CN106019577B - 电光装置、电光装置的制造方法、电光单元及电子设备 - Google Patents

电光装置、电光装置的制造方法、电光单元及电子设备 Download PDF

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Publication number
CN106019577B
CN106019577B CN201610162063.6A CN201610162063A CN106019577B CN 106019577 B CN106019577 B CN 106019577B CN 201610162063 A CN201610162063 A CN 201610162063A CN 106019577 B CN106019577 B CN 106019577B
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China
Prior art keywords
light
electro
wafer
mirror
transmitting plate
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CN201610162063.6A
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Chinese (zh)
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CN106019577A (zh
Inventor
山崎康男
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Seiko Epson Corp
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Seiko Epson Corp
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/085—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
    • G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Projection Apparatus (AREA)
  • Transforming Electric Information Into Light Information (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201610162063.6A 2015-03-27 2016-03-21 电光装置、电光装置的制造方法、电光单元及电子设备 Active CN106019577B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-065934 2015-03-27
JP2015065934A JP6500551B2 (ja) 2015-03-27 2015-03-27 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

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CN106019577A CN106019577A (zh) 2016-10-12
CN106019577B true CN106019577B (zh) 2020-07-21

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US (2) US9547169B2 (enExample)
JP (1) JP6500551B2 (enExample)
CN (1) CN106019577B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016184068A (ja) * 2015-03-26 2016-10-20 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
JP6500551B2 (ja) * 2015-03-27 2019-04-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

Citations (2)

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CN1573521A (zh) * 2003-05-30 2005-02-02 精工爱普生株式会社 冷却装置、具备该冷却装置的光学装置及投影机
CN103996674A (zh) * 2013-02-20 2014-08-20 哈曼贝克自动系统股份有限公司 电子组件

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US4481531A (en) * 1977-11-03 1984-11-06 Massachusetts Institute Of Technology Microchannel spatial light modulator
US5042923A (en) * 1988-06-27 1991-08-27 Allied-Signal, Inc. Adjustable tint window with electrochromic conductive polymer
KR100584538B1 (ko) * 1999-11-04 2006-05-30 삼성전자주식회사 마이크로미러 가동장치를 채용한 반사형 프로젝터
US6700557B1 (en) * 2000-03-07 2004-03-02 Three-Five Systems, Inc. Electrode border for spatial light modulating displays
JP3605752B2 (ja) * 2000-03-10 2004-12-22 ノーリツ鋼機株式会社 画像形成装置
US6555904B1 (en) * 2001-03-05 2003-04-29 Analog Devices, Inc. Electrically shielded glass lid for a packaged device
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US7760415B2 (en) * 2003-11-01 2010-07-20 Silicon Quest Kabushiki-Kaisha Micro mirror device
US20050184304A1 (en) * 2004-02-25 2005-08-25 Gupta Pavan O. Large cavity wafer-level package for MEMS
US7417783B2 (en) * 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
KR100667291B1 (ko) * 2005-07-27 2007-01-12 삼성전자주식회사 마이크로 미러 소자 패키지 및 그 제조방법
JP4142064B2 (ja) * 2005-08-05 2008-08-27 セイコーエプソン株式会社 液晶装置、電気光学装置、プロジェクタ、及びマイクロデバイス
US7763962B2 (en) * 2006-11-10 2010-07-27 Spatial Photonics, Inc. Wafer-level packaging of micro devices
JP5098681B2 (ja) * 2008-02-15 2012-12-12 セイコーエプソン株式会社 液晶装置、投射装置、及び電子機器
DE102008012384A1 (de) * 2008-03-04 2009-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckel für Mikro-Systeme und Verfahren zur Herstellung eines Deckels
JP2010014798A (ja) * 2008-07-01 2010-01-21 Nsk Ltd マイクロミラーデバイス及び光照射装置
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JP2012198401A (ja) 2011-03-22 2012-10-18 Seiko Epson Corp プロジェクター
KR101849974B1 (ko) * 2011-09-16 2018-04-19 삼성전자주식회사 개구수 제어 유닛, 이를 채용한 가변형 광 프로브 및 깊이 스캐닝 방법
US20140002964A1 (en) * 2012-06-28 2014-01-02 Qualcomm Mems Technologies, Inc. Mems device encapsulation with corner or edge seals
JP6500551B2 (ja) * 2015-03-27 2019-04-17 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、電気光学ユニット、および電子機器

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CN103996674A (zh) * 2013-02-20 2014-08-20 哈曼贝克自动系统股份有限公司 电子组件

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Publication number Publication date
JP6500551B2 (ja) 2019-04-17
US9547169B2 (en) 2017-01-17
CN106019577A (zh) 2016-10-12
US10156717B2 (en) 2018-12-18
US20170059853A1 (en) 2017-03-02
JP2016186527A (ja) 2016-10-27
US20160282607A1 (en) 2016-09-29

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