JP2016189377A - Component mounting device and adjusting method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device capable of easily performing an adjustment work of a component crimping part, and an adjustment method for the same.SOLUTION: In a component mounting device 1 including a mounting stage 35 for holding a substrate 2 on which a component 3 is mounted, a mounting stage moving mechanism 35M for moving the mounting stage 35 to position the substrate 2 held on the mounting stage 35 to a predetermined component crimping position, and a component crimping portion 33 for crimping the component 3 to the substrate 2 positioned at the component crimping position by the mounting stage moving mechanism 35 M, the mounting stage moving mechanism 35M moves the mounting stage 35 in a direction to make the mounting stage 35 be away from the component crimping portion 33 when an adjustment working mode setting operation unit 101 to be operated when adjusting the component crimping portion 33 is operated.SELECTED DRAWING: Figure 13

Description

  The present invention relates to a component mounting apparatus including a component crimping unit that crimps a component to a substrate and an adjustment method thereof.

  The component crimping device used in the liquid crystal panel production process by the liquid crystal panel production line is not only a component crimping part that crimps a component (film-like component or semiconductor device) to a substrate at a predetermined component crimping position, but also a substrate on which the component is mounted. A substrate holding stage to be held and stage moving means for moving the substrate holding stage to position the substrate held on the substrate holding stage at a component crimping position are provided. The component crimping section includes a support base that supports the substrate from below at the component crimping position, and a crimping head that descends from above the substrate supported by the support base and presses the component against the substrate for crimping. The crimping head is appropriately replaced according to the size of the component to be crimped to the substrate (for example, Patent Document 1).

Japanese Patent No. 3757868

  However, when adjusting the component crimping part such as replacement of the crimping head in the component crimping apparatus, if the substrate holding stage remains in the vicinity of the component crimping part, it is difficult for the operator to perform the work. There has been a problem that it takes a lot of time to adjust the crimping portion, and the improvement of the productivity of the substrate by the component mounting apparatus is hindered.

  Then, an object of this invention is to provide the component mounting apparatus which can perform the adjustment operation | work of a component crimping | compression-bonding part easily, and its adjustment method.

  The component mounting apparatus of the present invention includes a substrate holding stage that holds a substrate on which a component is mounted, and a stage movement that moves the substrate holding stage to position the substrate held on the substrate holding stage at a predetermined component crimping position. Means, a component crimping part for crimping the component to the substrate positioned at the component crimping position by the stage moving means, and an operation means operated when performing the adjustment operation of the component crimping part, The moving means moves the substrate holding stage in a direction away from the component crimping portion when the operating means is operated.

  The adjustment method of the component mounting apparatus according to the present invention includes a substrate holding stage that holds a substrate on which a component is mounted and a substrate held on the substrate holding stage by moving the substrate holding stage at a predetermined component crimping position. A component mounting apparatus, comprising: a stage moving unit that performs pressure adjustment; and a component crimping unit that crimps the component to a substrate positioned at the component crimping position by the stage moving unit. When working, the stage moving means moves the substrate holding stage in a direction away from the component crimping portion.

  ADVANTAGE OF THE INVENTION According to this invention, the adjustment operation | work of a component crimping | compression-bonding part can be performed easily.

The top view of the component mounting apparatus in embodiment of this invention The figure which shows the advancing procedure of the component mounting operation | work with respect to the board | substrate by the component mounting apparatus in embodiment of this invention The perspective view of the board | substrate transfer body with which the component mounting apparatus in embodiment of this invention is provided. (A) (b) Perspective view of ACF sticking part with which component mounting apparatus in embodiment of this invention is provided. (A) (b) The perspective view of the component mounting part with which the component mounting apparatus in embodiment of this invention is provided. (A) (b) The perspective view of the component mounting part with which the component mounting apparatus in embodiment of this invention is provided. (A) (b) The perspective view of the component crimping | compression-bonding part with which the component mounting apparatus in embodiment of this invention is provided. The block diagram which shows the control system of the component mounting apparatus in embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the sticking operation | work of the ACF tape by the ACF sticking part in embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in embodiment of this invention (A) (b) (c) The figure which shows the execution procedure of the component crimping | compression-bonding operation | work by the component crimping | compression-bonding part in embodiment of this invention. (A) (b) Operation | movement explanatory drawing at the time of adjustment operation | work of the component crimping | compression-bonding part with which the component mounting apparatus in embodiment of this invention is provided (A) (b) Operation | movement explanatory drawing at the time of adjustment operation | work of the component crimping | compression-bonding part with which the component mounting apparatus in embodiment of this invention is provided

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 shown in FIG. 1 is for mounting a film-like component 3 on a substrate 2 shown in FIG. 2 in manufacturing a liquid crystal panel substrate or the like. Specifically, an ACF (Anisotropic Conductive Film) tape 2T as an adhesive member is attached to the electrode portion 2d provided on the upper surface of the end portion of the substrate 2, and the film-like component 3 is mounted on the ACF tape 2T. Then crimp it. In the present embodiment, mounting and crimping of the component 3 are collectively referred to as “mounting of the component 3”. The “film-like component 3” refers to a component having an electrode 3a (FIG. 2) on a film-like member such as a flexible substrate.

  In FIG. 1, a carry-in stage 12, a board transfer unit 13, a component mount unit 14, and a carry-out stage 15 are provided on a base 11 of the component mounting apparatus 1. In the present embodiment, the left-right direction (left-right direction in FIG. 1) viewed from the operator OP is the X-axis direction. Further, the front-rear direction (up and down direction in FIG. 1) viewed from the operator OP is defined as the Y-axis direction, and the vertical direction is defined as the Z-axis direction.

  In FIG. 1, the carry-in stage 12 has carry-in stage suction ports 12K that open to the upper surface at both ends in the X-axis direction. The carry-in stage 12 sucks and holds one or two substrates 2 carried in from another apparatus on the upstream process side by a substrate carry-in means (not shown) at the carry-in stage suction port 12K.

  In FIG. 1, the substrate transfer unit 13 is provided so as to be movable in the X-axis direction on the transfer body moving table 13T provided extending in the X-axis direction in the foremost region of the base 11, and on the transfer body moving table 13T. And three substrate transfer bodies 13M (from left to left transfer body 13a, central transfer body 13b and right transfer body 13c). In FIG. 3, each of the three substrate transfer bodies 13M has a plurality of suction arms 21 extending rearward, and each suction arm 21 is provided with a plurality of suction portions 22 with suction ports facing downward. .

  Each of the three substrate transfer bodies 13M sucks (picks up) the substrate 2 from above by the suction portion 22, and is driven by the transfer body moving table 13T to move in the X-axis direction to transfer the substrate 2. Here, each substrate transfer body 13M shows a case where two substrates 2 are simultaneously sucked, but it is also possible to suck one large substrate 2.

  In FIG. 1, the component mounting unit 14 includes an ACF adhering unit 31, a component mounting unit 32, two component crimping units 33, an adhering stage 34, an adhering stage moving mechanism 34M, two mounting stages 35, and an attaching stage moving mechanism. 35M.

  The ACF sticking portion 31 is provided in the left region of the base 11. As shown in FIGS. 4A and 4B, the ACF adhering portion 31 includes two adhering heads 41 arranged side by side in the X-axis direction, and two adhering heads 41 provided below the respective adhering heads 41. An attachment support base 42 is provided. Each sticking head 41 has a tape supply part 41a and a sticking tool 41b.

  In FIG. 1, the component mounting portion 32 is provided on the right side of the ACF adhering portion 31. The component mounting unit 32 includes a component supply unit 51 that supplies the component 3, a mounting head moving mechanism 52, a mounting head 53 that is moved in the horizontal plane by the mounting head moving mechanism 52, and a mounting support base that is provided below the mounting head 53. 54 (see also FIGS. 5A and 5B and FIGS. 6A and 6B). In FIG. 5A, the mounting support base 54 is provided with two recognition cameras 55 arranged in the X-axis direction with the imaging visual field facing upward. The two recognition cameras 55 perform imaging through a transparent material portion 54T such as glass provided on the upper portion of the mounting support base 54.

  In FIG. 1, two component crimping portions 33 are provided at positions sandwiching the component mounting portion 32 from both the left and right sides. 7A and 7B, each component crimping portion 33 includes two crimping heads 61 provided side by side in the X-axis direction and two crimping support bases 62 provided below the respective crimping heads 61. I have.

  In FIG. 4A, the sticking stage 34 has sticking stage suction ports 34K that open to the upper surface at both ends in the X-axis direction. The adhering stage 34 adsorbs and holds the lower surface of the substrate 2 transferred from the carry-in stage 12 by the left transfer body 13a at the adhering stage suction port 34K. The sticking stage 34 is moved by the sticking stage moving mechanism 34M.

  As shown in FIG. 1 and FIGS. 4A and 4B, the sticking stage moving mechanism 34 </ b> M has a front region of the ACF sticking part 31 (a front side of the ACF sticking part 31 as viewed from the operator OP). The lower stage table 71 provided in the area) and the upper stage table 72 provided on the lower stage table 71. The sticking stage 34 is connected to the sticking stage upper table 72.

  The sticking stage lower table 71 moves the sticking stage upper table 72 in the X-axis direction, and the sticking stage upper table 72 moves the sticking stage 34 in the Y-axis direction so that the sticking stage 34 moves in the XY plane. Moving. The adhering stage 34 is referred to as a predetermined position (substrate transfer position) moved rearward from the foremost standby position on the adhering stage upper table 72 (the position indicated by the alternate long and short dash line in FIG. 4A). 4 (a), the substrate 2 is received and delivered at a position indicated by a solid line), and the sticking stage 34 is located at the upper stage of the sticking stage from the front area (area on the operator OP side) of the ACF sticking portion 31. The held substrate 2 can be positioned at the “ACF adhering position” by moving to the last work position (FIG. 4B) on the table 72. Here, the “ACF adhering position” means The electrode part 2d of the substrate 2 is located above the adhesion support base 42, and the ACF adhesion part 31 is a position where the ACF tape 2T can be adhered to the substrate 2.

  In FIG. 5A, each mounting stage 35 has a mounting stage suction port 35K that opens to the upper surface at both ends in the X-axis direction. The mounting stage 35 sucks and holds the lower surface of the substrate 2 transferred from the sticking stage 34 by the central transfer body 13b at the mounting stage suction port 35K. The two mounting stages 35 are respectively moved by the mounting stage moving mechanism 35M.

  As shown in FIG. 1 and FIGS. 5A and 5B, the mounting stage moving mechanism 35M includes a mounting stage lower table 81 provided in the front area of the component mounting portion 32 and the two component crimping portions 33, and a mounting stage. It is composed of two upper stage tables 82 mounted on the lower stage table 81. The two mounting stages 35 are connected to the two mounting stage upper tables 82, respectively.

  The mounting stage lower table 81 moves the mounting stage upper table 82 in the X-axis direction, and the mounting stage upper table 82 moves the mounting stage 35 in the Y-axis direction, so that the mounting stage 35 moves in the XY plane. The mounting stage 35 is referred to as a substrate transfer position at a predetermined position (referred to as a substrate transfer position (FIG. 5B)) moved rearward from the foremost standby position on the mounting stage upper table 82 (FIG. 5A). Then, the mounting stage 35 moves from the front area (area on the operator OP side) of the component mounting portion 32 to the rearmost work position on the mounting stage upper table 82 (FIG. 6A). As a result, the held substrate 2 can be positioned at the “component mounting position.” Here, the “component mounting position” means that the electrode portion 2 d of the substrate 2 is positioned above the mounting support base 54 and mounts the component. This is the position where the part 32 can perform the mounting operation of the component 3 on the substrate 2.

  In addition, the mounting stage 35 located at the work position moves from the front region of the component mounting unit 32 to the front region of the component crimping unit 33 in the X-axis direction, so that the substrate 2 can be positioned at the “component crimping position”. it can. Here, the “component crimping position” is a position where the electrode portion 2 d of the substrate 2 is located above the mounting support 54 and the component crimping portion 33 can perform the crimping operation of the component 3 against the substrate 2. It is.

  Thus, in the present embodiment, the mounting stage 35 is a substrate holding stage that holds the substrate 2 on which the component 3 is mounted. The mounting stage moving mechanism 35M is stage moving means for moving the mounting stage 35 to position the substrate held on the mounting stage 35 at a predetermined component crimping position.

  As shown in FIGS. 5 (a), 5 (b), 6 (a), 6 (b) and 7 (a), 7 (b), the mounting stage 35 is provided with component support means 90. The component support means 90 includes a pair of arm portions 91 extending rearward from the mounting stage 35, and a horizontal portion 92 having both ends attached to the pair of arm portions 91 and extending in the horizontal direction (X-axis direction). In the horizontal portion 92, the protruding portion 3b protruding from the rear portion of the substrate 2 among the components 3 attached to the substrate 2 is supported from below.

  In FIG. 1, the carry-out stage 15 has a carry-out stage suction port 15K that opens to the upper surface at both ends in the X-axis direction. The carry-out stage 15 sucks and holds the lower surface of the substrate 2 transferred from the mounting stage 35 by the right transfer body 13c at the carry-out stage suction port 15K.

  The operations of the suction control of the substrate 2 by the carry-in stage 12, the transfer control of the substrate 2 by the substrate transfer unit 13, the mounting control of the component 3 to the substrate 2 by the component mounting unit 14, and the suction control of the substrate 2 by the carry-out stage 15 are as follows: It is controlled by the control device 100 provided inside the base 11 (FIG. 8).

  Next, the operation of the component mounting apparatus 1 will be described. In FIG. 1, when the substrate 2 is loaded into the loading stage 12, the left transfer body 13 a attracts the substrate 2 from the loading stage 12 and transfers it to the sticking stage 34. At the substrate transfer position, the sticking stage 34 receives and holds the substrate 2 transferred by the left transfer body 13a (FIG. 4A). When the adhering stage 34 holds the substrate 2, the adhering stage moving mechanism 34M moves the adhering stage 34 to the working position (FIG. 4B) and positions each substrate 2 at the ACF adhering position.

  If each board | substrate 2 is located in an ACF sticking position, the sticking head 41 will supply the ACF tape 2T by the tape supply part 41a, and will cut | disconnect this to predetermined length. Then, after the cut ACF tape 2T is positioned above the electrode portion 2d (FIG. 9A), the sticking tool 41b is lowered (FIG. 9B). As a result, the ACF tape 2T is pressed against the bonding support base 42 together with the substrate 2 and is bonded to the substrate 2. When the ACF tape 2T is stuck to the substrate 2, the sticking head 41 raises the sticking tool 41b (FIG. 9C), and the sticking stage moving mechanism 34M returns the sticking stage 34 to the substrate transfer position ( FIG. 4 (a)).

  When the operation of attaching the ACF tape 2T to the substrate 2 in the ACF attaching unit 31 is completed as described above, the central transfer body 13b adsorbs the substrate 2 from the attaching stage 34 to one of the two attachment stages 35. Transport. The mounting stage 35 receives and holds the substrate 2 transferred by the central transfer body 13b at the substrate transfer position (FIG. 5B). When the mounting stage 35 holds the substrate 2, the mounting stage moving mechanism 35M moves the mounting stage 35 to the working position (FIG. 6A) and positions one substrate 2 at the component mounting position. In parallel with this, the mounting head moving mechanism 52 moves the mounting head 53 to attract (pick up) the component 3 supplied by the component supply unit 51 to the mounting head 53 and then mount the mounting head 53 on the mounting support base. 54 is located above.

  When one substrate 2 is positioned at the component mounting position, the two recognition cameras 55 recognize (capture) two position recognition marks 2m (FIG. 2) provided on the substrate 2 (FIG. 10A). The control device 100 recognizes the position of the substrate 2 based on the recognition result of the two position recognition marks 2m. When the position of the substrate 2 is recognized, the mounting stage moving mechanism 35M moves the mounting stage 35 forward, and temporarily retracts the electrode portion 2d from the position above the mounting support 54 (FIG. 10B). Arrow A1).

  When the mounting stage moving mechanism 35M retracts the mounting stage 35 forward, the mounting head moving mechanism 52 lowers the mounting head 53, and the two recognition cameras 55 recognize two position recognition marks (not shown) provided on the component 3. (FIG. 10C). The control device 100 calculates the position of the component 3 based on the recognition results of the two position recognition marks. When the position of the component 3 is calculated, the mounting head moving mechanism 52 raises the mounting head 53 (FIG. 11A). The mounting stage moving mechanism 35M moves the mounting stage 35 to the working position again to position the substrate 2 at the component mounting position (arrow A2 shown in FIG. 11B), and the substrate 2 that has already been calculated. The mounting stage 35 is moved based on the relationship between the position of the component 3 and the position of the component 3, and the substrate 2 is positioned with respect to the component 3 (FIG. 11B).

  When the substrate 2 is positioned with respect to the component 3, the mounting head moving mechanism 52 lowers the mounting head 53 and presses the component 3 adsorbed by the mounting head 53 against the ACF tape 2T on the substrate 2 (FIG. 6B). And FIG. 11 (c)). The pressing force of the mounting head 53 at this time is supported by the mounting support base 54. As a result, the component 3 is mounted on the substrate 2. When the component 3 is mounted on the substrate 2, the mounting head moving mechanism 52 raises the mounting head 53.

  When the component 3 is mounted on one substrate 2, the mounting stage moving mechanism 35M moves the mounting stage 35 in the X-axis direction (moves to the component mounting position) to position the other substrate 2 at the component mounting position and mount it. The head 53 mounts the component 3 on the substrate 2. When the component 3 is mounted on the two substrates, the mounting head moving mechanism 52 raises the mounting head 53.

  Here, in a state where the component 3 is mounted on the substrate 2 by the mounting head 53, the rear end portion of the component 3 protrudes rearward from the outer edge of the substrate 2 (FIG. 2), but from the outer edge of the substrate 2 The protruding portion 3b that protrudes is supported from below by the component support means 90 provided on the mounting stage 35 (see the substrate 2 shown in FIGS. 6A and 6B). For this reason, the protruding portion 3b of the component 3 mounted on the board 2 from the outer edge of the board 2 is prevented from hanging down from the edge of the board 2.

  When the mounting operation of the component 3 onto the substrate 2 in the component mounting portion 32 is completed as described above, the mounting stage moving mechanism 35M moves the mounting stage 35 in the X-axis direction to position each substrate 2 at the component crimping position. (FIGS. 7A and 12A).

  When the electrode portion 2d of the substrate 2 is positioned below the crimping head 61, the component crimping portion 33 lowers the crimping head 61 and presses the component 3 mounted on the substrate 2 together with the substrate 2 against the crimping support base 62 (FIG. 12). (A) → FIG. 12 (b)). Thereby, the component 3 is pressure-bonded to the substrate 2. When the component 3 is crimped to the substrate 2, the component crimping portion 33 raises the crimping head 61 (FIG. 12 (b) → FIG. 12 (c)), and the mounting stage moving mechanism 35M returns the mounting stage 35 to the substrate transfer position. (FIG. 7B).

  Also in the crimping operation of the component 3, the protruding portion 3 b that protrudes outward from the substrate 2 is still supported from below by the component support means 90 provided on the mounting stage 35. It is prevented that the substrate 2 hangs down from the edge of the substrate 2.

  When the component crimping operation to the substrate 2 in the component crimping section 33 is completed as described above, the right transfer body 13c sucks the substrate 2 from the mounting stage 35 and transfers the substrate 2 to the carry-out stage 15. The carry-out stage 15 receives and holds the substrate 2 transferred by the right transfer body 13c. The board 2 transferred to the carry-out stage 15 is carried out to another apparatus on the downstream process side of the component mounting apparatus 1 by a board carry-out means (not shown).

  Thus, in the present embodiment, the central transfer body 13b is a substrate transfer means for transferring the substrate 2 to the mounting stage 35, and the right transfer body 13c is a substrate transfer means for transferring the substrate 2 from the mounting stage 35. It has become.

  By the way, when the production of the board 2 is being performed by the component mounting apparatus 1 having the above-described configuration, when it is necessary to change the model of the board 2 to be produced, the operator OP can use the component crimping unit 33. Perform the adjustment work. Here, the “adjustment operation of the component crimping portion 33” means a replacement operation of components of the component crimping portion 33 such as changing the crimping head 61 to one corresponding to the size of the component 3 or the like, It means at least one of maintenance work and position adjustment work of components of the component crimping portion 33. Hereinafter, the procedure (adjustment method) of the investigation work of the component mounting apparatus 1 will be described.

  The operator OP operates the adjustment operation mode setting operation unit 101 (FIG. 8) connected to the control device 100 when performing the adjustment operation of the component crimping unit 33. As a result, the control mode of the control apparatus 100 for the component mounting apparatus 1 is switched from the normal mode to the adjustment work mode, and the control apparatus 100 stops all the operations of the respective parts of the component mounting apparatus 1 including the component crimping section 33. Then, after storing the position of each part at that time in the storage unit 100a (FIG. 8), the mounting stage moving mechanism 35M is operated to move the mounting stage 35 away from the component crimping part 33 (FIG. 13 ( a) → FIG. 13 (b), FIG. 14 (a) → FIG. 14 (b)). As a result, a working space SP is secured in front of each component crimping portion 33, and the operator OP can easily adjust the component crimping portion 33.

  FIGS. 13A and 13B show a first example in which the mounting stage 35 is moved away from the component crimping portion 33. In this first example, the two mounting stages 35 are respectively moved forward and positioned at the standby position (arrow B shown in FIG. 13B), and in a direction away from each other (left mounting stage). 35 is moved to the left and the right mounting stage 35 is moved to the right) (arrow C1 shown in FIG. 13B). In this first example, since the space SP1 is formed with the front region of the component mounting portion 32 being largely opened, the operator OP enters the space SP in the front region of each component crimping portion 33 through this space SP1. Can be accessed.

  In the first example, when the control device 100 moves the two mounting stages 35 in the direction away from the component crimping portion 33, the control device 100 combines the three substrate transfer bodies 13M (the left transfer body 13a and the central transfer body). Of the body 13b and the right-side transfer body 13c), which is located in front of the component crimping portion 33, either away from the component crimping portion 33 (from either the left or right side away from the nearest component crimping portion 33) (Fig. 13 (a)-> Fig. 13 (b). Arrow D shown in Fig. 13 (b)). As a result, the front region of each component crimping portion 33 becomes more open, so that the operator OP can more easily adjust the component crimping portion 33.

  FIGS. 14A and 14B show a second example in which the mounting stage 35 is moved away from the component crimping portion 33. In this second example, the two mounting stages 35 are respectively moved forward and positioned at the standby position (arrow B shown in FIG. 14B), and in a direction approaching each other (left mounting stage). 35 is moved to the right and the right mounting stage 35 is moved to the left (arrow C2 shown in FIG. 14B). In this second example, since a relatively large space SP is formed in front of each component mounting portion 32, the operator OP can directly use the component mounting portion directly from the large space SP formed in front of these component mounting portions 32. 32 can be accessed. Also in this case, when the control device 100 moves the two mounting stages 35 in the direction away from the component crimping portion 33, the control device 100 also combines the three substrate transfer bodies 13M (left transfer body 13a, central transfer). Of the body 13b and the right-side transfer body 13c), which is located in front of the component crimping portion 33, either away from the component crimping portion 33 (from either the left or right side away from the nearest component crimping portion 33) Direction (FIG. 14 (a) → FIG. 14 (b). Arrow D shown in FIG. 14 (b)).

  As described above, in the present embodiment, the adjustment work mode setting operation unit 101 is an operation unit that is operated when the adjustment work of the component crimping unit is performed, and the mounting stage moving mechanism 35M is the adjustment work mode setting operation unit 101. Is operated, the mounting stage 35 is moved away from the component crimping portion 33. Further, the board transfer body 13M moves in a direction away from the component crimping section 33 when the adjustment work mode setting operation section 101 is operated. Thereby, the front area of the two component crimping portions 33 is opened, and a working space SP is secured.

  As described above, when the mounting stage 35 moves away from the component crimping portion 33 and the board transfer body 13M moves away from the component crimping portion 33, the operator OP is formed in front of the component mounting apparatus 1. The component crimping portion 33 is adjusted by accessing the component crimping portion 33 from the space SP.

  When the adjustment operation of the component crimping unit 33 is completed, the operator OP operates the adjustment operation mode release operation unit 102 (FIG. 8) connected to the control device 100. As a result, the control mode for the component mounting apparatus 1 of the control device 100 is switched from the adjustment work mode so far to the normal work mode. Then, the control device 100 returns the moved one of the mounting stage 35 and the three substrate transfer bodies 13M to the original position based on the position information of each part stored in the storage unit 100a, and then in the normal mode. It is assumed that the control can be executed.

  As described above, in the component mounting apparatus 1 according to the present embodiment, when the adjustment work mode setting operation unit 101 (operation unit) is operated, the mounting stage moving mechanism 35M moves the mounting stage 35 from the component crimping unit 33. Since it moves in the direction of leaving | separating, it will be in the state which the vicinity area (specifically front area) of the component crimping | compression-bonding part 33 opened. Thereby, the operator OP can easily perform the adjustment work of the component crimping portion 33 such as the replacement of the crimping head 61 and the workability is improved, so that the productivity of the substrate 2 by the component mounting apparatus 1 can be improved. .

  In the above-described embodiment, when the mounting stage 35 moves in a direction away from the component crimping portion 33, the mounting stage 35 moves in the forward direction (standby position) and moves in the left-right direction (X-axis direction). However, this is merely an example, and there is no particular limitation on the manner of movement of the mounting stage 35. Therefore, if the working space SP is formed in front of the component crimping portion 33 by either the forward movement or the lateral movement of the mounting stage 35, the mounting stage 35 moves in that direction. (Only moving forward or only moving in the left-right direction).

  Provided are a component mounting apparatus and an adjustment method thereof that can easily perform an adjustment operation of a component crimping portion.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 Components 13b Central transfer body (board | substrate transfer means)
13c Right transfer body (substrate transfer means)
33 Component Crimping Section 35 Mounting Stage (Board Holding Stage)
35M mounting stage moving mechanism (stage moving means)
101 Adjustment work mode setting operation section (operation means)

Claims (6)

A substrate holding stage for holding a substrate on which components are mounted;
Stage moving means for moving the substrate holding stage to position the substrate held on the substrate holding stage at a predetermined component crimping position;
A component crimping section for crimping the component to the substrate positioned at the component crimping position by the stage moving means;
Operating means operated when performing the adjustment work of the component crimping part,
The stage moving unit is a component mounting apparatus that moves the substrate holding stage in a direction away from the component crimping portion when the operation unit is operated.   A substrate transfer means for transferring a substrate to the substrate holding stage and transferring the substrate from the substrate holding stage is provided, and the substrate transfer means moves in a direction away from the component crimping portion when the operation means is operated. The component mounting apparatus according to claim 1.   The adjustment operation of the component crimping portion is at least one of a replacement operation of components of the component crimping portion, a maintenance operation of components of the component crimping portion, and a position adjustment operation of components of the component crimping portion. The component mounting apparatus according to 1 or 2. A substrate holding stage for holding a substrate on which a component is mounted; stage moving means for moving the substrate holding stage to position the substrate held on the substrate holding stage at a predetermined component crimping position; and the stage moving means. A component crimping unit that crimps the component to the substrate positioned at the component crimping position, and an adjustment method for a component mounting apparatus,
A method for adjusting a component mounting apparatus, wherein the stage moving unit moves the substrate holding stage in a direction away from the component crimping portion when the component crimping portion is adjusted.   The component mounting apparatus includes substrate transfer means for transferring a substrate to the substrate holding stage and transferring the substrate from the substrate holding stage. When performing the adjustment operation, the substrate transfer means is separated from the component crimping portion. The adjustment method of the component mounting apparatus of Claim 4 which moves to (5).   6. The adjustment operation according to claim 4 or 5, wherein the adjustment operation is at least one of a replacement operation of components of the component crimping portion, a maintenance operation of components of the component crimping portion, and a position adjustment operation of components of the component crimping portion. The adjustment method of the component mounting apparatus of description.

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