JP2016207753A5 - - Google Patents
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- Publication number
- JP2016207753A5 JP2016207753A5 JP2015085360A JP2015085360A JP2016207753A5 JP 2016207753 A5 JP2016207753 A5 JP 2016207753A5 JP 2015085360 A JP2015085360 A JP 2015085360A JP 2015085360 A JP2015085360 A JP 2015085360A JP 2016207753 A5 JP2016207753 A5 JP 2016207753A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etching method
- gas
- etching
- plasma etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001020 plasma etching Methods 0.000 claims 18
- 238000005530 etching Methods 0.000 claims 17
- 239000000758 substrate Substances 0.000 claims 12
- 210000002381 Plasma Anatomy 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- 239000002023 wood Substances 0.000 claims 2
- 229910004018 SiF Inorganic materials 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015085360A JP6579786B2 (ja) | 2015-04-17 | 2015-04-17 | プラズマエッチング方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015085360A JP6579786B2 (ja) | 2015-04-17 | 2015-04-17 | プラズマエッチング方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016207753A JP2016207753A (ja) | 2016-12-08 |
JP2016207753A5 true JP2016207753A5 (ko) | 2018-03-01 |
JP6579786B2 JP6579786B2 (ja) | 2019-09-25 |
Family
ID=57490581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015085360A Active JP6579786B2 (ja) | 2015-04-17 | 2015-04-17 | プラズマエッチング方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6579786B2 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6208275B2 (ja) * | 2016-03-23 | 2017-10-04 | Sppテクノロジーズ株式会社 | 炭化珪素半導体素子の製造方法 |
CN111081871A (zh) * | 2019-12-16 | 2020-04-28 | 天津理工大学 | 一种新型相变材料Cr-SbTe的干法刻蚀方法 |
CN114682064B (zh) * | 2022-04-08 | 2023-02-17 | 武汉大学 | 一种sf6废气的射频放电降解方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11219938A (ja) * | 1998-02-02 | 1999-08-10 | Matsushita Electron Corp | プラズマエッチング方法 |
JP2000091321A (ja) * | 1998-09-10 | 2000-03-31 | Hitachi Ltd | 表面処理方法および装置 |
JP5114848B2 (ja) * | 2006-02-09 | 2013-01-09 | 凸版印刷株式会社 | インプリント用モールドの欠陥修正方法及びインプリント用モールドの製造方法 |
JP5224837B2 (ja) * | 2008-02-01 | 2013-07-03 | 株式会社東芝 | 基板のプラズマ処理装置及びプラズマ処理方法 |
GB201217712D0 (en) * | 2012-10-03 | 2012-11-14 | Spts Technologies Ltd | methods of plasma etching |
-
2015
- 2015-04-17 JP JP2015085360A patent/JP6579786B2/ja active Active
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