JP6449094B2 - レーザ加工装置及びレーザ加工方法 - Google Patents

レーザ加工装置及びレーザ加工方法 Download PDF

Info

Publication number
JP6449094B2
JP6449094B2 JP2015088065A JP2015088065A JP6449094B2 JP 6449094 B2 JP6449094 B2 JP 6449094B2 JP 2015088065 A JP2015088065 A JP 2015088065A JP 2015088065 A JP2015088065 A JP 2015088065A JP 6449094 B2 JP6449094 B2 JP 6449094B2
Authority
JP
Japan
Prior art keywords
processing
laser
workpiece
power
pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015088065A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016203211A (ja
JP2016203211A5 (https=
Inventor
鈴木　賢司
賢司 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Mechanics Ltd filed Critical Via Mechanics Ltd
Priority to JP2015088065A priority Critical patent/JP6449094B2/ja
Publication of JP2016203211A publication Critical patent/JP2016203211A/ja
Publication of JP2016203211A5 publication Critical patent/JP2016203211A5/ja
Application granted granted Critical
Publication of JP6449094B2 publication Critical patent/JP6449094B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
JP2015088065A 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法 Active JP6449094B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015088065A JP6449094B2 (ja) 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015088065A JP6449094B2 (ja) 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2016203211A JP2016203211A (ja) 2016-12-08
JP2016203211A5 JP2016203211A5 (https=) 2018-05-17
JP6449094B2 true JP6449094B2 (ja) 2019-01-09

Family

ID=57488288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015088065A Active JP6449094B2 (ja) 2015-04-23 2015-04-23 レーザ加工装置及びレーザ加工方法

Country Status (1)

Country Link
JP (1) JP6449094B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6682148B2 (ja) * 2016-12-13 2020-04-15 住友重機械工業株式会社 レーザパルス切出装置及び切出方法
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
CN110265861B (zh) * 2019-06-20 2020-07-07 北京盛镭科技有限公司 控制激光脉冲输出的方法和系统
JP7386073B2 (ja) 2019-12-24 2023-11-24 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7262410B2 (ja) * 2020-03-11 2023-04-21 住友重機械工業株式会社 加工順決定装置、レーザ加工装置、及びレーザ加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4324456B2 (ja) * 2003-12-12 2009-09-02 日立ビアメカニクス株式会社 レーザ加工方法
JP4527003B2 (ja) * 2005-05-24 2010-08-18 三菱電機株式会社 レーザ加工装置
JP2008194709A (ja) * 2007-02-09 2008-08-28 Hitachi Via Mechanics Ltd レーザ加工方法
JP4937011B2 (ja) * 2007-06-26 2012-05-23 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP5025391B2 (ja) * 2007-08-30 2012-09-12 住友重機械工業株式会社 レーザ加工装置及び加工方法

Also Published As

Publication number Publication date
JP2016203211A (ja) 2016-12-08

Similar Documents

Publication Publication Date Title
JP6449094B2 (ja) レーザ加工装置及びレーザ加工方法
JP6234296B2 (ja) レーザ加工装置及びレーザ加工方法
JP6817716B2 (ja) レーザ加工装置及びレーザ加工方法
JP6362130B2 (ja) レーザ加工方法及びレーザ加工装置
JP6773822B2 (ja) Ａｏｄラウト加工用レーザシステム及び方法
TWI734373B (zh) 雷射控制裝置及脈衝雷射輸出裝置
KR20180122605A (ko) 레이저가공장치
TWI691374B (zh) 雷射控制裝置及雷射加工方法
US20200038999A1 (en) Control device for laser machining apparatus, and laser machining apparatus
JP7260238B2 (ja) レーザ加工装置及びレーザ加工方法
JP2015186822A (ja) レーザ加工装置
JP6324151B2 (ja) レーザ加工装置及びレーザ加工方法
JP7539807B2 (ja) レーザ加工装置及びレーザ加工方法
JPWO2014080672A1 (ja) レーザ加工装置及びレーザ加工方法
WO2018110391A1 (ja) レーザパルス切出装置及び切出方法
JP2018099692A (ja) レーザ加工装置及びレーザ加工方法
JP2009006369A (ja) レーザ加工装置、及び、レーザ加工方法
JP7510380B2 (ja) レーザ加工装置
JP2007245159A (ja) レーザ加工装置及びレーザ加工方法
KR102496546B1 (ko) 레이저 가공장치, 레이저 가공방법 및 이를 위한 프로그램을 기록한 기록매체
KR20140029701A (ko) 스캐너 제어 장치 및 방법
JP2012200745A (ja) レーザ加工方法及び加工装置
JP6644421B2 (ja) レーザ加工装置
JP2003053564A (ja) レーザ加工制御方法及び装置
KR100817824B1 (ko) 광위치결정유닛의 제어방법

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180326

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180403

TRDD Decision of grant or rejection written
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20181114

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20181204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181205

R150 Certificate of patent or registration of utility model

Ref document number: 6449094

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150