JP2017010507A - タッチ表示パネル - Google Patents
タッチ表示パネル Download PDFInfo
- Publication number
- JP2017010507A JP2017010507A JP2015156347A JP2015156347A JP2017010507A JP 2017010507 A JP2017010507 A JP 2017010507A JP 2015156347 A JP2015156347 A JP 2015156347A JP 2015156347 A JP2015156347 A JP 2015156347A JP 2017010507 A JP2017010507 A JP 2017010507A
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- edge
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- display panel
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 73
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 60
- 229910052751 metal Inorganic materials 0.000 description 57
- 239000002184 metal Substances 0.000 description 57
- 238000013461 design Methods 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04106—Multi-sensing digitiser, i.e. digitiser using at least two different sensing technologies simultaneously or alternatively, e.g. for detecting pen and finger, for saving power or for improving position detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Position Input By Displaying (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
10:駆動電極ユニット
12:駆動電極部分
14:接続ライン
16:接続点
20:検出電極ユニット
30:タッチ検出ノード、タッチ画素
40:コモン電極、コモン電極層、第1電極層
52:第1金属線
54:第2金属線
54A:開路
60、62:表示画素
602:ゲート電極線
604:ソース電極線
606:ドレイン電極線
608:表示画素電極
610:半導体通路層
70:開路
72:第1導電線
74:第2導電線
C:接続箇所
C1:駆動電極容量
C2:検出電極容量
C3:相互容量
E1:第1エッジ
E2:第2エッジ
I1:ゲート電極誘電層
I2:ゲート電極カバー層
I3:層間絶縁層
I4:層間絶縁層
M1:第1金属層
M2:第2金属層
M3:第3金属層、第2電極層
P:電力経路
R:ライン抵抗
W:金属導線
W1:第1最大幅
W2:導線幅
W3:第2最大幅
W4:導線幅
T:薄膜トランジスタ
V:導電柱
Claims (10)
- 基板と、
前記基板上に設置される第1電極層と、
前記基板上に設置され、前記第1電極層に電気的に接続され、複数の感応電極を含み、各前記感応電極が互いに接続される複数の第1導電線及び複数の第2導電線を含み、これらの第1導電線が第1方向に平行し、これらの第2導電線が第2方向に平行し、かつ前記第1方向と前記第2方向が互いに異なるように構成した第2電極層と、
を備え、
近接する2つの前記感応電極の一方における最外側の前記第1導電線は、互いに接続される少なくとも1つの第1エッジ及び少なくとも1つの第2エッジを有し、前記第1エッジは他方の前記感応電極の前記第2導電線に対応し、かつ前記第1エッジは弧線であり、前記第2方向において前記第2エッジより突出しまたは陥凹することを特徴とするタッチ表示パネル。 - 前記第1エッジは前記第1方向において第1最大幅を有し、前記第1エッジに対応する前記第2導電線は、前記第1最大幅と異なる導線幅を有することを特徴とする請求項1に記載のタッチ表示パネル。
- 前記導線幅は前記第1最大幅より小さいことを特徴とする請求項2に記載のタッチ表示パネル。
- 前記第1エッジが前記第2エッジより突出/陥凹する範囲は前記第2方向において第2最大幅を有し、前記第1導電線は前記第2最大幅より大きい導線幅を有することを特徴とする請求項1に記載のタッチ表示パネル。
- 前記第1エッジは前記第1方向において第1最大幅を有し、前記第1エッジに対応する前記第2導電線は、前記第1最大幅と同じである導線幅を有し、前記第1エッジが前記第2エッジより突出/陥凹する範囲は、前記第2方向において第2最大幅を有し、前記第1導電線は前記第2最大幅より大きい導線幅を有することを特徴とする請求項1に記載のタッチ表示パネル。
- 近接する2つの前記感応電極の一方における最外側の前記第1導電線は、さらに互いに接続される複数の第1エッジ及び複数の第2エッジを有し、これらの第1エッジとこれらの第2エッジは互いに交差することを特徴とする請求項1に記載のタッチ表示パネル。
- これらの第1エッジは、他方の前記感応電極のこれらの第2導電線に対応することを特徴とする請求項6に記載のタッチ表示パネル。
- 近接する2つの前記感応電極の一方における最外側の前記第1導電線は、さらに複数の第1エッジ及び複数の第2エッジを有し、これらの第1エッジは互いに近接し、これらの第2エッジは、これらの第1エッジ間の接続箇所として前記第2方向においてこれらの第1エッジより突出し、これらの接続箇所とこれらの第1エッジは交差して互いに接続されることを特徴とする請求項1に記載のタッチ表示パネル。
- 前記第1エッジに対応する前記第2導電線は、
弧形エッジを有することを特徴とする請求項1に記載のタッチ表示パネル。 - 前記第1電極層の材料は透明導電材料であり、前記第2電極層の材料は金属材料であることを特徴とする請求項1に記載のタッチ表示パネル。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104120106 | 2015-06-23 | ||
TW104120106A TWI514232B (zh) | 2015-06-23 | 2015-06-23 | 觸控顯示面板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017010507A true JP2017010507A (ja) | 2017-01-12 |
JP6073995B2 JP6073995B2 (ja) | 2017-02-01 |
Family
ID=55407891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015156347A Active JP6073995B2 (ja) | 2015-06-23 | 2015-08-06 | タッチ表示パネル |
Country Status (4)
Country | Link |
---|---|
US (2) | US9977554B2 (ja) |
JP (1) | JP6073995B2 (ja) |
KR (1) | KR102531885B1 (ja) |
TW (1) | TWI514232B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022501669A (ja) * | 2018-09-29 | 2022-01-06 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co., Ltd. | 生体認証情報の検出方法、生体認証センサおよび表示装置 |
US11756330B2 (en) | 2018-09-29 | 2023-09-12 | Boe Technology Group Co., Ltd. | Biometric sensor, display apparatus, and method for detecting biometric information |
JP7391736B2 (ja) | 2020-03-18 | 2023-12-05 | 株式会社ジャパンディスプレイ | 表示装置及び半導体基板 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6787921B2 (ja) * | 2016-07-19 | 2020-11-18 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | タッチ基板、タッチ基板を製造するためのマスク板及びタッチ基板の製造方法 |
CN110291607B (zh) * | 2017-02-06 | 2021-12-07 | 夏普株式会社 | 显示装置 |
CN107357473B (zh) * | 2017-05-18 | 2021-09-03 | 华显光电技术(惠州)有限公司 | 电容屏触控调试方法 |
CN107390410A (zh) * | 2017-06-19 | 2017-11-24 | 武汉华星光电技术有限公司 | 内嵌式触摸屏 |
CN108469927B (zh) * | 2018-04-28 | 2021-02-09 | 上海天马微电子有限公司 | 触控显示面板及其驱动方法、触控显示装置 |
GB2587063A (en) | 2019-06-05 | 2021-03-17 | Touch Biometrix Ltd | Biometric skin contact sensing apparatus and method |
TWI721785B (zh) * | 2020-02-18 | 2021-03-11 | 凌巨科技股份有限公司 | 整合式觸控裝置 |
CN114201080A (zh) * | 2020-09-18 | 2022-03-18 | 群创光电股份有限公司 | 电子装置 |
JP2022135470A (ja) * | 2021-03-05 | 2022-09-15 | シャープディスプレイテクノロジー株式会社 | タッチパネル内蔵表示装置及びタッチパネル内蔵表示装置の制御方法 |
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-
2016
- 2016-06-16 US US15/183,933 patent/US9977554B2/en active Active
- 2016-06-21 KR KR1020160077387A patent/KR102531885B1/ko active IP Right Grant
-
2018
- 2018-04-23 US US15/959,476 patent/US10394404B2/en active Active
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JP3193545B2 (ja) * | 1993-10-08 | 2001-07-30 | 株式会社ユニコム | 異種素材からなる嵌合容器 |
US20140267086A1 (en) * | 2013-03-15 | 2014-09-18 | Apple Inc. | Dynamic cross-talk mitigation for integrated touch screens |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022501669A (ja) * | 2018-09-29 | 2022-01-06 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co., Ltd. | 生体認証情報の検出方法、生体認証センサおよび表示装置 |
US11756330B2 (en) | 2018-09-29 | 2023-09-12 | Boe Technology Group Co., Ltd. | Biometric sensor, display apparatus, and method for detecting biometric information |
JP7371020B2 (ja) | 2018-09-29 | 2023-10-30 | 京東方科技集團股▲ふん▼有限公司 | 生体認証情報の検出方法、生体認証センサおよび表示装置 |
JP7391736B2 (ja) | 2020-03-18 | 2023-12-05 | 株式会社ジャパンディスプレイ | 表示装置及び半導体基板 |
Also Published As
Publication number | Publication date |
---|---|
TWI514232B (zh) | 2015-12-21 |
US20180239467A1 (en) | 2018-08-23 |
US9977554B2 (en) | 2018-05-22 |
KR102531885B1 (ko) | 2023-05-11 |
US10394404B2 (en) | 2019-08-27 |
KR20170000347A (ko) | 2017-01-02 |
TW201701137A (zh) | 2017-01-01 |
JP6073995B2 (ja) | 2017-02-01 |
US20160378225A1 (en) | 2016-12-29 |
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