JP2016186527A5 - - Google Patents

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Publication number
JP2016186527A5
JP2016186527A5 JP2015065934A JP2015065934A JP2016186527A5 JP 2016186527 A5 JP2016186527 A5 JP 2016186527A5 JP 2015065934 A JP2015065934 A JP 2015065934A JP 2015065934 A JP2015065934 A JP 2015065934A JP 2016186527 A5 JP2016186527 A5 JP 2016186527A5
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JP
Japan
Prior art keywords
gap
cover
blower
light
support substrate
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JP2015065934A
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English (en)
Japanese (ja)
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JP6500551B2 (ja
JP2016186527A (ja
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Priority to JP2015065934A priority Critical patent/JP6500551B2/ja
Priority claimed from JP2015065934A external-priority patent/JP6500551B2/ja
Priority to US15/017,960 priority patent/US9547169B2/en
Priority to CN201610162063.6A priority patent/CN106019577B/zh
Publication of JP2016186527A publication Critical patent/JP2016186527A/ja
Priority to US15/348,172 priority patent/US10156717B2/en
Publication of JP2016186527A5 publication Critical patent/JP2016186527A5/ja
Application granted granted Critical
Publication of JP6500551B2 publication Critical patent/JP6500551B2/ja
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JP2015065934A 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器 Active JP6500551B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015065934A JP6500551B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器
US15/017,960 US9547169B2 (en) 2015-03-27 2016-02-08 Electro-optical device, method of manufacturing electro-optical device, electro-optical unit, and electronic apparatus
CN201610162063.6A CN106019577B (zh) 2015-03-27 2016-03-21 电光装置、电光装置的制造方法、电光单元及电子设备
US15/348,172 US10156717B2 (en) 2015-03-27 2016-11-10 Electro-optical device, method of manufacturing electro-optical device, electro-optical unit, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015065934A JP6500551B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

Publications (3)

Publication Number Publication Date
JP2016186527A JP2016186527A (ja) 2016-10-27
JP2016186527A5 true JP2016186527A5 (enExample) 2018-04-12
JP6500551B2 JP6500551B2 (ja) 2019-04-17

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ID=56975254

Family Applications (1)

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JP2015065934A Active JP6500551B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

Country Status (3)

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US (2) US9547169B2 (enExample)
JP (1) JP6500551B2 (enExample)
CN (1) CN106019577B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184068A (ja) * 2015-03-26 2016-10-20 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
JP6500551B2 (ja) * 2015-03-27 2019-04-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

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US4481531A (en) * 1977-11-03 1984-11-06 Massachusetts Institute Of Technology Microchannel spatial light modulator
US5042923A (en) * 1988-06-27 1991-08-27 Allied-Signal, Inc. Adjustable tint window with electrochromic conductive polymer
KR100584538B1 (ko) * 1999-11-04 2006-05-30 삼성전자주식회사 마이크로미러 가동장치를 채용한 반사형 프로젝터
US6700557B1 (en) * 2000-03-07 2004-03-02 Three-Five Systems, Inc. Electrode border for spatial light modulating displays
JP3605752B2 (ja) * 2000-03-10 2004-12-22 ノーリツ鋼機株式会社 画像形成装置
US6555904B1 (en) * 2001-03-05 2003-04-29 Analog Devices, Inc. Electrically shielded glass lid for a packaged device
JP2004354853A (ja) * 2003-05-30 2004-12-16 Seiko Epson Corp 冷却装置、この冷却装置を備えた光学装置およびプロジェクタ
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US7760415B2 (en) * 2003-11-01 2010-07-20 Silicon Quest Kabushiki-Kaisha Micro mirror device
US20050184304A1 (en) * 2004-02-25 2005-08-25 Gupta Pavan O. Large cavity wafer-level package for MEMS
US7417783B2 (en) * 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
KR100667291B1 (ko) * 2005-07-27 2007-01-12 삼성전자주식회사 마이크로 미러 소자 패키지 및 그 제조방법
JP4142064B2 (ja) * 2005-08-05 2008-08-27 セイコーエプソン株式会社 液晶装置、電気光学装置、プロジェクタ、及びマイクロデバイス
US7763962B2 (en) * 2006-11-10 2010-07-27 Spatial Photonics, Inc. Wafer-level packaging of micro devices
JP5098681B2 (ja) * 2008-02-15 2012-12-12 セイコーエプソン株式会社 液晶装置、投射装置、及び電子機器
DE102008012384A1 (de) * 2008-03-04 2009-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckel für Mikro-Systeme und Verfahren zur Herstellung eines Deckels
JP2010014798A (ja) * 2008-07-01 2010-01-21 Nsk Ltd マイクロミラーデバイス及び光照射装置
US7898724B2 (en) 2008-11-05 2011-03-01 Texas Instruments Incorporated Thermal conduction by encapsulation
WO2011134513A1 (en) * 2010-04-28 2011-11-03 Lemoptix Sa Optical mems scanning micro-mirror with speckle reduction
WO2012029370A1 (ja) * 2010-08-31 2012-03-08 京セラ株式会社 光伝送構造体およびその製造方法、ならびに光伝送モジュール
JP2012198401A (ja) 2011-03-22 2012-10-18 Seiko Epson Corp プロジェクター
KR101849974B1 (ko) * 2011-09-16 2018-04-19 삼성전자주식회사 개구수 제어 유닛, 이를 채용한 가변형 광 프로브 및 깊이 스캐닝 방법
US20140002964A1 (en) * 2012-06-28 2014-01-02 Qualcomm Mems Technologies, Inc. Mems device encapsulation with corner or edge seals
EP2769956B1 (en) * 2013-02-20 2016-08-24 Harman Becker Automotive Systems GmbH Circuit board comprising spatial light modulator
JP6500551B2 (ja) * 2015-03-27 2019-04-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

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