JP2012079847A - Electrical device and lighting system - Google Patents

Electrical device and lighting system Download PDF

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Publication number
JP2012079847A
JP2012079847A JP2010222285A JP2010222285A JP2012079847A JP 2012079847 A JP2012079847 A JP 2012079847A JP 2010222285 A JP2010222285 A JP 2010222285A JP 2010222285 A JP2010222285 A JP 2010222285A JP 2012079847 A JP2012079847 A JP 2012079847A
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substrate
layer
multilayer substrate
shaped core
pair
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Tsutomu Araki
努 荒木
Hiroshi Suzuki
浩史 鈴木
Kenichi Asami
健一 浅見
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electrical device formed in thin type, and a lighting system including the electrical device.SOLUTION: An electrical device 1 includes: a center hole 5 to which a central leg 4a of an E-shaped core 4 is inserted; a multilayer substrate 2 having conductive patterns formed in respective layers so as to surround the periphery of the center hole, and first electrical connection means 6 that connects the conductive patterns on the respective layers in series; an aperture to which the multilayer substrate 2 is fit and attached; a pair of side holes 8, 8 to which legs on both sides 4b, 4b of the E-shaped core 4 are inserted; a single-layer substrate 3 having second electrical connection means 9 that is electrically connected to conductive patterns on a lower-most layer and an upper-most layer of the multilayer substrate 2 that is fit and attached to the aperture; and the E-shaped core 4 that is inserted respectively into the center hole 5 and the pair of side holes 8, 8, and attached to the multilayer substrate 2 and the single-layer substrate 3.

Description

本発明の実施形態は、多層基板および単層基板を有する電気装置およびこの電気装置を具備する照明装置に関する。   Embodiments described herein relate generally to an electric device having a multilayer substrate and a single layer substrate, and an illumination device including the electric device.

電気装置には、商用交流電圧を直流電圧に変換し、さらに所定の直流電圧または所定の交流電圧に変換して負荷を制御しているものがある。この電気装置の電気回路には、インダクタが使用されている(例えば特許文献1参照。)。このインダクタは、他の回路部品とともに回路基板に実装されている。   Some electric devices convert a commercial AC voltage into a DC voltage, and further convert the AC voltage into a predetermined DC voltage or a predetermined AC voltage to control the load. An inductor is used in the electric circuit of this electric device (see, for example, Patent Document 1). This inductor is mounted on a circuit board together with other circuit components.

特公平7−1697号公報(第3頁、第1図)Japanese Patent Publication No. 7-1697 (page 3, Fig. 1)

インダクタは、比較的高さ寸法を有し、また、回路基板に沿うように配設しにくいので、回路基板の占有空間を大きくしている。このため、電気装置の薄形化を図りにくいということがあった。   Since the inductor has a relatively high dimension and is difficult to be disposed along the circuit board, the space occupied by the circuit board is increased. For this reason, it has been difficult to reduce the thickness of the electric device.

本発明は、薄形に形成可能な電気装置およびこの電気装置を具備する照明装置を提供することを目的とする。   An object of the present invention is to provide an electric device that can be formed into a thin shape and an illumination device including the electric device.

本実施形態の電気装置は、多層基板、単層基板およびE形コアを有して構成される。   The electric device according to the present embodiment includes a multilayer substrate, a single layer substrate, and an E-shaped core.

本実施形態の多層基板は、E形コアの中央脚が挿入される中央孔と、中央孔の周囲を周回するように各層に形成された導電パターンと、各層の導電パターンを直列接続する第1の電気接続手段を有している。   The multilayer substrate of the present embodiment includes a central hole into which the central leg of the E-shaped core is inserted, a conductive pattern formed in each layer so as to circulate around the central hole, and a first that connects the conductive patterns of each layer in series. It has the electrical connection means.

本実施形態の単層基板は、多層基板が嵌め込まれた開口と、E形コアの両側脚が挿入される一対の側孔と、開口に嵌め込まれた多層基板の最下層および最上層の導電パターンに電気接続する第2の電気接続手段とを有している。   The single-layer substrate of the present embodiment includes an opening in which the multilayer substrate is fitted, a pair of side holes into which both side legs of the E-shaped core are inserted, and the lowermost and uppermost conductive patterns of the multilayer substrate fitted in the opening. And second electrical connection means for electrical connection to.

本実施形態のE形コアは、多層基板に形成された中央孔および単層基板に形成された一対の側孔にそれぞれ挿入されていて、多層基板および単層基板に取り付けられている。   The E-shaped core of this embodiment is inserted into a central hole formed in the multilayer substrate and a pair of side holes formed in the single layer substrate, and is attached to the multilayer substrate and the single layer substrate.

本実施形態によれば、多層基板の各層に形成された導電パターンがE形コアの中央脚回りに巻回されるコイルとなり、多層基板および単層基板にインダクタ部品が形成されるので、多層基板および単層基板からE形コア部分が突出するのみであり、両基板の占有空間が小さくなって、電気装置を薄形にすることが期待できる。   According to the present embodiment, the conductive pattern formed on each layer of the multilayer substrate becomes a coil wound around the center leg of the E-shaped core, and the inductor component is formed on the multilayer substrate and the single layer substrate. Further, only the E-shaped core portion protrudes from the single-layer substrate, and the space occupied by both the substrates can be reduced, so that the electric device can be expected to be thin.

本発明の実施例1を示す電気装置の一部概略斜視図である。It is a partial schematic perspective view of the electric apparatus which shows Example 1 of this invention. 同じく、電気装置の一部概略分解斜視図である。Similarly, it is a partial schematic exploded perspective view of an electric device. 同じく、基板の概略分解斜視図である。Similarly, it is a schematic exploded perspective view of a substrate. 本発明の実施例2を示す照明装置の概略正面断面図である。It is a schematic front sectional drawing of the illuminating device which shows Example 2 of this invention. 同じく、照明装置の概略側面図である。Similarly, it is a schematic side view of an illuminating device.

以下、本発明の一実施の形態について、図面を参照して説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

本発明の実施例1を示す電気装置1は、図1ないし図3に示すように構成される。図1において、電気装置1は、多層基板2、単層基板3およびE形コア4を有して形成されている。   An electrical apparatus 1 showing Embodiment 1 of the present invention is configured as shown in FIGS. In FIG. 1, an electric device 1 is formed having a multilayer substrate 2, a single layer substrate 3, and an E-shaped core 4.

図3において、多層基板2は、4層以上であって、例えば厚さ2〜5mmのガラスエポキシ材からなり、長方形に形成されている。そして、長方形の中央部には、中央孔5が形成されている。中央孔5は、E形コア4の中央脚4aが挿入可能な形状および大きさに形成されている。   In FIG. 3, the multilayer substrate 2 has four or more layers and is made of, for example, a glass epoxy material having a thickness of 2 to 5 mm, and is formed in a rectangular shape. A central hole 5 is formed at the center of the rectangle. The center hole 5 is formed in a shape and size into which the center leg 4a of the E-shaped core 4 can be inserted.

また、各層においては、中央孔5の周囲を周回するような図示しない導電パターンが例えば渦巻状に形成されている。そして、端部側の上面2aおよび下面2bには、端面2cを跨ぐ第1の電気接続手段としての複数の端面パターン6が形成されている。端面パターン6は、前記導電パターンを直列接続している。なお、4層以上の上限値は、適宜設定すればよい。   In each layer, a conductive pattern (not shown) that circulates around the central hole 5 is formed in a spiral shape, for example. A plurality of end face patterns 6 as first electrical connection means straddling the end face 2c are formed on the upper surface 2a and the lower surface 2b on the end side. The end face pattern 6 connects the conductive patterns in series. In addition, what is necessary is just to set the upper limit of four layers or more suitably.

単層基板3は、多層基板2と同等の厚さを有するリジット基板であり、長尺の長方形に形成されている。そして、多層基板2が嵌め込まれる開口7およびE形コア4の両側脚4b,4bが挿入される一対の側孔8,8が形成されている。開口7は、多層基板2の長方形よりも若干大きい長方形に形成されている。また、一対の側孔8,8は、E形コア4の両側脚4b,4bが挿入可能な形状および大きさに形成されている。なお、図3において、開口7および一対の側孔8,8は連通しているが、E形コア4や多層基板2の大きさによっては、個別に形成される。   The single layer substrate 3 is a rigid substrate having a thickness equivalent to that of the multilayer substrate 2 and is formed in a long rectangular shape. An opening 7 into which the multilayer substrate 2 is fitted and a pair of side holes 8 and 8 into which both side legs 4b and 4b of the E-shaped core 4 are inserted are formed. The opening 7 is formed in a rectangle that is slightly larger than the rectangle of the multilayer substrate 2. The pair of side holes 8 and 8 are formed in a shape and size into which both side legs 4b and 4b of the E-shaped core 4 can be inserted. In FIG. 3, the opening 7 and the pair of side holes 8 and 8 communicate with each other, but are individually formed depending on the size of the E-shaped core 4 and the multilayer substrate 2.

そして、単層基板3には、多層基板2の最下層および最上層の導電パターンに電気接続される第2の電気接続手段としての複数の端子9が形成されている。端子9は、例えば銅箔からなる。端子9は、多層基板2の端面パターン6に対応して設けられている。   The single-layer substrate 3 is formed with a plurality of terminals 9 as second electrical connection means that are electrically connected to the lowermost layer and the uppermost conductive pattern of the multilayer substrate 2. The terminal 9 is made of, for example, copper foil. The terminal 9 is provided corresponding to the end face pattern 6 of the multilayer substrate 2.

そして、図2に示すように、開口7に多層基板2が嵌め込まれて取り付けられる。多層基板2は、その縁部に適宜の箇所に塗布された図示しない絶縁性の接着材で単層基板3に固着されている。また、多層基板2の端面パターン6と、単層基板3の端子9が近接しており、両者は、はんだが塗布されて電気接続されている。   Then, as shown in FIG. 2, the multilayer substrate 2 is fitted into the opening 7 and attached. The multilayer substrate 2 is fixed to the single-layer substrate 3 with an insulating adhesive (not shown) applied to an appropriate portion of the edge of the multilayer substrate 2. Moreover, the end face pattern 6 of the multilayer substrate 2 and the terminal 9 of the single layer substrate 3 are close to each other, and both are electrically connected by applying solder.

E形コア4は、フェライトからなり、中央脚4aおよび一対の側脚4b,4bを有する一対からなっている。そして、一対のE形コア4,4が多層基板の中央孔5および単層基板3の一対の側孔8,8にそれぞれの基板2,3の両面側から挿入されている。一対のE形コア4,4は、図示しない接着材により多層基板2および単層基板3に固着されて取り付けられている。   The E-shaped core 4 is made of ferrite and has a pair having a central leg 4a and a pair of side legs 4b and 4b. A pair of E-shaped cores 4 and 4 are inserted into the central hole 5 of the multilayer substrate and the pair of side holes 8 and 8 of the single-layer substrate 3 from both sides of the respective substrates 2 and 3. The pair of E-shaped cores 4 and 4 are fixedly attached to the multilayer substrate 2 and the single-layer substrate 3 with an adhesive (not shown).

そして、多層基板2および単層基板3のE形コア4を除く部位には、図1に示すように、電子部品9a,9b,9cが実装されている。電子部品9a,9b,9cは、銅箔からなる配線パターン9dにより、多層基板2の端面パターン6や単層基板3の端子9に電気接続されている。   Then, as shown in FIG. 1, electronic components 9a, 9b, and 9c are mounted on portions of the multilayer substrate 2 and the single-layer substrate 3 excluding the E-shaped core 4. The electronic components 9a, 9b and 9c are electrically connected to the end face pattern 6 of the multilayer substrate 2 and the terminals 9 of the single layer substrate 3 by a wiring pattern 9d made of copper foil.

本実施形態によれば、多層基板2の各層に形成された導電パターンがE形コア4,4の中央脚4a,4a回りに巻回されるコイルとなり、多層基板2および単層基板3にインダクタ部品が形成されるので、多層基板2および単層基板3からE形コア4,4部分が突出するのみであり、両基板2,3の占有空間が小さくなって、電気装置1を薄形にすることができるという効果を有する。   According to the present embodiment, the conductive pattern formed in each layer of the multilayer substrate 2 becomes a coil wound around the central legs 4a and 4a of the E-shaped cores 4 and 4, and the inductors are formed on the multilayer substrate 2 and the single-layer substrate 3. Since the components are formed, only the E-shaped cores 4 and 4 project from the multilayer substrate 2 and the single-layer substrate 3, and the space occupied by both the substrates 2 and 3 is reduced, so that the electric device 1 is made thin. It has the effect that it can be done.

なお、一対のE形コア4,4に替えて、E形およびI形のコアを用いてもよい。   In place of the pair of E-shaped cores 4 and 4, E-shaped and I-shaped cores may be used.

図4および図5は、本発明の実施例2を示し、図4は照明装置の概略正面断面図、図5は照明装置の概略側面図である。なお、図1と同一部分には、同一符号を付して説明は省略する。   4 and 5 show a second embodiment of the present invention, FIG. 4 is a schematic front sectional view of the lighting device, and FIG. 5 is a schematic side view of the lighting device. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

図4に示す照明装置10は、天井面などに直付けされる直付け照明器具であり、器具本体11と、この器具本体11に取り付けられた光源ユニット12に形成されている。器具本体11および光源ユニット12は、それぞれ長方形の箱状に形成されている。器具本体11は、その長手方向の大きさが光源ユニット12とほぼ同等に形成されているが、その短手方向の大きさは、図5に示すように、光源ユニット12よりも小さく形成されている。光源ユニット12は、器具本体11の一端側11aであって光源ユニット12の長手方向の両端側12a,12bにおいて、複数個のねじ13により器具本体10に取り付けられている。   A lighting device 10 shown in FIG. 4 is a direct-mounted lighting fixture that is directly attached to a ceiling surface or the like, and is formed in a fixture main body 11 and a light source unit 12 attached to the fixture main body 11. The instrument body 11 and the light source unit 12 are each formed in a rectangular box shape. The instrument body 11 has a length in the longitudinal direction substantially the same as that of the light source unit 12, but its width in the short direction is smaller than that of the light source unit 12, as shown in FIG. Yes. The light source unit 12 is attached to the instrument body 10 by a plurality of screws 13 at one end side 11 a of the instrument body 11 and at both end sides 12 a and 12 b in the longitudinal direction of the light source unit 12.

図4において、光源ユニット12は、照明負荷としての発光ダイオード14を格子状に多数配設している。発光ダイオード14は、可視光を放射するように形成されている。そして、光源ユニット12は、その開口側12cに透光性カバー15を配設している。発光ダイオード12から放射された可視光は、透光性カバー15を透過して床面側に放射される。すなわち、発光ダイオード12は、床面側に可視光を放射可能に配設されている。   In FIG. 4, the light source unit 12 has a large number of light emitting diodes 14 as illumination loads arranged in a lattice pattern. The light emitting diode 14 is formed to emit visible light. The light source unit 12 is provided with a translucent cover 15 on the opening side 12c. Visible light emitted from the light emitting diode 12 passes through the translucent cover 15 and is emitted to the floor surface side. That is, the light emitting diode 12 is disposed on the floor surface side so as to be able to emit visible light.

器具本体10は、その内部に図1示す電気装置1を収容している。電気装置1は、発光ダイオード14を点灯する点灯装置に形成されている。   The appliance main body 10 accommodates the electric device 1 shown in FIG. The electric device 1 is formed as a lighting device that lights the light emitting diode 14.

本実施形態の照明器具10は、薄形化される電気装置1が器具本体10に収容されているので、全体を薄形化することができるという効果を有する。   The lighting apparatus 10 of the present embodiment has an effect that the entire apparatus can be thinned since the electric apparatus 1 to be thinned is accommodated in the apparatus main body 10.

なお、本実施形態の照明装置は、直付け形照明器具に限らず、吊り下げ形照明器具や埋込形照明器具などに構成されてもよい。   In addition, the illuminating device of this embodiment is not limited to a direct-mounted illuminator, and may be configured as a suspended illuminator or an embedded illuminator.

1…電気装置、 2…多層基板、 3…単層基板、 4…E形コア、 5…中央孔、 6…第1の電気接続手段としての端面パターン、 7…開口、 8,8…一対の側孔、 9…第2の接続手段としての端子、 10…照明装置、 11…器具本体、 14…照明負荷としての発光ダイオード   DESCRIPTION OF SYMBOLS 1 ... Electrical apparatus, 2 ... Multi-layer board | substrate, 3 ... Single layer board | substrate, 4 ... E-shaped core, 5 ... Center hole, 6 ... End face pattern as 1st electrical connection means, 7 ... Opening, 8, 8 ... Pair Side hole, 9 ... Terminal as second connecting means, 10 ... Illuminating device, 11 ... Appliance body, 14 ... Light emitting diode as illumination load

Claims (2)

E形コアの中央脚が挿入される中央孔、前記中央孔の周囲を周回するように各層に形成された導電パターンおよび各層の前記導電パターンを直列接続する第1の電気接続手段を有する多層基板と;
この多層基板が嵌め込まれた開口と、E形コアの両側脚が挿入される一対の側孔と、前記開口に嵌め込まれた前記多層基板の最下層および最上層の導電パターンに電気接続する第2の電気接続手段を有する単層基板と;
前記多層基板に形成された前記中央孔および前記単層基板に形成された前記一対の側孔にそれぞれ挿入され、前記多層基板および前記単層基板に取り付けられたE形コアと;
を具備していることを特徴とする電気装置。
A multilayer board having a central hole into which a central leg of an E-shaped core is inserted, a conductive pattern formed in each layer so as to circulate around the central hole, and a first electrical connection means for connecting the conductive pattern of each layer in series When;
A second electrical connection electrically connected to the opening in which the multilayer board is fitted, a pair of side holes into which both side legs of the E-shaped core are inserted, and the lowermost and uppermost conductive patterns of the multilayer board fitted in the opening. A single layer substrate having electrical connection means of:
An E-shaped core inserted into the central hole formed in the multilayer substrate and the pair of side holes formed in the single-layer substrate, and attached to the multilayer substrate and the single-layer substrate;
An electrical device comprising:
可視光を放射する照明負荷と;
この照明負荷を点灯するように形成された請求項1記載の電気装置と;
一端側に可視光を放射可能に前記照明負荷が配設され、内部に前記電気装置が収容されている器具本体と;
を具備していることを特徴とする照明装置。
A lighting load that emits visible light;
The electrical device of claim 1 configured to turn on the lighting load;
An instrument body in which the illumination load is disposed so that visible light can be emitted on one end side, and the electric device is accommodated therein;
An illumination device comprising:
JP2010222285A 2010-09-30 2010-09-30 Electrical device and lighting system Pending JP2012079847A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014175386A (en) * 2013-03-07 2014-09-22 Yazaki Corp Printed wiring board
JP2016510513A (en) * 2013-01-30 2016-04-07 日本テキサス・インスツルメンツ株式会社 Circuit assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016510513A (en) * 2013-01-30 2016-04-07 日本テキサス・インスツルメンツ株式会社 Circuit assembly
JP2014175386A (en) * 2013-03-07 2014-09-22 Yazaki Corp Printed wiring board

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