JP2017032797A - 積層レンズ構造体およびその製造方法、並びに電子機器 - Google Patents
積層レンズ構造体およびその製造方法、並びに電子機器 Download PDFInfo
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- JP2017032797A JP2017032797A JP2015152919A JP2015152919A JP2017032797A JP 2017032797 A JP2017032797 A JP 2017032797A JP 2015152919 A JP2015152919 A JP 2015152919A JP 2015152919 A JP2015152919 A JP 2015152919A JP 2017032797 A JP2017032797 A JP 2017032797A
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- lens
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- resin
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
- B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/32—Fiducial marks and measuring scales within the optical system
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
- G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Cameras In General (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015152919A JP2017032797A (ja) | 2015-07-31 | 2015-07-31 | 積層レンズ構造体およびその製造方法、並びに電子機器 |
| PCT/JP2016/003371 WO2017022192A1 (en) | 2015-07-31 | 2016-07-19 | Stacked lens structure, method of manufacturing the same, and electronic apparatus |
| EP16751020.5A EP3329315B1 (en) | 2015-07-31 | 2016-07-19 | Stacked lens structure, method of manufacturing the same, and electronic apparatus |
| CN201680040007.3A CN107850758A (zh) | 2015-07-31 | 2016-07-19 | 堆叠型透镜结构、堆叠型透镜结构制造方法和电子设备 |
| KR1020177036647A KR20180034329A (ko) | 2015-07-31 | 2016-07-19 | 적층 렌즈 구조체, 그 제조 방법 및 전자 기기 |
| US15/741,528 US10627549B2 (en) | 2015-07-31 | 2016-07-19 | Stacked lens structure, method of manufacturing the same, and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015152919A JP2017032797A (ja) | 2015-07-31 | 2015-07-31 | 積層レンズ構造体およびその製造方法、並びに電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2017032797A true JP2017032797A (ja) | 2017-02-09 |
Family
ID=56684207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015152919A Pending JP2017032797A (ja) | 2015-07-31 | 2015-07-31 | 積層レンズ構造体およびその製造方法、並びに電子機器 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10627549B2 (ko) |
| EP (1) | EP3329315B1 (ko) |
| JP (1) | JP2017032797A (ko) |
| KR (1) | KR20180034329A (ko) |
| CN (1) | CN107850758A (ko) |
| WO (1) | WO2017022192A1 (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018173794A1 (ja) * | 2017-03-23 | 2018-09-27 | ソニーセミコンダクタソリューションズ株式会社 | 積層レンズ構造体及びその製造方法、並びに、電子機器 |
| CN110383446A (zh) * | 2017-03-16 | 2019-10-25 | Ev 集团 E·索尔纳有限责任公司 | 用于接合至少三个衬底的方法 |
| WO2020008591A1 (ja) * | 2018-07-05 | 2020-01-09 | オリンパス株式会社 | 撮像装置、内視鏡、および、撮像装置の製造方法 |
| CN110383446B (zh) * | 2017-03-16 | 2024-07-16 | Ev集团E·索尔纳有限责任公司 | 用于接合至少三个衬底的方法 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6967830B2 (ja) * | 2015-07-31 | 2021-11-17 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、レンズモジュール及びその製造方法、並びに、電子機器 |
| CN106054289B (zh) * | 2016-05-27 | 2019-01-25 | 京东方科技集团股份有限公司 | 一种显示面板、显示装置 |
| JP6949515B2 (ja) | 2017-03-15 | 2021-10-13 | ソニーセミコンダクタソリューションズ株式会社 | カメラモジュール及びその製造方法、並びに、電子機器 |
| CN108132558B (zh) * | 2018-01-26 | 2020-08-25 | 福州京东方光电科技有限公司 | 对位检测方法及显示装置 |
| KR20200044252A (ko) * | 2018-10-18 | 2020-04-29 | 삼성디스플레이 주식회사 | 표시 패널 검사 시스템, 표시 패널 검사 방법 및 이를 이용한 표시 패널. |
| CN109816733B (zh) * | 2019-01-14 | 2023-08-18 | 京东方科技集团股份有限公司 | 相机参数初始化方法及装置、相机参数标定方法及设备、图像采集系统 |
| US11626441B2 (en) * | 2020-01-16 | 2023-04-11 | Advanced Semiconductor Engineering, Inc. | Optical module |
| CN115356792B (zh) * | 2022-06-27 | 2023-12-08 | 杭州海康微影传感科技有限公司 | 光学镜头晶圆的制作方法与镜头成像模组的制作方法 |
| EP4332642A1 (en) * | 2022-08-29 | 2024-03-06 | Schott Ag | Structured substrate, method for manufacturing the structured substrate, and use of the structured substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0577577A (ja) * | 1991-09-18 | 1993-03-30 | Hitachi Ltd | 印刷マスク |
| JP2005268690A (ja) * | 2004-03-22 | 2005-09-29 | Sumitomo Bakelite Co Ltd | 多層回路基板の製造方法 |
| JP2010204635A (ja) * | 2009-02-06 | 2010-09-16 | Fujifilm Corp | レンズアレイ |
| JP2012104753A (ja) * | 2010-11-12 | 2012-05-31 | Sony Corp | 固体撮像装置及び電子機器 |
| JP2014006329A (ja) * | 2012-06-22 | 2014-01-16 | Konica Minolta Inc | ウエハレンズの製造方法及び撮像レンズ |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| JP2020511784A (ja) * | 2017-03-16 | 2020-04-16 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 少なくとも３枚の基板を接合するための方法 |
| KR102396022B1 (ko) * | 2017-03-16 | 2022-05-09 | 에베 그룹 에. 탈너 게엠베하 | 적어도 세 개의 기판들을 결합하기 위한 방법 |
| JP7177781B2 (ja) | 2017-03-16 | 2022-11-24 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 少なくとも３枚の基板を接合するための方法 |
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| US11374045B2 (en) | 2017-03-23 | 2022-06-28 | Sony Semiconductor Solutions Corporation | Stacked lens structure with a lens portion having a black resin comprising a plurality of voids |
| WO2020008591A1 (ja) * | 2018-07-05 | 2020-01-09 | オリンパス株式会社 | 撮像装置、内視鏡、および、撮像装置の製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20180203164A1 (en) | 2018-07-19 |
| CN107850758A (zh) | 2018-03-27 |
| EP3329315B1 (en) | 2021-03-31 |
| US10627549B2 (en) | 2020-04-21 |
| KR20180034329A (ko) | 2018-04-04 |
| WO2017022192A1 (en) | 2017-02-09 |
| EP3329315A1 (en) | 2018-06-06 |
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