JP2016537790A - 導電性の圧縮性部材を備えた窓組立体 - Google Patents
導電性の圧縮性部材を備えた窓組立体 Download PDFInfo
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- JP2016537790A JP2016537790A JP2016534864A JP2016534864A JP2016537790A JP 2016537790 A JP2016537790 A JP 2016537790A JP 2016534864 A JP2016534864 A JP 2016534864A JP 2016534864 A JP2016534864 A JP 2016534864A JP 2016537790 A JP2016537790 A JP 2016537790A
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- 239000004020 conductor Substances 0.000 claims abstract description 68
- 239000000463 material Substances 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 239000011888 foil Substances 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000006260 foam Substances 0.000 claims description 8
- 239000011231 conductive filler Substances 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- 229910052709 silver Inorganic materials 0.000 description 18
- 239000004332 silver Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 229920001940 conductive polymer Polymers 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011496 polyurethane foam Substances 0.000 description 3
- 229920002725 thermoplastic elastomer Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920002397 thermoplastic olefin Polymers 0.000 description 2
- 229920006342 thermoplastic vulcanizate Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000006262 metallic foam Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0236—Industrial applications for vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
- H05B3/86—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields the heating conductors being embedded in the transparent or reflecting material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/26—Connectors or connections adapted for particular applications for vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Resistance Heating (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
本発明は、2013年8月16日に出願された、同時係属の米国仮特許出願番号第61/866,911の優先日を主張する。
Claims (15)
- 透明ペイン、
前記透明ペインに接触する、導電体、
前記導電体にエネルギーを与えるための、電気接続要素、
前記電気接続要素及び前記導電体を覆って配置された封入部、及び
前記電気接続要素と前記導電体との間に電気接続を提供するために、前記電気接続要素と前記導電体との間に配置された導電性の圧縮性部材、
を有する、窓組立体。 - 前記導電性の圧縮性部材は、前記電気接続要素と前記導電体との間で圧縮される材料を有する、請求項1に記載の窓組立体。
- 前記材料は発泡体を有する、請求項2に記載の窓組立体。
- 前記材料内に伝導性フィラーを含む、請求項3に記載の窓組立体。
- 前記材料の周りに配置された箔層を含む、請求項2に記載の窓組立体。
- 前記箔層は、伝導性かつ柔軟な材料である、請求項5に記載の窓組立体。
- 前記封入部は、高分子材料で作られている、請求項1に記載の窓組立体。
- 前記電気接続要素と前記導電体との間の電気接続にはハンダがない、請求項1に記載の窓組立体。
- 透明ペイン、
前記透明ペインに接触する、導電体、
前記導電体への電気接続のための末端接続具を含む、前記導電体にエネルギーを与えるための電気接続要素、
前記末端接続具及び前記導電体を覆って配置された高分子の封入部、及び
ハンダを使用することなく前記末端接続具と前記導電体との間に電気接続を提供するために、前記末端接続具と前記導電体との間に配置された、導電性の圧縮性部材、
を有する、窓組立体。 - 前記導電性の圧縮性部材は、前記電気接続要素と前記導電体との間で圧縮される圧縮性材料を有する、請求項9に記載の窓組立体。
- 前記圧縮性材料は発泡体を有する、請求項10に記載の窓組立体。
- 前記圧縮性材料内に伝導性フィラーを含む、請求項10に記載の窓組立体。
- 前記圧縮性材料の周りに配置された箔層を含む、請求項10に記載の窓組立体。
- 前記箔層は、伝導性かつ柔軟な材料である、請求項11に記載の窓組立体。
- 透明ペイン用の無ハンダ組立体であって、
導電体、
前記導電体にエネルギーを与えるための、電気接続要素、
前記電気接続要素及び前記導電体を覆って配置された、封入部、及び
前記電気接続要素と前記導電体との間に電気接続を提供するために、前記電気接続要素と前記導電体との間に配置された、導電性の圧縮性部材、
を有する、無ハンダ組立体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361866911P | 2013-08-16 | 2013-08-16 | |
US61/866,911 | 2013-08-16 | ||
PCT/US2014/051250 WO2015023936A1 (en) | 2013-08-16 | 2014-08-15 | Window assembly with electrically conductive compressible member |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016537790A true JP2016537790A (ja) | 2016-12-01 |
JP2016537790A5 JP2016537790A5 (ja) | 2017-09-21 |
JP6823456B2 JP6823456B2 (ja) | 2021-02-03 |
Family
ID=51453871
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016534864A Active JP6823456B2 (ja) | 2013-08-16 | 2014-08-15 | 導電性の圧縮性部材を備えた窓組立体 |
JP2016534859A Active JP6618907B2 (ja) | 2013-08-16 | 2014-08-15 | ハンダ接合部用ケーシングを備えた窓組立体 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016534859A Active JP6618907B2 (ja) | 2013-08-16 | 2014-08-15 | ハンダ接合部用ケーシングを備えた窓組立体 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9966673B2 (ja) |
EP (2) | EP3039746B1 (ja) |
JP (2) | JP6823456B2 (ja) |
WO (2) | WO2015023921A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022196270A1 (ja) * | 2021-03-19 | 2022-09-22 | 富士フイルム株式会社 | 透明ヒータ用立体導電膜および透明ヒータ用立体導電膜の製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015023921A1 (en) | 2013-08-16 | 2015-02-19 | Agc Automotive Americas R&D, Inc. | Window assembly with casing for solder joint |
EP3089272A1 (en) * | 2015-04-29 | 2016-11-02 | AGC Glass Europe | Glazing panel having an electrically conductive connector |
DE202015007100U1 (de) * | 2015-10-10 | 2017-01-13 | Fractal-Technologies Dr.-Ing. Thomas Reul GmbH | Ausdehnungs-Kompensierter-Glas-Löt-Anschluß für Scheiben-Kontaktierung |
US10263362B2 (en) * | 2017-03-29 | 2019-04-16 | Agc Automotive Americas R&D, Inc. | Fluidically sealed enclosure for window electrical connections |
US10849192B2 (en) | 2017-04-26 | 2020-11-24 | Agc Automotive Americas R&D, Inc. | Enclosure assembly for window electrical connections |
GB201804622D0 (en) * | 2018-03-22 | 2018-05-09 | Central Glass Co Ltd | Method of producing a vehicle glass assembly |
US10374330B1 (en) | 2018-05-17 | 2019-08-06 | Agc Automotive Americas R&D, Inc. | Window assembly with solderless electrical connector |
DE202022002807U1 (de) * | 2021-06-08 | 2023-07-18 | Saint-Gobain Glass France | Scheibenanordnung mit einem elektrischen Anschlusselement |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001230616A (ja) * | 2000-02-18 | 2001-08-24 | Nippon Sheet Glass Co Ltd | ガラスアンテナ装置 |
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- 2014-08-15 EP EP14761459.8A patent/EP3039746B1/en active Active
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- 2014-08-15 JP JP2016534864A patent/JP6823456B2/ja active Active
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WO2022196270A1 (ja) * | 2021-03-19 | 2022-09-22 | 富士フイルム株式会社 | 透明ヒータ用立体導電膜および透明ヒータ用立体導電膜の製造方法 |
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EP3039746B1 (en) | 2020-10-07 |
JP6823456B2 (ja) | 2021-02-03 |
WO2015023936A1 (en) | 2015-02-19 |
WO2015023921A1 (en) | 2015-02-19 |
JP2016528705A (ja) | 2016-09-15 |
EP3039746A1 (en) | 2016-07-06 |
US20160204524A1 (en) | 2016-07-14 |
US10601149B2 (en) | 2020-03-24 |
EP3036795A1 (en) | 2016-06-29 |
US9966673B2 (en) | 2018-05-08 |
EP3036795B1 (en) | 2019-11-27 |
US20160204522A1 (en) | 2016-07-14 |
JP6618907B2 (ja) | 2019-12-11 |
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