JP2016512792A5 - - Google Patents

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Publication number
JP2016512792A5
JP2016512792A5 JP2016502393A JP2016502393A JP2016512792A5 JP 2016512792 A5 JP2016512792 A5 JP 2016512792A5 JP 2016502393 A JP2016502393 A JP 2016502393A JP 2016502393 A JP2016502393 A JP 2016502393A JP 2016512792 A5 JP2016512792 A5 JP 2016512792A5
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JP
Japan
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time
laser
route sequence
turning
beam position
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JP2016502393A
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English (en)
Japanese (ja)
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JP2016512792A (ja
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Priority claimed from PCT/US2014/027275 external-priority patent/WO2014152380A1/en
Publication of JP2016512792A publication Critical patent/JP2016512792A/ja
Publication of JP2016512792A5 publication Critical patent/JP2016512792A5/ja
Pending legal-status Critical Current

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JP2016502393A 2013-03-15 2014-03-14 Ａｏｄラウト加工用レーザシステム及び方法 Pending JP2016512792A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361791361P 2013-03-15 2013-03-15
US61/791,361 2013-03-15
PCT/US2014/027275 WO2014152380A1 (en) 2013-03-15 2014-03-14 Laser systems and methods for aod rout processing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019010116A Division JP6773822B2 (ja) 2013-03-15 2019-01-24 Ａｏｄラウト加工用レーザシステム及び方法

Publications (2)

Publication Number Publication Date
JP2016512792A JP2016512792A (ja) 2016-05-09
JP2016512792A5 true JP2016512792A5 (https=) 2017-04-20

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ID=51522871

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JP2016502393A Pending JP2016512792A (ja) 2013-03-15 2014-03-14 Ａｏｄラウト加工用レーザシステム及び方法
JP2019010116A Active JP6773822B2 (ja) 2013-03-15 2019-01-24 Ａｏｄラウト加工用レーザシステム及び方法

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JP2019010116A Active JP6773822B2 (ja) 2013-03-15 2019-01-24 Ａｏｄラウト加工用レーザシステム及び方法

Country Status (6)

Country Link
US (1) US9931713B2 (https=)
JP (2) JP2016512792A (https=)
KR (1) KR102245810B1 (https=)
CN (1) CN105102169B (https=)
TW (1) TWI632013B (https=)
WO (1) WO2014152380A1 (https=)

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KR20250037607A (ko) * 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
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TWI892641B (zh) 2019-01-31 2025-08-01 美商伊雷克托科學工業股份有限公司 光學系統
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WO2022271483A1 (en) * 2021-06-21 2022-12-29 Electro Scientific Industries, Inc. Laser processing apparatus including beam analysis system and methods of measurement and control of beam characteristics

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