JP2016207884A - Abnormality detection method and abnormality detection apparatus of bonding arm - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an abnormality detection method and an abnormality detection apparatus of a bonding arm, capable of accurately obtaining information of a collet tip portion without burying the information in the whole noise and capable of detecting abnormality of the bonding arm.SOLUTION: The abnormality detection method detects abnormality of the bonding arm when a chip is pushed up by push-up means, a collet engaged with a bonding arm tip is descended and the chip is adsorbed and picked up by the collet. Relative position coordinates of the collet from position coordinates of the push-up means when the chip is held by the collet and the push-up means are detected and a normal range region of the relative position coordinates is set from a plurality of relative position coordinates on the basis of a dispersion amount of the relative position coordinates. When the detected relative position coordinates are deviated from the normal range region, abnormality of the bonding arm is detected.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a bonding arm abnormality detection method and a bonding arm abnormality detection apparatus.

  In the manufacture of semiconductor devices, a chip bonding technique in which a wafer on which a large number of elements are fabricated is diced and separated into individual semiconductor chips, which are bonded one by one to a predetermined position such as a lead frame. Is adopted. A die bonder (pickup device) is used for this chip bonding (Patent Document 1).

  As shown in FIG. 4, such a die bonder observes a bonding arm (not shown) having a collet 3 that adsorbs a semiconductor chip 1 (hereinafter referred to as chip 1) at a pickup position 2 and a chip 1 at the pickup position 2. And a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position 6. At the pick-up position 2, the semiconductor wafer is divided into a large number of chips 1 and attached to an adhesive sheet 7 (dicing sheet) (see FIG. 5).

  The bonding arm holds the collet 3 at its tip, and can be moved between the pickup position 2 and the bonding position 6 via the conveying means. In the collet 3, the chip 1 at the pickup position 2 is vacuum-sucked through the suction hole opened in the lower end surface thereof, and the chip 1 is adsorbed on the lower end surface of the collet 3. If this vacuum suction (evacuation) is released, the chip 1 is detached from the collet 3.

  At the pickup position 2, as shown in FIG. 5, a stage 8 that receives the adhesive sheet 7 and a push-up pin 9 disposed in the stage 8 are provided. In such a case, the collet 3 is lowered from the upper position of the chip 1 as shown in FIG. 5A, and is brought into contact with and adsorbed to the chip 1 as shown in FIG. 5B. Thereafter, the push-up pin 9 that has been retracted by a predetermined amount from the upper surface 8a of the stage 8 is lifted, and the push-up pin 9 pushes up the chip 1 through the adhesive sheet 7 and is sucked by the collet 3. 1 is peeled from the pressure-sensitive adhesive sheet 7.

  The vertical movement of the bonding arm and the push-up pin 9 is driven by driving means such as a motor. At this time, a position detector such as an encoder detects the upper and lower positions of the bonding arm and the push-up pin 9, and the drive means drives while performing position control of the bonding arm and the push-up pin 9 based on the information.

  By the way, the collet 3 is normally held by a collet holder having a hole on the inner diameter side. That is, the collet is inserted into the hole of the collet holder, and the collet is fixed to the collet holder with screws or the like. In this case, for example, when there is an abnormality in the collet, such as when the insertion of the collet into the collet holder is not sufficient, when the screw tightening is insufficient, when the screw loosens during operation, or when the grease breaks out. The bottom dead center position of the collet is 100 μm to 200 μm, and in some cases, a deviation of about 1 mm may occur. If such a bottom dead center shift occurs, the pickup operation cannot be performed stably, and defects such as chip cracking may occur, resulting in poor bonding quality.

  For this reason, methods for detecting abnormalities in driven parts such as arms have been proposed (Patent Documents 2 and 3). The thing of patent document 2 sets the threshold value of the frequency which should determine with abnormality for every site | part of a to-be-driven part. Then, frequency conversion is performed from the position information of the servo motor, and if the frequency is greater than or equal to one of the threshold values, it is determined that there is an abnormality in the part corresponding to the threshold value. Further, in Patent Document 3, an acceleration sensor is provided at the tip of an arm, and a secular change and a failure of a transmission system (decelerator, belt, pulley) are detected based on a value detected by the acceleration sensor.

JP 2000-68296 A JP2013-81282A JP 2010-64232 A

  In the die bonder, in order to stably perform the pickup operation, it is effective to acquire information on the collet tip portion that is a work point. The method described in Patent Document 2 measures a frequency with a current sensor or a motor encoder, and can detect abnormality of a ball screw, abnormality of a control unit, and the like. However, when the work point behavior information is buried in the entire noise, only the work point information cannot be obtained. In addition, a threshold value needs to be set in advance before operating the apparatus.

  When a separate sensor is provided as in Patent Document 3, since the work point is very light and small, the sensor itself needs to be light and small. However, providing such a sensor separately increases the cost. Moreover, since the bonding arm reciprocates between the pickup position and the bonding position at high speed, the bonding arm gradually expands during operation, and the normal area of the bottom dead center changes with time according to the thermal expansion. However, it is not possible to cope with changes in the bottom dead center over time only by providing a sensor and detecting the position of the work point. For this reason, when the position of the detected work point is deviated, there is a risk that it is erroneously detected that it is due to a defect in the tip of the arm (abnormal) even if the deviation is normally in the normal range (no abnormality). There is.

  Therefore, in view of such circumstances, the present invention can accurately obtain information on the tip of the collet without being buried in the entire noise, and can detect an abnormality in the bonding arm and an abnormality in the bonding arm. A detection device is to be provided.

  In the bonding arm abnormality detection method of the present invention, the chip is pushed up by the push-up means, the collet provided at the tip of the bonding arm is lowered, and the bonding arm abnormality occurs when the chip is adsorbed and piped up by this collet. A detection method that detects a relative position coordinate of a collet with respect to a position coordinate of a push-up means when a chip is sandwiched between the collet and the push-up means, and based on a variation amount of the relative position coordinates from a plurality of relative position coordinates. Thus, the normal range area of the relative position coordinates is set, and when the detected relative position coordinates deviate from the normal range area, the bonding arm is abnormal.

  According to the abnormality detection method for a bonding arm of the present invention, the contact between the collet and the push-up means via the tip makes it possible to detect the position coordinates of the push-up means when the tip is sandwiched between the collet and the push-up means. Detects the relative position coordinates of the collet. That is, by using the position information of the push-up means that is low in speed and small in movement and having little thermal change, and detecting the relative position coordinates of the collet tip that is the work point based on the position coordinates of the push-up means The bottom dead center position of the work point can be detected stably. Thereby, the positional information of the collet tip part with more severe operating conditions can be obtained. In this case, since a sensor (position sensor used for driving the bonding arm and the push-up means) necessary for the pickup that is normally provided can be used, there is no need to separately provide a sensor for obtaining position information of the collet tip. In addition, since the normal range can be set while operating the apparatus, it is not necessary to set the normal range in advance.

  In the above configuration, the collet does not move up and down in response to an impact, and the push-up means is pushed up in advance, and when the collet comes into contact with the chip when the collet is lowered, the push-up means is lowered. It is possible to reduce the impact of the collet on the chip. In general, the collet has a relief mechanism for alleviating the impact when it comes into contact with the chip. If this escape mechanism is omitted, the collet can be prevented from moving up and down when the bonding arm is stationary. For this reason, the relative position coordinate of the collet with respect to the position coordinate of the lifting means when the chip is sandwiched between the collet and the lifting means can be accurately detected.

  In the above configuration, the normal range can be corrected from the change with time of the relative position coordinates. In this case, an approximate straight line is obtained from a plurality of relative position coordinates, and when the approximate straight line has an inclination, the normal range area can be corrected so as not to have an inclination. As a result, even if the bonding arm is thermally expanded and the bottom dead center changes with time, the influence of the thermal expansion can be ignored and an abnormality at the tip of the bonding arm can be accurately detected.

  In the above configuration, the cause of the abnormality of the bonding arm can be specified based on the relative position coordinates.

  In the bonding arm abnormality detection device of the present invention, the chip is pushed up by the pushing-up means, the collet provided at the tip of the bonding arm is lowered, and the bonding arm abnormality is detected when the chip is adsorbed and piped up by this collet. A detection device that detects the position of the tip of the collet while driving the bonding arm and the push-up drive that drives the push-up while detecting the position of the tip of the push-up means And a control means for controlling the arm drive means and the push-up drive means, wherein the control means is a relative position coordinate of the collet with respect to a position coordinate of the push-up means when the chip is sandwiched between the collet and the push-up means. Based on the relative position coordinate variation from the relative position coordinate detection unit and multiple relative position coordinates. A normal range area setting unit for setting the normal range area coordinates, the detected relative position coordinates, in which a failure detection unit for a malfunction occurs in the bonding arm when deviating from the normal range area.

  The said structure WHEREIN: The said normal range area setting part may be provided with the correction | amendment part which correct | amends a normal range area from the time-dependent change of the said relative position coordinate. In this case, the correction unit may obtain an approximate straight line from a plurality of relative position coordinates, and correct the normal range so as not to have an inclination when the approximate straight line has an inclination.

  The said structure WHEREIN: You may provide the abnormality specific part which specifies the abnormality cause of a bonding arm based on a relative position coordinate.

  In the present invention, it is possible to accurately obtain information on the tip of the collet without being buried in the entire noise, and it is possible to detect an abnormality in the bonding arm.

It is a block diagram which shows the abnormality detection apparatus of the bonding arm of this invention. It is explanatory drawing which shows the procedure of the pick-up of a chip | tip. It is a graph which shows the time-dependent change of the relative position coordinate of a collet, (a) is before normal range correction | amendment, (b) is during correction of a normal range, (c) is after correction | amendment of a normal range. It is a simplified diagram showing the whole pickup method. It is a simplified sectional view showing a conventional pickup device.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  The abnormality detection apparatus for a bonding arm according to the present invention detects an abnormality at the tip (collet) of the bonding arm particularly when the chip is adsorbed and piped up by a collet provided at the tip of the bonding arm.

  As shown in FIG. 1, at the pickup position 12, the semiconductor wafer is divided into a large number of chips 11 and attached to an adhesive sheet 17 (dicing sheet). A collet 13 is provided at the tip of the bonding arm (not shown), and the bonding arm picks up the chip 11 cut out from the wafer with the collet 13 at the pickup position 12 and bonds the substrate such as a lead frame (not shown). To (load).

  The bonding arm can be moved up and down at the pickup position 12 and the bonding position and reciprocated between the pickup position 12 and the bonding position by the arm driving means 20. The arm driving unit 20 includes a driving mechanism 21 and a position detection unit 22. The drive mechanism 21 moves the bonding arm in the vertical and horizontal directions, and can be configured by various mechanisms such as a ball screw mechanism, a cylinder mechanism, and a motor linear mechanism. The position detection unit 22 can detect the vertical position coordinates of the tip of the collet 13 and can be configured by various position detection mechanisms such as an encoder and a linear motor. The arm driving means 20 including the driving mechanism 21 and the position detection unit 22 is controlled by the control means 30 described later to drive the bonding arm up and down while detecting the vertical position of the tip of the collet 13. Is done.

  The collet 13 is formed with a suction hole for suction that opens at the lower end surface (suction surface), and a vacuum generator (not shown) is connected to the suction hole. By driving the vacuum generator, air in the suction hole is sucked, the chip 11 is sucked by vacuum, and the chip 11 is sucked to the lower end surface of the collet 13. When this vacuum suction (evacuation) is released, the chip 11 is detached from the collet 13. As the vacuum generator, for example, an ejector type that controls the opening and closing of high-pressure air and discharges it from the nozzle to the diffuser to generate a negative pressure in the diffusion chamber can be adopted.

  The collet 13 is configured not to move up and down in response to an impact. In general, the collet has a relief mechanism for alleviating the impact when it comes into contact with the chip. In the present embodiment, since this escape mechanism is omitted, the vertical movement of the collet 13 can be suppressed when the bonding arm is stationary.

  The pickup position 12 includes a stage 23 that receives the adhesive sheet 17 and a push-up means (push-up pin) 24 disposed on the stage 23. In this case, the stage 23 does not move up and down, and the push-up pin 24 moves up and down by the push-up drive means 25. The push-up drive unit 25 includes a drive mechanism 26 and a position detection unit 27. The drive mechanism 26 moves the push-up pin 24 up and down, and can be constituted by, for example, a ball screw mechanism, a cylinder mechanism, a motor linear mechanism, or the like. The position detection unit 27 can detect the vertical position coordinates of the tip of the push-up pin 24 and can be configured by various position detection mechanisms such as an encoder and a linear motor. The push-up drive means 25 including the drive mechanism 26 and the position detection unit 27 drives the push-up pin 24 up and down while detecting the vertical position of the tip of the push-up pin 24 by the control means 30 described later. Controlled.

  As described above, the arm driving unit 20 and the push-up driving unit 25 are controlled by the control unit 30. The control means 30 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The ROM stores programs executed by the CPU and data.

  The control unit 30 (program executed by the control unit 30) includes an arm operation command unit 31a, a push-up operation command unit 31b, a relative position coordinate detection unit 32, a normal range setting unit 33, and a correction unit 34. The abnormality detection unit 35 and the abnormality identification unit 36 are provided.

  The arm operation command unit 31a includes a deviation counter (not shown) that counts droop pulses (generated due to a delay of the feedback pulse with respect to the command pulse), and moves the bonding arm based on a command value from the controller 29. The drive mechanism 21 is driven so that the drive mechanism 21 operates in order to move the direction, acceleration, and speed at the command values. The push-up operation command unit 31b includes a deviation counter (not shown) that counts droop pulses (generated due to the delay of the feedback pulse with respect to the command pulse), and based on the command value from the controller 29, the push-up pin 24 The drive mechanism 26 is driven so that the drive mechanism 26 operates in order for the movement direction, acceleration, and speed to move at the command values.

  The relative position coordinate detection unit 32 detects the relative position coordinate of the collet 13 with respect to the position coordinate of the push-up pin 24 when the chip 11 is sandwiched between the collet 13 and the push-up pin 24. The pinch detection uses the push pin side position detection unit 27. That is, after setting a torque limit on the push-up pin 24, the push-up pin 24 is operated. Since a torque limit is set for the push-up pin 24, when the push-up pin 24 and the collet 13 come into contact with each other via the tip 11, the push-up pin 24 cannot generate more than a specified torque, and stops on the spot. Deviations accumulate in the deviation counter of the operation command unit 31b. From the amount of the deviation, it can be seen that the chip 11 is sandwiched between the collet 13 and the push-up pin 24. At this time, the position detection units 22 and 27 detect the vertical position coordinates of the tip portion of the collet 13 and the vertical position coordinates of the tip portion of the push-up pin 24, and from these information, the relative position coordinate detection unit 32 The relative position coordinates of the collet 13 with respect to the position coordinates of the push-up pin 24 are calculated.

  The normal range setting unit 33 sets a normal range H (see FIG. 3C) of relative position coordinates. Relative position coordinates usually vary (varies) every time they are detected. Therefore, it is necessary to set the relative position coordinates that should not be abnormal as a certain range (a range of variation that can be tolerated if there is no abnormality). In the present invention, this range is referred to as a normal range H. The normal range area H can be set based on the amount of variation from a plurality of relative position coordinates. For example, the normal range area setting unit 33 calculates an average value (μ) and a standard deviation (σ) of a plurality of relative position coordinates, and if the normal range area H is set to μ ± σ, μ ± σ is calculated. Calculate. The user sets in advance the setting of the normal range H (that is, how much variation should be allowed as no abnormality). The normal range setting unit 33 further includes a correction unit 34.

  The correction unit 34 corrects the normal range H from the change with time of the relative position coordinates. For example, as shown in FIG. 3A, when the relative position coordinate is gradually changed as a whole, this change is greatly influenced by the thermal expansion of the bonding arm, and the relative position is maintained thereafter. The coordinates are predicted to show a change trend overall. Therefore, the correction unit 34 obtains an approximate line from a plurality of relative position coordinates as shown in FIG. 3B, and when the approximate line has an inclination, as shown in FIG. The normal range H is corrected so as not to have. As a result, even if the bonding arm is thermally expanded and the bottom dead center changes with time, the influence of the thermal expansion can be ignored and an abnormality at the tip of the bonding arm can be accurately detected.

  The abnormality detection unit 35 is configured such that the relative position coordinate detected by the relative position coordinate detection unit 32 is within the normal range H set by the normal range setting unit 33 (within a range of variation that can be accepted as having no abnormality). If there is, there is no abnormality in the bonding arm, and if it is outside the normal range H, it is determined that there is an abnormality in the bonding arm.

  The abnormality identification unit 36 identifies the cause of abnormality of the bonding arm based on the relative position coordinates. That is, the abnormality detection unit 35 detects the presence or absence of an abnormality, and further automatically identifies the cause of the abnormality from the relative position coordinates determined to be abnormal by the abnormality detection unit 35. For example, the threshold value of the relative position coordinate is preset for each cause of the abnormality and stored in the control unit 30. The abnormality specifying unit 36 associates the threshold value with which the relative position coordinate corresponds, and the threshold value. Automatically identify the cause of the problem.

  Connected to the control means 30 is a display means 40 for displaying the detected data (for example, relative position coordinate values, a graph as shown in FIG. 3 and the like). The display means 40 is composed of, for example, a liquid crystal display.

  A bonding arm abnormality detection method using the bonding arm abnormality detection apparatus of the present invention will be described. As shown in FIG. 2A, the push-up pin 24 is raised to bring the chip 11 to be picked up from the stage 23, and the collet 13 is lowered. At this time, as shown in FIG. 2B, the collet 13 is dimensioned slightly above the chip 11 (for example, the gap between the collet 13 and the chip 11 is about 2 to 10 μm). In this embodiment, since the escape mechanism on the collet 13 side is omitted, the vertical movement of the collet 13 can be suppressed when the bonding arm is stationary. In this way, as will be described later, the relative position coordinate of the collet 13 with respect to the position coordinate of the push-up pin 24 when the chip 11 is sandwiched between the collet 13 and the push-up pin 24 can be accurately detected.

  In addition, even if the collet 13 contacts the chip 11 in FIG. 2B, the push-up pin 24 is in a state of being pushed up in advance, so that the push-up pin 24 is lowered when the collet 13 contacts the chip 11. Thus, the impact on the chip 11 from the collet 13 can be reduced. That is, by pushing up the push-up pin 24 in advance, the push-up pin 24 also functions as a relief mechanism.

  When the push-up pin 24 is raised, the chip 11 is sandwiched between the collet 13 and the push-up pin 24 as shown in FIG. The position detection units 22 and 27 detect the vertical position coordinates of the tip portion of the collet 13 and the vertical position coordinates of the tip portion of the push-up pin 24 at this time, and from these information, the relative position coordinate detection unit 32 The relative position coordinates of the collet 13 with respect to the position coordinates of the push-up pin 24 are calculated. This data is sent to the normal range setting unit 33 and the abnormality detection unit 35. Thereafter, as shown in FIG. 2 (d), the collet 13 and the push-up pin 24 are raised and synchronously pushed up, so that the push-up pin 24 breaks the adhesive sheet 17 and raises the collet 13 to raise the collet. The chip 11 adsorbed at 13 is peeled off from the adhesive sheet 17 and picked up. After picking up, the chip 11 is bonded to the bonding position.

  As described above, when the relative position coordinate of the collet 13 is detected every time the chip 11 is picked up, the relative position coordinate data is accumulated in the normal range setting unit 33. The normal range area setting unit 33 sets the normal range area H of the relative position coordinates from the plurality of relative position coordinates based on the variation amount of the relative position coordinates by the above method. In this case, when the relative position coordinates gradually change as a whole, the correction unit 34 corrects the normal range area.

  The abnormality detection unit 35 determines that there is no abnormality in the bonding arm if the relative position coordinate detected by the relative position coordinate detection unit 32 is within the normal range H set by the normal range setting unit 33. If it is off from H, it is determined that there is an abnormality in the bonding arm. Furthermore, the abnormality specifying unit 36 specifies the cause of the abnormality of the bonding arm based on the relative position coordinates determined to be abnormal.

  The bonding arm abnormality detection apparatus and bonding arm abnormality detection method according to the present invention uses the fact that the collet 13 and the push-up pin 24 are in contact with each other via the chip 11, so that the chip 11 is moved by the collet 13 and the push-up pin 24. The relative position coordinates of the collet 13 with respect to the position coordinates of the push-up pin 24 when sandwiched are detected. That is, the relative position coordinates of the collet tip, which is the work point, are detected with reference to the position coordinates of the push-up pin 24 by using the position information of the push-up pin 24 that is low in speed and has a small amount of movement and thus has little thermal change. Thus, the bottom dead center position of the work point can be detected stably. As a result, it is possible to obtain position information of the collet tip that is more severe in operating conditions, so it is possible to accurately obtain information on the collet tip without being buried in the entire noise, and to detect an abnormality in the bonding arm. .

  Further, since a sensor (position sensor used for driving the bonding arm and push-up pin 24) necessary for the pickup that is normally provided can be used, there is no need to separately provide a sensor for obtaining position information of the collet tip. In addition, since the normal range can be set while operating the apparatus, it is not necessary to set the normal range in advance.

  As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the relative position coordinates may not be detected every bonding cycle. The detection may be performed every predetermined cycle or may be detected every predetermined time. Further, the normal range area may be set based on all the data of the relative position coordinates, or the normal range area may be set based on a part of the data of the relative position coordinates. For example, among the detected relative position coordinates, the normal range area may be set based on the relative position coordinates every predetermined number of times, or the normal range area may be set based on the relative position coordinates every predetermined time. . Furthermore, for example, after performing the first pick-up, after performing a predetermined number of bonding cycles, or after a predetermined time has elapsed, the normal range area is determined based only on the relative position coordinates detected during a certain period. It may be set.

  In the embodiment, μ ± σ of the normal range H is an example, and the range can be arbitrarily set by the user, such as μ ± 2σ, μ ± 3σ,. Further, the calculation method for the normal range H may not be based on the average value and the standard deviation. For example, the setting method of the normal range area H can be arbitrarily set by the user, such as setting the specific numerical range of the relative position coordinates to the normal range area H.

  The presence / absence of an abnormality may be detected every time the pickup is performed, or the presence / absence of an abnormality may be detected every predetermined number of times or every predetermined time. Further, for example, the presence / absence of an abnormality may be detected only for a part of the period after the first pick-up and after a predetermined number of bonding cycles or after a predetermined time has elapsed.

  The abnormality specifying unit 36 may be omitted, and the user may specify the cause of the abnormality. Further, the display means 40 may be omitted. Further, the correction unit 34 can be omitted when the relative position coordinates are difficult to change with time, such as being hardly affected by thermal expansion.

  Although it is desirable not to have a relief mechanism for the collet 13 in terms of suppressing vibration when stationary, it may be provided as in the prior art. Further, in the stage before the collet 13 is lowered, the position of the tip of the push-up pin 24 does not necessarily protrude from the stage 23 (however, if the escape mechanism on the collet 13 side is omitted). It may be substantially the same as the upper surface of the stage 23, or may be lower than the upper surface of the stage 23.

11 Chip 13 Collet 20 Arm drive means 24 Push-up means 25 Push-up drive means 30 Control means 32 Relative position coordinate detection part 33 Normal range setting part 34 Correction part 35 Abnormality detection part 36 Abnormality detection part H Normal range area

Claims (9)

A method of detecting an abnormality in a bonding arm when a chip is pushed up by a push-up means, a collet provided at the tip of the bonding arm is lowered, and the chip is adsorbed and piped up by the collet,
The relative position coordinates of the collet with respect to the position coordinates of the lifting means when the chip is sandwiched between the collet and the lifting means are detected, and the relative position coordinates of the relative position coordinates are determined based on the amount of variation of the relative position coordinates. Set the normal range,
An abnormality detection method for a bonding arm, characterized in that an abnormality is detected in the bonding arm when the detected relative position coordinate is out of the normal range.   The collet does not move up and down in response to an impact, and the push-up means is pushed up in advance, and when the collet comes into contact with the chip when the collet is lowered, the push-up means descends, The bonding arm abnormality detection method according to claim 1, wherein an impact on the chip is reduced.   The bonding arm abnormality detection method according to claim 1 or 2, wherein a normal range is corrected from a change with time of the relative position coordinate.   4. The bonding arm abnormality according to claim 3, wherein an approximate straight line is obtained from a plurality of relative position coordinates, and when the approximate straight line has an inclination, the normal range is corrected so as not to have an inclination. Detection method.   The bonding arm abnormality detection method according to any one of claims 1 to 4, wherein a cause of abnormality of the bonding arm is specified based on the relative position coordinates. An apparatus for detecting an abnormality in a bonding arm when a chip is pushed up by a push-up means, a collet provided at the tip of the bonding arm is lowered, and the chip is adsorbed and piped up by the collet.
Arm driving means for driving the bonding arm while detecting the position of the tip of the collet;
A push-up drive means for driving the push-up means while detecting the position of the tip of the push-up means;
Control means for controlling the arm driving means and the push-up driving means,
The control means includes
A relative position coordinate detection unit for detecting a relative position coordinate of the collet with respect to a position coordinate of the lifting means when the chip is sandwiched between the collet and the lifting means;
From a plurality of relative position coordinates, a normal range area setting unit that sets a normal range area of the relative position coordinates based on a variation amount of the relative position coordinates,
An apparatus for detecting an abnormality in a bonding arm, comprising: an abnormality detection unit that detects an abnormality in the bonding arm when the detected relative position coordinates deviate from the normal range.   The bonding arm abnormality detection device according to claim 6, wherein the normal range region setting unit includes a correction unit that corrects the normal range region based on a change in the relative position coordinate with time.   8. The correction unit according to claim 7, wherein the correction unit obtains an approximate line from a plurality of relative position coordinates, and corrects the normal range area so as not to have an inclination when the approximate line has an inclination. Anomaly detection device for bonding arms.   9. The bonding arm abnormality detection device according to claim 6, further comprising an abnormality identification unit that identifies an abnormality cause of the bonding arm based on the relative position coordinates. 10.

Images