wiring part,
The second insulating layer is in contact with a portion of the first metal coating layer that covers the wiring portion and in contact with the other portion of the wiring portion,
The ratio of the length of the said 1st metal coating layer which covers the said part of the said wiring part with respect to the full length of the said wiring part is 40% or less. 4. The printed circuit board according to claim 2, wherein the first metal coating layer extends to a position separated by 5 μm or more from a position on a boundary between the terminal portion and the wiring portion on a surface of the wiring portion. 3. The printed circuit board according to claim 1, wherein the first metal coating layer includes at least one metal selected from gold, silver, chromium, tin, and platinum. The printed circuit board according to claim 3, wherein the first metal coating layer contains at least one kind of metal among nickel, gold, silver, chromium, tin, and platinum. The printed circuit board according to any one of claims 1 to 6, further comprising a second metal coating layer that covers a portion of the first metal coating layer that covers the terminal portion. The printed circuit board according to any one of claims 1 to 7, wherein at least a part of the first metal coating layer is configured by first and second metal layers stacked on each other. A terminal barrier layer covering a portion of the first metal coating layer covering the terminal portion;
A terminal surface layer covering the terminal barrier layer,
The conductor pattern includes copper,
The terminal surface layer includes gold,
The printed circuit board according to claim 1, wherein the terminal barrier layer includes nickel or palladium. A terminal surface layer formed so as to cover a portion of the first metal coating layer covering the terminal portion and not to contact the conductor pattern;
The conductor pattern includes copper,
The terminal surface layer includes gold,
The printed circuit board according to claim 3, wherein the first metal coating layer contains nickel. An upper conductor pattern formed on the second insulating layer;
The printed circuit board according to claim 1, wherein at least a part of the upper conductor pattern overlaps the conductor pattern. An upper conductor pattern formed on the second insulating layer and having an upper terminal portion and an upper wiring portion extending from the upper terminal portion;
An upper metal coating layer that covers a part of the upper wiring portion and the upper terminal portion and is provided so as to continuously extend from the surface of the upper terminal portion to the surface of the upper wiring portion;
Covering the portion of the upper metal coating layer that covers the part of the upper wiring portion and the other portion of the upper wiring portion that is not covered by the upper metal coating layer and the upper portion of the upper metal coating layer A third insulating layer provided on the second insulating layer so as not to cover a portion covering the terminal portion;
At least a part of the upper conductor pattern overlaps the conductor pattern,
The upper metal coating layer is in contact with the part of the upper wiring portion and extends to a position 3 μm or more away from a position on the boundary between the upper terminal portion and the upper wiring portion on the surface of the upper wiring portion. ,
The third insulating layer is in contact with a portion of the upper metal coating layer that covers the upper wiring portion and in contact with the other portion of the upper wiring portion;
The printed circuit board according to claim 3, wherein a ratio of a length of the upper metal coating layer covering the part of the upper wiring portion to a total length of the upper wiring portion is 40% or less. An upper conductor pattern formed on the second insulating layer and having an upper terminal portion and an upper wiring portion extending from the upper terminal portion;
An upper metal covering layer provided to cover the upper wiring portion and the upper terminal portion and to continuously extend from the surface of the upper terminal portion to the surface of the upper wiring portion;
A third insulation provided on the second insulating layer so as to cover a portion of the upper metal coating layer covering the upper wiring portion and not to cover a portion of the upper metal coating layer covering the upper terminal portion. And further comprising a layer,
At least a part of the upper conductor pattern overlaps the conductor pattern,
The upper metal coating layer is in contact with the upper wiring portion;
The third insulating layer is in contact with a portion of the upper metal coating layer that covers the upper wiring portion,
The printed circuit board according to claim 1, wherein the upper metal coating layer has a magnetic property lower than that of nickel. An upper conductor pattern formed on the second insulating layer and having an upper terminal portion and an upper wiring portion extending from the upper terminal portion;
An upper metal coating layer that covers a part of the upper wiring portion and the upper terminal portion and is provided so as to continuously extend from the surface of the upper terminal portion to the surface of the upper wiring portion;
Covering the portion of the upper metal coating layer that covers the part of the upper wiring portion and the other portion of the upper wiring portion that is not covered by the upper metal coating layer and the upper portion of the upper metal coating layer A third insulating layer provided on the second insulating layer so as not to cover a portion covering the terminal portion;
At least a part of the upper conductor pattern overlaps the conductor pattern,
The upper metal coating layer is in contact with the part of the upper wiring portion and extends to a position 3 μm or more away from a position on the boundary between the upper terminal portion and the upper wiring portion on the surface of the upper wiring portion. ,
The third insulating layer is in contact with a portion of the upper metal coating layer that covers the upper wiring portion and in contact with the other portion of the upper wiring portion;
The printed circuit board according to claim 1, wherein the upper metal coating layer has a magnetic property lower than that of nickel. A lower insulating layer;
Further comprising a lower conductor pattern formed on the lower insulating layer,
The first insulating layer is formed on the lower insulating layer so as to cover at least a part of the lower conductor pattern,
The printed circuit board according to claim 1, wherein at least a part of the conductor pattern overlaps the lower conductor pattern. Forming a conductor pattern having a terminal portion and a wiring portion extending from the terminal portion on the first insulating layer;
Covering the wiring part and the terminal part and having a magnetism lower than that of nickel so as to continuously extend from the surface of the terminal part to the surface of the wiring part and to contact the wiring part Forming a metal coating layer using a metal;
Covering the portion of the metal coating layer covering the wiring portion and not covering the portion of the metal coating layer covering the terminal portion and contacting the portion of the metal coating layer covering the wiring portion. Forming a second insulating layer on the first insulating layer. A method for manufacturing a printed circuit board. Forming a conductor pattern having a terminal portion and a wiring portion extending from the terminal portion on the first insulating layer;
Covering a part of the wiring part and the terminal part and extending continuously from the surface of the terminal part to the surface of the wiring part and in contact with the part of the wiring part. Forming a metal coating layer using a metal having magnetism lower than magnetism;
A portion of the metal coating layer that covers the part of the wiring portion and a portion of the wiring portion that is not covered by the metal coating layer and a portion of the metal coating layer that covers the terminal portion. A second insulating layer is formed on the first insulating layer so as not to cover and in contact with the portion of the metal coating layer covering the wiring portion and in contact with the other portion of the wiring portion. Process,
In the step of forming the metal coating layer, the metal coating layer is formed so as to extend to a position 3 μm or more away from a position on the boundary between the terminal portion and the wiring portion on the surface of the wiring portion. A method for manufacturing a printed circuit board. Forming a conductor pattern having a terminal portion and a wiring portion extending from the terminal portion on the first insulating layer;
A metal coating layer that covers a part of the wiring part and the terminal part and extends continuously from the surface of the terminal part to the surface of the wiring part and contacts the part of the wiring part Forming a step;
A portion of the metal coating layer that covers the part of the wiring portion and a portion of the wiring portion that is not covered by the metal coating layer and a portion of the metal coating layer that covers the terminal portion. A second insulating layer is formed on the first insulating layer so as not to cover and to contact a portion of the metal coating layer covering the wiring portion and to contact the other portion of the wiring portion. Including the steps of:
In the step of forming the metal coating layer, the metal coating layer is formed so as to extend to a position 3 μm or more away from a position on the boundary between the terminal portion and the wiring portion on the surface of the wiring portion,
The method of manufacturing a printed circuit board, wherein a ratio of a length of the metal coating layer covering the part of the wiring portion to a total length of the wiring portion is set to 40% or less.

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