JP2016197781A - Vibration element, vibrator, oscillator, electronic apparatus and moving body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration element capable of exerting stable vibration characteristics by reducing fluctuation of vibration characteristics due to external force such as acceleration, and to provide a vibrator, an oscillator, an electronic apparatus and a moving body.SOLUTION: A vibration element 1 includes: a vibration part 21; a thick portion 22 thicker than the vibration part 21; and a beam part 25 disposed in the vibration part 21. The thick portion 22 includes: a first thick portion 23 which is formed along a first outer edge 211 of the vibration part 21; and a second thick portion 24 which is formed along a third outer edge 213 of the vibration part 21. The beam part 25 is disposed along a fourth outer edge 214 of the vibration part 21, and is formed of an etching residue when the vibration part 21 is formed in a manner of wet etching.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a vibration element, a vibrator, an oscillator, an electronic device, and a moving body.

  The AT-cut crystal resonator element is a thickness-shear vibration mode of the main vibration to be excited, and is suitable for miniaturization and high frequency, and exhibits a cubic curve with excellent frequency temperature characteristics. Used in many ways.

  Patent Document 1 discloses an AT-cut quartz crystal vibrating element having an inverted mesa structure having a thin vibrating portion and a thick portion provided in an L shape along two sides of the vibrating portion. The cut crystal resonator element is fixed to the package via an adhesive at one end of the thick portion. In such a configuration, there is a possibility that the rigidity of the vibration part is insufficient, and when the acceleration in the thickness direction is applied to the AT-cut quartz crystal vibration element while the AT-cut crystal vibration element is cantilevered, the vibration part is deformed. This may cause a problem that the vibration characteristics (frequency characteristics) are not stable.

Japanese Patent Application Laid-Open No. 2014-7693

  An object of the present invention is to provide a vibration element, a vibrator, an oscillator, an electronic device, and a moving body that can reduce changes in vibration characteristics due to external forces such as acceleration and can exhibit stable vibration characteristics.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.

[Application Example 1]
The vibration element according to the present embodiment is configured to rotate the X axis of an orthogonal coordinate system including an X axis as an electric axis that is a crystal axis of crystal, a Y axis as a mechanical axis, and a Z axis as an optical axis. As
An axis inclined from the positive side of the Z axis to the negative side of the Y axis is defined as a Z ′ axis,
When the axis that tilts the positive side of the Y axis to the positive side of the Z axis is the Y ′ axis,
A quartz substrate having a plane including the X axis and the Z ′ axis as a main surface and a thickness along the direction along the Y ′ axis;
The quartz substrate is
A first region including a vibration region that vibrates by thickness shear vibration;
A second region that is integrated with an outer edge of the first region and is thicker than the first region;
A beam portion integrally disposed on an outer edge of the first region;
Including
The first region is
A first outer edge and a second outer edge along the Z′-axis direction;
A second outer edge and a fourth outer edge along the X-axis direction;
Including
The first outer edge is separated from the second outer edge in the X-axis direction,
The third outer edge is separated from the fourth outer edge in the Z′-axis direction,
The second region is
A first thick part provided along the first outer edge and provided with a fixing part fixed to the object;
A second thick portion provided along the third outer edge;
Including
The beam portion is disposed along the fourth outer edge, and is constituted by an etching residue generated when the first region is formed by wet etching.

  Thereby, the vibration element which can reduce the change of the vibration characteristic by external forces, such as acceleration, and can exhibit the stable vibration characteristic is obtained.

[Application Example 2]
In the vibration element of this application example, the thickness of the second region is T,
When the thickness of the beam portion is T1,
It is preferable that the relationship T> T1 is satisfied.
Thereby, the rigidity of the first region can be increased while reducing the mass of the beam portion.

[Application Example 3]
In the resonator element of this application example, it is preferable that the relationship 0.1 ≦ T1 / T ≦ 0.8 is satisfied.
Thereby, the rigidity of the first region can be increased while reducing the mass of the beam portion.

[Application Example 4]
In the vibration element of this application example, it is preferable that the relationship of 0.3 ≦ T1 / T ≦ 0.6 is satisfied.
Thereby, the rigidity of the first region can be increased while reducing the mass of the beam portion.

[Application Example 5]
In the resonator element according to this application example, the first region is formed by forming a concave portion in the quartz substrate from the positive side of the Y ′ axis by the wet etching.
The fourth outer edge is preferably located on the negative side of the Z axis with respect to the third outer edge.
Thereby, a thin beam part can be formed easily.

[Application Example 6]
In the resonator element according to this application example, the first region is formed by forming a concave portion in the quartz substrate from the negative side of the Y ′ axis by the wet etching.
It is preferable that the fourth outer edge is located on the positive side of the Z axis with respect to the third outer edge.
Thereby, a thin beam part can be formed easily.

[Application Example 7]
In the vibration element of this application example, in a plan view of the crystal substrate,
The second thick portion preferably includes outer edge portions that are inclined with respect to both the X axis and the Z ′ axis.
Thereby, the mass of the front-end | tip part of a vibration element can be made smaller.

[Application Example 8]
The vibrator of this application example includes the vibration element of the above application example,
A package containing the vibration element;
It is characterized by having.
Thereby, a highly reliable vibrator is obtained.

[Application Example 9]
The oscillator of this application example includes the vibration element of the above application example,
Circuit,
It is characterized by having.
Thereby, a highly reliable oscillator can be obtained.

[Application Example 10]
An electronic apparatus according to this application example includes the vibration element according to the application example described above.
As a result, a highly reliable electronic device can be obtained.

[Application Example 11]
The moving body of this application example includes the vibration element of the above application example.
Thereby, a mobile body with high reliability is obtained.

1 is a perspective view of a vibration element according to a first embodiment of the present invention. FIG. 2 is a plan view of the vibration element shown in FIG. 1. It is a figure explaining the relationship between an AT cut quartz substrate and the crystal axis of quartz. It is a side view which shows the state which fixed the vibration element shown in FIG. 1 to the target object. It is sectional drawing explaining the formation method of the beam part which the vibration element shown in FIG. 1 has. It is sectional drawing explaining the formation method of the beam part which the vibration element shown in FIG. 1 has. FIG. 6 is a perspective view illustrating a modification of the vibration element illustrated in FIG. 1. It is a perspective view of a vibration element concerning a 2nd embodiment of the present invention. It is sectional drawing explaining the formation method of the beam part which the vibration element shown in FIG. 8 has. It is sectional drawing which shows suitable embodiment of the vibrator | oscillator of this invention. It is sectional drawing which shows suitable embodiment of the oscillator of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (a smart phone, PHS etc. are included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. 1 is a perspective view schematically showing an automobile as an example of a moving object of the present invention.

  Hereinafter, a resonator element, a vibrator, an oscillator, an electronic device, and a moving body of the present invention will be described in detail based on preferred embodiments shown in the drawings.

1. First, the vibration element of the present invention will be described.

<First Embodiment>
FIG. 1 is a perspective view of a vibration element according to the first embodiment of the present invention. FIG. 2 is a plan view of the vibration element shown in FIG. FIG. 3 is a diagram for explaining the relationship between the AT-cut quartz substrate and the crystal axis of quartz. FIG. 4 is a side view showing a state in which the vibration element shown in FIG. 1 is fixed to an object. 5 and 6 are cross-sectional views illustrating a method of forming a beam part included in the vibration element shown in FIG. FIG. 7 is a perspective view showing a modification of the vibration element shown in FIG. In the following, for convenience of explanation, the right side in FIG. 2 is also referred to as the distal end, and the left side is also referred to as the proximal end.

  As shown in FIGS. 1 and 2, the vibration element 1 includes a crystal substrate 2 and an electrode 3 formed on the crystal substrate 2.

(Quartz substrate)
Quartz, which is a material of the quartz substrate 2, belongs to the trigonal system and has crystal axes X, Y, and Z orthogonal to each other as shown in FIG. The X axis, the Y axis, and the Z axis are referred to as an electric axis, a mechanical axis, and an optical axis, respectively. The quartz substrate 2 is a so-called “rotated Y-cut quartz substrate” cut from the quartz crystal along a plane obtained by rotating the XZ plane around the X axis by a predetermined angle θ, for example, θ = 35 °. A substrate cut out along the XZ ′ plane rotated by 15 ′ is referred to as an “AT cut quartz substrate”. By using such a quartz substrate 2, the vibration element 1 having excellent temperature characteristics is obtained. However, the quartz substrate 2 is not limited to the AT-cut quartz substrate as long as the thickness-shear vibration can be excited. For example, a BT-cut quartz substrate may be used. Hereinafter, the Y axis and the Z axis rotated around the X axis corresponding to the angle θ are referred to as a Y ′ axis and a Z ′ axis. That is, the quartz crystal substrate 2 has a plate shape having a thickness in the Y′-axis direction and extending in the XZ ′ plane direction.

  In other words, as shown in FIG. 3, the quartz substrate 2 has a Z′-axis whose axis is inclined to the negative side of the Y-axis with the X-axis of the orthogonal coordinate system composed of the X-axis, Y-axis, and Z-axis as the center. When the Y ′ axis is the axis tilted to the positive side of the Z axis, the plate has a thickness in the Y ′ axis direction and a spread in the XZ ′ plane direction.

  In plan view, the quartz crystal substrate 2 has a substantially long shape in which the direction along the X axis is a long side and the direction along the Z ′ axis is a short side. The quartz substrate 2 has the −X axis direction as the distal end side and the + X axis direction as the proximal end side.

  As shown in FIG. 1 and FIG. 2, the quartz substrate 2 is integrated with a vibrating portion (first region) 21 including a thin vibrating region (region in which vibration energy is confined) 219, and the vibrating portion 21. 21, a thick portion (second region) 22 that is thicker than the vibration region 219 and a beam portion 25 that increases the rigidity of the vibration portion 21.

  The vibration part 21 is formed, for example, by forming a concave part on the main surface on the + Y′-axis side of the quartz substrate by wet etching. Further, the vibration part 21 is offset toward the −X axis side and the −Z ′ axis side with respect to the center of the quartz crystal substrate 2, and a part of the outer edge is exposed from the thick part 22. Specifically, the vibration unit 21 is spaced apart in the X-axis direction (vibration direction of thickness shear vibration) and extends in the Z′-axis direction (direction intersecting the X-axis direction) in plan view of the vibration element 1. And a third outer edge 213 and a fourth outer edge 214 that are spaced apart from each other in the Z′-axis direction and extend in the X-axis direction. Of the first outer edge 211 and the second outer edge 212, the first outer edge 211 is located on the + X axis side, and the second outer edge 212 is located on the −X axis side. Of the third outer edge 213 and the fourth outer edge 214, the third outer edge 213 is located on the + Z′-axis side, and the fourth outer edge 214 is located on the −Z′-axis side. A thick portion 22 is provided so as to surround two sides of the vibrating portion 21.

  As shown in FIG. 1, the surface of the thick portion 22 (the main surface on the + Y′-axis side) is provided so as to protrude toward the + Y′-axis side than the surface of the vibrating portion 21 (the main surface on the + Y′-axis side). Yes. On the other hand, the back surface (the main surface on the −Y′-axis side) of the thick portion 22 is provided on the same plane as the back surface (the main surface on the −Y′-axis side) of the vibration unit 21.

  As shown in FIGS. 1 and 2, the thick portion 22 includes a first thick portion 23 disposed along the first outer edge 211 and a second thick portion 24 disposed along the third outer edge 213. And have. Therefore, the thick portion 22 has a structure bent along the vibration portion 21 in a plan view, and has a substantially L shape.

  On the other hand, the thick part 22 is not connected to the second outer edge 212 and the fourth outer edge 214 of the vibration part 21, and the second outer edge 212 and the fourth outer edge 214 are respectively exposed from the thick part 22. . As described above, by providing the thick portion 22 partially on the outer edge of the vibration portion 21, it is possible to reduce the mass of the vibration element 1 on the tip side while maintaining the rigidity of the vibration element 1 (vibration portion 21). . Further, the vibration element 1 can be reduced in size.

  Here, by providing the second thick part 24 on the + Z′-axis side with respect to the vibration part 21, an inclined part which will be described later, compared to the case where the second thick part 24 is provided on the −Z′-axis side. The width 241 (the length in the Z′-axis direction) can be shortened. Therefore, according to such a thick portion 22, the vibration element 1 can be downsized.

  The first thick portion 23 is connected to the first outer edge 211 and has an inclined portion 231 that gradually increases in thickness in the + X-axis direction, and a thickness that is connected to the + X-axis side edge of the inclined portion 231 is substantially constant. And a thick portion main body 232. Similarly, the second thick portion 24 is connected to the third outer edge 213 and connected to the inclined portion 241 whose thickness gradually increases in the + Z′-axis direction and the edge of the inclined portion 241 on the + Z′-axis side. And a thick portion main body 242 having a substantially constant thickness. Note that these inclined portions 231 and 241 are formed of etching residues when the vibrating portion 21 is formed.

  Further, a mount portion (fixed portion) 29 is provided on the surface of the thick portion main body 232 of the first thick portion 23, that is, on the proximal end side of the vibration element 1. As shown in FIG. 4, the vibration element 1 is fixed to the object 92 using an adhesive 91 at the mount portion 29. The position of the mount portion 29 is not particularly limited, and may be provided on the back surface of the thick portion main body 232, for example.

  Further, the second thick part 24 has an outer edge part 243 extending in a direction intersecting with both the X axis and the Z ′ axis in a plan view of the vibration element 1 at the tip part thereof. . The outer edge portion 243 is provided so as to cut out a corner portion located on the −X axis side and the + Z ′ axis side of the quartz crystal substrate 2. The outer edge portion 243 is formed across the thick portion main body 242, the inclined portion 241 and the vibrating portion 21. However, the formation range of the outer edge portion 243 is not limited to this. For example, the outer edge portion 243 may be formed in the thick portion main body 242 so as not to straddle the inclined portion 241 and the vibrating portion 21. .

  As described above, the second thick portion 24 has the outer edge portion 243, whereby the mass on the distal end side can be reduced. Therefore, as shown in FIG. 4, the bending amount of the vibrating portion 21 when the angular velocity in the Y′-axis direction is applied to the vibrating element 1 in a state where the mounting portion 29 is fixed to the object via an adhesive is used. Can be small. As a result, it is possible to suppress a change in vibration characteristics due to the acceleration in the Y′-axis direction. That is, the sensitivity of the vibration element 1 to the acceleration in the Y′-axis direction can be reduced. Therefore, the vibration element 1 can exhibit stable vibration characteristics regardless of whether acceleration in the Y′-axis direction is applied. In particular, as in the present embodiment, by forming the outer edge portion 243 so as to reach the vibration portion 21, the mass on the distal end side can be further reduced, and the above effect becomes more remarkable. In addition, although it does not specifically limit as inclination-angle (theta) 1 with respect to the X-axis of the outer edge part 243, It is preferable that it is 40 degrees or more and 50 degrees or less, and it is more preferable that it is about 45 degrees.

  As shown in FIGS. 1 and 2, the beam portion 25 is disposed so as to extend in the X-axis direction along the fourth outer edge 214 of the vibration portion 21. Such a beam portion 25 functions as a reinforcing portion that reinforces the vibration portion 21. Therefore, by arranging the beam portion 25, it is possible to reduce the amount of bending of the vibration portion 21 when acceleration in the Y′-axis direction is applied. Therefore, the above-described synergistic effect of the mass reduction effect by the outer edge portion 243 and the bending suppression effect by the beam portion 25 exhibits more stable vibration characteristics regardless of whether acceleration in the Y′-axis direction is applied. It becomes the vibration element 1 to do.

  In addition, the beam portion 25 is thinner than the thick portion 22. That is, when the thickness of the beam portion 25 (the thickness including the thickness of the vibrating portion 21) is T1, and the thickness of the thick portion 22 (the thickness of the quartz substrate 2) is T, the relationship T> T1 is satisfied. Is satisfied. Therefore, the beam portion 25 can be lightened, and an increase in the mass of the distal end portion of the vibration element 1 due to the provision of the beam portion 25 can be suppressed to be small. Note that T and T1 preferably satisfy the relationship of 0.1 ≦ T1 / T ≦ 0.8, and more preferably satisfy the relationship of 0.3 ≦ T1 / T ≦ 0.6. By satisfying such a relationship, the above-described effects can be more effectively exhibited.

  Such a beam portion 25 is constituted by an etching residue when the vibrating portion 21 is formed by wet etching. Thereby, the beam part 25 can be formed easily. Specifically, when the concave portion 210 for forming the vibration portion 21 is formed by wet etching from the + Y′-axis side of the crystal substrate 2, as shown in FIG. 5, the wall surface Z1 on the + Z′-axis side of the concave portion 210 is formed. Is a steeply inclined surface, and the wall surface Z2 on the −Z′-axis side (the collective surface of Z21, Z22, and Z23) is an inclined surface that is gently inclined with respect to the wall surface Z1. Then, if the crystal substrate 2 is cut at a virtual XY ′ plane F1 intersecting the wall surface Z2 in FIG. 5, a beam portion 25 is obtained as shown in FIG. 6 (a). Further, if the crystal substrate is cut at a virtual XY ′ plane F2 intersecting the wall surface Z2 in FIG. 5, as shown in FIG. 6B, the beam is thicker than FIG. Part 25 is obtained. As described above, by using the wall surface Z2 inclined more gently than the wall surface Z1, the beam portion 25 having a small thickness and a small mass can be easily formed.

  As described above, when the beam portion 25 is formed of an etching residue, the upper surface 251 of the beam portion 25 becomes a surface inclined with respect to the + Z ′ axis, and the upper surface 251 is directly connected to the upper surface of the vibration portion 21. Therefore, the beam portion 25 has a shape that gradually rises from the vibrating portion 21 toward the −Z ′ axis, and the rigidity continuously and gently changes from the vibrating portion 21 to the beam portion 25. Therefore, the stress is less likely to concentrate at the boundary between the vibration part 21 and the beam part 25, and the vibration element 1 that exhibits more stable vibration characteristics is obtained.

  As mentioned above, although the shape of the beam part 25 was demonstrated in detail, as a shape of the beam part 25, it is not limited to the shape of this embodiment.

  The length L of the quartz substrate 2 is not particularly limited, but it is preferable to satisfy the relationship L ≦ 5 mm. Further, the width W of the quartz substrate 2 is not particularly limited, but it is preferable to satisfy the relationship of W ≦ 3 mm.

  Further, the thickness T of the quartz substrate 2 is not particularly limited, but it is preferable that the relationship of 50 μm ≦ T ≦ 70 μm is satisfied. Thereby, the rigidity of the vibration element 1 can be ensured. Furthermore, since the etching depth when forming the vibration part 21 (concave part 210) is not excessively deep, the vibration part 21 can be formed with high accuracy. Therefore, the vibration element 1 can stably exhibit desired vibration characteristics. On the other hand, if the thickness T is less than the lower limit, depending on the mass of the vibration element 1 (length L, width W, etc.), the rigidity of the vibration element 1 is insufficient, and the vibration element 1 has a Y′-axis direction. In some cases, the bending amount of the distal end portion (vibration portion 21) of the vibration element 1 when the angular velocity is applied cannot be sufficiently reduced. On the other hand, if the thickness T exceeds the upper limit, the vibration element 1 may be excessively enlarged or the yield of the vibration element 1 may be reduced. Specifically, as described above, the vibration portion 21 is obtained by forming a concave portion on the main surface on the + Y ′ side by wet etching. However, as the thickness T increases, the concave portion becomes deeper accordingly. Accordingly, the widths of the inclined portions 231 and 241 are increased. Therefore, the vibration element 1 is increased in size. Further, as the thickness T increases, the depth of the recessed portion (etching depth) increases, and the etching accuracy decreases. For this reason, it is difficult to adjust the vibration part 21 to a desired thickness, and as a result, the yield of the vibration element decreases.

(electrode)
The electrode 3 has a pair of excitation electrodes 31 and 32, a pair of pad electrodes 33 and 34, and a pair of extraction electrodes 35 and 36. The excitation electrode 31 is formed on the surface of the vibration region 219. On the other hand, the excitation electrode 32 is disposed on the back surface of the vibration region 219 so as to face the excitation electrode 31. A region between the excitation electrodes 31 and 32 of the vibration unit 21 is a vibration region 219.

  The pad electrode 33 is formed on the mount portion 29 on the surface of the thick portion main body 232. On the other hand, the pad electrode 34 is formed on the back surface of the thick portion main body 232 so as to face the pad electrode 33.

  An extraction electrode 35 extends from the excitation electrode 31, and the excitation electrode 31 and the pad electrode 33 are electrically connected via the extraction electrode 35. An extraction electrode 36 extends from the excitation electrode 32, and the excitation electrode 31 and the pad electrode 34 are electrically connected via the extraction electrode 36. The extraction electrode 36 is provided so as not to overlap the extraction electrode 35 through the quartz crystal substrate 2 in plan view. Thereby, the electrostatic capacitance between the extraction electrodes 35 and 36 can be suppressed.

The configuration of such an electrode 3 is not particularly limited. For example, Au (gold) or Al (aluminum), Au (gold) or Al (alloy) is formed on a base layer such as Cr (chromium) or Ni (nickel). It can be constituted by a metal film in which an alloy mainly composed of (aluminum) is laminated.
The vibration element 1 according to the present embodiment has been described above.

  In the vibration element 1 of the present embodiment, since the vibration part 21 is formed by forming a recessed part from the + Y′-axis side, the second thick part 24 is located on the + Z′-axis side. 213, and the beam portion 25 is formed along the fourth outer edge 214 located on the −Z′-axis side. On the contrary, as shown in FIG. In the case where the vibration part 21 is formed by forming a concave part, the second thick part 24 is formed along the third outer edge 213 located on the −Z ′ axis side, and the beam part 25 is formed on the + Z ′ axis. What is necessary is just to form along the 4th outer edge 214 located in the side. Even with such a configuration, the same effect as in the present embodiment can be exhibited.

Second Embodiment
Next, a second embodiment of the resonator element according to the invention will be described.

  FIG. 8 is a perspective view of the resonator element according to the second embodiment of the invention. FIG. 9 is a cross-sectional view illustrating a method of forming a beam portion included in the vibration element shown in FIG.

  Hereinafter, the resonator element according to the second embodiment will be described focusing on differences from the first embodiment described above, and description of similar matters will be omitted.

  The vibration element according to the second embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the piezoelectric substrate is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 8, in the vibration element 1 of the present embodiment, the vibration part 21 is formed by forming concave portions on both main surfaces of the crystal substrate 2. In other words, the surface of the thick portion 22 (the main surface on the −Y′-axis side) is provided so as to protrude toward the + Y′-axis side than the surface of the vibrating portion 21 (the main surface on the + Y′-axis side). The back surface (the main surface on the −Y′-axis side) of the meat portion 22 is provided so as to protrude toward the −Y′-axis side from the back surface (the main surface on the −Y′-axis side) of the vibration unit 21. In this way, by forming the recessed portions on both main surfaces of the quartz substrate 2 and forming the vibrating portion 21, for example, the etching depth of the recessed portions can be made shallower than in the first embodiment described above. Can do. Therefore, etching can be performed with higher accuracy, and the outer shape of the quartz crystal substrate 2 can be obtained with higher accuracy. In addition, since the width of the inclined portions 231 and 241 can be reduced, the size of the vibration element 1 can be reduced.

  In the present embodiment, in order to form the vibration part 21, the recesses 210A and 210B are formed from both sides of the quartz substrate 2 as shown in FIG. In the recessed portion 210A, the wall surface Z3 on the −Z′-axis side has a gentle inclination, and on the contrary, in the recessed portion 210B, the wall surface Z4 on the −Z′-axis side has a steep inclination. Therefore, for example, if the crystal substrate 2 is cut at the virtual XY ′ plane F3 that intersects the wall surface Z3, the beam portion 25 that protrudes only to the upper surface side of the vibration portion 21 is obtained.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

2. Next, a vibrator (the vibrator of the present invention) to which the above-described vibration element 1 is applied will be described.

FIG. 10 is a cross-sectional view showing a preferred embodiment of the vibrator of the present invention.
A vibrator 10 illustrated in FIG. 10 includes the above-described vibration element 1 and a package 4 that houses the vibration element 1.

(package)
The package 4 includes a box-shaped base 41 having a concave portion 411 that opens to the upper surface, and a plate-shaped lid 42 that closes the opening of the concave portion 411 and is joined to the base 41. The vibration element 1 is housed in the housing space S formed by closing the recess 411 with the lid 42. The storage space S may be in a reduced pressure (vacuum) state, or may be filled with an inert gas such as nitrogen, helium, or argon.

  The constituent material of the base 41 is not particularly limited, but various ceramics such as aluminum oxide can be used. The constituent material of the lid 42 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 41. For example, when the constituent material of the base 41 is ceramic as described above, an alloy such as Kovar is preferable. In addition, joining of the base 41 and the lid 42 is not specifically limited, For example, you may join via an adhesive material and may join by seam welding etc.

  Connection electrodes 451 and 461 are formed on the bottom surface of the recess 411 of the base 41. External mounting terminals 452 and 462 are formed on the lower surface of the base 41. The connection electrode 451 is electrically connected to the external mounting terminal 452 via an internal wiring (not shown) formed on the base 41, and the connection electrode 461 is externally connected via an internal wiring (not shown) formed on the base 41. The mounting terminal 462 is electrically connected.

  The configurations of the connection electrodes 451 and 461 and the external mounting terminals 452 and 462 are not particularly limited as long as they have electrical conductivity. For example, a metallized layer such as Cr (chrome) or W (tungsten) (lower It can be constituted by a metal film in which each film such as Ni (nickel), Au (gold), Ag (silver), Cu (copper), etc. is laminated on the (layer).

  The vibration element 1 housed in the housing space S is fixed to the base 41 by the conductive adhesive 51 in the mount portion 29 with the surface facing the base 41 side. The conductive adhesive 51 is provided in contact with the connection electrode 451 and the pad electrode 33. Thereby, the connection electrode 451 and the pad electrode 33 are electrically connected via the conductive adhesive 51. By supporting the vibration element 1 at one place (one point) using the conductive adhesive 51, for example, stress generated in the vibration element 1 due to a difference in thermal expansion coefficient between the base 41 and the quartz substrate 2 can be suppressed. .

  The conductive adhesive 51 is not particularly limited as long as it has conductivity and adhesiveness. For example, a conductive filler is added to a silicone-based, epoxy-based, acrylic-based, polyimide-based, bismaleimide-based adhesive, or the like. A dispersed product can be used.

  The pad electrode 34 of the vibration element 1 is electrically connected to the connection electrode 461 through the bonding wire 52. As described above, since the pad electrode 34 is disposed to face the pad electrode 33, the pad electrode 34 is located immediately above the conductive adhesive 51 in a state where the vibration element 1 is fixed to the base 41. Therefore, leakage of vibration (ultrasonic vibration) applied to the pad electrode 34 during wire bonding can be suppressed, and the bonding wire 52 can be more reliably connected to the pad electrode 34.

3. Next, an oscillator to which the vibration element of the present invention is applied (the oscillator of the present invention) will be described.

FIG. 11 is a cross-sectional view showing a preferred embodiment of the oscillator of the present invention.
An oscillator 100 illustrated in FIG. 11 includes a vibrator 10 and an IC chip 110 for driving the vibration element 1. Hereinafter, the oscillator 100 will be described with a focus on differences from the above-described vibrator, and description of similar matters will be omitted.

  As shown in FIG. 11, in the oscillator 100, the IC chip 110 is fixed to the recess 411 of the base 41. The IC chip 110 is electrically connected to a plurality of internal terminals 120 formed on the bottom surface of the recess 411. The plurality of internal terminals 120 include those connected to the connection electrodes 451 and 461 and those connected to the external mounting terminals 452 and 462. The IC chip 110 has an oscillation circuit for controlling the driving of the vibration element 1. When the vibration element 1 is driven by the IC chip 110, a signal having a predetermined frequency can be extracted.

4). Next, an electronic device to which the vibration element of the present invention is applied (electronic device of the present invention) will be described.

  FIG. 12 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator 10 (vibrating element 1) that functions as a reference clock or the like.

  FIG. 13 is a perspective view illustrating a configuration of a mobile phone (including a smartphone, a PHS, and the like) to which the electronic device of the present invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 has a built-in vibrator 10 (vibrating element 1) that functions as a reference clock or the like.

  FIG. 14 is a perspective view showing a configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, a display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and a display is performed based on an image pickup signal by a CCD. Functions as a viewfinder that displays images. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. Such a digital still camera 1300 has a built-in vibrator 10 (vibrating element 1) that functions as a reference clock or the like.

  Note that the electronic device including the vibration element of the present invention includes, for example, a smartphone, a tablet terminal, a watch in addition to the personal computer (mobile personal computer) in FIG. 12, the mobile phone in FIG. 13, and the digital still camera in FIG. , Inkjet dispenser (for example, inkjet printer), laptop personal computer, TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game machine , Word processor, workstation, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish school Machine, various Constant devices, gauges (e.g., gages for vehicles, aircraft, and ships), can be applied to a flight simulator or the like.

5. Next, a moving body (moving body of the present invention) to which the vibration element of the present invention is applied will be described.

  FIG. 15 is a perspective view schematically showing an automobile as an example of the moving object of the present invention. The automobile 1500 is equipped with the vibrator 10 (the vibration element 1). The vibrator 10 is a keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS), engine control, hybrid car, The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for electric vehicles, vehicle body posture control systems, and the like.

  As described above, the resonator element, the vibrator, the oscillator, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part is the same. It can be replaced with any configuration having the above function. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment mentioned above suitably.

DESCRIPTION OF SYMBOLS 1 ... Vibrating element 10 ... Vibrator 100 ... Oscillator 110 ... IC chip 120 ... Internal terminal 2 ... Quartz substrate 21 ... Vibrating part 210, 210A, 210B ... Recessed part 211 ... 1st outer edge 212 …… Second outer edge 213 …… Third outer edge 214 …… Fourth outer edge 219 …… Vibration region 22 …… Thick part 23 …… First thick part 231 …… Inclined part 232 …… Thick part main body 24… ... 2nd thick part 241 ... Inclined part 242 ... Thick part main body 243 ... Outer edge part 25 ... Beam part 251 ... Upper surface 29 ... Mount part 3 ... Electrode 31, 32 ... Excitation electrode 33, 34 ... Pad electrode 35, 36 ... Lead electrode 4 ... Package 41 ... Base 411 ... Recess 42 ... Lid 451 ... Connection electrode 452 ... External mounting terminal 461 ... Connection electrode 462 ... External mounting terminal 51 …… Electrical adhesive 52 ... Bonding wire 91 ... Adhesive 92 ... Target 1100 ... Personal computer 1102 ... Keyboard 1104 ... Main body 1106 ... Display unit 1108 ... Display unit 1200 ... Mobile phone 1202 ... ... Operation buttons 1204 ... Earpiece 1206 ... Transmission mouth 1208 ... Display unit 1300 ... Digital still camera 1302 ... Case 1304 ... Light receiving unit 1306 ... Shutter button 1308 ... Memory 1310 ... Display unit 1500 ... ... automobile F1, F2, F3 ... surface S ... accommodation space T, T1 ... thickness Z1, Z2, Z21, Z22, Z23, Z3, Z4 ... wall surface θ ... angle θ1 ... inclination angle

Claims (11)

With the X axis of the orthogonal coordinate system consisting of the X axis as the electrical axis that is the crystal axis of quartz, the Y axis as the mechanical axis, and the Z axis as the optical axis,
An axis inclined from the positive side of the Z axis to the negative side of the Y axis is defined as a Z ′ axis,
When the axis that tilts the positive side of the Y axis to the positive side of the Z axis is the Y ′ axis,
A quartz substrate having a plane including the X axis and the Z ′ axis as a main surface and a thickness along the direction along the Y ′ axis;
The quartz substrate is
A first region including a vibration region that vibrates by thickness shear vibration;
A second region that is integrated with an outer edge of the first region and is thicker than the first region;
A beam portion integrally disposed on an outer edge of the first region;
Including
The first region is
A first outer edge and a second outer edge along the Z′-axis direction;
A second outer edge and a fourth outer edge along the X-axis direction;
Including
The first outer edge is separated from the second outer edge in the X-axis direction,
The third outer edge is separated from the fourth outer edge in the Z′-axis direction,
The second region is
A first thick part provided along the first outer edge and provided with a fixing part fixed to the object;
A second thick portion provided along the third outer edge;
Including
The beam element is arranged along the fourth outer edge, and is constituted by an etching residue generated when the first region is formed by wet etching. In claim 1,
The thickness of the second region is T,
When the thickness of the beam portion is T1,
A vibration element characterized by satisfying a relationship of T> T1. In claim 2,
A vibration element characterized by satisfying a relationship of 0.1 ≦ T1 / T ≦ 0.8. In claim 3,
A vibration element characterized by satisfying a relationship of 0.3 ≦ T1 / T ≦ 0.6. In any one of Claims 1 thru | or 4,
The first region is formed by forming a recess in the quartz substrate from the positive side of the Y ′ axis by the wet etching,
The vibration element, wherein the fourth outer edge is located on the negative side of the Z axis with respect to the third outer edge. In any one of Claims 1 thru | or 4,
The first region is formed by forming a recess in the quartz substrate from the negative side of the Y ′ axis by the wet etching,
The vibrating element according to claim 4, wherein the fourth outer edge is located on the positive side of the Z axis with respect to the third outer edge. In any one of Claims 1 thru | or 6,
In plan view of the quartz substrate,
The second thick portion includes an outer edge portion that is inclined with respect to both the X-axis and the Z′-axis. The vibration element according to any one of claims 1 to 7,
A package containing the vibration element;
A vibrator characterized by comprising: The vibration element according to any one of claims 1 to 7,
Circuit,
An oscillator comprising:   An electronic apparatus comprising the vibration element according to claim 1.   A moving body comprising the vibration element according to claim 1.

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