JP2016513941A5 - - Google Patents
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- Publication number
- JP2016513941A5 JP2016513941A5 JP2016502833A JP2016502833A JP2016513941A5 JP 2016513941 A5 JP2016513941 A5 JP 2016513941A5 JP 2016502833 A JP2016502833 A JP 2016502833A JP 2016502833 A JP2016502833 A JP 2016502833A JP 2016513941 A5 JP2016513941 A5 JP 2016513941A5
- Authority
- JP
- Japan
- Prior art keywords
- protective layer
- wafer
- trenches
- ultrasonic transducers
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 13
- 239000011241 protective layer Substances 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 3
- 239000012528 membrane Substances 0.000 claims 3
- 229920000131 polyvinylidene Polymers 0.000 claims 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims 2
- TWCAHZDBCHPECW-UHFFFAOYSA-N 1,1-difluoroethene ethene trihydrofluoride Chemical compound C=C.C=C(F)F.F.F.F TWCAHZDBCHPECW-UHFFFAOYSA-N 0.000 claims 1
- MHWAJHABMBTNHS-UHFFFAOYSA-N 1,1-difluoroethene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C.FC(F)=C(F)F MHWAJHABMBTNHS-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 238000000708 deep reactive-ion etching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920000052 poly(p-xylylene) Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361781159P | 2013-03-14 | 2013-03-14 | |
| US61/781,159 | 2013-03-14 | ||
| PCT/US2014/028552 WO2014152987A1 (en) | 2013-03-14 | 2014-03-14 | Wafer-scale transducer coating and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016513941A JP2016513941A (ja) | 2016-05-16 |
| JP2016513941A5 true JP2016513941A5 (OSRAM) | 2017-08-10 |
| JP6297131B2 JP6297131B2 (ja) | 2018-03-20 |
Family
ID=51530489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016502833A Active JP6297131B2 (ja) | 2013-03-14 | 2014-03-14 | ウェハスケールトランスデューサコーティング及び方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10123775B2 (OSRAM) |
| EP (1) | EP2973767B1 (OSRAM) |
| JP (1) | JP6297131B2 (OSRAM) |
| CN (1) | CN105122488B (OSRAM) |
| WO (1) | WO2014152987A1 (OSRAM) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6189033B2 (ja) * | 2012-12-14 | 2017-08-30 | 株式会社日立製作所 | 超音波探触子の製造方法、超音波探触子、及び超音波診断装置 |
| JP2017080132A (ja) | 2015-10-29 | 2017-05-18 | セイコーエプソン株式会社 | 超音波デバイス、超音波プローブ、電子機器、および超音波画像装置 |
| JP6569473B2 (ja) * | 2015-10-29 | 2019-09-04 | セイコーエプソン株式会社 | 超音波デバイス、超音波プローブ、電子機器、および超音波画像装置 |
| US10618079B2 (en) * | 2016-02-29 | 2020-04-14 | Qualcomm Incorporated | Piezoelectric micromechanical ultrasonic transducers and transducer arrays |
| WO2018125185A1 (en) * | 2016-12-30 | 2018-07-05 | Intel Corporation | Packaging for ultrasonic transducers |
| US11413008B2 (en) * | 2017-06-30 | 2022-08-16 | Koninklijke Philips N.V. | Intraluminal ultrasound imaging device comprising a substrate separated into a plurality of spaced-apart segments, intraluminal ultrasound imaging device comprising a trench, and method of manufacturing |
| JP6922651B2 (ja) | 2017-10-26 | 2021-08-18 | セイコーエプソン株式会社 | 超音波デバイス、及び超音波測定装置 |
| CN108652669A (zh) * | 2018-03-14 | 2018-10-16 | 业成科技（成都）有限公司 | 超音波感测器及其运作方法 |
| US11465177B2 (en) | 2018-05-21 | 2022-10-11 | Fujifilm Sonosite, Inc. | PMUT ultrasound transducer with damping layer |
| US11890136B2 (en) * | 2018-08-22 | 2024-02-06 | Philips Image Guided Therapy Corporation | Fluid barrier for intraluminal ultrasound imaging and associated devices, systems, and methods |
| US11971477B2 (en) * | 2018-09-25 | 2024-04-30 | Exo Imaging, Inc. | Imaging devices with selectively alterable characteristics |
| KR102670111B1 (ko) * | 2018-09-28 | 2024-05-27 | 재단법인대구경북과학기술원 | 초음파 트랜스듀서 장치의 제조 방법 |
| DE102019101325A1 (de) * | 2019-01-17 | 2020-07-23 | USound GmbH | Herstellungsverfahren für mehrere MEMS-Schallwandler |
| KR102707729B1 (ko) * | 2020-03-05 | 2024-09-20 | 엑소 이미징, 인크. | 프로그래밍 가능한 해부 및 흐름 이미징을 가지는 초음파 이미징 장치 |
| WO2021207851A1 (en) * | 2020-04-16 | 2021-10-21 | Vuereal Inc. | Micro thin-film device |
| US20220287679A1 (en) * | 2021-03-09 | 2022-09-15 | OneProjects Design and Innovation Ltd. | Disposable catheter with rotatable image array |
| EP4348725A1 (de) * | 2021-05-28 | 2024-04-10 | Robert Bosch GmbH | Verfahren zur herstellung eines mikro-elektronisch-mechanischen schwingungssystems und piezoelektrischer mikrogefertigter ultraschallwandler |
| US20240023929A1 (en) * | 2022-07-20 | 2024-01-25 | SoundCath, Inc. | Ultrasonic catheter |
| FR3155598B1 (fr) * | 2023-11-20 | 2025-10-10 | Vermon | Sonde ultrasonore à transducteurs MUT et méthode de fabrication d’une telle sonde |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5160870A (en) * | 1990-06-25 | 1992-11-03 | Carson Paul L | Ultrasonic image sensing array and method |
| US5488954A (en) * | 1994-09-09 | 1996-02-06 | Georgia Tech Research Corp. | Ultrasonic transducer and method for using same |
| US6331163B1 (en) * | 1998-01-08 | 2001-12-18 | Microsense Cardiovascular Systems (1196) Ltd. | Protective coating for bodily sensor |
| US7008812B1 (en) * | 2000-05-30 | 2006-03-07 | Ic Mechanics, Inc. | Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation |
| JP4067964B2 (ja) * | 2000-12-01 | 2008-03-26 | ザ クリーブランド クリニック ファウンデーション | 小型超音波トランスデューサ |
| US6659954B2 (en) * | 2001-12-19 | 2003-12-09 | Koninklijke Philips Electronics Nv | Micromachined ultrasound transducer and method for fabricating same |
| US6784600B2 (en) * | 2002-05-01 | 2004-08-31 | Koninklijke Philips Electronics N.V. | Ultrasonic membrane transducer for an ultrasonic diagnostic probe |
| US20050124896A1 (en) * | 2003-08-25 | 2005-06-09 | Jacob Richter | Method for protecting implantable sensors and protected implantable sensors |
| US7415883B2 (en) * | 2004-06-28 | 2008-08-26 | Zuli Holdings Ltd | Method for protecting resonating sensors and open protected resonating sensors |
| US20050177045A1 (en) * | 2004-02-06 | 2005-08-11 | Georgia Tech Research Corporation | cMUT devices and fabrication methods |
| WO2005084284A2 (en) * | 2004-02-27 | 2005-09-15 | Georgia Tech Research Corporation | Multiple element electrode cmut devices and fabrication methods |
| JP2008510324A (ja) * | 2004-03-11 | 2008-04-03 | ジョージア テック リサーチ コーポレイション | 非対称薄膜ｃＭＵＴ素子及び製作方法 |
| TWI268183B (en) | 2005-10-28 | 2006-12-11 | Ind Tech Res Inst | Capacitive ultrasonic transducer and method of fabricating the same |
| US7331236B2 (en) * | 2006-03-21 | 2008-02-19 | Radi Medical Systems Ab | Pressure sensor |
| EP1902789B1 (de) * | 2006-09-22 | 2014-03-19 | Baumer Electric AG | Ultraschallwandler und Ultraschallsensor |
| JP4839176B2 (ja) * | 2006-10-12 | 2011-12-21 | オリンパスメディカルシステムズ株式会社 | 超音波トランスデューサ及び超音波診断装置 |
| JP4271252B2 (ja) * | 2006-10-12 | 2009-06-03 | オリンパスメディカルシステムズ株式会社 | 超音波振動子セル、超音波振動子エレメント、超音波振動子アレイ及び超音波診断装置 |
| CN101662989B (zh) * | 2006-11-03 | 2013-10-30 | 研究三角协会 | 使用挠曲模式压电换能器的增强的超声成像探头 |
| JP2009244235A (ja) * | 2008-03-31 | 2009-10-22 | New Industry Research Organization | 水中用超音波アレイセンサ |
| KR101545271B1 (ko) * | 2008-12-19 | 2015-08-19 | 삼성전자주식회사 | 압전형 음향 변환기 및 이의 제조방법 |
| JP5724168B2 (ja) * | 2009-10-21 | 2015-05-27 | 株式会社リコー | 電気−機械変換素子とその製造方法、及び電気−機械変換素子を有する液滴吐出ヘッド、液滴吐出ヘッドを有する液滴吐出装置 |
| US8040020B2 (en) * | 2010-02-17 | 2011-10-18 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Encapsulated active transducer and method of fabricating the same |
| JP2012151583A (ja) | 2011-01-18 | 2012-08-09 | Yamaha Corp | 圧電型アクチュエータ |
| CN106269451B (zh) | 2011-02-15 | 2020-02-21 | 富士胶卷迪马蒂克斯股份有限公司 | 使用微圆顶阵列的压电式换能器 |
| US9612227B2 (en) * | 2012-10-31 | 2017-04-04 | Hitachi, Ltd. | Ultrasonic probe |
| US9815087B2 (en) * | 2013-12-12 | 2017-11-14 | Qualcomm Incorporated | Micromechanical ultrasonic transducers and display |
-
2014
- 2014-03-14 JP JP2016502833A patent/JP6297131B2/ja active Active
- 2014-03-14 US US14/212,707 patent/US10123775B2/en active Active
- 2014-03-14 WO PCT/US2014/028552 patent/WO2014152987A1/en not_active Ceased
- 2014-03-14 EP EP14768700.8A patent/EP2973767B1/en active Active
- 2014-03-14 CN CN201480014925.XA patent/CN105122488B/zh active Active
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