JP6456841B2 - 誘電体材料蒸発のためのプラズマ強化堆積設備、堆積装置及びその操作方法 - Google Patents
誘電体材料蒸発のためのプラズマ強化堆積設備、堆積装置及びその操作方法 Download PDFInfo
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- JP6456841B2 JP6456841B2 JP2015548616A JP2015548616A JP6456841B2 JP 6456841 B2 JP6456841 B2 JP 6456841B2 JP 2015548616 A JP2015548616 A JP 2015548616A JP 2015548616 A JP2015548616 A JP 2015548616A JP 6456841 B2 JP6456841 B2 JP 6456841B2
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- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/0402—Methods of deposition of the material
- H01M4/0421—Methods of deposition of the material involving vapour deposition
- H01M4/0428—Chemical vapour deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/056—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes
- H01M10/0561—Accumulators with non-aqueous electrolyte characterised by the materials used as electrolytes, e.g. mixed inorganic/organic electrolytes the electrolyte being constituted of inorganic materials only
- H01M10/0562—Solid materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1391—Processes of manufacture of electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Health & Medical Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Secondary Cells (AREA)
- Battery Electrode And Active Subsutance (AREA)
Description
本発明の上記の特徴を詳細に理解することができるように、実施形態を参照することによって、上で簡単に概説した本発明のより具体的な説明を得ることができる。添付の図面は本発明の実施形態に関連し、以下の記述において説明される。
以上の説明は本発明の実施形態を対象としているが、本発明の基本的な範囲を逸脱することなく本発明の他の追加の実施形態を考案することができ、本発明の範囲は、添付の特許請求の範囲によって定められる。
Claims (16)
- 誘電体材料の蒸発のための堆積設備であって、
蒸気分配シャワーヘッドと、
前記誘電体材料を前記蒸気分配シャワーヘッドに提供するためのホルダであって、前記誘電体材料を前記蒸気分配シャワーヘッド内に供給するための供給ユニットを有するホルダと、
前記誘電体材料の蒸気は前記蒸気分配シャワーヘッド内で生成されるように前記誘電体材料を前記蒸気分配シャワーヘッドで融解及び蒸発させる、若しくは前記誘電体材料を前記蒸気分配シャワーヘッドで昇華させるように構成されるエネルギー源であって、前記蒸気分配シャワーヘッドは、気化した前記誘電体材料を基板に向けるための一つ又は複数の排気口を有する、エネルギー源と、
前記蒸気分配シャワーヘッドと前記基板との間にプラズマを提供するように構成されるプラズマ源と
を備え、
前記供給ユニットが前記誘電体材料を前記蒸気分配シャワーヘッド内に供給する第1の方向と、前記複数の排気口の配置の方向が断面方向から見て平行であり、かつ、前記第1の方向は、前記誘電体材料の蒸気を基板に送る第2の方向と垂直に交差する、堆積設備。 - 前記蒸気分配シャワーヘッドは、前記シャワーヘッド内の圧力が前記シャワーヘッドの外側よりも少なくとも1桁以上高くなるように、エンクロージャーと、前記エンクロージャーにおける前記一つまたは複数の排気口とを備える請求項1に記載の設備。
- 前記蒸気分配シャワーヘッドは、直線的蒸気分配シャワーヘッドである、請求項1または2に記載の設備。
- 前記蒸気分配シャワーヘッドは、細長い管又は直方体である、請求項1から3のいずれか一項に記載の設備。
- 前記ホルダは、るつぼであり、当該るつぼは、当該るつぼを冷却するための冷却要素を有する、請求項1から4の何れか一項に記載の設備。
- 前記プラズマ源は、前記蒸気分配シャワーヘッド及び対向電極にバイアスをかけることにより提供される、請求項1から5の何れか一項に記載の設備。
- 前記プラズマ源は、前記蒸気分配シャワーヘッドと前記基板との間に設けられる処理領域に提供される、請求項1から6の何れか一項に記載の設備。
- 前記プラズマ源は、遠隔プラズマ源である、請求項1から7の何れか一項に記載の設備。
- 前記誘電体材料は、Li3PO4又はLCOである、請求項1から8の何れか一項に記載の設備。
- 誘電体材料の蒸発のための及び誘電体材料の基板上への堆積のための堆積装置であって、
前記誘電体材料を前記基板上に堆積させるための真空チャンバと、
前記チャンバに提供される基板支持体と、
請求項1から9の何れか一項に記載の堆積設備と
を備える、堆積装置。 - 前記真空チャンバに設けられる基板支持体システムであって、前記基板又は前記真空チャンバの前記基板を運ぶキャリアの垂直支持のために構成される、基板支持体システム
を更に備える、請求項10に記載の装置。 - 誘電体材料を蒸発させる方法であって、
前記誘電体材料を蒸気分配シャワーヘッド内に供給することと、
前記誘電体材料の蒸気は前記蒸気分配シャワーヘッド内で生成されるように前記誘電体材料を前記蒸気分配シャワーヘッドで蒸発させる、または前記誘電体材料を前記蒸気分配シャワーヘッドで昇華させることと、
前記誘電体材料の蒸気を基板に向けることと
を含み、
前記誘電体材料を前記蒸気分配シャワーヘッド内に供給する第1の方向は、前記誘電体材料の蒸気を基板に送る第2の方向と垂直に交差する、方法。 - 前記蒸気分配シャワーヘッドは、1100℃から1500℃までの温度に加熱される、請求項12に記載の方法。
- 前記誘電体材料は、Li3PO4又はLCOである、請求項12又は13に記載の方法。
- 前記蒸気分配シャワーヘッドと前記基板との間にプラズマを提供すること
を更に含む、請求項12から14の何れか一項に記載の方法。 - 前記誘電体材料を前記蒸気分配シャワーヘッドで蒸発させる、または前記誘電体材料を前記蒸気分配シャワーヘッドで昇華させることは、電子の前記誘電体材料上への衝突を含み、前記電子の衝突は、電子銃により提供される、請求項12から15の何れか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12198692.1 | 2012-12-20 | ||
EP12198692.1A EP2747122B1 (en) | 2012-12-20 | 2012-12-20 | Plasma enhanced deposition arrangement for evaporation of dielectric materials, deposition apparatus and methods of operating thereof |
PCT/EP2013/077575 WO2014096303A1 (en) | 2012-12-20 | 2013-12-20 | Plasma enhanced deposition arrangement for evaporation of dielectric materials, deposition apparatus and methods of operating thereof |
Publications (3)
Publication Number | Publication Date |
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JP2016507645A JP2016507645A (ja) | 2016-03-10 |
JP2016507645A5 JP2016507645A5 (ja) | 2017-02-09 |
JP6456841B2 true JP6456841B2 (ja) | 2019-01-23 |
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JP2015548616A Expired - Fee Related JP6456841B2 (ja) | 2012-12-20 | 2013-12-20 | 誘電体材料蒸発のためのプラズマ強化堆積設備、堆積装置及びその操作方法 |
Country Status (7)
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US (1) | US20150284841A1 (ja) |
EP (1) | EP2747122B1 (ja) |
JP (1) | JP6456841B2 (ja) |
KR (1) | KR20150099577A (ja) |
CN (1) | CN104838467B (ja) |
TW (1) | TWI607102B (ja) |
WO (1) | WO2014096303A1 (ja) |
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CN105449216B (zh) * | 2015-11-18 | 2018-10-23 | 何整风 | 一种锂电池 |
EP3417085A1 (en) * | 2016-05-10 | 2018-12-26 | Applied Materials, Inc. | Methods of operating a deposition apparatus, and deposition apparatus |
CN109154066B (zh) * | 2016-05-18 | 2019-09-13 | 应用材料公司 | 用于运输沉积源的设备和方法 |
US20190338412A1 (en) * | 2017-01-31 | 2019-11-07 | Applied Materials, Inc. | Material deposition arrangement, vacuum deposition system and method therefor |
WO2020251696A1 (en) | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
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US5628829A (en) * | 1994-06-03 | 1997-05-13 | Materials Research Corporation | Method and apparatus for low temperature deposition of CVD and PECVD films |
JP2001200361A (ja) * | 2000-01-19 | 2001-07-24 | Mitsubishi Heavy Ind Ltd | 高温真空蒸着装置における観測装置 |
CA2411174C (en) * | 2000-05-23 | 2008-05-06 | James F. Groves | A process and apparatus for plasma activated deposition in a vacuum |
US20030045098A1 (en) * | 2001-08-31 | 2003-03-06 | Applied Materials, Inc. | Method and apparatus for processing a wafer |
JP4013859B2 (ja) * | 2003-07-17 | 2007-11-28 | 富士電機ホールディングス株式会社 | 有機薄膜の製造装置 |
US8784512B2 (en) * | 2007-08-13 | 2014-07-22 | University Of Virginia Patent Foundation | Thin film battery synthesis by directed vapor deposition |
EP2128303B1 (en) * | 2008-05-30 | 2013-03-13 | Applied Materials, Inc. | Arrangement for coating a substrate |
US20100267191A1 (en) * | 2009-04-20 | 2010-10-21 | Applied Materials, Inc. | Plasma enhanced thermal evaporator |
WO2012124564A1 (ja) * | 2011-03-14 | 2012-09-20 | シャープ株式会社 | 蒸着粒子射出装置および蒸着装置並びに蒸着方法 |
US9130238B2 (en) * | 2011-06-10 | 2015-09-08 | Applied Materials, Inc. | Methods of and hybrid factories for thin-film battery manufacturing |
-
2012
- 2012-12-20 EP EP12198692.1A patent/EP2747122B1/en not_active Not-in-force
-
2013
- 2013-12-18 TW TW102146965A patent/TWI607102B/zh not_active IP Right Cessation
- 2013-12-20 CN CN201380063812.4A patent/CN104838467B/zh not_active Expired - Fee Related
- 2013-12-20 KR KR1020157019436A patent/KR20150099577A/ko not_active Application Discontinuation
- 2013-12-20 US US14/646,680 patent/US20150284841A1/en not_active Abandoned
- 2013-12-20 JP JP2015548616A patent/JP6456841B2/ja not_active Expired - Fee Related
- 2013-12-20 WO PCT/EP2013/077575 patent/WO2014096303A1/en active Application Filing
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Publication number | Publication date |
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WO2014096303A1 (en) | 2014-06-26 |
EP2747122A1 (en) | 2014-06-25 |
TWI607102B (zh) | 2017-12-01 |
US20150284841A1 (en) | 2015-10-08 |
EP2747122B1 (en) | 2019-07-03 |
CN104838467A (zh) | 2015-08-12 |
TW201432072A (zh) | 2014-08-16 |
CN104838467B (zh) | 2018-01-19 |
JP2016507645A (ja) | 2016-03-10 |
KR20150099577A (ko) | 2015-08-31 |
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