JP2016509132A5 - - Google Patents
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- JP2016509132A5 JP2016509132A5 JP2015555085A JP2015555085A JP2016509132A5 JP 2016509132 A5 JP2016509132 A5 JP 2016509132A5 JP 2015555085 A JP2015555085 A JP 2015555085A JP 2015555085 A JP2015555085 A JP 2015555085A JP 2016509132 A5 JP2016509132 A5 JP 2016509132A5
- Authority
- JP
- Japan
- Prior art keywords
- precipitate
- solid solution
- producing
- copper alloy
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002244 precipitate Substances 0.000 claims description 36
- 239000006104 solid solution Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 10
- 239000002905 metal composite material Substances 0.000 claims description 9
- 230000032683 aging Effects 0.000 claims description 7
- 230000001413 cellular effect Effects 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000001556 precipitation Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 241000446313 Lamella Species 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 11
- 239000000203 mixture Substances 0.000 claims 3
- 229910052759 nickel Inorganic materials 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000010587 phase diagram Methods 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 238000000265 homogenisation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130006993A KR101274063B1 (ko) | 2013-01-22 | 2013-01-22 | 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법 |
KR10-2013-0006993 | 2013-01-22 | ||
PCT/KR2013/001163 WO2014115920A1 (ko) | 2013-01-22 | 2013-02-14 | 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016509132A JP2016509132A (ja) | 2016-03-24 |
JP2016509132A5 true JP2016509132A5 (enrdf_load_stackoverflow) | 2016-12-28 |
JP6209621B2 JP6209621B2 (ja) | 2017-10-04 |
Family
ID=48866864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015555085A Active JP6209621B2 (ja) | 2013-01-22 | 2013-02-14 | 配向された析出物を有する金属複合材料及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20150354048A1 (enrdf_load_stackoverflow) |
JP (1) | JP6209621B2 (enrdf_load_stackoverflow) |
KR (1) | KR101274063B1 (enrdf_load_stackoverflow) |
WO (1) | WO2014115920A1 (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101708285B1 (ko) * | 2015-07-29 | 2017-02-20 | 창원대학교 산학협력단 | 배향형 석출물을 포함하는 금속복합재료 및 이의 제조 방법 |
JP6695570B2 (ja) * | 2015-10-02 | 2020-05-20 | 大同特殊鋼株式会社 | 時効硬化型ベイナイト非調質鋼を用いた部品の製造方法 |
KR101760076B1 (ko) * | 2016-06-09 | 2017-07-24 | 한국기계연구원 | 석출물을 포함하는 강도와 연신율이 향상된 알루미늄-아연 합금 및 이의 제조방법 |
KR102012952B1 (ko) | 2019-01-15 | 2019-08-21 | (주)일광주공 | 알루미늄 합금 및 그 제조방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728372A (en) * | 1985-04-26 | 1988-03-01 | Olin Corporation | Multipurpose copper alloys and processing therefor with moderate conductivity and high strength |
JP2869859B2 (ja) * | 1995-10-09 | 1999-03-10 | 科学技術庁金属材料技術研究所長 | 高強度導電性Cr含有銅合金とその製造方法 |
JPH11264040A (ja) * | 1998-03-18 | 1999-09-28 | Nippon Mining & Metals Co Ltd | 銅合金箔 |
JP2000096199A (ja) * | 1998-09-22 | 2000-04-04 | Nippon Mining & Metals Co Ltd | 銅合金箔 |
US7182823B2 (en) * | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
JP4779100B2 (ja) * | 2004-12-13 | 2011-09-21 | Dowaメタルテック株式会社 | 銅合金材料の製造法 |
JP2008056974A (ja) * | 2006-08-30 | 2008-03-13 | Nikko Kinzoku Kk | 熱間加工性に優れた銅合金 |
JP4143662B2 (ja) | 2006-09-25 | 2008-09-03 | 日鉱金属株式会社 | Cu−Ni−Si系合金 |
JP4418028B2 (ja) * | 2007-03-30 | 2010-02-17 | 日鉱金属株式会社 | 電子材料用Cu−Ni−Si系合金 |
US20110223056A1 (en) * | 2007-08-07 | 2011-09-15 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy sheet |
JP5630002B2 (ja) * | 2008-11-17 | 2014-11-26 | Jfeスチール株式会社 | 引張強さが1500MPa以上の高強度鋼板およびその製造方法 |
EP2371976B1 (en) * | 2008-12-01 | 2014-10-22 | JX Nippon Mining & Metals Corporation | Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor |
JP5578827B2 (ja) | 2009-10-13 | 2014-08-27 | Dowaメタルテック株式会社 | 高強度銅合金板材およびその製造方法 |
EP2508634B1 (en) * | 2009-12-02 | 2017-08-23 | Furukawa Electric Co., Ltd. | Method for producing a copper alloy sheet material having low young's modulus |
CN102695811B (zh) * | 2009-12-02 | 2014-04-02 | 古河电气工业株式会社 | 铜合金板材及其制造方法 |
JP5048046B2 (ja) * | 2009-12-14 | 2012-10-17 | Jx日鉱日石金属株式会社 | 電子機器用銅合金 |
JP4677505B1 (ja) * | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
CN102822364A (zh) * | 2010-04-02 | 2012-12-12 | Jx日矿日石金属株式会社 | 电子材料用Cu-Ni-Si系合金 |
JP5961335B2 (ja) * | 2010-04-05 | 2016-08-02 | Dowaメタルテック株式会社 | 銅合金板材および電気・電子部品 |
JP4830048B1 (ja) * | 2010-07-07 | 2011-12-07 | 三菱伸銅株式会社 | 深絞り加工性に優れたCu−Ni−Si系銅合金板及びその製造方法 |
JP5441876B2 (ja) * | 2010-12-13 | 2014-03-12 | Jx日鉱日石金属株式会社 | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 |
CN104011236B (zh) * | 2011-12-22 | 2016-03-16 | 三菱伸铜株式会社 | 模具耐磨性及剪切加工性良好的Cu-Ni-Si系铜合金板及其制造方法 |
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2013
- 2013-01-22 KR KR1020130006993A patent/KR101274063B1/ko active Active
- 2013-02-14 US US14/762,772 patent/US20150354048A1/en not_active Abandoned
- 2013-02-14 WO PCT/KR2013/001163 patent/WO2014115920A1/ko active Application Filing
- 2013-02-14 JP JP2015555085A patent/JP6209621B2/ja active Active