JP2006134946A - Printed wiring board - Google Patents

Printed wiring board Download PDF

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Publication number
JP2006134946A
JP2006134946A JP2004319563A JP2004319563A JP2006134946A JP 2006134946 A JP2006134946 A JP 2006134946A JP 2004319563 A JP2004319563 A JP 2004319563A JP 2004319563 A JP2004319563 A JP 2004319563A JP 2006134946 A JP2006134946 A JP 2006134946A
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Prior art keywords
printed wiring
wiring board
terminal
test
board
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JP2004319563A
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Inventor
Minoru Naganami
稔 長南
Toshihiro Murakami
敏裕 村上
Koji Taniguchi
康二 谷口
Toshinari Tanaka
俊成 田中
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2004319563A priority Critical patent/JP2006134946A/en
Publication of JP2006134946A publication Critical patent/JP2006134946A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board in which increase in area of a substrate due to addition of a test terminal is suppressed, and deflection or tilting under pressure at jointing of a printed wiring board to a flexible printed wiring board is reduced and defective jointing can be prevented in a mounted circuit board. <P>SOLUTION: In the printed wiring board, wiring is so formed as to be jointed to another board by a first surface of the board. It comprises a jointing terminal 3S which is provided to the first surface to be jointed to that another board, and test terminals 4 spaced regularly in the formation region of the jointing terminal, on a second surface facing the first surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、プリント配線基板に係り、特にフレキシブルプリント配線基板を接合する場合に有効なプリント配線基板の端子構造に関するものである。   The present invention relates to a printed wiring board, and more particularly to a terminal structure of a printed wiring board effective when a flexible printed wiring board is joined.

従来、プリント配線基板とフレキシブルプリント基板を接合しようとする場合、図１０に示すように、プリント配線基板１側では、基板２に接合端子３ｆを設ける一方、フレキシブルプリント基板６側でも、図４に示すように、フレキシブル基板７に接合端子３を設け、これらを図１１に示すように、熱圧着等の手法により、図１０に示されたプリント配線基板の接合端子３Ｓと図４に示すフレキシブル基板の接合端子３ｆとを接合している。
また、プリント配線基板１を単体で検査する必要がある場合、接合端子３Ｓ（図１１参照）に直接検査針を接触させると、接合端子３Ｓの劣化を招くことがある。そこで図１２に示すように、基板２にテスト端子４を設け、このテスト端子４を用いてプリント配線基板１の単体検査を行っている。 Conventionally, when a printed wiring board and a flexible printed board are to be joined, as shown in FIG. 10, the printed wiring board 1 side is provided with the joining terminal 3f on the board 2, while the flexible printed board 6 side is also shown in FIG. As shown in FIG. 11, the junction terminals 3 are provided on the flexible substrate 7, and as shown in FIG. 11, the junction terminals 3S of the printed wiring board shown in FIG. 10 and the flexible substrate shown in FIG. The junction terminal 3f is joined.
In addition, when it is necessary to inspect the printed wiring board 1 alone, if the inspection needle is brought into direct contact with the junction terminal 3S (see FIG. 11), the junction terminal 3S may be deteriorated. Therefore, as shown in FIG. 12, a test terminal 4 is provided on the substrate 2, and a single inspection of the printed wiring board 1 is performed using the test terminal 4.

さらに、図１０のプリント配線基板１と図４のフレキシブルプリント基板６を、図１１のように接合する場合、プリント配線基板１の接合端子３Ｓがある領域の裏面を保持しつつ、プリント配線基板２とフレキシブルプリント配線基板６の、接合端子３ｆがある領域に、両基板の水平面に対して鉛直に、接合のため押圧をかけ、熱圧着等により接合している。   Furthermore, when the printed wiring board 1 of FIG. 10 and the flexible printed circuit board 6 of FIG. 4 are joined as shown in FIG. 11, the printed wiring board 2 is held while holding the back surface of the region where the joining terminals 3S of the printed wiring board 1 are present. The flexible printed wiring board 6 is pressed to join the region having the joining terminals 3f perpendicular to the horizontal surfaces of the two substrates for joining, and joined by thermocompression bonding or the like.

従って、プリント配線基板１の基板２における、接合端子３Ｓの形成された領域の裏面（対向面）に、プリント配線基板１の基板２の水平面に対して鉛直に突起構造がある場合、接合時の押圧に対して集中荷重が起こり、接合時にプリント配線基板１にたわみが起こり、その結果プリント配線基板２とフレキシブルプリント配線基板６の、接合端子３Ｓ，３ｆでの接合不良の一因となることがある。   Therefore, when a projection structure is perpendicular to the horizontal plane of the substrate 2 of the printed wiring board 1 on the back surface (opposing surface) of the printed wiring board 1 where the bonding terminals 3S are formed, A concentrated load is generated with respect to the pressing, and the printed wiring board 1 is deflected at the time of joining. As a result, the printed wiring board 2 and the flexible printed wiring board 6 may cause a joint failure at the joining terminals 3S and 3f. is there.

また、プリント配線基板１の、接合端子３Ｓがある領域の裏面に、プリント配線基板１の水平面に対して鉛直に突起構造がある場合、接合時の熱圧着等の押圧に対してプリント配線基板１に傾きが起こり、この事もプリント配線基板２とフレキシブルプリント配線基板６の、接合端子３ｆでの接合不良の一因となっている。   Moreover, when there is a protrusion structure perpendicular to the horizontal plane of the printed wiring board 1 on the back surface of the printed wiring board 1 in the region where the joining terminals 3S are present, the printed wiring board 1 against the pressing such as thermocompression bonding at the time of joining. Inclination occurs, and this also contributes to the bonding failure between the printed wiring board 2 and the flexible printed wiring board 6 at the bonding terminal 3f.

そこで、前記の接合不良の要因であるたわみ・傾き等を防止するために、プリント配線基板２の接合端子３Ｓがある領域の裏側は、パターン配線が禁止されることが多い。
また、パターン配線が禁止されなくとも、前記配線禁止領域にダミー配線パターンを形成する方法も提案されている（特許文献１）。しかしながら、ダミー配線パターンを配置することにより、配線領域を別に必要とすることになり、小型化の妨げとなっていた。 Therefore, in order to prevent the above-described deflection, inclination, etc., which are the cause of the bonding failure, pattern wiring is often prohibited on the back side of the printed wiring board 2 where the bonding terminals 3S are present.
In addition, a method of forming a dummy wiring pattern in the wiring prohibited area has been proposed even if pattern wiring is not prohibited (Patent Document 1). However, disposing a dummy wiring pattern necessitates a separate wiring area and hinders downsizing.

従来例では、テスト端子４を、接合時の保持面である接合端子３Ｓの裏側の領域に配置することはできず、従ってテスト端子４をそれ以外の領域に配置しており、基板の小型化の妨げになっていた。
また図１３に示すように、テスト端子４を、接合時の保持面である接合端子３Ｓの裏側の領域に、単純に配置した場合、プリント配線基板１との接合時、熱圧着等の押圧により、テスト端子４に対して集中荷重が起こり、プリント配線基板２がたわみ、結果接合不良の一因となっていた。 In the conventional example, the test terminal 4 cannot be arranged in the region on the back side of the joining terminal 3S which is a holding surface at the time of joining. Therefore, the test terminal 4 is arranged in the other region, so that the size of the substrate can be reduced. It was an obstacle.
Further, as shown in FIG. 13, when the test terminal 4 is simply arranged in the region on the back side of the joining terminal 3S that is a holding surface at the time of joining, the test terminal 4 is pressed by thermocompression bonding or the like at the time of joining with the printed wiring board 1. As a result, a concentrated load occurs on the test terminal 4 and the printed wiring board 2 bends, resulting in poor bonding.

さらに、テスト端子４をこのように配置した場合、プリント配線基板の接合端子３Ｓの裏側の領域を保持した場合、テスト端子４が保持面に均一に存在しないため、結果プリント配線基板１の傾きの一因となり、結果図１２のフレキシブルプリント基板１との、接合端子３ｆでの接合不良を招く危険があった。   Further, when the test terminals 4 are arranged in this way, when the region on the back side of the junction terminal 3S of the printed wiring board is held, the test terminals 4 are not uniformly present on the holding surface, and as a result, the inclination of the printed wiring board 1 is reduced. As a result, there is a risk of causing a bonding failure with the flexible printed circuit board 1 of FIG. 12 at the bonding terminal 3f.

特開2003-249734号公報JP2003-249734

上記構成では、図１０のプリント配線基板を単体でテストしようとする場合、前述したように直接接合端子３ｆに検査針をあてることが出来ない。従って、図１２に示すように、テスト端子４を設ける必要がある。これは、実装回路基板の小型化を阻む原因となる場合があった。   In the above configuration, when the printed wiring board of FIG. 10 is to be tested alone, the inspection needle cannot be directly applied to the bonding terminal 3f as described above. Therefore, it is necessary to provide the test terminal 4 as shown in FIG. This sometimes hindered downsizing of the mounting circuit board.

また、先述の実装回路基板の小型化への妨げを解消しようと、図１３および図１４（図１４は図１３の裏面からみた図）に示すように、接合時の保持面である領域にテスト端子を配置した場合、図４に示したフレキシブルプリント配線基板６との接合時の、接合端子３ｆのある領域へのプリント配線基板１に対しての鉛直方向への押圧により、その裏面にあるテスト端子４での集中荷重によるプリント配線基板１のたわみもしくはプリント配線基板１の傾きが起こり、その結果、プリント配線基板１とフレキシブルプリント配線基板６の接合端子３ｆにおける接合不良が引き起こされる可能性がある。   Further, in order to eliminate the obstacle to the miniaturization of the above-mentioned mounting circuit board, as shown in FIG. 13 and FIG. 14 (FIG. 14 is a view seen from the back side of FIG. 13), a test is performed in the region which is a holding surface at the time of joining. When the terminals are arranged, the test on the back surface of the printed wiring board 1 is pressed in the vertical direction against the printed wiring board 1 to the area where the bonding terminals 3f are present when joining the flexible printed wiring board 6 shown in FIG. Deflection of the printed wiring board 1 due to the concentrated load at the terminal 4 or inclination of the printed wiring board 1 occurs, and as a result, there is a possibility of causing a bonding failure in the bonding terminal 3f of the printed wiring board 1 and the flexible printed wiring board 6. .

本発明は、前記実情に鑑みてなされたものであり、テスト端子の追加による基板の面積の増加を抑止するとともに、プリント配線基板とフレキシブルプリント配線基板との接合時の、押圧によるたわみや傾きを低減し、実装回路基板の接合不良を防止することのできる配線基板を提供することを目的とする。   The present invention has been made in view of the above circumstances, and suppresses an increase in the area of the substrate due to the addition of the test terminal, and at the same time, the deflection and inclination due to the pressure at the time of joining the printed wiring board and the flexible printed wiring board. An object of the present invention is to provide a wiring board capable of reducing and preventing a bonding failure of a mounting circuit board.

そこで、本発明においては、基板の第１の面で別の基板と接合されるように配線が形成されたプリント配線基板であって、前記第１の面に設けられ、前記別の基板と接合される接合端子と、前記第１の面に対向する第２の面に、前記接合端子の形成領域において均等となるように配列されたテスト端子とを具備している。
この構成により、テスト端子が接合端子の形成領域において均等に配列されているため、接合のための熱圧着工程においても均一に力がかかり、たわみや傾きなしに精度よく接合することができ、また、プリント配線基板の省スペース化による小型化、低コスト化をはかることができる。 Therefore, in the present invention, a printed wiring board in which wiring is formed so as to be bonded to another substrate on the first surface of the substrate, provided on the first surface, and bonded to the other substrate. And a test terminal arranged on the second surface facing the first surface so as to be even in the region where the junction terminal is formed.
With this configuration, since the test terminals are evenly arranged in the bonding terminal formation region, a uniform force is applied even in the thermocompression bonding process for bonding, and the bonding can be performed accurately without deflection or inclination. The printed wiring board can be reduced in size and cost by saving space.

特に別の基板がフレキシブルプリント配線基板である場合、プリント配線基板とフレキシブルプリント配線基板との接合時の、接合端子領域へのプリント配線基板の水平面に対して鉛直方向の押圧力を用いた熱圧着工程における、テスト端子への集中荷重によるたわみ、あるいはプリント配線基板の傾きを低減し、結果接合端子での接合不良の抑止が期待できる。   Especially when another printed circuit board is a flexible printed circuit board, thermocompression using a pressing force in the vertical direction to the horizontal plane of the printed circuit board to the bonded terminal area when the printed circuit board and the flexible printed circuit board are bonded. In the process, the deflection due to the concentrated load on the test terminal or the inclination of the printed wiring board can be reduced, and as a result, it can be expected to suppress the bonding failure at the bonding terminal.

また本発明のプリント配線基板は、前記テスト端子が、ほぼ一定幅となるように配設された端子間領域を隔して、導電層を残すような形状で形成されたものを含む。
この構成によれば、テスト端子を構成する銅箔などで構成される導電層は、端子間領域を除去しただけで残されたパターン形状をなしているため、面全体で支えた構造となり、安定に支持可能である。 In the printed wiring board of the present invention, the test terminal is formed in a shape that leaves a conductive layer with an inter-terminal region disposed so as to have a substantially constant width.
According to this configuration, the conductive layer made of copper foil or the like that constitutes the test terminal has a pattern shape that is left only by removing the inter-terminal region. Can be supported.

また本発明のプリント配線基板は、前記接合端子と前記テスト端子とが相対向するように同一ピッチで配置されたものを含む。
この構成によれば、接合端子の受ける力をそのまま裏面のテスト端子が支えることができる構造となるため、安定に支持可能である。 Moreover, the printed wiring board of this invention contains what was arrange | positioned at the same pitch so that the said junction terminal and the said test terminal may mutually oppose.
According to this configuration, since the test terminal on the back surface can support the force received by the joining terminal as it is, it can be stably supported.

また本発明のプリント配線基板は、前記接合端子とテスト端子が、前記基板に設けられたスルーホールを介して接続されるものを含む。
この構成によれば、接合端子とテスト端子との接続距離が極めて近くなり、配線長を短縮することができるため、ノイズの低減をはかることができる。 The printed wiring board of the present invention includes one in which the junction terminal and the test terminal are connected through a through hole provided in the board.
According to this configuration, since the connection distance between the junction terminal and the test terminal is extremely short and the wiring length can be shortened, noise can be reduced.

また本発明のプリント配線基板は、前記スルーホールが、隣接するスルーホールと交互に突出されるものを含む。
この構成によれば、狭ピッチ化に対する制約を緩和でき、プリント配線基板の小型化、ひいては低コスト化をはかることができる。 The printed wiring board of the present invention includes one in which the through holes protrude alternately with adjacent through holes.
According to this configuration, it is possible to alleviate restrictions on narrowing the pitch, and it is possible to reduce the size of the printed wiring board and thus reduce the cost.

本発明によれば、プリント配線基板の省スペース化による小型化、低コスト化をはかることができる。
また、プリント配線基板とフレキシブルプリント配線基板との接合時の、テスト端子への集中荷重によるたわみ、もしくはプリント配線基板の傾きを低減し、結果接合端子での接合不良の抑制をはかることができる。 According to the present invention, the printed wiring board can be reduced in size and cost by saving space.
Further, when the printed wiring board and the flexible printed wiring board are joined, the bending due to the concentrated load on the test terminal or the inclination of the printed wiring board can be reduced, and as a result, the joining failure at the joining terminal can be suppressed.

以下に、本発明の実施の形態について、図面を参照しつつ詳細に説明する。
（実施の形態１）
図１は、本発明の実施の形態１におけるプリント配線基板の斜視図である（図２は図１の裏面から見た図である）。また図３は図１のＡ−Ａ断面図である。
このプリント配線基板２は、第１の面に設けられ、別の基板としてのフレキシブルプリント配線基板１と接合される接合端子３Ｓと、この第１の面に対向する第２の面に、接合端子３Ｓの形成領域において均等となるように配列されたテスト端子４とを具備したものである。すなわち、接続端子３Ｓを一方の面に配置し、その裏側の、接合時の保持面である領域に均等にテスト端子４を配置する。この領域は接合端子の形成領域に対して対向する領域である。そしてこの接合端子３Ｓとテスト端子４とは基板２に設けられたスルーホールＨを介して電気的に接続されている。 Embodiments of the present invention will be described below in detail with reference to the drawings.
(Embodiment 1)
1 is a perspective view of a printed wiring board according to Embodiment 1 of the present invention (FIG. 2 is a view as seen from the back surface of FIG. 1). FIG. 3 is a cross-sectional view taken along the line AA in FIG.
The printed wiring board 2 is provided on the first surface, and joined terminals 3S to be joined to the flexible printed wiring board 1 as another board, and the joining terminals on the second surface facing the first surface. The test terminals 4 are arranged so as to be even in the 3S formation region. That is, the connection terminals 3S are arranged on one surface, and the test terminals 4 are evenly arranged on the back side of the region which is a holding surface at the time of joining. This region is a region facing the formation region of the junction terminal. The junction terminal 3S and the test terminal 4 are electrically connected through a through hole H provided in the substrate 2.

この構成により、図１のように、テスト端子４を接合端子３Ｓの裏側の領域に均等に配置することにより、図５に断面図を示すように、プリント配線基板１とフレキシブルプリント配線基板６との接合時の、熱圧着等の押圧による、テスト端子４への荷重が分散され、プリント配線基板１のたわみ量の低減が期待でき、その結果、フレキシブルプリント基板６との、接合端子３Ｓ，３ｆでの接合不良の抑制を期待することができる。   With this configuration, as shown in FIG. 1, the test terminals 4 are evenly arranged in the region on the back side of the joining terminal 3S, so that the printed wiring board 1 and the flexible printed wiring board 6 The load applied to the test terminals 4 due to pressing such as thermocompression bonding during the bonding of the first and second terminals can be expected to reduce the amount of deflection of the printed circuit board 1, and as a result, the connection terminals 3S and 3f with the flexible printed circuit board 6 can be expected. It can be expected that the bonding failure is suppressed.

また、プリント配線基板１を接続端子３Ｓの裏側の領域で保持した場合の、フレキシブルプリント基板との接合時の、接合端子３Ｓ領域への熱圧着等の押圧による、プリント配線基板１の傾きの低減を期待することもでき、その結果、接合端子３Ｓ，３ｆでの接合不良の抑止を期待することができる。   In addition, when the printed wiring board 1 is held in the area behind the connection terminal 3S, the inclination of the printed wiring board 1 is reduced by pressing, such as thermocompression, to the bonding terminal 3S area when bonded to the flexible printed board. As a result, it can be expected to suppress the bonding failure at the bonding terminals 3S and 3f.

さらに、図３に示すようにテスト端子４と接続端子３Ｓを基板２の両面に相対向して配置することにより、テスト端子４と接続端子３Ｓの距離が近くなるため、テスト端子４と接続端子３Ｓの配線が容易になり、結果、プリント配線基板１と図４に示したフレキシブルプリント配線基板６との接合端子３ｆでの接合不良を招くこと無く、テスト端子４と接続端子３Ｓの配線効率向上、特にノイズ耐性の向上が期待でき、さらには配線容量の低減という効果も期待できる。   Further, as shown in FIG. 3, the test terminal 4 and the connection terminal 3S are arranged opposite to each other on both surfaces of the substrate 2, so that the distance between the test terminal 4 and the connection terminal 3S is reduced. 3S wiring becomes easy, and as a result, the wiring efficiency of the test terminal 4 and the connection terminal 3S is improved without causing a bonding failure at the bonding terminal 3f between the printed wiring board 1 and the flexible printed wiring board 6 shown in FIG. In particular, improvement in noise resistance can be expected, and further, an effect of reducing wiring capacitance can be expected.

そして、図１に示すようにテスト端子４と接続端子３Ｓを相対向する領域に配置することにより、従来の手段では困難であった、接続端子３Ｓの裏側の領域へのテスト端子４の配置が、接合端子３Ｓでの接合不良を招くことなく可能になり、その結果、プリント配線基板の省スペース化が期待でき、基板１の小型化、低コスト化が期待できる。   As shown in FIG. 1, the test terminal 4 and the connection terminal 3S are arranged in regions facing each other, so that the test terminal 4 can be arranged in the region on the back side of the connection terminal 3S, which is difficult with conventional means. As a result, the printed wiring board can be saved in space, and the board 1 can be reduced in size and cost.

（実施の形態２）
図６は、本発明の実施の形態２におけるプリント配線基板の斜視図である。
実施の形態２との差分は、実施の形態１において、均等に配置されたテスト端子４を、各テスト端子の間隙に、導箔を残すような形状にした点である。
図６のプリント配線基板１において、図４に示したような接合端子３ｆを有するフレキシブルプリント基板１と接合端子３Ｓで接合する場合、テスト端子４の配置されている領域でプリント配線基板１を保持する。 (Embodiment 2)
FIG. 6 is a perspective view of a printed wiring board according to Embodiment 2 of the present invention.
The difference from the second embodiment is that, in the first embodiment, the test terminals 4 arranged uniformly are shaped so as to leave a conductive foil in the gap between the test terminals.
In the printed wiring board 1 of FIG. 6, when the flexible printed circuit board 1 having the joining terminal 3f as shown in FIG. 4 is joined by the joining terminal 3S, the printed wiring board 1 is held in the region where the test terminal 4 is arranged. To do.

プリント配線基板１を図４のフレキシブルプリント基板６と接合する場合、プリント配線基板１の接合端子３Ｓの領域に、プリント配線基板１の水平面と鉛直方向に、熱圧着等の押圧をかける。このとき発生する荷重はテスト端子４に均一にかかるため、プリント配線基板１がたわんだり、接合端子３Ｓ，３ｆでの接合不良を引き起こすこともない。そして、このたわみは、実施の形態１の構成により軽減されることが期待できる。   When the printed wiring board 1 is joined to the flexible printed board 6 in FIG. 4, a pressure such as thermocompression bonding is applied to the area of the joining terminal 3 </ b> S of the printed wiring board 1 in a direction perpendicular to the horizontal plane of the printed wiring board 1. Since the load generated at this time is uniformly applied to the test terminals 4, the printed wiring board 1 does not bend and bonding failure at the bonding terminals 3 </ b> S and 3 f is not caused. This deflection can be expected to be reduced by the configuration of the first embodiment.

この構成により、テスト端子４の面積が大きいことにより、テスト端子４への荷重は実施の形態１よりさらに分散され、結果実施の形態１と比較して、更なるたわみの減少が期待できる。
また、テスト端子３Ｓの形状は、テスト端子３Ｓどうしの間隙が少なくなるような形状であればよく、図のように角型でなくても良い。 With this configuration, since the area of the test terminal 4 is large, the load on the test terminal 4 is further distributed as compared with the first embodiment, and as a result, further reduction in deflection can be expected as compared with the first embodiment.
Further, the shape of the test terminal 3S may be any shape as long as the gap between the test terminals 3S is reduced, and may not be rectangular as shown in the figure.

（実施の形態３）
図７、および図８（図８は図７を裏面からみた図である）は、本発明の実施の形態３におけるプリント配線基板の斜視図である。
この構成ではテスト端子４および接合端子３Ｓを、配線パターンの引きまわりにより、その端点で、接合端子３Ｓとテスト端子４をスルーホール５により接続し、そのスルーホール５の位置を、隣り合うスルーホール５と直線上に並ばないように千鳥状に配列した構成とした点で前記実施の形態１および２と異なるが、他は前記実施の形態２と同様に形成されている。 (Embodiment 3)
7 and 8 (FIG. 8 is a view of FIG. 7 as viewed from the back) are perspective views of the printed wiring board according to the third embodiment of the present invention.
In this configuration, the test terminal 4 and the junction terminal 3S are connected to each other at the end points of the wiring pattern by connecting the junction terminal 3S and the test terminal 4 through the through hole 5, and the position of the through hole 5 is set to the adjacent through hole. 5 is different from the first and second embodiments in that it is arranged in a zigzag pattern so as not to line up with a straight line, but the others are formed in the same manner as in the second embodiment.

プリント配線基板１単体の検査を行う場合、テスト端子４に検査針もしくは他の冶具を使用して検査を行う。また、接合端子３Ｓ経由で、プリント配線基板１で実現される機能を制御、もしくはプリント配線基板１で実現される機能により、外部の機能を制御するのが一般的であり、プリント配線基板１単体の検査を行う場合、接合端子３Ｓとテスト端子４は、接続される必要がある。   When the printed wiring board 1 is inspected alone, the test terminal 4 is inspected using an inspection needle or other jig. Further, it is common to control functions realized by the printed wiring board 1 via the junction terminals 3S or to control external functions by functions realized by the printed wiring board 1, and the printed wiring board 1 alone. When the inspection is performed, the junction terminal 3S and the test terminal 4 need to be connected.

そこで、本実施の形態のように、接合端子３Ｓとテスト端子４からパターン配線を引き出し、その端点で接合端子とテスト端子をスルーホール５により接続するような構成にする。このことにより、接合端子３Ｓとテスト端子４の接続配線の最短化による配線容量の低減、結果配線効率の向上よるノイズ耐性の向上が期待できる。さらにはプリント配線基板の省スペース化による、プリント配線基板１の小型化、低コスト化が期待できる   Therefore, as in the present embodiment, the pattern wiring is drawn out from the junction terminal 3S and the test terminal 4, and the junction terminal and the test terminal are connected by the through hole 5 at the end points. As a result, the wiring capacity can be reduced by minimizing the connection wiring between the junction terminal 3S and the test terminal 4, and the noise resistance can be expected to be improved due to the improvement of the wiring efficiency. Furthermore, it can be expected that the printed wiring board 1 is reduced in size and cost due to space saving of the printed wiring board.

また、接合端子３Ｓは、プリント配線基板１の小型化のために、狭ピッチ化が求められることが多い。   In addition, in order to reduce the size of the printed wiring board 1, the joining terminals 3S are often required to have a narrow pitch.

そこで、本実施の形態のように、スルーホール５の位置を、隣り合うスルーホール５と直線上に並ばないような配置にする。このことにより、単純にスルーホール５を直線上に並ぶように配置した場合と比較して、狭ピッチ化に対する制約を緩和できると考えられる。結果、プリント配線基板１の小型化、ひいては低コスト化が期待できる。
しかしながら単純に、接合端子３Ｓとテスト端子４から、それぞれが配置されている領域外までパターン配線を引き出し、その端点で接合端子とテスト端子をスルーホール５により接続し、図１０に示すように、スルーホール５を直線上に並ぶように配置してもよいことはいうまでもない。この場合、スルーホール５の外形が狭ピッチ化の制約になることもある。
なお、テスト端子の配置については、均等であるのが望ましいが、許容範囲内で適宜変更可能である。 Therefore, as in the present embodiment, the positions of the through holes 5 are arranged so as not to be aligned with the adjacent through holes 5 in a straight line. As a result, it is considered that the restriction on the narrow pitch can be relaxed as compared with the case where the through holes 5 are simply arranged in a straight line. As a result, the printed wiring board 1 can be expected to be reduced in size and cost.
However, simply, the pattern wiring is drawn from the junction terminal 3S and the test terminal 4 to the outside of the region where each is arranged, and the junction terminal and the test terminal are connected by the through hole 5 at the end point, as shown in FIG. Needless to say, the through holes 5 may be arranged in a straight line. In this case, the outer shape of the through hole 5 may be a constraint for narrowing the pitch.
It should be noted that the test terminals are preferably arranged uniformly, but can be appropriately changed within an allowable range.

本発明のプリント配線基板は、フレキシブルプリント配線基板などを接合するプリント配線基板において、接合時の保持面である、プリント配線基板側の接合端子の裏側の領域に、相対向してテスト端子を均等に配置しているため、接合端子での接合不良を抑止し、小型化、低コスト化が期待できることから、歩留まりの向上、小型化、低コスト化が特に期待されている電子製品分野、特に携帯無線通信端末に通信チップを搭載する等の用途に有用である。   In the printed wiring board of the present invention, in the printed wiring board for bonding a flexible printed wiring board, etc., the test terminals are evenly arranged opposite to each other in the area on the back side of the bonding terminal on the printed wiring board side, which is a holding surface at the time of bonding. Therefore, it can be expected to reduce the size and cost of joints at the junction terminals, so that the improvement of yield, size and cost can be expected. This is useful for applications such as mounting a communication chip on a wireless communication terminal.

本発明の実施の形態１におけるプリント配線基板の斜視図The perspective view of the printed wiring board in Embodiment 1 of this invention 図１のプリント配線基板の裏面からみた図The figure seen from the back side of the printed wiring board of FIG. 図１のプリント配線基板の断面図Sectional view of the printed wiring board of FIG. フレキシブルプリント基板の斜視図Perspective view of flexible printed circuit board 図１のプリント配線基板にフレキシブルプリント基板を接合した状態を示す断面図Sectional drawing which shows the state which joined the flexible printed circuit board to the printed wiring board of FIG. 本発明の実施の形態２におけるプリント配線基板の斜視図The perspective view of the printed wiring board in Embodiment 2 of this invention 本発明の実施の形態３におけるプリント配線基板の斜視図The perspective view of the printed wiring board in Embodiment 3 of this invention 本発明の実施の形態３におけるプリント配線基板の裏面図The back view of the printed wiring board in Embodiment 3 of this invention 本発明の実施の形態３におけるプリント配線基板の変形例を示す図The figure which shows the modification of the printed wiring board in Embodiment 3 of this invention. 従来のプリント配線基板の斜視図Perspective view of a conventional printed wiring board 従来のプリント基板とフレキシブル基板を接合した状態の斜視図A perspective view of a conventional printed circuit board and a flexible circuit board joined together 従来のプリント配線基板の斜視図Perspective view of a conventional printed wiring board 従来のプリント配線基板の斜視図Perspective view of a conventional printed wiring board 図１３のプリント配線基板の裏面からみた図The figure seen from the back side of the printed wiring board of FIG.

符号の説明Explanation of symbols

１ プリント配線基板
２ プリント基板
３Ｓ 接合端子
３ｆ 接合端子
４ テスト端子
５ スルーホール
６ フレキシブルプリント配線基板
７ フレキシブル基板 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Printed circuit board 3S Joint terminal 3f Joint terminal 4 Test terminal 5 Through hole 6 Flexible printed circuit board 7 Flexible board

Claims (5)

基板の第１の面で別の基板と接合されるように配線が形成されたプリント配線基板であって、
前記第１の面に設けられ、前記別の基板と接合される接合端子と、
前記第１の面に対向する第２の面に、前記接合端子の形成領域において均等となるように配列されたテスト端子とを具備したプリント配線基板。 A printed wiring board in which wiring is formed so as to be bonded to another board on the first surface of the board,
A bonding terminal provided on the first surface and bonded to the other substrate;
A printed wiring board comprising test terminals arranged on a second surface opposite to the first surface so as to be even in a region where the junction terminals are formed. 請求項１に記載のプリント配線基板であって、
前記テスト端子は、ほぼ一定幅となるように配設された端子間領域を隔して、導電層を残すような形状で形成されたプリント配線基板。 The printed wiring board according to claim 1,
The test terminal is a printed wiring board formed in such a shape as to leave a conductive layer with an inter-terminal region disposed so as to have a substantially constant width. 請求項１または２に記載のプリント配線基板であって、
前記接合端子と前記テスト端子とが相対向するように同一ピッチで配置されたプリント配線基板。 The printed wiring board according to claim 1 or 2,
A printed wiring board arranged at the same pitch so that the joint terminal and the test terminal face each other. 請求項１乃至３のいずれかに記載のプリント配線基板であって、
前記接合端子とテスト端子は、前記基板に設けられたスルーホールを介して接続されたプリント配線基板。 The printed wiring board according to any one of claims 1 to 3,
The junction terminal and the test terminal are connected to each other through a through hole provided in the substrate. 請求項１乃至４のいずれかに記載のプリント配線基板であって、
前記スルーホールは、隣接するスルーホールと交互に突出されるプリント配線基板。 The printed wiring board according to any one of claims 1 to 4,
The through hole is a printed wiring board that protrudes alternately with adjacent through holes.
JP2004319563A 2004-11-02 2004-11-02 Printed wiring board Pending JP2006134946A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009146879A (en) * 2007-12-17 2009-07-02 Samsung Sdi Co Ltd Protective circuit board and battery pack using the same
JP5869076B1 (en) * 2014-08-28 2016-02-24 京楽産業．株式会社 Game machine
US9451691B2 (en) 2013-09-13 2016-09-20 Samsung Electronics Co., Ltd. Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230286A (en) * 1988-03-10 1989-09-13 Canon Inc Check pad for flexible printed board
JPH0774284A (en) * 1993-09-13 1995-03-17 Ibiden Co Ltd Electronic device mounting board
JPH10160761A (en) * 1996-11-30 1998-06-19 Enplas Corp Contact film and production thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230286A (en) * 1988-03-10 1989-09-13 Canon Inc Check pad for flexible printed board
JPH0774284A (en) * 1993-09-13 1995-03-17 Ibiden Co Ltd Electronic device mounting board
JPH10160761A (en) * 1996-11-30 1998-06-19 Enplas Corp Contact film and production thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009146879A (en) * 2007-12-17 2009-07-02 Samsung Sdi Co Ltd Protective circuit board and battery pack using the same
US8709622B2 (en) 2007-12-17 2014-04-29 Samsung Sdi Co., Ltd. Protective circuit board and battery pack using the same
US9451691B2 (en) 2013-09-13 2016-09-20 Samsung Electronics Co., Ltd. Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same
JP5869076B1 (en) * 2014-08-28 2016-02-24 京楽産業．株式会社 Game machine

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