JP2016533650A - 高密度モールド貫通配線を形成するための方法 - Google Patents
高密度モールド貫通配線を形成するための方法 Download PDFInfo
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- JP2016533650A JP2016533650A JP2016549013A JP2016549013A JP2016533650A JP 2016533650 A JP2016533650 A JP 2016533650A JP 2016549013 A JP2016549013 A JP 2016549013A JP 2016549013 A JP2016549013 A JP 2016549013A JP 2016533650 A JP2016533650 A JP 2016533650A
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Abstract
Description
第1のパッケージを形成するステップであって、第1のパッケージを形成するステップは:
マイクロ電子基板を形成するステップであって、マイクロ電子基板は、その能動面に及び/又はこの能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び少なくとも1つの相互接続ボンドパッドを有する、形成するステップと;
マイクロ電子デバイスの複数の取付けボンドパッドにマイクロ電子デバイスを取り付けるステップと;
型成形体及びこの型成形体から延びる少なくとも1つの突起部を有する金型チェイスを形成するステップであって、少なくとも1つの突起部は、少なくとも1つの側壁及び接触面を含む、形成するステップと;
金型チェイスの突起部の少なくとも1つの接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップと;
マイクロ電子基板と金型チェイスとの間に成形材料を配置するステップと;
金型チェイスを取り外して、成形材料の上面からマイクロ電子基板のそれぞれの相互接続ボンドパッドに延びる少なくとも1つの相互接続ビアを形成するステップと;
少なくとも1つの相互接続ビアを導電性材料で充填して、少なくとも1つのモールド貫通配線を形成するステップと;を含む、第1のパッケージを形成するステップと;
第1のパッケージに第2のパッケージを取り付けるステップと;を含み、
電気的接続部が、第2のパッケージから第1のパッケージの少なくとも1つのモールド貫通配線に形成される。
基板を形成するステップと;
基板上にパッケージオンパッケージ・マイクロ電子デバイスを取り付けるステップと;を含み、
パッケージオンパッケージ・マイクロ電子デバイスは:
第1のパッケージを形成するステップであって、第1のパッケージを形成するステップは:
マイクロ電子基板を形成するステップであって、マイクロ電子基板は、その能動面に及び/又はこの能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び少なくとも1つの相互接続ボンドパッドを有する、形成するステップと;
マイクロ電子デバイスの複数の取付けボンドパッドにマイクロ電子デバイスを取り付けるステップと;
型成形体及び型成形体から延びる少なくとも1つの突起部を有する金型チェイスを形成するステップであって、少なくとも1つの突起部は、少なくとも1つの側壁及び接触面を含む、形成するステップと;
金型チェイスの突起部の少なくとも1つの接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップと;
マイクロ電子基板と金型チェイスとの間に成形材料を配置するステップと;
金型チェイスを取り外して、成形材料の上面からマイクロ電子基板のそれぞれの相互接続ボンドパッドに延びる少なくとも1つの相互接続ビアを形成するステップと;
少なくとも1つの相互接続ビアを導電性材料で充填して、少なくとも1つのモールド貫通配線を形成するステップと;を含む、第1のパッケージを形成するステップと;
第1のパッケージに第2のパッケージを取り付けるステップと;によって形成され、
電気的接続部は、第2のパッケージから第1のパッケージの少なくとも1つのモールド貫通配線に形成される。
Claims (25)
- マイクロ電子デバイスの製造方法であって、当該製造方法は:
マイクロ電子基板を形成するステップであって、該マイクロ電子基板は、その能動面に及び/又は該能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び少なくとも1つの相互接続ボンドパッドを有する、形成するステップと;
前記マイクロ電子デバイスの複数の取付けボンドパッドにマイクロ電子デバイスを取り付けるステップと;
型成形体及び該型成形体から延びる少なくとも1つの突起部を有する金型チェイスを形成するステップであって、前記少なくとも1つの突起部は、少なくとも1つの側壁及び接触面を含む、形成するステップと;
前記金型チェイスの突起部の少なくとも1つの接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップと;
前記マイクロ電子基板と前記金型チェイスとの間に成形材料を配置するステップと;
前記金型チェイスを取り外して、前記成形材料の上面からマイクロ電子基板のそれぞれの相互接続ボンドパッドに延びるような少なくとも1つの相互接続ビアを形成するステップと;を含む、
製造方法。 - 前記少なくとも1つの相互接続ビアを導電性材料で充填して、モールド貫通配線を形成するステップをさらに含む、
請求項1に記載の製造方法。 - 前記金型チェイスを取り外すステップの前に、前記成形材料を硬化させるステップをさらに含む、
請求項1に記載の製造方法。 - 前記成形材料を配置するステップは、前記マイクロ電子基板と前記金型チェイスとの間に前記成形材料を配置して、前記マイクロ電子デバイスを実質的に封止し、相互接続突起部の前記少なくとも1つの側壁を取り囲むステップを含む、
請求項1に記載の製造方法。 - 前記金型チェイスを形成するステップは、前記金型チェイスの突起部の弾性材料から形成された接触面を含み且つ該接触面に近接した前記金型チェイスの少なくとも1つの突起部の一部を形成するステップを含む、
請求項1に記載の製造方法。 - 前記マイクロ電子基板を形成するステップは、能動面を有するマイクロ電子基板を形成するステップを含み、該マイクロ電子基板は、前記マイクロ電子基板の能動面に及び/又は該能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び保護バンプを有する少なくとも1つの相互接続ボンドパッドを含む、
請求項1に記載の製造方法。 - 前記マイクロ電子基板を形成するステップは、はんだ材料から前記保護バンプを形成するステップを含む、
請求項6に記載の製造方法。 - 前記金型チェイスの突起部の接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップは、前記金型チェイスの突起部の接触面を前記マイクロ電子基板の相互接続ボンドパッドのそれぞれの保護バンプに接触させるステップを含む、
請求項6又は7に記載の製造方法。 - 前記金型チェイスの少なくとも1つの突起部は、高さよりも大きな幅を有する断面形状を有する、
請求項1に記載の製造方法。 - パッケージオンパッケージ・マイクロ電子デバイスの製造方法であって、当該製造方法は:
第1のパッケージを形成するステップであって、第1のパッケージを形成するステップは:
マイクロ電子基板を形成するステップであって、該マイクロ電子基板は、その能動面に及び/又は該能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び少なくとも1つの相互接続ボンドパッドを有する、形成するステップと;
前記マイクロ電子デバイスの複数の取付けボンドパッドにマイクロ電子デバイスを取り付けるステップと;
型成形体及び該型成形体から延びる少なくとも1つの突起部を有する金型チェイスを形成するステップであって、前記少なくとも1つの突起部は、少なくとも1つの側壁及び接触面を含む、形成するステップと;
前記金型チェイスの突起部の少なくとも1つの接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップと;
前記マイクロ電子基板と前記金型チェイスとの間に成形材料を配置するステップと;
前記金型チェイスを取り外して、前記成形材料の上面からマイクロ電子基板のそれぞれの相互接続ボンドパッドに延びる少なくとも1つの相互接続ビアを形成するステップと;
該少なくとも1つの相互接続ビアを導電性材料で充填して、少なくとも1つのモールド貫通配線を形成するステップと;を含む、第1のパッケージを形成するステップと;
第1のパッケージに第2のパッケージを取り付けるステップと;を含み、
電気的接続部が、第2のパッケージから第1のパッケージの前記少なくとも1つのモールド貫通配線に形成される、
製造方法。 - 前記金型チェイスを取り外すステップの前に、前記成形材料を硬化させるステップをさらに含む、
請求項10に記載の製造方法。 - 前記成形材料を配置するステップは、前記マイクロ電子基板と前記金型チェイスとの間に前記成形材料を配置して、前記マイクロ電子デバイスを実質的に封止し、相互接続突起部の前記少なくとも1つの側壁を取り囲むステップを含む、
請求項10に記載の製造方法。 - 前記金型チェイスを形成するステップは、前記金型チェイスの突起部の弾性材料から形成された接触面を含み且つ該接触面に近接した前記金型チェイスの少なくとも1つの突起部の一部を形成するステップを含む、
請求項10に記載の製造方法。 - 前記マイクロ電子基板を形成するステップは、能動面を有するマイクロ電子基板を形成するステップを含み、該マイクロ電子基板は、前記マイクロ電子基板の能動面に及び/又は該能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び保護バンプを有する少なくとも1つの相互接続ボンドパッドを含む、
請求項10に記載の製造方法。 - 前記マイクロ電子基板を形成するステップは、はんだ材料から前記保護バンプを形成するステップを含む、
請求項14に記載の製造方法。 - 前記金型チェイスの突起部の接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップは、前記金型チェイスの突起部の接触面を前記マイクロ電子基板の相互接続ボンドパッドのそれぞれの保護バンプに接触させるステップを含む、
請求項14又は15に記載の製造方法。 - 前記金型チェイスの少なくとも1つの突起部は、高さよりも大きな幅を有する断面形状を有する、
請求項10に記載の製造方法。 - 電子システムの製造方法であって、当該製造方法は:
基板を形成するステップと;
前記基板上にパッケージオンパッケージ・マイクロ電子デバイスを取り付けるステップと;を含み、
前記パッケージオンパッケージ・マイクロ電子デバイスは:
第1のパッケージを形成するステップであって、第1のパッケージを形成するステップは:
マイクロ電子基板を形成するステップであって、該マイクロ電子基板は、その能動面に及び/又は該能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び少なくとも1つの相互接続ボンドパッドを有する、形成するステップと;
前記マイクロ電子デバイスの複数の取付けボンドパッドにマイクロ電子デバイスを取り付けるステップと;
型成形体及び該型成形体から延びる少なくとも1つの突起部を有する金型チェイスを形成するステップであって、前記少なくとも1つの突起部は、少なくとも1つの側壁及び接触面を含む、形成するステップと;
前記金型チェイスの突起部の少なくとも1つの接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップと;
前記マイクロ電子基板と前記金型チェイスとの間に成形材料を配置するステップと;
前記金型チェイスを取り外して、前記成形材料の上面からマイクロ電子基板のそれぞれの相互接続ボンドパッドに延びる少なくとも1つの相互接続ビアを形成するステップと;
前記少なくとも1つの相互接続ビアを導電性材料で充填して、少なくとも1つのモールド貫通配線を形成するステップと;を含む、第1のパッケージを形成するステップと;
第1のパッケージに第2のパッケージを取り付けるステップと;によって形成され、
電気的接続部は、第2のパッケージから第1のパッケージの前記少なくとも1つのモールド貫通配線に形成される、
製造方法。 - 前記金型チェイスを取り外すステップの前に、前記成形材料を硬化させるステップをさらに含む、
請求項18に記載の製造方法。 - 前記成形材料を配置するステップは、前記マイクロ電子基板と前記金型チェイスとの間に前記成形材料を配置して、前記マイクロ電子デバイスを実質的に封止し、相互接続突起部の前記少なくとも1つの側壁を取り囲むステップを含む、
請求項18に記載の製造方法。 - 前記金型チェイスを形成するステップは、前記金型チェイスの突起部の弾性材料から形成された接触面を含み且つ該接触面に近接した前記金型チェイスの少なくとも1つの突起部の一部を形成するステップを含む、
請求項18に記載の製造方法。 - 前記マイクロ電子基板を形成するステップは、能動面を有するマイクロ電子基板を形成するステップを含み、該マイクロ電子基板は、前記マイクロ電子基板の能動面に及び/又は該能動面上に形成された、マイクロ電子デバイスの複数の取付けボンドパッド及び保護バンプを有する少なくとも1つの相互接続ボンドパッドを含む、
請求項18に記載の製造方法。 - 前記マイクロ電子基板を形成するステップは、はんだ材料から前記保護バンプを形成するステップを含む、
請求項22に記載の製造方法。 - 前記金型チェイスの突起部の接触面をマイクロ電子基板のそれぞれの相互接続ボンドパッドに接触させるステップは、前記金型チェイスの突起部の接触面を前記マイクロ電子基板の相互接続ボンドパッドのそれぞれの保護バンプに接触させるステップを含む、
請求項22又は23に記載の製造方法。 - 前記金型チェイスの少なくとも1つの突起部は、高さよりも大きな幅を有する断面形状を有する、
請求項18に記載の製造方法。
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |