JP2016507645A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016507645A5 JP2016507645A5 JP2015548616A JP2015548616A JP2016507645A5 JP 2016507645 A5 JP2016507645 A5 JP 2016507645A5 JP 2015548616 A JP2015548616 A JP 2015548616A JP 2015548616 A JP2015548616 A JP 2015548616A JP 2016507645 A5 JP2016507645 A5 JP 2016507645A5
- Authority
- JP
- Japan
- Prior art keywords
- distribution showerhead
- substrate
- dielectric material
- showerhead
- vapor distribution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12198692.1A EP2747122B1 (en) | 2012-12-20 | 2012-12-20 | Plasma enhanced deposition arrangement for evaporation of dielectric materials, deposition apparatus and methods of operating thereof |
| EP12198692.1 | 2012-12-20 | ||
| PCT/EP2013/077575 WO2014096303A1 (en) | 2012-12-20 | 2013-12-20 | Plasma enhanced deposition arrangement for evaporation of dielectric materials, deposition apparatus and methods of operating thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016507645A JP2016507645A (ja) | 2016-03-10 |
| JP2016507645A5 true JP2016507645A5 (enExample) | 2017-02-09 |
| JP6456841B2 JP6456841B2 (ja) | 2019-01-23 |
Family
ID=47632733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015548616A Expired - Fee Related JP6456841B2 (ja) | 2012-12-20 | 2013-12-20 | 誘電体材料蒸発のためのプラズマ強化堆積設備、堆積装置及びその操作方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150284841A1 (enExample) |
| EP (1) | EP2747122B1 (enExample) |
| JP (1) | JP6456841B2 (enExample) |
| KR (1) | KR20150099577A (enExample) |
| CN (1) | CN104838467B (enExample) |
| TW (1) | TWI607102B (enExample) |
| WO (1) | WO2014096303A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449216B (zh) * | 2015-11-18 | 2018-10-23 | 何整风 | 一种锂电池 |
| CN112458404A (zh) * | 2016-05-10 | 2021-03-09 | 应用材料公司 | 操作沉积设备的方法和沉积设备 |
| WO2017198297A1 (en) * | 2016-05-18 | 2017-11-23 | Applied Materials, Inc. | Apparatus and method for transportation of a deposition source |
| EP3374540A1 (en) * | 2017-01-31 | 2018-09-19 | Applied Materials, Inc. | Material deposition arrangement, vacuum deposition system and method therefor |
| WO2020251696A1 (en) | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| CN119800292B (zh) * | 2024-12-20 | 2025-06-17 | 合肥致真精密设备有限公司 | 一种电子束蒸发镀膜设备及其应用方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5628829A (en) * | 1994-06-03 | 1997-05-13 | Materials Research Corporation | Method and apparatus for low temperature deposition of CVD and PECVD films |
| JP2001200361A (ja) * | 2000-01-19 | 2001-07-24 | Mitsubishi Heavy Ind Ltd | 高温真空蒸着装置における観測装置 |
| WO2001090438A1 (en) * | 2000-05-23 | 2001-11-29 | University Of Virginia Patent Foundation | A process and apparatus for plasma activated deposition in a vacuum |
| US20030045098A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
| JP4013859B2 (ja) * | 2003-07-17 | 2007-11-28 | 富士電機ホールディングス株式会社 | 有機薄膜の製造装置 |
| WO2009023744A1 (en) * | 2007-08-13 | 2009-02-19 | University Of Virginia Patent Foundation | Thin film battery synthesis by directed vapor deposition |
| EP2128303B1 (en) * | 2008-05-30 | 2013-03-13 | Applied Materials, Inc. | Arrangement for coating a substrate |
| US20100267191A1 (en) * | 2009-04-20 | 2010-10-21 | Applied Materials, Inc. | Plasma enhanced thermal evaporator |
| CN103385035B (zh) * | 2011-03-14 | 2016-02-17 | 夏普株式会社 | 蒸镀颗粒射出装置和蒸镀装置以及蒸镀方法 |
| US9130238B2 (en) * | 2011-06-10 | 2015-09-08 | Applied Materials, Inc. | Methods of and hybrid factories for thin-film battery manufacturing |
-
2012
- 2012-12-20 EP EP12198692.1A patent/EP2747122B1/en not_active Not-in-force
-
2013
- 2013-12-18 TW TW102146965A patent/TWI607102B/zh not_active IP Right Cessation
- 2013-12-20 US US14/646,680 patent/US20150284841A1/en not_active Abandoned
- 2013-12-20 JP JP2015548616A patent/JP6456841B2/ja not_active Expired - Fee Related
- 2013-12-20 KR KR1020157019436A patent/KR20150099577A/ko not_active Withdrawn
- 2013-12-20 CN CN201380063812.4A patent/CN104838467B/zh not_active Expired - Fee Related
- 2013-12-20 WO PCT/EP2013/077575 patent/WO2014096303A1/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6456841B2 (ja) | 誘電体材料蒸発のためのプラズマ強化堆積設備、堆積装置及びその操作方法 | |
| KR102494630B1 (ko) | 증발기, 증착 배열체, 증착 장치 및 이들의 작동 방법들 | |
| JP2016507645A5 (enExample) | ||
| KR102137181B1 (ko) | 증착 배열체, 증착 장치 및 그의 동작 방법들 | |
| US20100206713A1 (en) | PZT Depositing Using Vapor Deposition | |
| WO2015134108A1 (en) | Ion beam sputter deposition assembly, sputtering system, and sputter method of physical vapor deposition | |
| KR101323249B1 (ko) | 초전도 선재 제조장치 및 제조방법 | |
| KR20180047087A (ko) | 유도 가열 증발 증착 장치 | |
| JP7572475B2 (ja) | 真空チャンバ内で基板をコーティングするための気相堆積装置及び方法 | |
| JP2003231963A (ja) | 真空蒸着方法とその装置 | |
| KR20180057601A (ko) | 유도 가열 증발 증착 장치 | |
| KR20140131916A (ko) | 기판 위에 lipon 층을 증착하기 위한 방법 | |
| TW201718917A (zh) | 使用電漿作為間接加熱媒介之氣相沉積裝置及方法 | |
| JP2005281726A (ja) | プラズマ成膜方法及びその装置 | |
| KR20220053651A (ko) | 열 증발 플라즈마 증착 | |
| KR102890153B1 (ko) | 진공 챔버에서 기판을 코팅하기 위한 기상 증착 장치 및 방법 | |
| JP2013136832A (ja) | スパッタガン及びこれを用いた成膜装置 | |
| JPH01119663A (ja) | 薄膜形成装置 | |
| WO2019096391A1 (en) | Method and apparatus for vapor depositing an insulation layer of metal oxide on a substrate | |
| JPH01242773A (ja) | 化合物薄膜の製造方法とその製造装置 |