JP2017002401A - Silver-coated copper powder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a novel silver-coated copper powder which is composed of a silver-coated copper powder particle, in which a surface of a copper powder particle obtained by an electrolysis is coated by silver or a silver alloy, and the conductivity of which can effectively increased even with containing chlorine.SOLUTION: There is provided the silver-coated copper powder in which a surface of a dendrite-like copper powder is coated by silver or a silver alloy, concentration of chlorine is 5 to 250 wt.ppm, ratio of a total Cu concentration of Cu, CuO and CuO (ρCu) and silver concentration of (ρAg), (ρCu/ρAg) of a surface of the silver coated copper powder particle measured by an X-ray photoelectron spectroscopy analysis method is 0.12 or less, BET specific surface area is 0.30 to 2.00 m/g and volume accumulation D50 by a laser diffraction scattering type particle size distribution measurement device is 1.0 to 11.2 μm.SELECTED DRAWING: None

Description

  The present invention relates to a silver-coated copper powder that can be suitably used as a conductive material such as a conductive paste.

  The conductive paste is a fluid composition in which conductive powder is dispersed in a vehicle composed of a resin binder and a solvent, and the formation of an electric circuit, the formation of an external electrode of a ceramic capacitor, the formation of an electromagnetic shielding film, Widely used for forming bonding films.

  This type of conductive paste has a resin-cured type in which conductive powder is pressure-bonded by curing the resin to ensure conduction, and an organic component is volatilized by firing to sinter the conductive powder to ensure conduction. It is classified as a firing mold.

  The former resin-curable conductive paste is generally a paste-like composition containing conductive powder made of metal powder and an organic binder made of thermosetting resin such as epoxy resin, and applies heat. As a result, the thermosetting resin is cured and shrunk together with the conductive powder, and the conductive powder is pressed and brought into contact with each other through the resin, thereby ensuring conductivity. This resin-curable conductive paste can be processed in a relatively low temperature range from 100 ° C. to 200 ° C. and has little thermal damage, so it can be used for printed wiring boards, heat-sensitive resin substrates, electromagnetic shielding films, bonding films, etc. Mainly used.

On the other hand, the latter fired conductive paste is a paste-like composition in which conductive powder (metal powder) and glass frit are generally dispersed in an organic vehicle. By firing at 500 to 900 ° C., Conductivity is ensured by volatilization of the organic vehicle and sintering of the conductive powder. At this time, the glass frit has a function of adhering the conductive film to the substrate, and the organic vehicle functions as an organic liquid medium for enabling printing of the metal powder and the glass frit.
Firing-type conductive paste cannot be used for printed wiring boards or resin materials because of its high firing temperature, but it can be reduced in resistance because it is sintered and the metal is integrated. It is used for external electrodes.

  Since silver is excellent in conductivity, it is used as a main constituent material of various conductive materials such as anisotropic conductive films, conductive pastes, and conductive adhesives. For example, a silver paste can be mixed with a binder and a solvent to form a conductive paste, and a circuit pattern can be printed on the substrate using this conductive paste and baked to form a printed wiring board or an electric circuit of an electronic component. it can.

However, since silver is very expensive, conductive powder called silver-coated powder obtained by plating a noble metal film on the surface of core material particles has been developed and used. For example, Patent Document 1 discloses a silver compound-coated copper powder obtained by coating the surface of silver-coated copper particles as a core material with a silver compound of silver oxide, silver carbonate, and organic acid silver, and SSA (M ³ / g) is 0.1 to 10.0, D50 (μm) is 0.5 to 10.0, and a silver compound is adhered to the particle surface at a rate of 1 wt% to 40 wt%. Silver compound-coated copper powder is disclosed.

  As a method for coating the surface of the copper powder particles with silver, there can be mentioned two types, ie, a reduction plating coating method and a displacement plating coating.

  The reduction plating coating method is a method in which fine particles of silver reduced with a reducing agent are densely coated on the surface of copper powder particles. For example, Patent Document 2 discloses metallic copper in an aqueous solution in which a reducing agent is dissolved. A method for producing a silver-coated copper powder in which powder and silver nitrate are reacted is proposed.

  On the other hand, in the displacement plating coating method, silver ions exchange electrons with metallic copper at the interface of copper powder particles, silver ions are reduced to metallic silver, and instead metallic copper is oxidized into copper ions. That is, a method in which the surface layer of the copper powder particles is a silver layer. For example, in Patent Document 3, silver is exchanged between silver ions and metallic copper in an organic solvent-containing solution in which silver ions are present. A method for producing silver-coated copper powder for coating the surface of copper particles is described.

Regarding the silver-coated copper powder, in Patent Document 4, it is a dendritic conductive powder having a silver layer on the surface of the copper powder particles, and the silver content is 3.0 to the entire dendritic conductive powder. A dendritic conductive powder characterized by 30.0% by mass has been proposed.
Moreover, in patent document 5, it is silver covering copper powder which consists of silver covering copper powder particle which exhibits the dendritic shape by which the copper powder particle surface is coat | covered with silver, Comprising: Ratio measured by the laser diffraction scattering type particle size distribution measuring apparatus The ratio (BET specific surface area / spherical approximate specific surface area) of the specific surface area (referred to as “BET specific surface area”) measured by the BET single point method to the surface area (referred to as “spherical approximate specific surface area”) is 6.0 to 15.0. A silver-coated copper powder characterized by the above has been proposed.
Furthermore, in Patent Document 6, a silver-coated copper powder composed of silver-coated copper powder particles whose surface is coated with silver, and the silver-coated copper powder particles were observed using a scanning electron microscope (SEM). At this time, it is provided with one main shaft, a plurality of branches obliquely branch from the main shaft, exhibiting a dendritic shape grown two-dimensionally or three-dimensionally, and the thickness a of the main shaft is 0.3 μm. Silver having a dendrite-like shape and silver-coated copper powder particles having a length b of 0.6 μm to 10.0 μm, the longest branch length b of the branches extending from the main axis is about 5.0 μm Coated copper powder has been proposed.

JP 2008-106368 A JP 2000-248303 A JP 2006-161081 A JP 2012-153967 A JP 2013-89576 A JP 2013-100592 A Japanese Patent Laid-Open No. 1-224784

By the way, as a method for producing a silver-coated copper powder core material, that is, copper powder particles, a method of electrolyzing by adding chlorine to an electrolytic solution has been conventionally known (patent). Reference 7). However, due to the effect of residual chlorine, when adding chlorine to the electrolyte and electrolyzing it, it is difficult to uniformly coat the silver when the copper powder particles are coated with silver. The problem that it was not possible to improve the sex was found. In particular, when the coating amount of silver is small, it is particularly difficult to uniformly coat silver, and it has been found that the conductivity cannot be effectively increased even if silver is coated.
Therefore, the present invention relates to a silver-coated copper powder composed of silver-coated copper powder particles having a structure in which the surface of the copper powder particles obtained by the electrolytic method is coated with silver or a silver alloy. It is intended to provide a new silver-coated copper powder that can enhance the properties.

The present invention is a silver-coated copper powder containing silver-coated copper powder particles having a structure in which the surface of the copper powder particles obtained by the electrolytic method is coated with silver or a silver alloy, and the concentration of chlorine is 5 wtppm to Ratio of total Cu concentration (ρCu) and silver concentration (ρAg) of Cu, CuO and Cu ₂ O on the surface of the silver-coated copper powder particles, which is 250 wtppm and measured by X-ray photoelectron spectroscopy A silver-coated copper powder characterized in that (ρCu / ρAg) is 0.12 or less is proposed.

The silver-coated copper powder proposed by the present invention is a silver-coated copper powder containing silver-coated copper powder particles having a structure in which the surface of the copper powder particles obtained by the electrolytic method is coated with silver or a silver alloy. By lowering the ratio of copper (total amount of Cu, CuO and Cu ₂ O) on the surface of the coated copper powder particles and uniformly coating silver, the conductivity can be effectively increased even if chlorine is contained. Became. Therefore, the silver-coated copper powder proposed by the present invention can be used particularly effectively as a material such as a conductive paste.

It is a model figure of the particle shape of the silver covering copper powder particle which comprises the silver covering copper powder of this invention.

  Hereinafter, embodiments of the present invention will be described in detail. However, the scope of the present invention is not limited to the following embodiments.

<Silver-coated copper powder>
Silver-coated copper powder according to the present embodiment (referred to as “main silver-coated copper powder”) is a silver-coated copper powder particle having a structure in which the surface of a copper powder particle as a core material is coated with silver or a silver alloy ( (Referred to as “silver-coated copper powder particles”).

(Core particles)
The copper powder particles as the core material may be copper powder particles obtained by an electrolytic method. For example, spherical copper powder particles are also included. Among these, from the viewpoint that a dendrite shape is preferable as the shape of the silver-coated copper powder particles, the core material particles are preferably copper powder particles exhibiting a dendrite shape.

(Shape of this silver-coated copper powder particle)
The shape of the silver-coated copper powder particles is not particularly limited. For example, various shapes such as a spherical shape, a substantially spherical shape, an elliptical granular shape, a substantially elliptical spherical shape, a prismatic shape, a bowl shape, a plate shape, a flake shape, a needle shape, and a dendrite shape may be used. Among these, if the silver-coated copper powder particles have a dendritic shape, the number of contacts between the particles is large, and excellent conductivity can be obtained. For example, if the conductive powder particles contained in the conductive paste have a dendritic shape, the number of contact points between the particles is larger than that of the spherical particles, so that even if the amount of the conductive powder is reduced, the conductive powder particles are conductive. The characteristics can be enhanced. Therefore, it is preferable that the silver-coated copper powder particles have a dendrite shape.

Here, as shown in the model diagram of FIG. 1, the “dendritic shape” includes a single main axis when observed with an electron microscope (500 to 20,000 times), and a plurality of the main axes from the main axis. This means that the branches are vertically or obliquely branched to form a shape grown two-dimensionally or three-dimensionally. In this case, the main axis refers to a rod-like portion that is a group from which a plurality of branches are branched.
Among these, when the present silver-coated copper powder particles are observed with an electron microscope (500 to 20,000 times), it is particularly preferable to exhibit a dendrite shape having the following predetermined characteristics.

The thickness “a” of the main shaft is preferably 0.3 μm to 5.0 μm, more preferably 0.4 μm or more and 4.5 μm or less, and particularly preferably 0.5 μm or more or 4.0 μm or less.
If the thickness a of the main axis in the dendrite is 0.3 μm or more, the main axis is firm and the branches are likely to grow. On the other hand, if the thickness is 5.0 μm or less, the particles are not likely to aggregate. Can be prevented.

The longest branch length b (referred to as “branch length b”) among the branches extending from the main axis indicates the degree of dendrite growth, and is preferably 0.7 μm to 12.0 μm. 0.0 μm or more or 10.0 μm or less, more preferably 1.2 μm or more or 8.0 μm or less.
If the branch length b is 0.7 μm or more, the dendrite is sufficiently grown, and it is possible to enjoy the effect that the conductivity can be increased with a small amount. On the other hand, if the branch length b is 12.0 μm or less, the present Since the fluidity | liquidity of silver covering copper powder falls and handling does not become difficult, it is preferable.

The number of branches relative to the major axis L of the main axis (number of branches / major axis L) indicates the number of dendrite branches, and is preferably 0.5 / μm to 4.0 / μm. .6 / μm or more or 3.5 / μm or less, more preferably 0.8 / μm or more or 3.0 / μm or less. If the number of branches / major axis L is 0.5 / μm or more, the number of branches is sufficiently large and sufficient contact can be secured, while if the number of branches / major axis L is 4.0 / μm or less, It can prevent that the fluidity | liquidity of this silver covering copper powder becomes inferior because there are too many branches.
Note that the number of branch branches is the number that can be confirmed by a photograph, and the number of hidden branch branches is an ignored number.

  However, when the present silver-coated copper powder is observed with an electron microscope (500 to 20,000 times), if many are occupied by dendritic particles as described above, particles of other shapes are mixed, The same effect as when the present silver-coated copper powder consists only of dendritic particles as described above can be obtained. Therefore, from this viewpoint, when the present silver-coated copper powder is observed with an electron microscope (500 to 20,000 times), the present silver-coated copper powder particles as described above are preferably 80% by number or more of the total copper powder particles, preferably As long as it occupies 90% by number or more, it may contain non-dendritic silver-coated copper powder particles that are not recognized as dendritic.

Incidentally, among the copper powder particles constituting the present copper powder, the average value of the main axis thickness a in the particles recognized as dendritic particles is preferably 0.5 μm to 4.0 μm, and more preferably 1.0 μm or more. Alternatively, it is preferably 3.0 μm or less, more preferably 1.2 μm or more or 2.0 μm or less.
Moreover, it is preferable that the average of the branch length b in the particle | grains recognized as dendrite-like particle | grains among the copper powder particle | grains which comprise this copper powder is 0.7 micrometer-8.0 micrometers, Especially 3.0 micrometers or more or 6.0 micrometers. In particular, the thickness is particularly preferably 2.0 μm or more and 4.0 μm or less.
The average number of branches / major axis major axis L is preferably 1.0 to 4.0 / μm, and more preferably 1.5 / μm or more or 3.0 / μm or less. More preferably, it is 7 pieces / μm or more or 2.5 pieces / μm or less.
At this time, as a method for obtaining the average value, it is necessary to arbitrarily measure 50 or more dendrite-like particles among the copper powder particles constituting the copper powder and obtain the average value.

  In order to develop the dendrite shape of the present silver-coated copper powder particles as described above, in other words, to grow a dendrite branch long, as described later, the core material of the present silver-coated copper powder particles, that is, In the production of copper powder, it is preferable to perform electrolysis by adding chlorine to the electrolyte under predetermined electrolysis conditions using an electrolysis apparatus described later.

(Contained chlorine concentration)
The chlorine concentration of the present silver-coated copper powder, that is, the contained chlorine concentration is preferably 5 wtppm to 250 wtppm. More preferably, it is 50 wtppm or more.
If the concentration of chlorine contained in the present silver-coated copper powder is 250 wtppm or less, adverse effects due to residual chlorine can be effectively suppressed. For example, when silver is coated on copper powder particles, it can be uniformly coated to a uniform thickness. The chlorine concentration contained in the present silver-coated copper powder is about 5 wtppm, which is the detection limit.

In order to adjust the chlorine concentration of the present silver-coated copper powder to 5 wtppm to 250 wtppm, when producing copper powder as a core material by an electrolytic method, while adding chlorine to the electrolytic solution, copper immediately after being obtained by electrolysis It is preferable to perform an alkali treatment in which the powder is brought into contact with an alkaline solution having a pH of 8 or higher.
When producing copper powder containing dendritic copper powder particles, it is preferable to perform electrolysis using an electrolytic solution to which chlorine is added. In that case, chlorine remains in the particles simply by washing with pure water. Therefore, the adverse effect of residual chlorine cannot be effectively suppressed. Therefore, by performing alkali treatment as described above, the chlorine concentration in the copper powder as a core material and further the silver-coated copper powder is reduced to 5 wtppm by removing even the chlorine inside the particles, at least the adverse effect of the vicinity of the surface. By setting it to -250 wtppm, the bad influence by a residual chlorine can be suppressed effectively, for example, when silver is coat | covered to a copper powder particle, it can be made to coat | cover to uniform thickness.
By the way, as a result of washing with pure water instead of alkali treatment with an alkaline solution having a pH of 8 or more, the concentration of chlorine contained in the core copper powder and the silver-coated copper powder cannot be 5 wtppm to 250 wtppm. It has been confirmed.

(Oxygen concentration)
The oxygen concentration of the present silver-coated copper powder is preferably 0.20% by mass or less.
If the oxygen concentration of the present silver-coated copper powder is 0.20% by mass or less, the conductivity can be further improved. From this viewpoint, the oxygen concentration of the present silver-coated copper powder is more preferably 0.18% by mass or less, and particularly preferably 0.15% by mass or less.
In order to set the oxygen concentration of the present silver-coated copper powder to 0.20% by mass or less, when producing copper powder as a core material, the oxygen concentration and drying temperature in a dry atmosphere are controlled, or after electrolysis The method of carrying out alkali treatment of copper powder can be mentioned. However, it is not limited to this method.

(Copper ratio on particle surface)
The present silver-coated copper powder is a ratio of the total Cu concentration (ρCu) and silver concentration (ρAg) of Cu, CuO and Cu ₂ O on the surface of the silver-coated copper powder particles measured by X-ray photoelectron spectroscopy. It is important that (ρCu / ρAg) is 0.12 or less.
If the ratio (ρCu / ρAg) of the total Cu concentration (ρCu) and silver concentration (ρAg) of Cu, CuO and Cu ₂ O on the surface of the silver-coated copper powder particles is 0.12 or less, chlorine is included. Also, the conductivity can be effectively increased.
From this viewpoint, the ratio (ρCu / ρAg) of the total Cu concentration (ρCu) and the silver concentration (ρAg) of Cu, CuO and Cu ₂ O on the surface of the silver-coated copper powder particles is 0.12 or less. Is important, and among them, it is preferably 0.10 or less, more preferably 0.08 or less, and particularly preferably 0.06 or less. In consideration of analysis accuracy and the like, the lower limit value of ρCu / ρAg is estimated to be about 0.01.

  In the present silver-coated copper powder, in order to reduce the copper ratio on the particle surface in this way, in other words, in order to uniformly coat silver on the copper powder particles as the core material, as described above, the core material When the copper powder to be obtained is produced by an electrolytic method, it is preferable to perform an alkali treatment in which chlorine is added to the electrolytic solution, and the copper powder immediately after electrolysis is brought into contact with an alkaline solution having a pH of 8 or more.

(Amount of silver)
In the present silver-coated copper powder, the silver content is preferably 0.5 to 35.0 mass% with respect to the entire present silver-coated copper powder. If the silver content occupies 0.5% by mass or more of the total silver-coated copper powder, the particles on the surface of the silver-coated copper powder will be in contact with each other when the particles composing the silver-coated copper powder overlap. Can be increased. On the other hand, when it exceeds 35.0 mass%, it will be uneconomical because it coats silver more than necessary. In other words, if it is 35.0% by mass or less, although it depends on the production method, it is preferable because it is economically superior to silver particles. From such a viewpoint, the silver content is preferably 0.5 to 35.0 mass% of the total silver-coated copper powder, and more preferably 3.0 mass% or more or 25.0 mass% or less. Of these, 5.0% by mass or more or 20.0% by mass or less is more preferable.

(D50)
The central particle size (D50) of the present silver-coated copper powder, that is, the volume cumulative particle size D50 measured by a laser diffraction / scattering particle size distribution analyzer is preferably 1.0 μm to 30.0 μm. If the particles are large as the conductive particles, the conductive particle network in the paste is reduced, which may reduce the conductive performance. On the other hand, if the particle diameter is too small, it is necessary to increase the silver content in order to eliminate unevenness in the silver coating, which is economically wasteful.
Therefore, the center particle diameter (D50) of the present silver-coated copper powder is preferably 1.0 μm to 30.0 μm, more preferably 2.0 μm or more or 25.0 μm or less, and particularly preferably 3.0 μm or more or 20.0 μm. More preferably, it is as follows.

(BET specific surface area)
The BET specific surface area (SSA) of the silver-coated copper powder is preferably, for example, 0.30 to 2.00 m ² / g. If it is remarkably smaller than 0.30 m ² / g, the branches are not developed, and it becomes close to a pinecone or a sphere, so that the dendrite shape defined by the present invention cannot be exhibited. On the other hand, if it is significantly larger than 2.00 m ² / g, the dendrite branch becomes too thin and it becomes difficult to disperse without breaking the dendrite branch when it is made into a paste. It is not preferable because a problem may occur and the target conductivity may not be ensured.
Therefore, the specific surface area as measured by single point method BET of the silver-coated copper powder 0.30~2.00m ² / g at and even good properly, inter alia 0.40 m ² / g or more or 1.80 m ² / g In particular, among these, it is more preferable to be 1.50 m ² / g or less.

(Tap bulk density: TD)
The tap bulk density of the present silver-coated copper powder is preferably 0.5 to 2.0 g / cm ³ . The tap bulk density of the present silver-coated copper powder depends on the degree of development of the dendrite shape. Since the silver-coated copper powder particles have a dendrite shape, the tap bulk density is low and can be 2.0 g / cm ³ or less. On the other hand, if the tap bulk density is 0.5 g / cm ³ or more, not only the handling at the time of preparing the paste becomes easy, but also higher conductivity can be obtained.
From this point of view, the tap bulk density of the silver-coated copper powder is preferably from 0.5 to 2.0 g / cm ^3, among them 0.7 g / cm ³ or more, or 1.8 g / cm ³ or less, among the More preferably, it is 0.9 g / cm ³ or more or 1.6 g / cm ³ or less.

<Manufacturing method>
The present silver-coated copper powder is prepared by dispersing desired copper powder as a core material in water, adding a chelating agent as necessary, and then adding a water-soluble silver salt to cause a substitution reaction. The surface layer can be replaced with silver, and the obtained silver-coated copper powder can be taken out of the solution, washed with a chelating agent as necessary, and then dried. However, it is not limited to this manufacturing method.
In addition, if the surface of the copper powder particles as the core material is coated with silver or a silver alloy by such a method, the shape of the copper powder particles used as the core material is almost directly converted to the particle shape of the silver-coated copper powder. be able to.

(Manufacturing method of copper powder used as core material)
As described above, as the copper powder used as the core material, it is preferable to use a copper powder obtained by an electrolysis method, and in particular, an electrolytic copper powder exhibiting a dendritic shape with sufficiently developed branches.

  The electrolytic copper powder having a dendritic shape with sufficiently developed branches as described above can be produced by the following electrolytic method.

As an electrolysis method, for example, an anode and a cathode are immersed in a sulfuric acid electrolytic solution containing copper ions, and a direct current is passed through the electrolyte to conduct electrolysis. An example is a method of producing electrolytic copper powder by scraping and collecting by an electric method, washing, drying, and passing through a sieving step as necessary.
In electrolysis, it is preferable to add chlorine to the electrolytic solution to adjust the chlorine concentration of the electrolytic solution to 3 to 300 mg / L, particularly 5 to 200 mg / L.

Also, when copper powder is produced by the electrolytic method, the copper ions in the electrolytic solution are consumed as copper is deposited, so the copper ion concentration in the electrolytic solution near the electrode plate is reduced, and the electrolytic efficiency is reduced as it is. Resulting in. Therefore, normally, in order to increase the electrolytic efficiency, the electrolytic solution in the electrolytic cell is circulated so that the copper ion concentration of the electrolytic solution between the electrodes does not become thin.
However, it has been found that in order to develop the dendrite of each copper powder particle, in other words, to promote the growth of branches extending from the main axis, it is preferable that the copper ion concentration in the electrolyte solution near the electrode is low. Accordingly, in the production of copper powder, it is preferable to adjust the size of the electrolytic cell, the number of electrodes, the distance between the electrodes, and the circulation amount of the electrolytic solution, and to adjust the copper ion concentration of the electrolytic solution in the vicinity of the electrode to be low. At this time, it is preferable to adjust so that the copper ion concentration of the electrolytic solution between the electrodes is always thinner than the copper ion concentration of the electrolytic solution at the bottom of the electrolytic cell.

In order to adjust the particle size of the dendritic copper powder particles, conditions may be set as appropriate based on common general technical knowledge within the range of the above conditions. For example, if it is intended to obtain dendritic copper powder particles having a large particle size, the copper concentration is preferably set to a relatively high concentration within the above preferred range, and the current density is relatively low within the above preferred range. The density is preferably set, and the electrolysis time is preferably set to a relatively long time within the above preferable range. If it is intended to obtain dendritic copper powder particles having a small particle size, it is preferable to set the respective conditions based on the opposite concept. As an example, the copper concentration may be 1 g / L to 30 g / L, the current density may be 100 A / m ^{2 to} 4000 A / m ² , and the electrolysis time may be 3 minutes to 8 hours.

After electrolyzing in this manner, the electrolytically deposited copper powder is washed with water as necessary, and then mixed with water to form a slurry, or a copper powder cake, and then an alkaline solution having a pH of 8 or more is added. It is preferable to reduce the concentration of chlorine contained in the copper powder by mixing, stirring as necessary, performing an alkali treatment for bringing the copper powder into contact with the alkaline solution, and washing with water or the like.
In the alkali treatment, the pH of the slurry or copper powder cake after electrolytic copper powder deposition is preferably adjusted to 8 or more, particularly 9 or more, or 12 or less, and more preferably 10 or more or 11 or less.
Examples of the alkali agent used for such alkali treatment include ammonium carbonate solution, caustic soda solution, sodium bicarbonate, potassium hydroxide, and aqueous ammonia.

Moreover, the surface of the electrolytic copper powder particles may be subjected to an oxidation resistance treatment using an organic material as necessary to form an organic material layer on the surface of the copper powder particles. It is not always necessary to form the organic layer, but it is more preferable that the organic layer is formed in consideration of the change over time due to oxidation of the copper powder particle surface.
The organic substance used for this oxidation resistance treatment is not particularly limited, and examples thereof include glue, gelatin, organic fatty acid, and a coupling agent.
The oxidation-resistant treatment method, that is, the organic layer forming method may be a dry method or a wet method. In the case of a dry method, a method of mixing an organic substance and copper powder particles with a V-type mixer or the like, and in the case of a wet method, a method of adding an organic substance to a water-copper powder particle slurry and adsorbing it on the surface can be exemplified. However, it is not limited to these.
For example, after carrying out alkali treatment after electrolytic copper powder precipitation, the method of mixing the copper powder cake and the aqueous solution containing the desired organic substance, and the organic solvent, and making an organic substance adhere to the copper powder surface is a preferable example.

  In addition, it is good to perform the process which removes a surface oxide (oxide film) before a substitution reaction as needed for a core material. For example, after the core material is put into water and stirred and mixed, a reducing agent such as hydrazine is added and stirred and mixed to react. At this time, it is preferable that the added reducing agent is sufficiently washed and removed from the core material.

(Silver coating)
Next, a method for coating the surface of the copper powder particles produced as described above with silver or a silver alloy will be described. As an example, a displacement plating coating method will be described. However, the method of coating the surface of the copper powder particles with silver or a silver alloy is not limited to this method.

Compared to the reduction plating coating method, the displacement plating coating method can more uniformly coat the surface of the core material (copper powder particles) with silver or a silver alloy, and can also suppress aggregation of particles after coating. Furthermore, it has a feature that it can be manufactured at a lower cost. Therefore, it is preferable to employ a displacement plating coating method.
In addition, when the hydrophobic organic substance layer is formed in the copper powder particle surface as mentioned above, when coat | covering silver, it is necessary to degrease and to make the surface of a copper powder particle hydrophilic. When this degreasing treatment is performed, mechanical stirring as usual may cause breakage of the copper powder particle shape, especially the dendrite copper powder particle branch, so stirring with strength sufficient to maintain the copper powder particle shape. Alternatively, the degreasing treatment is preferably performed in a non-stirred state such as soaking. On the other hand, when the copper powder particles are surface treated with a hydrophilic surface treatment agent such as gelatin to make them hydrophilic, it is not necessary to degrease, so from the viewpoint of maintaining the shape of the copper powder particles, Is preferable.

In the conventional displacement plating coating method, when silver-coated copper powder is taken out from the reaction solution, it is filtered and washed with water or the like, but only by washing with water, some of the copper ions are adsorbed on the silver-coated copper powder. Therefore, copper ions remain on the particle surface, and when dried in this state, the copper ions form copper oxide and a copper oxide film is formed on the particle surface.
In contrast, by washing with a chelating agent, copper re-adsorption after the substitution reaction can be prevented, so that copper ions remaining on the particle surface can be suppressed. Conductivity can be improved by suppressing the formation of a copper film.
However, since washing with a chelating agent may leave the chelating agent, washing with pure water or the like is preferable.

  Examples of the chelating agent include ethylenediaminetetraacetic acid salt (hereinafter referred to as “EDTA”), aminocarboxylic acid-based chelating agents such as diethylenetriaminepentaacetic acid and iminodiacetic acid, hydroxyethylethylenediaminetriacetic acid, dihydroxyethylethylenediaminediacetic acid), 1 , 3-propanediaminetetraacetic acid, one or two or more selected from propanediaminetetraacetic acid can be mentioned, and among these, EDTA is preferably used.

When adding a silver salt, it is preferable to adjust the pH of the solution, that is, the pH of the solution at the time of the substitution reaction to 3 to 4.
Silver salts soluble in water, that is, Ag ion sources include silver nitrate, silver perchlorate, silver acetate, silver oxalate, silver chlorate, silver hexafluorophosphate, and boron tetrafluoride. One or more selected from acid silver, silver hexafluoroarsenate, and silver sulfate can be mentioned.
The addition amount of the silver salt is preferably equal to or greater than the theoretical equivalent, for example, when copper is used as the core material, the silver salt is added in an amount of 2 mol or more, particularly 2.1 mol or more, per 1 mol of copper. When the amount is less than 2 mol, the substitution is insufficient and a large amount of copper remains in the silver powder particles. However, it is not economical to add 2.5 mol or more.

The silver content in the present silver-coated copper powder can be adjusted by the amount of silver salt added, the reaction time, the reaction rate, the amount of chelating agent added, and the like.
After completion of the substitution reaction, the silver powder particles are preferably thoroughly washed and dried.

(Use)
Since the silver-coated copper powder has excellent conductive properties, the silver-coated copper powder can be used for various conductive materials such as conductive resin compositions such as conductive pastes and conductive adhesives, and conductive paints. It can be suitably used as a main constituent material.

For example, in order to produce a conductive paste, the present silver-coated copper powder can be mixed with a binder and a solvent, and further, if necessary, a curing agent, a coupling agent, a corrosion inhibitor, etc. to produce a conductive paste.
In this case, examples of the binder include liquid epoxy resins, phenol resins, unsaturated polyester resins, and the like, but are not limited thereto.
Examples of the solvent include terpineol, ethyl carbitol, carbitol acetate, butyl cellosolve and the like.
Examples of the curing agent include 2-ethyl 4-methylimidazole.
Examples of the corrosion inhibitor include benzothiazole and benzimidazole.

  The conductive paste can be used to form a circuit pattern on a substrate to form various electric circuits. For example, it is possible to form a printed wiring board, an electric circuit of various electronic components, external electrodes, and the like by applying or printing on a fired substrate or an unfired substrate, heating, pressurizing and baking as necessary. Moreover, it can utilize also for formation of an electromagnetic wave shield film, a bonding film, etc.

<Explanation of words>
In the present specification, when expressed as “X to Y” (X and Y are arbitrary numbers), “X is preferably greater than X” or “preferably more than Y” with the meaning of “X to Y” unless otherwise specified. The meaning of “small” is also included.
In addition, when expressed as “X or more” (X is an arbitrary number), it means “preferably larger than X” unless otherwise specified, and expressed as “Y or less” (Y is an arbitrary number). In the case, unless otherwise specified, the meaning of “preferably smaller than Y” is included.

  Examples of the present invention will be described below. However, the present invention is not limited to the following examples.

<Observation of particle shape>
With respect to the silver-coated copper powder (sample) obtained in Examples and Comparative Examples, the shape of arbitrary 500 particles was observed with a scanning electron microscope (5,000 times), respectively, and the thickness a (“ Main axis thickness a "), the length b of the longest branch among the branches extending from the main axis (" branch length b "), the number of branches with respect to the major axis of the main axis (" number of branches / major axis L "), The average value is shown in Table 1. In addition, this average value is an average value in the particles recognized as dendrite-like copper powder particles.
In Table 1, the thickness a is in the range of 0.3 μm to 5.0 μm, the length b is in the range of 0.7 μm to 12.0 μm, and the number of branches / major axis L is 0. Table 1 shows the number proportion of dendritic copper powder particles (referred to as “special dendrites”) of 5 to 4.0 particles / μm in the total copper powder particles as “number proportion of special dendrites in all particles”. It was shown to.
Further, the thickness a is in the range of 0.3 μm to 5.0 μm, the length b is in the range of 0.7 μm to 12.0 μm, and the number of branches / major axis L is 0.5 to 4.0. Table 1 shows the number ratio of the dendrite-like copper powder particles (referred to as “special dendrites”) / μm in the dendrite-like copper powder particles as “number ratio of special dendrite in dendrites”.
In the observation of the particle shape, a small amount of copper powder (sample) was attached to the carbon tape so that the particles did not overlap each other.

<Particle size measurement>
Take the silver-coated copper powder (sample) obtained in Examples and Comparative Examples in a small amount of beaker, add a few drops of 3% Triton X solution (manufactured by Kanto Chemical Co., Inc.), blend into the powder, and then add 0.1% SN Dispersant 41 solution (manufactured by San Nopco) (50 mL) was added, and thereafter a dispersion sample was dispersed for 2 minutes using an ultrasonic disperser TIPφ20 (manufactured by Nippon Seiki Seisakusho) to prepare a measurement sample.
The volume accumulation standard D50 of this measurement sample was measured using a laser diffraction / scattering particle size distribution measuring device MT3300 (manufactured by Nikkiso).

<Measurement of BET specific surface area>
The specific surface area of the silver-coated copper powder (sample) obtained in Examples and Comparative Examples was measured by a BET one-point method using a monosorb manufactured by Macsorb Corporation, and is shown in Table 1 as a BET specific surface area.

<Measurement of chlorine concentration>
The silver-coated copper powder (sample) obtained in Examples and Comparative Examples was washed with pure water and washed until the chlorine concentration of the liquid after washing was 5 wtppm or less. The thus-washed silver-coated copper powder (sample) was completely dissolved with nitric acid, and the chlorine concentration in the resulting solution was measured with a spectrophotometer to measure the chlorine concentration (wtppm). Note that “<5” in Table 1 indicates that it was less than the measurement limit.

<Measurement of oxygen concentration>
The silver-coated copper powder (sample) obtained in Examples and Comparative Examples was heated and melted in a He atmosphere using “EMGA-820ST” manufactured by Horiba, Ltd., and the oxygen concentration (wt%) was measured.

<Surface analysis by XPS>
The surface of the particles of the silver-coated copper powder (sample) obtained in Examples and Comparative Examples was analyzed by X-ray photoelectron spectroscopy (X-ray Photoelectron Spectroscopy, XPS).
Using an Mg-Kα ray (1253.6 eV) as an X-ray source, operation was performed at 15 KV × 26.7 mA.
Charging correction: Charging correction was performed with the SiO ₂ binding energy set to 103.2 eV.
Test sample: Molded in a disc shape with a pressure of 230 kg / cm ^{2 by} a pressure molding machine.
By the above method, the silver-coated copper powder (sample) obtained in Examples and Comparative Examples was quantitatively analyzed for Ag and Cu components at a depth from the particle surface to about 5 nm.
Table 1 shows the total Ag concentration (ρAg) of Ag on the particle surface as “Ag (wt%)” or “Ag (atomic%)”, Cu, CuO (Cu concentration conversion) and Cu ₂ O on the particle surface. The total Cu concentration (ρCu) in terms of Cu concentration is shown as “Cu (atomic%)”, and the ratio of the total Cu concentration (ρCu) of Cu, CuO and Cu ₂ O to the Ag concentration (ρAg) on the particle surface is It was shown as “ρCu / ρAg”.

<Tap bulk density (TD) measurement>
The tap bulk density (g / cm ³ ) of the silver-coated copper powder (sample) obtained in Examples and Comparative Examples was measured with a powder tester PT-E type (manufactured by Hosokawa Micron) using a sample 200 g.

<Evaluation of conductivity (specific resistance) of conductive paste>
The silver-coated copper powder (sample) obtained in the examples and comparative examples is blended at a ratio of 60% by mass with respect to the resin varnish, and thoroughly mixed using Shintaro Awatori Nertaro (model number AR-100). Then, the paste was applied on a glass plate, dried at 180 ° C. for 3 minutes in the air, and then the electric resistance was measured with a quadrupole terminal type (manufactured by Agilent Technologies).
And the specific resistance (Ω · cm) = width (cm) × film thickness (μm) × electrical resistance (Ω) / (length (cm) × 10 ⁴ ) Resistance) was calculated and shown in Table 1.

<Example 1>
In an electrolytic cell having a size of 2.5 m × 1.1 m × 1.5 m (about 4 m ³ ), 9 SUS cathode plates and insoluble anode plates (DSE) each having a size (1.0 m × 1.0 m). (Permelec Electrode Co., Ltd.)) is suspended so that the distance between the electrodes is 5 cm, and a copper sulfate solution as an electrolytic solution is circulated at 30 L / min, and an anode and a cathode are immersed in the electrolytic solution. Electrolysis was performed by applying a direct current, and powdered copper was deposited on the cathode surface.
At this time, the Cu concentration of the electrolyte to be circulated is adjusted to 10 g / L, the sulfuric acid (H ₂ SO ₄ ) concentration is set to 100 g / L, the chlorine concentration is set to 50 mg / L, and the current density is adjusted to 800 A / m ² to 30. Electrolysis was performed for a minute. The pH of the solution at this time was 1.
During electrolysis, the copper ion concentration of the electrolyte solution between the electrodes was always kept lower than the copper ion concentration of the electrolyte solution at the bottom of the electrolytic cell.

Then, the copper deposited on the cathode surface was mechanically scraped and collected, and then washed to obtain a hydrated copper powder cake equivalent to 1 kg of copper powder. This cake was dispersed in 3 L of water to form a slurry, and an ammonium carbonate solution was added until pH 9 was obtained, followed by stirring to perform “alkalizing treatment”. Thereafter, the impurities were removed by washing with pure water.
Next, 1 L of an industrial gelatin (Nitta Gelatin) 10 g / L aqueous solution was added and stirred, and then dried under reduced pressure (1 × 10 ⁻³ Pa) at 80 ° C. for 6 hours to obtain electrolytic copper powder. It was.
When the electrolytic copper powder obtained in this way was observed using a scanning electron microscope (SEM), at least 90% by number or more of copper powder particles had a single main axis, and a plurality of branches from the main axis. It was confirmed that it had a dendritic shape that branched vertically or obliquely and grew three-dimensionally.

25 kg of the obtained electrolytic copper powder was put into 50 L of pure water kept at 50 ° C. and stirred well. Separately, 4.5 kg of silver nitrate was put into 5 L of pure water to prepare a silver nitrate solution. The silver nitrate solution was added all at once to the solution in which the copper powder was dissolved. In this state, stirring was performed for 2 hours to obtain a silver-coated copper powder slurry.
Next, the silver-coated copper powder slurry is filtered by vacuum filtration. After the filtration is completed, the slurry is washed with a solution obtained by dissolving 600 g of EDTA (ethylenediaminetetraacetic acid) in 6 L of pure water, followed by 3 L of pure water. Residual EDTA was washed with water. Then, it was made to dry at 120 degreeC for 3 hours, and dendritic silver covering copper powder (sample) was obtained. The silver coating amount was 10.8% by mass of the total silver-coated copper powder.

When the obtained dendrite-like silver-coated copper powder (sample) was observed using a scanning electron microscope (SEM), at least 90% by number of silver-coated copper powder particles had one main axis, It has a dendritic shape in which a plurality of branches are obliquely branched from the main axis and grown three-dimensionally, the main axis thickness a is in the range of 0.3 μm to 5.0 μm, and the length of the longest branch It was confirmed that b was in the range of 0.7 μm to 12.0 μm, and the number of branches with respect to the major axis L (the number of branches / major axis L) was 0.5 to 4.0 / μm.
Moreover, when the electroconductivity of this silver covering copper powder was measured as shown in Table 1, the favorable value was shown.

(Examples 2 and 3)
In Example 1, “Alkali treatment”, instead of adding an ammonium carbonate solution until pH 9 and performing an alkali treatment, in Example 2, an aqueous ammonia was added until pH 11 and an alkali treatment was performed. In Example 3, caustic soda was added to pH 14 to perform alkali treatment, and silver coating treatment was performed. Except this point, a silver-coated copper powder (sample) was obtained in the same manner as in Example 1.

When the obtained silver-coated copper powder (sample) was observed using a scanning electron microscope (SEM), at least 90% by number or more of the silver-coated copper powder particles had one main axis, and the main axis A plurality of branches obliquely branch to form a dendritic shape that grows three-dimensionally, the main axis thickness a is in the range of 0.3 μm to 5.0 μm, and the longest branch length b is It was within the range of 0.7 μm to 12.0 μm, and it was confirmed that the number of branches with respect to the major axis L of the main shaft (the number of branches / major axis L) was 0.5 to 4.0 / μm.
Moreover, when the electroconductivity of this silver covering copper powder was measured as shown in Table 1, the favorable value was shown.

Example 4
In an electrolytic cell having a size of 2.5 m × 1.1 m × 1.5 m (about 4 m ³ ), 9 SUS cathode plates and insoluble anode plates (DSE) each having a size (1.0 m × 1.0 m). (Permelec Electrode Co., Ltd.)) is suspended so that the distance between the electrodes is 5 cm, and a copper sulfate solution as an electrolytic solution is circulated at 30 L / min, and an anode and a cathode are immersed in the electrolytic solution. Electrolysis was performed by applying a direct current, and powdered copper was deposited on the cathode surface.
At this time, the Cu concentration of the electrolyte to be circulated is adjusted to 5 g / L, the sulfuric acid (H ₂ SO ₄ ) concentration is set to 80 g / L, the chlorine concentration is set to 100 mg / L, and the current density is adjusted to 1200 A / m ² to 10. Electrolysis was performed for a minute. The pH of the solution at this time was 1.
During electrolysis, the copper ion concentration of the electrolyte solution between the electrodes was always kept lower than the copper ion concentration of the electrolyte solution at the bottom of the electrolytic cell.

Then, the copper deposited on the cathode surface was mechanically scraped and collected, and then washed to obtain a hydrated copper powder cake equivalent to 1 kg of copper powder. This cake was dispersed in 3 L of water to make a slurry, and an ammonium carbonate solution was added until pH 9 was obtained, followed by stirring to perform alkalinization treatment. Thereafter, the impurities were removed by washing with pure water.
Next, 1 L of an industrial gelatin (Nitta Gelatin) 10 g / L aqueous solution was added and stirred, and then dried under reduced pressure (1 × 10 ⁻³ Pa) at 80 ° C. for 6 hours to obtain electrolytic copper powder. It was.
The electrolytic copper powder thus obtained was subjected to a silver coating step in the same manner as in Example 1 to obtain a silver-coated copper powder (sample).

When the silver-coated copper powder (sample) obtained in this way was observed using a scanning electron microscope (SEM), at least 90% by number or more of the silver-coated copper powder particles had one main axis, It has a dendritic shape in which a plurality of branches are obliquely branched from the main axis and grown three-dimensionally, the main axis thickness a is in the range of 0.3 μm to 5.0 μm, and the longest branch length b In the range of 0.7 μm to 12.0 μm, and the number of branches (the number of branches / major axis L) with respect to the major axis L of the main shaft was confirmed to be 0.5 to 4.0 / μm.
Moreover, when the electroconductivity of this silver covering copper powder was measured as shown in Table 1, the favorable value was shown.

(Examples 5 and 6)
In the alkali treatment of Example 4, instead of performing an alkali treatment by adding an ammonium carbonate solution until the pH reached 9, in Example 5, an aqueous ammonia was added until the pH reached 11, and the alkali treatment was performed. Then, alkali treatment was performed by adding caustic soda to pH14. Except this point, it carried out similarly to Example 4, and obtained the silver covering copper powder (sample).

When the silver-coated copper powder (sample) obtained in this way was observed using a scanning electron microscope (SEM), at least 90% by number or more of the silver-coated copper powder particles had one main axis, It has a dendritic shape in which a plurality of branches are obliquely branched from the main axis and grown three-dimensionally, the main axis thickness a is in the range of 0.3 μm to 5.0 μm, and the longest branch length b In the range of 0.7 μm to 12.0 μm, and the number of branches (the number of branches / major axis L) with respect to the major axis L of the main shaft was confirmed to be 0.5 to 4.0 / μm.
Moreover, when the electroconductivity of this silver covering copper powder was measured as shown in Table 1, the favorable value was shown.

(Example 7)
In an electrolytic cell having a size of 2.5 m × 1.1 m × 1.5 m (about 4 m ³ ), 9 SUS cathode plates and insoluble anode plates (DSE) each having a size (1.0 m × 1.0 m). (Permelec Electrode Co., Ltd.)) is suspended so that the distance between the electrodes is 5 cm, and a copper sulfate solution as an electrolytic solution is circulated at 30 L / min, and an anode and a cathode are immersed in the electrolytic solution. Electrolysis was performed by applying a direct current, and powdered copper was deposited on the cathode surface.
At this time, the electrolytic solution to be circulated was adjusted to a Cu concentration of 20 g / L, a sulfuric acid (H ₂ SO ₄ ) concentration of 80 g / L, a chlorine concentration of 20 mg / L, and a current density of 500 A / m ² to 10 Electrolysis was performed for a minute. The pH of the solution at this time was 1.
During electrolysis, the copper ion concentration of the electrolyte solution between the electrodes was always kept lower than the copper ion concentration of the electrolyte solution at the bottom of the electrolytic cell.

Then, the copper deposited on the cathode surface was mechanically scraped and collected, and then washed to obtain a hydrated copper powder cake equivalent to 1 kg of copper powder. This cake was dispersed in 3 L of water to make a slurry, and an ammonium carbonate solution was added until pH 9 was obtained, followed by stirring to perform alkalinization treatment. Thereafter, the impurities were removed by washing with pure water.
Next, 1 L of an industrial gelatin (Nitta Gelatin) 10 g / L aqueous solution was added and stirred, and then dried under reduced pressure (1 × 10 ⁻³ Pa) at 80 ° C. for 6 hours to obtain electrolytic copper powder. It was.
The electrolytic copper powder thus obtained was subjected to a silver coating step in the same manner as in Example 1 to obtain a silver-coated copper powder (sample).

When the silver-coated copper powder (sample) obtained in this way was observed using a scanning electron microscope (SEM), at least 90% by number or more of the silver-coated copper powder particles had one main axis, It has a dendritic shape in which a plurality of branches are obliquely branched from the main axis and grown three-dimensionally, the main axis thickness a is in the range of 0.3 μm to 5.0 μm, and the longest branch length b In the range of 0.7 μm to 12.0 μm, and the number of branches (the number of branches / major axis L) with respect to the major axis L of the main shaft was confirmed to be 0.5 to 4.0 / μm.
Moreover, when the electroconductivity of this silver covering copper powder was measured as shown in Table 1, the favorable value was shown.

(Example 8)
A silver-coated copper powder (sample) was obtained in the same manner as in Example 4 except that the “current density” in Example 4 was set to 3000 A / m ² and the “chlorine concentration” was set to 30 mg / L.

When the obtained silver-coated copper powder (sample) was observed using a scanning electron microscope (SEM), at least 90% by number or more of the silver-coated copper powder particles had one main axis, and the main axis A plurality of branches obliquely branch to form a dendritic shape that grows three-dimensionally, the main axis thickness a is in the range of 0.3 μm to 5.0 μm, and the longest branch length b is It was within the range of 0.7 μm to 12.0 μm, and it was confirmed that the number of branches with respect to the major axis L of the main shaft (the number of branches / major axis L) was 0.5 to 4.0 / μm.
Moreover, when the electroconductivity of this silver covering copper powder was measured as shown in Table 1, the favorable value was shown.

(Comparative Example 1)
In Example 1, the copper deposited on the cathode surface was mechanically scraped and collected, and then washed to obtain a hydrous copper powder cake equivalent to 1 kg of copper powder. The cake was dispersed in 3 L of water, 1 L of an aqueous solution of 10 g / L of industrial gelatin (manufactured by Nitta Gelatin) was added, and then washed with pure water. Next, it was dried at 80 ° C. for 6 hours under reduced pressure (1 × 10 ⁻³ Pa) to obtain electrolytic copper powder. Otherwise, silver-coated copper powder (sample) was obtained in the same manner as in Example 1.

  When the silver-coated copper powder (sample) obtained in this way was observed using a scanning electron microscope (SEM), at least 90% by number or more of the silver-coated copper powder particles had one main axis, It was confirmed that a plurality of branches from the main axis branched vertically or obliquely to form a dendritic shape that grew three-dimensionally.

(Comparative Example 2)
In Example 4, the copper deposited on the cathode surface was mechanically scraped off and collected, and then washed to obtain a hydrous copper powder cake equivalent to 1 kg of copper powder. The cake was dispersed in 3 L of water, 1 L of an aqueous solution of 10 g / L of industrial gelatin (manufactured by Nitta Gelatin) was added, and then washed with pure water. Next, it was dried at 80 ° C. for 6 hours under reduced pressure (1 × 10 ⁻³ Pa) to obtain electrolytic copper powder. Otherwise, silver-coated copper powder (sample) was obtained in the same manner as in Example 1.

  When the silver-coated copper powder (sample) obtained in this way was observed using a scanning electron microscope (SEM), at least 90% by number or more of the silver-coated copper powder particles had one main axis, It was confirmed that a plurality of branches from the main axis were obliquely branched to form a dendritic shape that grew three-dimensionally.

(Comparative Example 3)
In an electrolytic cell having a size of 5.0 m × 1.1 m × 1.5 m (about 8 m ³ ), 19 copper cathode plates and copper anode plates each having a size (1.0 m × 1.0 m) are electrodes. Suspended so as to have a distance of 10 cm, and circulated a copper sulfate solution as an electrolytic solution at 150 L / min, immersed an anode and a cathode in the electrolytic solution, and conducted a direct current to conduct electrolysis. Powdered copper was deposited on the cathode surface, and the copper deposited on the cathode surface was mechanically scraped and collected, and then washed to obtain a hydrous copper powder cake equivalent to 1 kg of copper powder.
At this time, the electrolytic solution to be circulated was adjusted to a Cu concentration of 80 g / L, a sulfuric acid (H ₂ SO ₄ ) concentration of 200 g / L, and a current density of 90 A / m ² for electrolysis for 6 hours.
This cake was dispersed in 3 L of water to make a slurry, and an ammonium carbonate solution was added until pH 9 was obtained, followed by stirring to perform alkalinization treatment. Thereafter, the impurities were removed by washing with pure water.
Next, 1 L of an industrial gelatin (Nitta Gelatin) 10 g / L aqueous solution was added and stirred, and then dried under reduced pressure (1 × 10 ⁻³ Pa) at 80 ° C. for 6 hours to obtain electrolytic copper powder. It was.
The electrolytic copper powder thus obtained was subjected to a silver coating step in the same manner as in Example 1 to obtain a silver-coated copper powder (sample).
The particle shape of the obtained electrolytic copper powder was pinecone-like, and the main shaft thickness, branch length, number of branches / long diameter L could not be measured.

(Discussion)
Considering the above examples and the test results conducted so far, even if the chlorine concentration is 5 wtppm to 250 wtppm, the total Cu concentration (ρCu) of Cu, CuO and Cu ₂ O on the surface of the silver-coated copper powder particles It was found that if the ratio (ρCu / ρAg) to the silver concentration (ρAg) is 0.12 or less, the conductivity can be effectively increased.

As a result of observing the coated copper powder obtained in the examples using a scanning electron microscope (SEM), it is provided with one main axis, and a plurality of branches branch obliquely from the main axis, It has a dendritic shape that grows three-dimensionally, has a main axis thickness a of 0.3 μm to 5.0 μm, and the longest branch length b among the branches extending from the main axis is 0.7 μm to 12 μm. It was confirmed that the dendrite-like silver-coated copper powder particles having a dendrite shape of 0.0 μm (referred to as “special dendritic shape”) accounted for 80% by number or more of the total silver-coated copper powder particles.
Moreover, as a result of observing the coated copper powder obtained in the Examples using a scanning electron microscope (SEM), the dendrite-like silver-coated copper powder particles exhibiting the above-mentioned special dendritic shape are among the dendrite-like silver-coated copper powder particles. It was confirmed that it occupied 90% by number or more.

Claims (6)

A silver-coated copper powder containing silver-coated copper powder particles having a configuration in which the surface of dendritic copper powder particles exhibiting a dendritic shape is coated with silver or a silver alloy,
The total Cu concentration (ρCu, atomic%) and silver concentration of Cu, CuO and Cu2O on the surface of the silver-coated copper powder particles, measured by X-ray photoelectron spectroscopy, with a chlorine concentration of 5 wtppm to 250 wtppm The ratio (ρCu / ρAg) to (ρAg, atomic%) is 0.12 or less, the BET specific surface area is 0.30 to 2.00 m ² / g, and the laser diffraction / scattering particle size distribution measuring apparatus A silver-coated copper powder characterized by having a volume cumulative particle diameter D50 measured by: 1.0 μm to 11.2 μm.   The silver-coated copper powder according to claim 1, wherein the volume cumulative particle diameter D50 is 1.0 μm to 5.8 μm.   The silver-coated copper powder has one main axis when the silver-coated copper powder particles are observed using a scanning electron microscope (SEM), and a plurality of branches are obliquely branched from the main axis. It has a dendritic shape that is grown three-dimensionally or three-dimensionally, has a main axis thickness a of 0.3 μm to 5.0 μm, and has a longest branch length b of 0. The silver coating according to claim 1 or 2, wherein the dendrite-like silver-coated copper powder particles having a dendritic shape of 7 µm to 12.0 µm occupy 80% by number or more of the total silver-coated copper powder particles. Copper powder.   The dendrite-like silver-coated copper powder particles have a number of branches (number of branches / major axis L) of 0.5 / μm to 4.0 / μm with respect to the major axis L of the main axis. Silver-coated copper powder as described.   The silver-coated copper powder according to any one of claims 1 to 4, wherein the silver coating amount is 0.5 to 35.0 mass% of the entire silver-coated copper powder. The silver-coated copper according to any one of claims 1 to 5, wherein the oxygen concentration is 0.20% by mass or less and the tap bulk density is 0.5 to 2.0 g / cm ^3. powder.