JP2016203211A5 - - Google Patents

Download PDF

Info

Publication number
JP2016203211A5
JP2016203211A5 JP2015088065A JP2015088065A JP2016203211A5 JP 2016203211 A5 JP2016203211 A5 JP 2016203211A5 JP 2015088065 A JP2015088065 A JP 2015088065A JP 2015088065 A JP2015088065 A JP 2015088065A JP 2016203211 A5 JP2016203211 A5 JP 2016203211A5
Authority
JP
Japan
Prior art keywords
laser
aom
fluctuation
hole
hole interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015088065A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016203211A (ja
JP6449094B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015088065A priority Critical patent/JP6449094B2/ja
Priority claimed from JP2015088065A external-priority patent/JP6449094B2/ja
Publication of JP2016203211A publication Critical patent/JP2016203211A/ja
Publication of JP2016203211A5 publication Critical patent/JP2016203211A5/ja
Application granted granted Critical
Publication of JP6449094B2 publication Critical patent/JP6449094B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015088065A 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法 Active JP6449094B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015088065A JP6449094B2 (ja) 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015088065A JP6449094B2 (ja) 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2016203211A JP2016203211A (ja) 2016-12-08
JP2016203211A5 true JP2016203211A5 (https=) 2018-05-17
JP6449094B2 JP6449094B2 (ja) 2019-01-09

Family

ID=57488288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015088065A Active JP6449094B2 (ja) 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法

Country Status (1)

Country Link
JP (1) JP6449094B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6682148B2 (ja) * 2016-12-13 2020-04-15 住友重機械工業株式会社 レーザパルス切出装置及び切出方法
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
CN110265861B (zh) * 2019-06-20 2020-07-07 北京盛镭科技有限公司 控制激光脉冲输出的方法和系统
JP7386073B2 (ja) 2019-12-24 2023-11-24 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7262410B2 (ja) * 2020-03-11 2023-04-21 住友重機械工業株式会社 加工順決定装置、レーザ加工装置、及びレーザ加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4324456B2 (ja) * 2003-12-12 2009-09-02 日立ビアメカニクス株式会社 レーザ加工方法
JP4527003B2 (ja) * 2005-05-24 2010-08-18 三菱電機株式会社 レーザ加工装置
JP2008194709A (ja) * 2007-02-09 2008-08-28 Hitachi Via Mechanics Ltd レーザ加工方法
JP4937011B2 (ja) * 2007-06-26 2012-05-23 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP5025391B2 (ja) * 2007-08-30 2012-09-12 住友重機械工業株式会社 レーザ加工装置及び加工方法

Similar Documents

Publication Publication Date Title
JP2016203211A5 (https=)
BR112016005829B8 (pt) Método e dispositivo de controle da densidade de energia de um feixe de laser
MY176317A (en) Polycrystalline sic wafer producing method
SG10201910033TA (en) Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatus
IL283753A (en) Additive manufacturing system and method using a pulse modulated laser for two-dimensional printing
MX385506B (es) Metodo y sistema para el endurecimiento por laser de una superficie de una pieza de trabajo.
ZA201803918B (en) Method for producing a pre-coated metal sheet, with removal of the coating by means of an inclined laser beam, and corresponding metal sheet
MX2023008522A (es) Sistemas de soldadura con laser, revestimiento con laser, y/o fabricacion aditiva con laser y metodos de soldadura con laser, revestimiento con laser, y/o fabricacion aditiva con laser.
WO2011107602A3 (en) Methods and device for laser processing
MY185736A (en) Dividing method of workpiece and laser processing apparatus
PH12016000471A1 (en) 3d printing device for producing a spatially extended product
EP3343548A4 (en) CIRCUIT AND METHOD FOR PRODUCING A LIGHT-EMITTING CONTROL SIGNAL AND PIXEL CIRCUIT CONTROL METHOD
BRPI0911864A2 (pt) método e sistema para estabelecer uma pluralidade de freqüências de saída de uma correspondente pluralidade de feixes de laser, conjunto de circuitos ópticos e eletrônicos, e, sistema e método para estabilizar freqüência de uma pluralidade de lasers.
MY202343A (en) Wafer producing method and wafer producing apparatus
KR20180084667A (ko) 기판 프로세싱 방법
EP4329112C0 (en) LASER DIODE-PUMPED SEMICONDUCTOR LASER DEVICE
EP3435160A4 (en) NEGATIVE PHOTORESISTIC COMPOSITION FOR KRF LASER, HIGH RESOLUTION AND HIGH ASPECT RATIO
FR3021901B1 (fr) Structure de support d'un objet au cours de sa fabrication par un procede de fabrication additive ; procede de generation d'une telle structure.
HUE067023T2 (hu) Eljárás és eszköz lézeres forrasztáshoz
JP2015536402A5 (https=)
GB2538874A8 (en) Selective laser melting
JP6449094B2 (ja) レーザ加工装置及びレーザ加工方法
EP2556753A4 (en) INSTANT NOODLES AND MANUFACTURING METHOD THEREFOR
MX366999B (es) Metodo de soldadura con laser y dispositivo de soldadura con laser.
EP3412473A4 (en) CYLINDRICAL PRESSURE PLATE, CYLINDRICAL ORIGINAL PRESSURE PLATE, METHOD FOR THE PRODUCTION OF A CYLINDRICAL ORIGINAL PRESSURE PLATE AND METHOD FOR THE PRODUCTION OF A CYLINDRICAL PRESSURE PLATE