JP2016175159A - Transport device and transport method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transport device which reduces a load applied on a transporting object as much as possible, positions the transporting object, and securely transports the transporting object.SOLUTION: A transport device 10 holds and transports a transporting object WF in an unspecified position in a predetermined area CT, and includes holding means 20 for holding the transporting object WF on a holding surface 21A, and moving means 30 for moving the holding means 20. The moving means 30 moves the holding means 20 in one linear direction within a plane parallel to the holding surface 21A, makes the holding means 20 abut on an outer edge of the transporting object WF. Thereby, the transporting object WF is arranged in a specific position in the predetermined area CT, and the transporting object WF arranged in the specific position is held and transported by associating to a reference position HC of the holding means 20.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a transport apparatus and a transport method.

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) is taken out from a cassette, and the taken-out wafer is transferred using a robot (for example, see Patent Document 1). .
In the transfer method described in Patent Document 1, a wafer holding apparatus applies a holding force from the outer periphery of the wafer toward the center in the surface direction, and positions and transfers the wafer.

JP 2003-218183 A

  However, in the conventional method described in Patent Document 1, if the gripping force for gripping the wafer is large, the wafer is damaged, and if the gripping force is small, the wafer is dropped during transfer. There is an inconvenience.

  An object of the present invention is to provide a transport apparatus and a transport method that can position and transport a transported object while minimizing a load applied to the transported object.

  In order to achieve the above object, a transport apparatus according to the present invention includes a holding unit that holds a transported object on a holding surface in a transport apparatus that holds and transports a transported object at an unspecified position in a predetermined area. Moving means for moving the holding means, the moving means moving the holding means in one linear direction in a plane parallel to the holding surface, and moving the holding means to the outer edge of the object to be conveyed. By bringing them into contact, the object to be conveyed is arranged at a specific position in the predetermined area, and the object to be conveyed arranged at the specific position is held in association with the reference position of the holding means and conveyed. The configuration is adopted.

In the transport apparatus according to the aspect of the invention, it is preferable that the holding unit includes a contact unit that contacts an outer edge of the transported object.
In the transport apparatus of the present invention, it is preferable that the transport apparatus includes a vibration applying unit that applies vibration to the object to be transported.

  On the other hand, the transport method of the present invention is a transport method for transporting while holding a transported object at an unspecified position in a predetermined area. Placing the transported object at a specific position in the predetermined area by moving the holding means in contact with an outer edge of the transported object in a single linear direction within a plane; and And a step of holding and transporting the object to be transported arranged at the position in association with the reference position of the holding means.

According to the present invention as described above, since it is not necessary to grip the object to be conveyed, it is possible to position and convey the object to be conveyed while minimizing the load applied to the object to be conveyed.
Moreover, by providing the contact means, the object to be conveyed can be easily moved within the predetermined area.
Furthermore, the object to be conveyed can be moved more easily in the predetermined area by providing the vibration applying means.

The top view which shows the conveying apparatus which concerns on 1st Embodiment of this invention. Operation | movement explanatory drawing of the conveying apparatus of FIG. Operation | movement explanatory drawing of the conveying apparatus which concerns on 2nd Embodiment of this invention. The top view which shows the modification of this invention.

Hereinafter, a first embodiment and a second embodiment of the present invention will be described with reference to the drawings.
In each embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. And Further, in the present embodiment, when viewed from the direction of the arrow D1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, and “left”. Is the arrow direction of the X axis, “right” is the opposite direction, “front” is the arrow direction of the Y axis, and “rear” is the opposite direction.
In the second and subsequent embodiments, the same configurations and similar operations described in the first embodiment are omitted or simplified as appropriate.

<First Embodiment>
1 and 2, a transfer apparatus 10 is an apparatus that holds and transfers a wafer WF as a transfer object at an unspecified position in a cassette CT as a predetermined area, and holds the wafer WF on a holding surface 21A. Holding means 20, holding means 20 for moving the holding means 20, and vibration applying means 50 for applying vibration to the wafer WF, and positioning the wafer WF taken out from the cassette CT, On the other hand, it is placed on the work table 60 at a predetermined position. Note that the cassette CT includes an opening CT1 and a plurality of ribs CT2 that support the left and right sides of the wafer WF and can stack the wafer WF in a multi-stage in the vertical direction. It is positioned and placed at a predetermined position on a certain mounting table 70.

The holding means 20 has a suction port 21B communicating with a suction means (not shown) such as a decompression pump or a vacuum ejector on a holding surface 21A that holds the wafer WF, and a holding arm 21 whose predetermined position is a reference position HC; A first contact member 21D and a second contact member 21E are provided as contact means that are supported on the neck portion 21C of the holding arm 21 and contact the outer edge of the wafer WF.
The first and second abutting members 21D and 21E are arranged as line targets with respect to a reference line HL extending in the extending direction of the holding arm 21 through the reference position HC of the holding arm 21, and each of them is arranged on the wafer WF. By contacting two arbitrary points on the outer edge, the center WC of the wafer WF can be positioned on the reference line HL.

  The moving means 30 serves as a driving device that supports the holding means 20 by the work arm 31A via the vibration applying means 50 and can displace the holding means 20 supported within the working range at any position and at any angle. An articulated robot 31 that is a so-called six-axis robot is provided.

  The vibration applying means 50 includes a vibrator 51 as a driving device that applies vibration to at least one of the holding arm 21 and the first and second contact members 21D and 21E.

The transfer procedure of the wafer WF will be described using the transfer device 10 described above.
First, a transfer device (not shown) such as a manual or multi-joint robot or a belt conveyor places the cassette CT in which the wafer WF is stored on the mounting table 70 at an unspecified position on the rib CT2. Next, after the operator inputs the diameter of the circumference of the wafer WF or the like via an input means (not shown) such as an operation panel or a personal computer, an automatic operation start signal is input. Then, the moving means 30 drives the articulated robot 31 and, as shown in FIG. 2 (A), the holding arm 21 is inserted below the wafer WF to separate the wafer WF from the rib CT2, and then FIG. As shown in B), the holding arm 21 is moved in the cassette CT forward by a predetermined distance. At this time, the holding means 2 may or may not hold the wafer WF by suction with the suction port 21B. Thereafter, the moving means 30 drives the articulated robot 31, lowers the holding arm 21 downward, and supports the wafer WF with the rib CT2.

  Next, the moving unit 30 moves the holding unit 20 in the rearward direction in the Y-axis direction as one linear direction in a plane parallel to the holding surface 21A, and moves the first and second contact members 21D and 21E on the wafer WF. By contacting the outer edge, the wafer WF is placed at a specific position in the cassette CT. That is, the moving means 30 drives the articulated robot 31 to move the holding means 20 backward, and as shown in FIG. 2C, the wafer WF is pushed back by the first and second contact members 21D and 21E. . When the detection means (not shown) such as an optical sensor or an imaging means detects that the outer edge of the wafer WF is in contact with each of the first and second contact members 21D and 21E, the center WC of the wafer WF is on the reference line HL. Therefore, the wafer WF is arranged at a specific position. Thereafter, the wafer WF placed at a specific position is held in association with the reference position HC of the holding means 20. That is, the moving means 30 drives the articulated robot 31, and the holding surface 21A is brought into contact with the wafer WF so that the reference position HC and the center WC of the wafer WF coincide with each other in a plan view (line of sight when viewed from above). Then, the holding unit 20 drives a decompression unit (not shown) to suck and hold the wafer WF (see FIG. 2D). The center WC of the wafer WF can be determined from the diameter of the circumference of the wafer WF input via the input means. When the holding arm 21 is moved to move the wafer WF, the vibration applying unit 50 may drive the vibrator 51 so that the wafer WF can be easily moved.

  Then, after the moving means 30 drives the articulated robot 31 to take out the wafer WF from the cassette CT and invert the wafer WF upside down, the reference position HC of the holding arm 21, that is, the center WC of the wafer WF is set as a work table. It is placed so as to coincide with the center TC of 60. Next, after the holding unit 20 stops driving the suction unit (not shown), the moving unit 30 drives the articulated robot 31 to retract the holding arm 21 from above the wafer WF, and thereafter the same operation is repeated.

  According to the first embodiment as described above, since it is not necessary to hold the wafer WF, the load applied to the wafer WF can be minimized and the wafer WF can be positioned and transferred.

Second Embodiment
In FIG. 3, the conveyance device 10 </ b> A is different in that a holding unit 20 </ b> A is employed instead of the holding unit 20 in the conveyance device 10 of the first embodiment. The holding unit 20A includes a holding arm 22 having a suction port (not shown) that communicates with a suction unit (not shown) such as a vacuum pump or a vacuum ejector on a holding surface 22A that holds the wafer WF. The holding arm 22 includes a linear motion motor 22B as two drive devices supported on the surface opposite to the holding surface 22A, and left and right ends of a bracket 22D supported by the output shaft 22C of each linear motion motor 22B. Is provided with a front pin 22F and a rear pin 22G as contact means protruding from the opening 22E of the holding surface 22A. The front pins 22F and the rear pins 22G are in contact with each other at two arbitrary points on the outer edge of the wafer WF, so that the center WC of the wafer WF is positioned on the reference line HL passing through the reference position HC of the holding arm 22. Can be done. The cassette CTA is formed on the opening CT1, a plurality of ribs CT2 that can support the left and right sides of the wafer WF and stack the wafers WF in the vertical direction, and the rear side opposite to the opening CT1. And an opening CT3.

The transfer procedure of the wafer WF will be described using the above transfer apparatus 10A.
First, when an automatic operation start signal is input in the same manner as in the first embodiment, as shown in FIG. 3A, after the holding arm 22 is inserted below the wafer WF, the holding means 20A moves linearly. The motor 22B is driven to bring the front and rear pins 22F and 22G closer as shown in FIG. At this time, the diameter of the inscribed circle formed by the front and rear pins 22F and 22G is set to be larger than the diameter of the wafer WF. For example, when the diameter of the wafer WF is 300 mm, the inner circle The diameter of the tangent circle is set to be 303 mm or the like. As a result, even if the wafer WF comes into contact with any of the front and rear pins 22F and 22G, no gripping force is applied to the wafer WF. The interval between the front and rear pins 22F and 22G may be an interval at which the wafer WF does not pass through when the wafer WF is moved by the front and rear pins 22F and 22G, and an inscribed circle cannot be drawn. Arrangement is also acceptable.

  Next, the moving means 30 drives the articulated robot 31, moves the holding means 20A in the backward direction, and pushes the wafer WF back by the front pins 22F, as shown in FIG. When a detection means (not shown) such as an optical sensor or an imaging means detects that the outer edge of the wafer WF is in contact with each front pin 22F, the center WC of the wafer WF is positioned on the reference line HL. Thus, the wafer WF is arranged in a specific position. Thereafter, the moving unit 30 and the holding unit 20 drive the articulated robot 31 and the decompression unit (not shown), and the wafer WF is sucked by the holding surface 21A so that the reference position HC and the center WC of the wafer WF coincide in plan view. Hold (see FIG. 3E).

  Even in the second embodiment described above, the same effects as in the first embodiment can be obtained.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

  As shown in FIG. 4A, the detection means for detecting that the outer edge of the wafer WF is in contact with each of the first and second contact members 21D and 21E is the first and second contact members 21D and 21E. The continuity detecting means 80 such as a continuity checker or a resistor that is supported by the holding arm 21 in a state of being electrically insulated and detects their continuity may be employed. In this case, the outer edge of the object to be conveyed having contact with each of the first and second abutting members 21 </ b> D and 21 </ b> E is in contact with the center of the object to be conveyed on the reference line HL of the holding arm 21. Can be detected, and the completion of positioning can be determined. Such continuity detecting means 80 may be employed in the front and rear pins 22F and 22G of the second embodiment.

As shown in FIGS. 4B and 4C, the contact means includes third and fourth contact members 21F and 21G whose contact surface with the wafer WF follows the shape of the outer edge of the wafer WF. It may be.
In the case of the third abutting member 21F, as shown in the figure, by setting the diameter of the arc to a predetermined diameter, the third contact member 21F may be used exclusively for the wafer WFA having the predetermined diameter dimension. Alternatively, the two end portions 21FA may be brought into contact with the wafer WFB having a large diameter.
In the case of the fourth abutting member 21G, the angle of the corner may be changed to correspond to a polygonal object to be transferred other than a hexagon. In order to improve the fit of the wafer WF, the corner is opened. An escape portion 21GA such as a hole or a hole may be provided.
As shown in FIG. 4D, the tip end portion 21H of the holding arm 21 may be brought into contact with the outer edge of the wafer WF so that the wafer WF is arranged at a specific position. In this case, the holding means is bothered. There is no need to provide contact means.

The holding means 20, 20 </ b> A may be configured to be able to hold the object to be conveyed by magnetic adhesion, adhesion, adhesion, electrostatic chuck, Bernoulli adsorption device, or the like.
The reference position HC of the holding means 20 and 20A may be any position, and may be inside the support surfaces 21A and 22A or outside the support surfaces 21A and 22A.
The shape of the holding arms 21 and 22 is not limited at all, such as I-type, Y-type, and round shape.
The abutting means may be supported on the neck portion 21C of the holding arm 21 via a rotating motor as a driving device, and the rotating motor functions as a vibration applying means or the shape of the outer edge of the object to be conveyed. The angle formed between the contact members may be changed according to the above.
The number of front pins 22F and rear pins 22G in the second embodiment may be one, three or more, or a configuration that can move in a direction orthogonal to the reference line HL.

The moving unit 30 may apply vibration to the wafer WF via at least one of the holding units 20 and 20A and the contact unit. In this case, the moving unit 30 serves as the vibration applying unit.
The moving unit 30 may move the holding arm 22 in the X-axis direction and place the wafer WF at a specific position in the cassette CT. In this case, the contact means may be configured to be arranged on at least one of the left and right sides of the wafer WF when the holding arm 21 is inserted below the wafer WF.
Even if the moving means 30 performs the positioning operation shown in FIGS. 2A to 2C only once in the first embodiment, the outer edge of the wafer WF is applied to each of the first and second contact members 21D and 21E. If they do not contact, the positioning operation may be repeated a plurality of times until they contact.
In the second embodiment, when the outer edge of the wafer WF does not come into contact with each of the front pins 22F even when the holding arm 22 is moved backward in the second embodiment, as shown in FIG. The holding arm 21 may be moved in the forward direction, and the outer edge of the wafer WF may be brought into contact with each of the rear pins 22G. If the outer edge of the wafer WF is not in contact with each of the rear pins 22G, the front and rear movements are continued until the outer edge of the wafer WF is in contact with each of the front pins 22F or each of the rear pins 22G. You may repeat.
The distance by which the moving means 30 moves the holding arms 21 and 22 forward or backward can be arbitrarily determined by the operator, and these distances may be the same distance or different distances.
For example, the moving unit 30 moves the wafer on the holding surface 21A in a state where the reference position HC and the center WC of the wafer WF are shifted by a predetermined distance in at least one of the reference line HL direction and the direction orthogonal to the reference line HL. WF may be held. Even in such a case, if the wafer WF can be held in association with the reference position HC so that it can be understood in which direction and how much the center WC of the wafer WF held shifted is shifted with respect to the reference position HC, The wafer WF can be placed at a predetermined position at the transfer destination.
The moving means 30 holds, for example, one corner of a triangular or quadrangular or more polygonal conveyed object, a mark formed on the conveyed object, and the like by the holding means 20 and 20A in association with the reference position HC. It may be.

The vibration applying means 50 may include an amplitude adjusting means capable of adjusting the amplitude of vibration according to the size, weight, etc. of the wafer WF.
The vibrator 51 is provided so as to be able to apply vibration to the wafer WF with a predetermined amplitude and frequency. For example, an unbalanced mass in which an eccentric weight is attached to a rotating shaft of a piezoelectric type using a piezoelectric element or a rotary type electric motor. A type that vibrates on an arbitrary principle, such as an electrodynamic type that uses a force generated by passing a current through a drive coil, a known ultrasonic vibration generator, a known vibrator that uses an electric motor or air, etc. Any device that can be employed and that can directly or indirectly impart vibration to the wafer WF may be used.
The vibration applying means 50 may be provided on at least one of the holding means 20 and the contact means, or may be omitted.

The cassette CT may store only one wafer or a plurality of wafers.
The predetermined area may be a member other than the cassette CT, the upper surface of the mounting table 70, or the like.
In the first and second embodiments, detection means for detecting that the first and second contact members 21D and 21E contact each of the front pins 22F or the rear pins 22G and the outer edge of the wafer WF. May not be provided. In such a case, it is statistically derived how many times the holding arms 21 and 22 are moved forward and backward, and the outer edge of the wafer WF comes into contact therewith. However, the forward movement and the backward movement may be repeated by the number of times.

  The material to be transported is not limited in material, type, shape, etc., for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording boards such as optical disks, glass plates, etc. Further, members and articles in any form such as steel plates, earthenware, wood plates, or resin plates can be targeted.

  The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the holding means can hold the object to be conveyed on the holding surface, it is not limited in any way as long as it is within the technical scope in light of the technical common sense at the beginning of the application. And description of the process is omitted).

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to the above, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

10, 10A Conveying device 20, 20A Holding means 21A, 22A Holding surface 30 Moving means 21D, 21E, 21F, 21G Abutting means 50 Vibration applying means CT, CTA cassette (predetermined area)
HC reference position WF Wafer (conveyed object)

Claims (4)

In a transport device that holds and transports an object to be transported at an unspecified position in a predetermined area,
Holding means for holding the object to be conveyed by a holding surface;
Moving means for moving the holding means,
The moving means moves the holding means in one linear direction within a plane parallel to the holding surface, and brings the holding means into contact with an outer edge of the transferred object, thereby bringing the transferred object into the predetermined direction. A transport apparatus, wherein the transport apparatus is disposed at a specific position in an area and transports the transported object disposed at the specific position in association with a reference position of the holding means.   The transport apparatus according to claim 1, wherein the holding unit includes a contact unit configured to contact an outer edge of the object to be transported.   The conveying apparatus according to claim 1, further comprising a vibration applying unit that applies vibration to the object to be conveyed. In a transport method for holding and transporting an object to be transported at an unspecified position in a predetermined area,
The holding means for holding the object to be conveyed is moved in one linear direction within a plane parallel to the holding surface, and the holding means is brought into contact with the outer edge of the object to be conveyed, Arranging an object at a specific position in the predetermined area;
And a step of holding and transferring the object to be transferred arranged at the specific position in association with a reference position of the holding means.

Images