JP2016526792A - ダイパッケージ用の被覆されたボンドワイヤおよび被覆されたボンドワイヤの製造方法 - Google Patents
ダイパッケージ用の被覆されたボンドワイヤおよび被覆されたボンドワイヤの製造方法 Download PDFInfo
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- JP2016526792A JP2016526792A JP2016522334A JP2016522334A JP2016526792A JP 2016526792 A JP2016526792 A JP 2016526792A JP 2016522334 A JP2016522334 A JP 2016522334A JP 2016522334 A JP2016522334 A JP 2016522334A JP 2016526792 A JP2016526792 A JP 2016526792A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Chemically Coating (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (15)
- 金属コアと、誘電体層と、接地接続可能な金属被覆とを有するリード線であって、
前記リード線は、少なくとも1つの蒸気バリア被覆をさらに有することを特徴とするリード線。 - 前記リード線は、モールドコンパウンドへの接着を促進するための付加的な被覆を有することを特徴とする請求項1に記載のリード線。
- 前記誘電体層は、前記金属コアを少なくとも部分的に被覆し、さらに、接地接続可能な金属被覆によって少なくとも部分的に被覆されることを特徴とする請求項1または2に記載のリード線。
- 前記金属被覆は、前記誘電体層を部分的にのみ被覆することを特徴とする請求項1から3のいずれか一項に記載のリード線。
- 前記リード線は、付加的な金属層および/または付加的な誘電体層を有することを特徴とする請求項1から4のいずれか一項に記載のリード線。
- 前記リード線は、薄い金属層によって隔てられた厚さの異なる複数の誘電体層を有し、最外層は接地接続されていることを特徴とする請求項1から5のいずれか一項に記載のリード線。
- 優れた蒸気バリアおよび/または酸素分解耐性を提供する高性能誘電体が別の誘電体材料の厚い層の上に薄く被着されることを特徴とする請求項1から6のいずれか一項に記載のリード線。
- 複数の接続パッドを有するダイと、
複数の接続素子を支持するダイ基板と、
前記ダイと前記ダイ基板との間に接続された請求項1から7のいずれか一項に記載の1以上のリード線と、
を備えたダイパッケージ。 - 前記リード線は、規定のコア径を持つ第1の金属コアと、前記第1の金属コアを被覆する第1の誘電体厚を持つ誘電体層と、前記誘電体層を少なくとも部分的に被覆する外側金属層とを備え、前記リード線は、蒸気バリアオーバーコートを有することを特徴とする請求項8に記載のダイパッケージ。
- 前記ダイは、オーバーモールドが施され、さらに硬化および/またはシンギュレーションが施されて使用されることを特徴とする請求項1から9のいずれか一項に記載のダイパッケージ。
- ワイヤボンディングを使用して、リード線の金属コアをダイおよび基板の両方の接続パッドへの相互接続を行うステップと、
前記金属コアを誘電体で被覆するステップと、
金属層で被覆するステップと、
少なくとも1つの蒸気バリアの被覆を施すステップと、
を有する請求項8から10のいずれか一項に記載のダイパッケージの製造方法。 - モールドコンパウンドへの接着を促進するための付加的な被覆を施すステップをさらに有する請求項11に記載の方法。
- 前記ダイにオーバーモールドを施し、硬化および/またはシンギュレーションを施すステップをさらに有する請求項11または12に記載の方法。
- 前記誘電体の少なくとも一部を除去して接地パッドを露出し、続いて、前記金属層を前記接地パッドに接続するための金属被覆を施すステップをさらに有する請求項11から13のいずれか一項に記載の方法。
- 前記金属層および/または付加的な金属層の少なくとも部分的な除去を施し、続いて、付加的な誘電体層および/または少なくとも1つの蒸気バリアの被覆を施すステップをさらに有する請求項11から14のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361842951P | 2013-07-03 | 2013-07-03 | |
US61/842,951 | 2013-07-03 | ||
PCT/EP2014/001821 WO2015000592A1 (en) | 2013-07-03 | 2014-07-02 | Coated bond wires for die packages and methods of manufacturing said coated bond wires |
Publications (2)
Publication Number | Publication Date |
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JP2016526792A true JP2016526792A (ja) | 2016-09-05 |
JP6730182B2 JP6730182B2 (ja) | 2020-07-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016522334A Active JP6730182B2 (ja) | 2013-07-03 | 2014-07-02 | ダイパッケージ用の被覆されたボンドワイヤおよび被覆されたボンドワイヤの製造方法 |
Country Status (9)
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US (2) | US9997489B2 (ja) |
EP (1) | EP3017468B1 (ja) |
JP (1) | JP6730182B2 (ja) |
KR (1) | KR102038022B1 (ja) |
CN (1) | CN105408998B (ja) |
CA (1) | CA2915404C (ja) |
HK (1) | HK1224431A1 (ja) |
TW (1) | TWM506372U (ja) |
WO (1) | WO2015000592A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102016109349A1 (de) * | 2016-05-20 | 2017-11-23 | Infineon Technologies Ag | Chipgehäuse, verfahren zum bilden eines chipgehäuses und verfahren zum bilden eines elektrischen kontakts |
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2014
- 2014-07-02 WO PCT/EP2014/001821 patent/WO2015000592A1/en active Application Filing
- 2014-07-02 TW TW103211713U patent/TWM506372U/zh unknown
- 2014-07-02 US US14/902,183 patent/US9997489B2/en active Active
- 2014-07-02 CA CA2915404A patent/CA2915404C/en active Active
- 2014-07-02 EP EP14734743.9A patent/EP3017468B1/en active Active
- 2014-07-02 CN CN201480038198.0A patent/CN105408998B/zh active Active
- 2014-07-02 JP JP2016522334A patent/JP6730182B2/ja active Active
- 2014-07-02 KR KR1020157037288A patent/KR102038022B1/ko active IP Right Grant
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2016
- 2016-11-03 HK HK16112688.4A patent/HK1224431A1/zh unknown
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- 2017-05-17 US US15/597,367 patent/US20170271296A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
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US9997489B2 (en) | 2018-06-12 |
HK1224431A1 (zh) | 2017-08-18 |
US20170271296A1 (en) | 2017-09-21 |
WO2015000592A1 (en) | 2015-01-08 |
KR20160029759A (ko) | 2016-03-15 |
EP3017468B1 (en) | 2020-09-02 |
CN105408998A (zh) | 2016-03-16 |
TWM506372U (zh) | 2015-08-01 |
CA2915404C (en) | 2020-06-23 |
JP6730182B2 (ja) | 2020-07-29 |
EP3017468A1 (en) | 2016-05-11 |
KR102038022B1 (ko) | 2019-11-26 |
US20170125370A1 (en) | 2017-05-04 |
CN105408998B (zh) | 2018-07-24 |
CA2915404A1 (en) | 2015-01-08 |
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