JP2017020000A5 - - Google Patents

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Publication number
JP2017020000A5
JP2017020000A5 JP2016111352A JP2016111352A JP2017020000A5 JP 2017020000 A5 JP2017020000 A5 JP 2017020000A5 JP 2016111352 A JP2016111352 A JP 2016111352A JP 2016111352 A JP2016111352 A JP 2016111352A JP 2017020000 A5 JP2017020000 A5 JP 2017020000A5
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JP
Japan
Prior art keywords
monomers
polymer
formula
dimers
polymerized units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016111352A
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English (en)
Japanese (ja)
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JP2017020000A (ja
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Publication date
Priority claimed from US14/739,402 external-priority patent/US9442377B1/en
Application filed filed Critical
Publication of JP2017020000A publication Critical patent/JP2017020000A/ja
Publication of JP2017020000A5 publication Critical patent/JP2017020000A5/ja
Pending legal-status Critical Current

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JP2016111352A 2015-06-15 2016-06-02 湿式剥離性シリコン含有反射防止剤 Pending JP2017020000A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/739,402 2015-06-15
US14/739,402 US9442377B1 (en) 2015-06-15 2015-06-15 Wet-strippable silicon-containing antireflectant

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018128294A Division JP6643411B2 (ja) 2015-06-15 2018-07-05 湿式剥離性シリコン含有反射防止剤

Publications (2)

Publication Number Publication Date
JP2017020000A JP2017020000A (ja) 2017-01-26
JP2017020000A5 true JP2017020000A5 (https=) 2017-10-19

Family

ID=56881349

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016111352A Pending JP2017020000A (ja) 2015-06-15 2016-06-02 湿式剥離性シリコン含有反射防止剤
JP2018128294A Expired - Fee Related JP6643411B2 (ja) 2015-06-15 2018-07-05 湿式剥離性シリコン含有反射防止剤

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018128294A Expired - Fee Related JP6643411B2 (ja) 2015-06-15 2018-07-05 湿式剥離性シリコン含有反射防止剤

Country Status (5)

Country Link
US (2) US9442377B1 (https=)
JP (2) JP2017020000A (https=)
KR (1) KR101849638B1 (https=)
CN (1) CN106243357B (https=)
TW (1) TWI600724B (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107077072B (zh) * 2014-11-19 2021-05-25 日产化学工业株式会社 能够湿式除去的含有硅的抗蚀剂下层膜形成用组合物
US10043162B1 (en) 2015-03-31 2018-08-07 Square, Inc. Open ticket payment handling with bill splitting
US10528945B1 (en) 2015-03-31 2020-01-07 Square, Inc. Open ticket payment handling with incremental authorization
US10658191B2 (en) * 2015-09-04 2020-05-19 Taiwan Semiconductor Manufacturing Company, Ltd. Conformal middle layer for a lithography process
US10410883B2 (en) * 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10311420B1 (en) 2016-06-17 2019-06-04 Square, Inc. Synchronizing open ticket functionality with kitchen display systems
US10580062B1 (en) * 2016-06-28 2020-03-03 Square, Inc. Integrating predefined templates with open ticket functionality
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10007184B2 (en) * 2016-09-01 2018-06-26 Rohm And Haas Electronic Materials Llc Silicon-containing underlayers
US11506979B2 (en) * 2016-12-14 2022-11-22 Rohm And Haas Electronic Materials Llc Method using silicon-containing underlayers
US20180164685A1 (en) * 2016-12-14 2018-06-14 Rohm And Haas Electronic Materials Llc Method using silicon-containing underlayers
KR102577038B1 (ko) * 2017-03-31 2023-09-12 닛산 가가쿠 가부시키가이샤 카르보닐구조를 갖는 실리콘함유 레지스트 하층막 형성 조성물
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
KR102674631B1 (ko) 2017-07-06 2024-06-12 닛산 가가쿠 가부시키가이샤 알칼리성 현상액 가용성 실리콘함유 레지스트 하층막 형성 조성물
US11360387B2 (en) * 2017-08-04 2022-06-14 Rohm And Haas Electronic Materials Llc Silicon-containing underlayers
US10761423B2 (en) 2017-08-30 2020-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical composition for tri-layer removal
US10943311B1 (en) 2017-09-29 2021-03-09 Square, Inc. Order fulfillment and tracking systems and methods
US20190146343A1 (en) 2017-11-10 2019-05-16 Rohm And Haas Electronic Materials Llc Silicon-containing underlayers
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11138680B1 (en) 2018-11-21 2021-10-05 Square, Inc. Updating menus based on predicted efficiencies
US10915905B1 (en) 2018-12-13 2021-02-09 Square, Inc. Batch-processing transactions in response to an event
US20220187709A1 (en) * 2019-03-28 2022-06-16 Nissan Chemical Corporation Film-forming composition
WO2021020091A1 (ja) * 2019-07-29 2021-02-04 Jsr株式会社 組成物、ケイ素含有膜、ケイ素含有膜の形成方法及び半導体基板の処理方法
JP7692902B2 (ja) * 2019-10-24 2025-06-16 ブルーワー サイエンス アイ エヌ シー． シリコン含有高水分除去可能平坦化層
CN115003759B (zh) * 2020-01-15 2023-12-01 株式会社钟化 树脂组合物、其制造方法、以及多组分型固化性树脂组合物
KR102924234B1 (ko) * 2020-03-31 2026-02-09 닛산 가가쿠 가부시키가이샤 막 형성용 조성물
US12585188B2 (en) 2020-04-30 2026-03-24 Nissan Chemical Corporation Composition for forming resist underlying film

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03100021A (ja) * 1989-09-14 1991-04-25 Nippon Telegr & Teleph Corp <Ntt> ポリシロキサン
JP4096138B2 (ja) 1999-04-12 2008-06-04 Ｊｓｒ株式会社 レジスト下層膜用組成物の製造方法
US6268457B1 (en) 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
US6890448B2 (en) 1999-06-11 2005-05-10 Shipley Company, L.L.C. Antireflective hard mask compositions
US6420088B1 (en) 2000-06-23 2002-07-16 International Business Machines Corporation Antireflective silicon-containing compositions as hardmask layer
US6730454B2 (en) 2002-04-16 2004-05-04 International Business Machines Corporation Antireflective SiO-containing compositions for hardmask layer
US6740469B2 (en) 2002-06-25 2004-05-25 Brewer Science Inc. Developer-soluble metal alkoxide coatings for microelectronic applications
JP3951124B2 (ja) 2002-12-06 2007-08-01 Ｊｓｒ株式会社 絶縁膜
ATE377036T1 (de) 2003-05-23 2007-11-15 Dow Corning Siloxan-harz basierte anti- reflektionsbeschichtung mit hoher nassätzgeschwindigkeit
US7270887B2 (en) 2004-10-13 2007-09-18 Shin-Etsu Chemical Co., Ltd. Antireflective coating, coating composition, and antireflective coated article
EP1762895B1 (en) 2005-08-29 2016-02-24 Rohm and Haas Electronic Materials, L.L.C. Antireflective Hard Mask Compositions
US7678529B2 (en) 2005-11-21 2010-03-16 Shin-Etsu Chemical Co., Ltd. Silicon-containing film forming composition, silicon-containing film serving as etching mask, substrate processing intermediate, and substrate processing method
KR101436336B1 (ko) 2005-12-06 2014-09-01 닛산 가가쿠 고교 가부시키 가이샤 광가교 경화의 레지스트 하층막을 형성하기 위한 규소 함유레지스트 하층막 형성 조성물
JP4421566B2 (ja) 2005-12-26 2010-02-24 チェイル インダストリーズ インコーポレイテッド フォトレジスト下層膜用ハードマスク組成物及びこれを利用した半導体集積回路デバイスの製造方法
EP2121808A1 (en) * 2007-02-27 2009-11-25 AZ Electronic Materials USA Corp. Silicon-based antifrelective coating compositions
JP5078475B2 (ja) * 2007-07-11 2012-11-21 旭化成イーマテリアルズ株式会社 ポリオルガノシロキサン
JP5369553B2 (ja) * 2007-09-07 2013-12-18 東レ株式会社 シロキサン樹脂組成物、硬化物およびこれを用いた光半導体
JP2009265595A (ja) * 2007-09-07 2009-11-12 Sekisui Chem Co Ltd 感光性組成物及びパターン膜の製造方法
CN101990551B (zh) * 2008-03-04 2012-10-03 陶氏康宁公司 倍半硅氧烷树脂
JP2010039051A (ja) * 2008-08-01 2010-02-18 Sekisui Chem Co Ltd 感光性組成物及びパターン膜の製造方法
JP2010039056A (ja) * 2008-08-01 2010-02-18 Sekisui Chem Co Ltd 感光性組成物及びパターン膜の製造方法
US7955782B2 (en) 2008-09-22 2011-06-07 Honeywell International Inc. Bottom antireflective coatings exhibiting enhanced wet strip rates, bottom antireflective coating compositions for forming bottom antireflective coatings, and methods for fabricating the same
JP5015892B2 (ja) * 2008-10-02 2012-08-29 信越化学工業株式会社 ケイ素含有膜形成用組成物、ケイ素含有膜形成基板及びパターン形成方法
EP2373722A4 (en) 2008-12-10 2013-01-23 Dow Corning SILSESQUIOXAN RESINS
JP5534230B2 (ja) 2008-12-19 2014-06-25 日産化学工業株式会社 アニオン基を有するシリコン含有レジスト下層膜形成組成物
CN102460301B (zh) 2009-06-02 2014-08-06 日产化学工业株式会社 含有带硫醚键的硅的抗蚀剂下层膜形成用组合物
JP5534250B2 (ja) 2009-09-16 2014-06-25 日産化学工業株式会社 スルホンアミド基を有するシリコン含有レジスト下層膜形成組成物
TWI432895B (zh) * 2010-12-01 2014-04-01 Chi Mei Corp 感光性聚矽氧烷組成物及其所形成之基材保護膜
JP5785121B2 (ja) 2011-04-28 2015-09-24 信越化学工業株式会社 パターン形成方法
TWI553409B (zh) 2011-08-31 2016-10-11 旭化成電子材料股份有限公司 Hardened
US9011591B2 (en) 2011-09-21 2015-04-21 Dow Global Technologies Llc Compositions and antireflective coatings for photolithography
TWI432898B (zh) * 2011-12-05 2014-04-01 Chi Mei Corp 彩色濾光片用藍色感光性樹脂組成物及其應用
JPWO2014080908A1 (ja) * 2012-11-26 2017-01-05 東レ株式会社 ネガ型感光性樹脂組成物
US9348228B2 (en) 2013-01-03 2016-05-24 Globalfoundries Inc. Acid-strippable silicon-containing antireflective coating
US9651865B2 (en) 2013-02-14 2017-05-16 Toray Industries, Inc. Negative-type photosensitive coloring composition, cured film, light-shielding pattern for touch panel, and touch panel manufacturing method
JP5830044B2 (ja) 2013-02-15 2015-12-09 信越化学工業株式会社 レジスト下層膜形成用組成物及びパターン形成方法
TWI490653B (zh) * 2013-09-10 2015-07-01 Chi Mei Corp 正型感光性樹脂組成物及其圖案形成方法
WO2016052268A1 (ja) * 2014-09-30 2016-04-07 東レ株式会社 感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び半導体装置の製造方法

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