JP2016174088A - End face electrode substrate and method of manufacturing composite substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for enhancement of the degree-of-freedom in the design of a composite substrate, while enhancing the ease, reliability and economy in the manufacturing of a composite substrate.SOLUTION: An end face electrode substrate includes a fitting portion where the inner periphery of the opening of a plate in the thickness direction is fitted partially or entirely to a part or the whole of the outer periphery of an end face electrode slave substrate having a first electrode on the outer peripheral end face of a plate, and a second electrode provided on the inner peripheral end face of the fitting portion, and approaches to a distance capable of soldering to the first electrode at the time of fitting.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an end face electrode substrate having electrodes on the end face of the substrate, and a composite substrate manufacturing method using the end face electrode substrate.

  Many board mounting techniques have been proposed.

  An example of a technique for preventing an electronic component from being deteriorated or destroyed due to thermal stress is disclosed in Patent Document 1. In the module manufacturing method of Patent Document 1, a cover mounting step for press-fitting and holding a shield cover on the upper surface side, a printing step for printing cream solder on the lower surface side, a mounting step for mounting the back side electronic component, and the back side electronic component And a reflow process of reflow soldering the shield cover at the same time in this order. Thereby, in the manufacturing method of the module of patent documents 1, the number of reflows decreases and the thermal stress added to front side electronic parts decreases.

  An example of a technique for cutting out more module substrates from the parent substrate is disclosed in Patent Document 2. In the end face electrode forming method of Patent Literature 2, a plurality of module substrates are cut out and formed by cutting the parent substrate along each side of a plurality of arrayed module substrate formation regions. Thereby, in the end surface electrode forming method of Patent Document 2, a common rim through hole is formed between the adjacent module substrate forming regions.

  Patent Document 3 discloses an example of a technique that can prevent the occurrence of defects by suppressing the warpage of the package and suppress the increase in the thickness of the package. The semiconductor device of Patent Document 3 includes a first substrate on which a semiconductor chip is mounted, a second substrate having an opening larger than the size in the surface direction of the first substrate, and the first substrate. And a flexible connecting member that electrically and mechanically connects the first and second substrates in a state of being disposed in the opening of the two substrates. Thereby, in the semiconductor device of Patent Document 3, it is possible to prevent the occurrence of defects by suppressing the warpage of the package, and to suppress an increase in the thickness of the package.

  An example of a technique for achieving a reduction in the thickness of a card-type optical communication module is disclosed in Patent Document 4. The card-type optical communication module of Patent Document 4 includes a daughter board, a mother board on which a cutout portion on which the daughter board is mounted is formed, and pins that connect the boards. Thereby, in the card-type optical communication module of Patent Document 4, a reduction in thickness is achieved.

  An example of a technique for eliminating the mounting height due to the multistage mounting structure is disclosed in Patent Document 5. In the flip-chip IC mounting structure of Patent Document 5, an inner shape corresponding to the outer shape of the flip-chip IC is slightly larger than the outer shape and is inserted into an opening formed in the mother substrate. The mounted IC mounting substrate is connected and mounted via solder bumps.

  Hereinafter, the circuit board is simply referred to as “substrate”. When a series of electric circuits includes two substrates, and a smaller substrate is installed on a larger substrate, the smaller substrate is referred to as a “child substrate” and the larger substrate is referred to as a “parent substrate”. A substrate in which a child substrate and a parent substrate are combined is called a “composite substrate”. An electrode disposed on an end face perpendicular to the thickness direction of the plate material is referred to as an “end face electrode”. A substrate having end face electrodes is referred to as an “end face electrode substrate”. In addition, the end face electrode substrate that is a child substrate is referred to as an “end face electrode child substrate” and the end face electrode substrate that is a parent substrate is referred to as an “end face electrode parent substrate”.

  FIG. 6 is a schematic configuration diagram of a composite substrate 800 in which an end face electrode substrate and a parent substrate are combined. 6A is a cross-sectional view, and FIG. 6B is a plan view. 6A shows the composite substrate 800 before the end electrode substrate 200 and the parent substrate 900 are combined, and the right side of FIG. 6A shows the end electrode substrate 200 and the parent substrate 900 combined. The composite substrate 800 is shown. 6B shows the end face electrode substrate 200 before bonding, the center of FIG. 6B shows the parent substrate 900 before bonding, and the right side of FIG. 6B shows after bonding. A composite substrate 800 is shown.

  When the end surface electrode substrate 200 and the parent substrate 900 are connected, the end surface electrode substrate 200 is disposed on an electrode 910 (also referred to as “land” or “pad”) formed on the surface of the parent substrate 900. The electrode 910 of the parent substrate 900 and the end surface electrode 210 of the end surface electrode substrate 200 are soldered.

JP 2007-305719 A JP 2003-224336 A JP 2005-019692 A JP 2004-087150 A Japanese Patent Laid-Open No. 06-232199

In the composite substrate 800, the end face electrode substrate 200 is disposed on the parent substrate 900. Therefore, the composite substrate 800 has a problem that the thickness of the composite substrate 800 is large. Further, in the composite substrate 800, when the end face electrode substrate 200 and the parent substrate 900 are joined, the back surface of the end face electrode substrate 200 and the front surface of the parent substrate 900 are arranged to contact each other. Therefore, the composite substrate 800 has a problem that components cannot be arranged on both surfaces of the end electrode substrate 200. In addition, the composite substrate 800 is soldered only between the back surface side and a part of the end surface side of the electrode 210 of the end surface electrode substrate 200 and a part of the surface side of the electrode 910 of the parent substrate 900. Therefore, the composite substrate 800 has problems that soldering is difficult and soldering reliability is low. Further, the composite substrate 800 does not have an opening at a position where the end face electrode substrate 200 is disposed, or has an opening smaller than the outer shape of the end face electrode substrate 200. Therefore, the composite substrate 800 has a problem that a plate material for the parent substrate 900 cannot be manufactured by cutting out the plate material for the end face electrode substrate 200 from one plate material.
(Object of invention)
The main object of the present invention is to improve the degree of freedom in designing a composite substrate, and to improve the ease, reliability, and economy of manufacturing the composite substrate, and to manufacture an end face electrode substrate and a composite substrate. It is to provide a method.

  In the end face electrode parent substrate of the present invention, a part or all of the inner periphery of the opening in the thickness direction of the plate material is fitted to a part or all of the outer periphery of the end surface electrode child substrate having the first electrode on the outer peripheral end surface of the plate material. And a second electrode provided on an inner peripheral end surface of the fitting portion, which is close to a distance that can be soldered to the first electrode during fitting.

  In the composite substrate manufacturing method of the present invention, an end face electrode substrate having a first electrode on the outer peripheral end face of a plate material is placed on a part or all of the outer periphery of the end face electrode substrate, and the inner circumference of the opening in the thickness direction of the plate material is reduced. An end face electrode mother board having a fitting part that fits all or part, and a second electrode provided on the inner peripheral end face of the fitting part that is close to a distance that can be soldered to the first electrode during fitting And a soldering step of soldering the end face electrode of the end face electrode substrate and the end face electrode of the end face electrode parent substrate.

  According to the present invention, it is possible to improve the degree of freedom in designing a composite substrate, and to improve the ease, reliability, and economy in manufacturing the composite substrate.

It is a schematic block diagram which shows an example of a structure of the composite substrate in the 1st Embodiment of this invention. It is a schematic block diagram which shows an example of the whole shape of the end surface electrode in the 1st Embodiment of this invention. It is a schematic block diagram which shows an example of the detailed shape of the end surface electrode in the 1st Embodiment of this invention. It is a schematic block diagram which shows an example of the shape of the fitting part in the 1st Embodiment of this invention. It is a flowchart which shows the manufacturing process of the composite substrate in the 1st Embodiment of this invention. It is a schematic block diagram of the composite substrate with which the end surface electrode substrate and the main substrate were combined.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, equivalent components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
(First embodiment)
A configuration in the present embodiment will be described.

  FIG. 1 is a schematic configuration diagram showing an example of the configuration of the composite substrate 300 in the first embodiment of the present invention. 1A is a cross-sectional view, and FIG. 1B is a plan view. The left side of FIG. 1A shows the composite substrate 300 before the end face electrode substrate 200 and the end face electrode parent substrate 100 are joined, and the right side of FIG. 1A shows the end face electrode substrate 200 and the end face electrode parent substrate 100. The composite substrate 300 is shown after and are combined. The left side of FIG. 1B shows the end face electrode substrate 200 before joining, the center of FIG. 1B shows the end face electrode parent substrate 100 before joining, and the right side of FIG. The composite substrate 300 is shown.

  The composite substrate 300 includes an end face electrode substrate 200 and an end face electrode parent substrate 100.

  The end face electrode substrate 200 has end face electrodes 210 on the outer peripheral end face of the end face electrode substrate 200.

  The end face electrode main substrate 100 has a fitting portion 120 and an end face electrode 110.

  The fitting portion 120 is an opening in the thickness direction of the plate member of the fitting portion 120 in which a part or all of the inner periphery is fitted to a part or all of the outer periphery of the end face electrode substrate 200.

  The end face electrode 110 is a conductor foil that is provided on the inner peripheral end face of the fitting portion 120 and is close to a distance that can be soldered to the end face electrode 210 during fitting.

  The structure of the end face electrode in this embodiment will be described.

  FIG. 2 is a schematic configuration diagram showing an example of the overall shape of the end face electrode 110 of the end face electrode parent substrate 100 and the end face electrode 210 of the end face electrode child substrate 200 in the first embodiment of the present invention. 2A shows a semicylindrical end face electrode, FIG. 2B shows an uneven end face electrode, and FIG. 2C shows a flat end face electrode. In FIG. 2, the upper diagram shows the shape of the end surface electrode terminal 210, and the lower diagram shows the shape of the end surface electrode terminal 110. In FIG. 2B, a concave end face electrode is shown as the structure of the end face electrode terminal 110 of the end face electrode parent substrate 100, and a convex end face electrode is shown as the structure of the end face electrode terminal 210 of the end face electrode child substrate 200. However, the concave shape and the convex shape may be reversed.

  FIG. 3 is a schematic configuration diagram showing an example of detailed shapes of the end face electrode 110 and the end face electrode 210 in the first embodiment of the present invention. 3A shows a semi-cylindrical end face electrode, FIG. 3B shows an uneven end face electrode, and FIG. 3C shows a flat end face electrode. In FIG. 3, the upper diagram shows the shape of the end electrode terminal 210 of the end electrode substrate 200, the middle diagram shows the shape of the end electrode terminal 110 of the end electrode parent substrate 100, and the lower diagram shows the end electrode terminal 110 and the end surface. The cross-sectional shape at the time of fitting of the electrode terminal 210 is shown.

  As shown in FIGS. 2 and 3, the end face electrode 110 of the end face electrode main substrate 100 and the end face electrode 210 of the end face electrode child substrate 200 are fitted together between the end face electrode parent substrate 100 and the end face electrode substrate 200. It has a cylindrical or quadrangular prism shape. The end face electrode 110 and the end face electrode 210 are adjacent to each other when the end face electrode parent substrate 100 and the end face electrode child substrate 200 are fitted together. In the uneven end face electrode, when the end face electrode parent substrate 100 and the end face electrode child substrate 200 are fitted, the end face electrode uneven shapes are fitted to each other. Further, when the end face electrode parent substrate 100 and the end face electrode child substrate 200 are fitted together, the end face electrode 110 and the end face electrode 210 form a columnar or prismatic shape, and the end face electrode 110 and the end face electrode 210 are minute. The gap is filled with solder. Alternatively, when the end face electrode parent substrate 100 and the end face electrode child substrate 200 are fitted together, the end face electrode 110 and the end face electrode 210 form a cylindrical or rectangular tube shape, and the end face electrode 110 and the end face electrode 210 form. The opening may be filled with solder. When the end face electrode 110 and the end face electrode 210 have a cylindrical or prismatic shape, more solder is used than when the end face electrode 110 and the end face electrode 210 have a cylindrical or prismatic shape. Is filled between the end face electrodes, and the end face electrodes are more firmly bonded.

  In addition, the fitting part 120 may have a fine shape that fits into the fine shape provided on the outer peripheral end face of the end face electrode substrate 200 on the inner peripheral end face of the fitting part 120. In the case of having such a fine shape, the fine shape of the inner peripheral end face of the fitting portion 120 is the same as that of the outer peripheral end face of the end face electrode substrate 200 when the end face electrode parent substrate 100 and the end face electrode substrate 200 are fitted. Fits into a fine shape.

  Further, the inner periphery of the opening in the thickness direction of the plate material of the fitting portion 120 may be long on the surface of the plate material and short on the back surface of the plate material. In that case, the outer periphery of the plate material of the end face electrode substrate 200 has a long shape on the surface of the plate material and a short shape on the back surface of the plate material. As a result, the end face electrode substrate 200 does not fall from the fitting portion 120 of the end face electrode parent substrate 100 when the end face electrode parent substrate 100 and the end face electrode substrate 200 are fitted. FIG. 4 is a schematic configuration diagram showing an example of the shape of the fitting portion 120 in the first embodiment of the present invention. Fig.4 (a) shows an example of the fitting part in the 1st Embodiment of this invention when the inner periphery of the opening of the thickness direction of a board | plate material is the same on the surface of a board | plate material, and a back surface. In FIG. 4A, the outer peripheral end surface of the end electrode substrate 200 is press-fitted and fitted so as to be in contact with the end surface of the end of the end electrode parent substrate 100. FIG. 4B shows an example of the fitting portion where the inner circumference of the opening in the thickness direction of the plate material is long on the surface of the plate material and short on the back surface of the plate material. In FIG. 4B, the end face of the plate material of the end face electrode substrate 200 is cut so that the end face on the outer periphery of the plate material is wide on the front surface side and a narrow step is formed on the back surface side. It is cut so that a wide step is formed on the side and a narrow step is formed on the back side, and the two steps are fitted. In addition, the fitting portion of the end face electrode substrate 200 is slightly smaller than the fitting portion of the end face electrode parent substrate 100.

  Next, the operation in this embodiment will be described.

  FIG. 5 is a flowchart showing manufacturing steps of the composite substrate 300 according to the first embodiment of the present invention. Note that the flowchart shown in FIG. 5 and the following description are merely examples, and the processing order may be changed, the processing may be returned, or the processing may be repeated depending on the processing that is appropriately obtained.

  A case where a circuit is formed in advance on the end face electrode parent substrate 100 and the end face electrode child substrate 200 will be described.

  First, the end face electrode substrate 200 is fitted into the fitting portion 120 of the end face electrode parent substrate 100 (step S110). Note that the end face electrode substrate 200 is arranged so that the end face electrode 210 and the end face electrode 110 of the corresponding end face electrode parent substrate 100 face each other. Further, when the frictional force between the end face electrode substrate 200 and the fitting portion 120 is large, the end face electrode substrate 200 may be press-fitted into the fitting portion 120.

  Next, the end face electrode 210 of the end face electrode child substrate 200 is soldered to the end face electrode 110 of the end face electrode parent substrate 100 (step S120). The soldering may be performed using a soldering iron, or may be performed using a flow method, a reflow method, or the like.

  As a result of the above operation, the end face electrode parent substrate 100 and the end face electrode child substrate 200 are electrically connected, and the composite substrate 300 can operate as a series of circuits. Note that the end face electrode 110 of the end face electrode parent substrate 100 may be formed by partial circuit formation by an electrodeposition coating method.

  Further, the plate material for the end face electrode substrate 200 may be cut out from the plate material for the end face electrode parent substrate 100 at a position where the fitting portion 120 is formed.

  The end face electrode 110 may be formed by cutting the end face electrode child substrate 200 plate from the end face electrode parent substrate 100 plate at a position where the fitting portion 120 is formed.

  As described above, in the end face electrode parent substrate 100 of the present embodiment, the end face electrode child substrate 200 is fitted to the end face electrode parent substrate 100. Therefore, in the end face electrode parent substrate 100 of the present embodiment, the thickness of the composite substrate after the end face electrode child substrate 200 is mounted is suppressed to the same thickness as the end face electrode parent substrate 100. Further, in the end face electrode main substrate 100 of the present embodiment, the end face electrode sub substrate 200 is fitted into the opening of the end face electrode main substrate 100. Therefore, in the end face electrode parent substrate 100 of this embodiment, components can be arranged on both sides of the end face electrode child substrate 200. Therefore, the degree of freedom in designing the composite substrate is improved. Further, in the end face electrode parent substrate 100 of the present embodiment, no obstacle exists between the end face electrode of the end face electrode parent substrate 100 and the end face electrode of the end face electrode child substrate 200. Furthermore, the surface side, the back surface side, and the side surface side of the end surface electrode of the end surface electrode parent substrate 100 and the surface side, the back surface side, and the side surface side of the end surface electrode of the end surface electrode child substrate 200 are soldered. Therefore, the solder is easily and sufficiently supplied between the electrodes by a manual operation using a soldering iron, a reflow method, a flow method, or the like. Therefore, the end face electrode parent substrate 100 of the present embodiment has high ease and reliability of soldering. Further, in the end face electrode main substrate 100 of the present embodiment, the opening of the end face electrode main substrate 100 and the end face electrode substrate 200 have the same outer shape with the same size and shape. Therefore, in the end face electrode main substrate 100 of the present embodiment, the plate material of the parent substrate can be manufactured by cutting out the end plate electrode substrate from the plate material.

  As described above, according to the present embodiment, the degree of freedom in designing the composite substrate can be improved, and the ease, reliability, and economy in manufacturing the composite substrate can be improved.

  The present invention has been exemplarily described with the above-described embodiments and modifications thereof. However, the technical scope of the present invention is not limited to the scope described in the above-described embodiments and modifications thereof. It will be apparent to those skilled in the art that various modifications and improvements can be made to such embodiments. In such a case, new embodiments to which such changes or improvements are added can also be included in the technical scope of the present invention. This is clear from the matters described in the claims.

A part or all of the above-described embodiment can be described as in the following supplementary notes, but is not limited thereto.
(Appendix 1)
A fitting portion in which a part or all of the inner periphery of the opening in the thickness direction of the plate material is fitted to a part or all of the outer periphery of the end electrode substrate having the first electrode on the outer peripheral end surface of the plate material;
An end face electrode main substrate comprising: a second electrode provided on an inner peripheral end face of the fitting portion, which is close to a distance that can be soldered to the first electrode during fitting.
(Appendix 2)
The end face electrode parent substrate according to appendix 1, wherein the first electrode and the second electrode at the time of fitting are formed in a cylindrical or prismatic shape.
(Appendix 3)
2. The end face electrode parent substrate according to appendix 1, wherein the first electrode and the second electrode at the time of fitting are formed in a cylindrical shape or a rectangular tube shape.
(Appendix 4)
2. The end face electrode according to claim 1, wherein the end face electrode has a second fine structure fitted to the first fine structure provided on the outer peripheral end face of the end face electrode substrate on the inner peripheral end face of the fitting portion. Parent board.
(Appendix 5)
The entire inner circumference of the opening in the thickness direction of the plate material of the fitting portion is fitted to the outer circumference of the end face electrode substrate, or the inner circumference of the opening in the thickness direction of the plate material of the fitting portion is the end face electrode element The end face electrode parent substrate according to appendix 1, wherein the end surface electrode parent substrate is fitted to the entire outer periphery of the substrate.
(Appendix 6)
The outer periphery of the plate material of the end face electrode substrate is long on the surface of the plate material and short on the back surface of the plate material, and the inner periphery of the opening in the thickness direction of the plate material of the fitting portion is long on the surface of the plate material and short on the back surface of the plate material. The end face electrode parent substrate according to Supplementary Note 1.
(Appendix 7)
An end face electrode substrate having a first electrode on the outer peripheral end face of the plate,
A fitting part in which a part or all of the inner circumference of the opening in the thickness direction of the plate material is fitted to a part or all of the outer circumference of the end face electrode substrate, and can be soldered to the first electrode at the time of fitting An end face electrode parent substrate including a second electrode provided on an inner peripheral end face of the fitting portion, which is close to a distance;
A composite substrate characterized by comprising:
(Appendix 8)
An end face electrode substrate having a first electrode on the outer peripheral end face of the plate material is fitted into a part or all of the outer periphery of the end face electrode substrate, with part or all of the inner periphery of the opening in the thickness direction of the plate material. A fitting step and an arrangement step of fitting to an end face electrode parent substrate having a second electrode provided on an inner peripheral end face of the fitting portion, which is close to a distance that can be soldered to the first electrode at the time of fitting When,
A composite substrate manufacturing method comprising: a soldering step of soldering an end surface electrode of the end surface electrode child substrate and an end surface electrode of the end surface electrode parent substrate.
(Appendix 9)
The composite substrate manufacturing method according to appendix 8, wherein the soldering step is performed by using a flow method or a reflow method.
(Appendix 10)
The composite substrate manufacturing according to appendix 8 or appendix 9, further comprising an electrode forming step of forming the second electrode on an inner peripheral end face of the fitting portion by partial circuit formation by an electrodeposition coating method Method.
(Appendix 11)
11. The supplementary note 8 to 10, further comprising a cutting-out step of cutting out the plate material for the end surface electrode child substrate from the plate material for the end surface electrode parent substrate at a position where the fitting portion is formed. Composite substrate manufacturing method.
(Appendix 12)
12. The composite according to appendix 11, wherein, in the cutting step, the second electrode is formed by cutting the end face electrode substrate on which the circuit is formed from the end face electrode parent substrate on which the circuit is formed. Substrate manufacturing method.

DESCRIPTION OF SYMBOLS 100 End surface electrode main substrate 110 End surface electrode 120 Fitting part 200 End surface electrode child substrate 210 End surface electrode 300 Composite substrate 800 Composite substrate 900 Parent substrate 910 Electrode

Claims (10)

A fitting portion in which a part or all of the inner periphery of the opening in the thickness direction of the plate material is fitted to a part or all of the outer periphery of the end electrode substrate having the first electrode on the outer peripheral end surface of the plate material;
An end face electrode main substrate comprising: a second electrode provided on an inner peripheral end face of the fitting portion, which is close to a distance that can be soldered to the first electrode during fitting. 2. The end face electrode parent substrate according to claim 1, wherein the first electrode and the second electrode at the time of the fitting have a cylindrical shape or a prismatic shape. 2. The end face electrode parent substrate according to claim 1, wherein the first electrode and the second electrode at the time of the fitting have a cylindrical shape or a rectangular tube shape. 2. The end surface according to claim 1, wherein the inner peripheral end surface of the fitting portion has a second fine structure that fits into the first fine structure provided on the outer peripheral end surface of the end face electrode substrate. Electrode parent substrate. The entire inner circumference of the opening in the thickness direction of the plate material of the fitting portion is fitted to the outer circumference of the end face electrode substrate, or the inner circumference of the opening in the thickness direction of the plate material of the fitting portion is the end face electrode element The end face electrode parent substrate according to claim 1, wherein the end surface electrode parent substrate is fitted to the entire outer periphery of the substrate. The outer periphery of the plate material of the end face electrode substrate is long on the surface of the plate material and short on the back surface of the plate material, and the inner periphery of the opening in the thickness direction of the plate material of the fitting portion is long on the surface of the plate material and short on the back surface of the plate material. The end face electrode parent substrate according to claim 1. An end face electrode substrate having a first electrode on the outer peripheral end face of the plate,
A fitting part in which a part or all of the inner circumference of the opening in the thickness direction of the plate material is fitted to a part or all of the outer circumference of the end face electrode substrate, and can be soldered to the first electrode at the time of fitting An end face electrode parent substrate including a second electrode provided on an inner peripheral end face of the fitting portion, which is close to a distance;
A composite substrate characterized by comprising: An end face electrode substrate having a first electrode on the outer peripheral end face of the plate material is fitted into a part or all of the outer periphery of the end face electrode substrate, with part or all of the inner periphery of the opening in the thickness direction of the plate material. A fitting step and an arrangement step of fitting to an end face electrode parent substrate having a second electrode provided on an inner peripheral end face of the fitting portion, which is close to a distance that can be soldered to the first electrode at the time of fitting When,
A composite substrate manufacturing method comprising: a soldering step of soldering an end surface electrode of the end surface electrode child substrate and an end surface electrode of the end surface electrode parent substrate. The composite substrate manufacturing method according to claim 8, further comprising an electrode forming step of forming the second electrode on an inner peripheral end face of the fitting portion by partial circuit formation by an electrodeposition coating method. A cutting step of cutting out the plate material for the end face electrode substrate on which the circuit is formed from the plate material for the end face electrode parent substrate on which the circuit is formed at the position where the fitting portion is formed;
The composite substrate manufacturing method according to claim 8 or 9, wherein:

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