JP2012079846A - Electrical device and lighting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical device formed in thin type at a low cost, and a lighting system including the electrical device.SOLUTION: An electrical device 1 includes: a multilayer substrate 2 on which a surface mount component 6 is mounted; a single-layer substrate 3 having an aperture to which the multilayer substrate 2 is fit and attached, and on which an electronic component 8 is mounted; a surface mount component 6 mounted on the multilayer substrate 2; and plural electrical connection means 4, 5 that are electrically connected to the electronic component 8 mounted on the single-layer substrate 3 or a wiring pattern formed on the single-layer substrate 3.

Description

  Embodiments described herein relate generally to an electric device having a multilayer substrate and a single layer substrate, and an illumination device including the electric device.

  Conventionally, when an electric device is formed by combining two circuit boards, a second circuit board is mounted vertically on the first circuit board, and the connection patterns of both are electrically connected by soldering. (See Patent Document 1). In this case, the solder deposition area can be increased, and the connection strength between the first and second circuit boards can be improved.

Japanese Patent Laid-Open No. 2008-109067 (page 4-5, FIG. 1)

  However, in the above-described conventional electric device, the height of the first and second circuit boards is increased by the size of the protrusion of the second circuit board, and the electric device cannot be thinned. Further, if the entire first circuit board has a multilayer structure, there is a disadvantage that the cost increases and the electric device becomes expensive.

  An object of the present invention is to provide an electric device that is formed in a thin shape and can be formed at low cost, and an illumination device including the electric device.

  The electrical device according to the present embodiment includes a multilayer substrate, a single layer substrate, and electrical connection means.

  The multilayer substrate of the embodiment has surface mounted components mounted thereon.

  The single layer substrate of the embodiment has an opening into which the multilayer substrate is fitted. A multilayer substrate is fitted into the opening. The single-layer board has electronic components mounted on one side or both sides.

  Electrical connection means are terminals, lead wires, jumper wires, etc., which electrically connect surface-mounted components mounted on a multilayer board and electronic components mounted on a single-layer board or wiring patterns formed on a single-layer board is doing.

  According to this embodiment, since the multilayer substrate is fitted and attached to the opening of the single-layer substrate, it is possible to reduce the height due to both, and it can be expected that the electric device is made thinner. In addition, by mounting surface-mounted components with many wiring patterns on the multilayer board, a relatively expensive multilayer board can be used to a minimum, and the overall size of the board can be reduced. The electric device can be miniaturized and can be expected to be formed at a low cost.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially exploded schematic perspective view of an electric device showing Embodiment 1 of the present invention. Similarly, it is a partial schematic perspective view of an electric device. It is a schematic front sectional drawing of the illuminating device which shows Example 2 of this invention. Similarly, it is a schematic side view of an illuminating device.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  An electric apparatus 1 showing Embodiment 1 of the present invention is configured as shown in FIGS. In FIG. 1, an electric device 1 is formed having a multilayer substrate 2, a single layer substrate 3, and end face patterns 4 and 5 as electrical connection means.

  The multilayer substrate 2 is made of a glass epoxy material having a thickness of 2 to 3 mm, for example, and is formed in a rectangular shape. An IC component 6 that is a surface mounting type component is mounted on one surface 2a. A large number of terminals 6 a are led out to the side of the IC component 6. The terminals 6 a are connected to conductive pads on the surface of the multilayer substrate 2 and are connected to a wiring pattern (not shown) inside the multilayer substrate 2. A plurality of end face patterns 4 made of copper foil are provided on the end face side of the multilayer substrate 2. The end face pattern 4 is electrically connected to the terminal 6 a of the IC component 6 through the wiring pattern inside the multilayer substrate 2.

  The single layer substrate 3 is formed of a rigid substrate and has a thickness of 1.6 mm. And the opening 7 in which the multilayer substrate 2 is engage | inserted is formed. The opening 7 is formed in a rectangular shape that is slightly larger than the outer dimensions of the multilayer substrate 2, and is inserted into the single-layer substrate 3. A plurality of electronic components 8 are mounted on one surface 3 a of the single-layer substrate 3. The electronic component 8 is preferably surface-mounted as much as possible from the viewpoint of reducing the height dimension of the electric device 1. When using discrete components, the electronic component 8 is disposed along the single-layer substrate 3. Is desirable. A terminal 5 made of copper foil is provided on the end face of the opening 7. This terminal 5 is provided corresponding to the end face pattern 4 of the multilayer substrate 2 and is connected to the electronic component 8 by a wiring pattern (not shown).

  As shown in FIG. 2, the multilayer substrate 2 is fitted and attached to the opening 7. The multilayer substrate 2 is fixed to the single-layer substrate 3 with an insulating adhesive (not shown) at a plurality of locations on the edge of the opening 7. The multilayer substrate 2 protrudes from the one surface 3 a of the single-layer substrate 3 by a thickness larger than that of the single-layer substrate 3. The end face pattern 4 of the multilayer substrate 2 and the terminals 4 of the single layer substrate 3 are electrically connected by solder (not shown).

  In addition, the single-layer board | substrate 3 may mount the electronic component 8 also in the other surface on the opposite side to the one surface 3a. That is, the single-layer substrate 3 may be a double-sided mounting substrate.

  Next, the operation of the first embodiment of the present invention will be described.

  Since the multilayer substrate 2 has a complicated wiring pattern formed therein, to which a large number of terminals 6a of the IC component 6 are connected, the external dimensions thereof can be minimized. Thereby, the relatively expensive multilayer substrate 2 is used to the minimum. Further, the size of both the multilayer substrate 2 and the single layer substrate 3 is reduced.

  Then, the multi-layer substrate 2 is fitted into the opening 7 of the single-layer substrate 3 so that the height of both is set by the multi-layer substrate 2 having a large thickness, and the height of the entire substrate is reduced. .

  As described above, the electric device 1 of the present embodiment is attached by fitting the multilayer substrate 2 into the opening 7 of the single-layer substrate 3, so that the height of both can be reduced, and the electric device 1 is made thin. It has the effect that it can be made into. Further, by mounting the IC component 6 which is a surface mounting type component with many wiring patterns on the multilayer substrate 2, the relatively expensive multilayer substrate 2 can be used to the minimum, and the overall size of the substrate can be reduced. Thus, the electric device 1 can be downsized and formed at low cost.

  3 and 4 show a second embodiment of the present invention, FIG. 3 is a schematic front sectional view of the lighting device, and FIG. 4 is a schematic side view of the lighting device. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  A lighting device 10 shown in FIG. 7 is a direct-mounted lighting fixture that is directly attached to a ceiling surface or the like, and is formed in a fixture main body 11 and a light source unit 12 attached to the fixture main body 11. The instrument body 11 and the light source unit 12 are each formed in a rectangular box shape. The instrument main body 11 has a length in the longitudinal direction substantially the same as that of the light source unit 12, but the width in the short direction is smaller than that of the light source unit 12, as shown in FIG. Yes. The light source unit 12 is attached to the instrument body 10 by a plurality of screws 13 at one end side 11 a of the instrument body 11 and at both end sides 12 a and 12 b in the longitudinal direction of the light source unit 12.

  In FIG. 3, the light source unit 12 has a large number of light emitting diodes 14 as illumination loads arranged in a grid pattern. The light emitting diode 14 is formed to emit visible light. The light source unit 12 is provided with a translucent cover 15 on the opening side 12c. Visible light emitted from the light emitting diode 12 passes through the translucent cover 14 and is emitted to the floor surface side. That is, the light emitting diode 12 is disposed on the floor surface side so as to be able to emit visible light.

  The appliance main body 10 accommodates the electric device 1 shown in FIG. The electric device 1 is formed as a lighting device that lights the light emitting diode 14.

  The lighting apparatus 10 of the present embodiment is thin and inexpensive, and the electric device 1 that is formed at low cost is accommodated in the apparatus main body 10, so that the entire apparatus can be thinned and formed at low cost. Has the effect of being able to.

  In addition, the illuminating device of this embodiment is not limited to a direct-mounted illuminator, and may be configured as a suspended illuminator or an embedded illuminator.

  DESCRIPTION OF SYMBOLS 1 ... Electrical apparatus, 2 ... Multi-layer substrate, 3 ... Single layer substrate, 4 ... End face pattern as an electrical connection means, 5 ... Terminal as an electrical connection means, 6 ... IC component as a surface mounting type part, 7 ... Opening, DESCRIPTION OF SYMBOLS 8 ... Electronic component, 10 ... Illuminating device, 11 ... Appliance main body, 14 ... Light emitting diode as illumination load

Claims (2)

A multilayer board on which surface-mounted components are mounted;
A single-layer substrate having an opening, the multilayer substrate being fitted in the opening, and an electronic component mounted thereon;
Electrical connection means for electrically connecting the surface-mounted component mounted on the multilayer substrate and the electronic component mounted on the single-layer substrate or the wiring pattern formed on the single-layer substrate;
An electrical device comprising: A lighting load that emits visible light;
The electrical device of claim 1 configured to turn on the lighting load;
An instrument body in which the illumination load is disposed so that visible light can be emitted on one end side, and the electric device is accommodated therein;
An illumination device comprising:

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