JP2016162840A - Electronic component, manufacturing method thereof, and manufacturing apparatus - Google Patents

Electronic component, manufacturing method thereof, and manufacturing apparatus Download PDF

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JP2016162840A
JP2016162840A JP2015038968A JP2015038968A JP2016162840A JP 2016162840 A JP2016162840 A JP 2016162840A JP 2015038968 A JP2015038968 A JP 2015038968A JP 2015038968 A JP2015038968 A JP 2015038968A JP 2016162840 A JP2016162840 A JP 2016162840A
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mold
plate
resin
electronic component
mounted substrate
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JP6400509B2 (en
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岩田　康弘
Yasuhiro Iwata
康弘 岩田
智行 後藤
Tomoyuki Goto
智行 後藤
竹内　慎
Shin Takeuchi
慎 竹内
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Towa Corp
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Priority to CN201580075550.2A priority patent/CN107210271A/en
Priority to PCT/JP2015/079941 priority patent/WO2016136021A1/en
Priority to KR1020177018910A priority patent/KR20170121157A/en
Priority to TW104135739A priority patent/TW201637149A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PROBLEM TO BE SOLVED: To manufacture an electronic component that preferably shields an electromagnetic wave and has an excellent heat dissipation in a high productivity.SOLUTION: A mounted substrate 13 in which an electronic element 3 and a projection conductive member 6 are mounted to a main surface 9 is disposed to an upper mold 15. A plate-like member 5 in which a cream solder 20 is previously coated to a position where the conductive member 6 contacts is disposed to an inner bottom surface of a cavity 17 of a lower mold 16. A liquid resin 21 is injected to the cavity 17, the upper mold 15 and the lower mold 16 are clamped, conductive member 6, a metal thin wire 11, the electronic element 3, a bonding pad 7, and the main surface 9 of the mounted substrate 13 are dipped in the liquid resin 21, and the conductive member 6 contacts with the plate-like member 5 through the cream solder 20. A sealing resin 4 is formed by hardening the liquid resin 21, and a sealed substrate 22 is completed. In a state where the conductive member 6 is pressed by the plate-like member 5 depending on a compression stress at hardening the liquid resin 21, the conductive member 6 and the plate-like member 5 are surly electrically connected by the cream solder 20.SELECTED DRAWING: Figure 3

Description

本発明は、電子部品、その製造装置及び製造方法に関し、より詳細には電磁シールド板又は放熱板として機能する板状部材と配線基板と封止性樹脂とを有する電子部品、その製造装置及び製造方法に関する。   The present invention relates to an electronic component, a manufacturing apparatus and a manufacturing method thereof, and more specifically, an electronic component having a plate-like member functioning as an electromagnetic shield plate or a heat sink, a wiring board, and a sealing resin, a manufacturing apparatus and a manufacturing method thereof Regarding the method.

従来、電子部品は携帯電話機等の通信機器等における高周波回路等に用いられている。この電子部品の製造方法は、次の３つの工程を有する。まず、信号配線パターンやグラウンド配線パターン等の表面配線パターンを有する配線基板の上面に、IC（Integrated Circuit）等の半導体素子等の電子素子を載置させる工程である。次に、電子素子の上面に設けられている接続電極と表面配線パターンとを、金属細線を介して電気的に接続する工程である。次に、絶縁性を有する封止樹脂によって電子素子を被覆する工程である。   Conventionally, electronic components are used in high-frequency circuits and the like in communication devices such as mobile phones. This electronic component manufacturing method has the following three steps. First, an electronic element such as a semiconductor element such as an IC (Integrated Circuit) is placed on the upper surface of a wiring board having a surface wiring pattern such as a signal wiring pattern or a ground wiring pattern. Next, it is a step of electrically connecting the connection electrode provided on the upper surface of the electronic element and the surface wiring pattern via a fine metal wire. Next, the electronic element is covered with an insulating sealing resin.

従来の電子部品は、携帯電話などの通信機器内に組み込まれた後に、電子部品の周囲に配置される他の電子部品からの電磁的な影響によって、誤動作するおそれを有する。特に、電子部品が高周波回路に用いられる際に誤作動する可能性が高い。そこで、誤作動するおそれを解消するために、次の工程を有する電子部品の製造方法が提案されている(特許文献１参照)。まず配線基板上に金属ポストを形成する工程である。次に、チップ部品（電子素子）の上面に設けられている電極端子（接続電極）と基板上のパッド部（表面配線パターン）とを、金属ワイヤ（金属細線）を介して電気的に接続する工程である。次に、金属ポストの上面に、樹脂封止の際に用いる成形型よりも柔らかい材料からなる金属ワイヤを形成する工程である。次に成形型を金属ワイヤに接触させて型締めした状態で、チップ部品及び金属ポストを封止樹脂によって樹脂封止する工程である。次に、前の工程で得られた樹脂封止後の構造体を、ダイサー等により、各デバイス単位に切断して個片化する工程である。次に、個片化された構造体に対し、金属製シールドケースを装着する工程である。この工程によって、封止樹脂から露出した金属ワイヤと金属製シールドケースを電気的に接続する。  Conventional electronic components have a risk of malfunctioning due to electromagnetic influences from other electronic components arranged around the electronic components after being incorporated in a communication device such as a mobile phone. In particular, there is a high possibility of malfunction when electronic components are used in high-frequency circuits. Thus, in order to eliminate the possibility of malfunction, an electronic component manufacturing method having the following steps has been proposed (see Patent Document 1). First, a metal post is formed on a wiring board. Next, an electrode terminal (connection electrode) provided on the upper surface of the chip component (electronic element) and a pad portion (surface wiring pattern) on the substrate are electrically connected via a metal wire (metal thin wire). It is a process. Next, it is a step of forming a metal wire made of a material softer than the mold used for resin sealing on the upper surface of the metal post. Next, in a state where the mold is brought into contact with the metal wire and clamped, the chip component and the metal post are resin-sealed with a sealing resin. Next, the resin-encapsulated structure obtained in the previous step is a step of cutting into individual devices by dicer or the like and dividing into individual devices. Next, a metal shield case is attached to the separated structure. By this step, the metal wire exposed from the sealing resin and the metal shield case are electrically connected.

特開２００９−２８９９２６号公報(段落[００１６]、[００１７]、[００１８]参照)JP 2009-289926 A (see paragraphs [0016], [0017], [0018])

上述した金属部材を用いる電子部品の製造方法によれば、樹脂封止する工程と接地用電極部材を露出させる工程と金属部材を装着する工程とを別々に要するので、電子部品の組立作業が複雑になる。また、各工程を実施するために加工機の費用やその加工機を操作する作業員の人件費等が必要となるので、電子部品の製造原価が増加する。   According to the electronic component manufacturing method using the metal member described above, the process of resin sealing, the step of exposing the ground electrode member, and the step of mounting the metal member are required separately, so that the assembly work of the electronic component is complicated. become. In addition, since the cost of the processing machine and the labor cost of the operator who operates the processing machine are required to perform each process, the manufacturing cost of the electronic component increases.

本発明は上記課題に鑑み案出されたもので、電子部品を製造する際の工程を削減し、電磁波を良好に遮蔽し、良好な放熱性を有する電子部品、その製造装置及び製造方法を提供することを目的とする。   The present invention has been devised in view of the above-described problems, and provides an electronic component having good heat dissipation, a manufacturing apparatus and a manufacturing method thereof, which can reduce steps when manufacturing an electronic component, shield electromagnetic waves well, and have good heat dissipation. The purpose is to do.

本発明に係る電子部品は、電子素子と、電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され電子素子とグラウンド配線パターンとを少なくとも覆う封止樹脂とを備える電子部品であって、封止樹脂における実装済基板とは反対側の面に固着され、導電性を有する板状部材と、実装済基板が有するグラウンド配線パターンに対して予め電気的に接続され、板状部材に対して電気的に接続され、導電性を有する機能部材とを備え、機能部材が封止樹脂によって覆われていることを特徴とする。   An electronic component according to the present invention is obtained by curing an electronic element, a mounted substrate electrically connected to a connection electrode of the electronic element, a ground wiring pattern on a main surface, and a fluid resin. An electronic component comprising a sealing resin that is formed and covers at least the electronic element and the ground wiring pattern, and is fixed to a surface opposite to the mounted substrate in the sealing resin, and has a conductive plate-like member, It is electrically connected in advance to the ground wiring pattern of the mounted substrate, electrically connected to the plate-like member, and has a conductive functional member, and the functional member is covered with a sealing resin. It is characterized by being.

本発明に係る電子部品は、電子素子と、電子素子の接続電極に電気的に接続されたボンディングパッドとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され電子素子を少なくとも覆う封止樹脂とを備える電子部品であって、封止樹脂における実装済基板とは反対側の面に固着され、熱伝導性を有する板状部材と、実装済基板が有する主面に対して予め熱的に接続され、板状部材に対して熱的に接続され、熱伝導性を有する機能部材とを備え、機能部材が封止樹脂によって覆われていることを特徴とする。   An electronic component according to the present invention includes an electronic device, a mounted substrate having a bonding pad electrically connected to a connection electrode of the electronic device on a main surface, and an electronic device formed by curing a fluid resin. An electronic component comprising at least an encapsulating resin, which is fixed to a surface opposite to the mounted substrate in the encapsulating resin, and has a plate-like member having thermal conductivity, and a main surface of the mounted substrate And a functional member that is thermally connected in advance and thermally connected to the plate-like member and has thermal conductivity, and the functional member is covered with a sealing resin.

本発明に係る電子部品は、上述した電子部品において、実装済基板が導電性部材を板状部材に向かって押圧した状態において流動性樹脂が硬化することによって、導電性部材が板状部材に電気的に接続されたことを特徴とする。   In the electronic component according to the present invention, in the electronic component described above, the flowable resin is cured in a state where the mounted substrate presses the conductive member toward the plate-like member, so that the conductive member is electrically connected to the plate-like member. It is characterized by being connected.

本発明に係る電子部品は、上述した電子部品において、流動性樹脂が硬化する際の圧縮応力によって導電性部材と板状部材とが互いに圧接された状態において流動性樹脂が硬化することによって、導電性部材が板状部材に電気的に接続されたことを特徴とする。   In the electronic component according to the present invention, in the electronic component described above, the flowable resin is cured in a state where the conductive member and the plate-like member are pressed against each other by the compressive stress when the flowable resin is cured. The characteristic member is electrically connected to the plate-like member.

本発明に係る電子部品の製造方法は、電子素子と、電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンと、グラウンド配線パターンに対して予め電気的に接続され導電性を有する機能部材とを主面において有する実装済基板を準備する工程と、導電性を有する板状部材を準備する工程と、第１の型の所定の位置に実装済基板を一時的に固定する工程と、第１の型に相対向する第２の型に設けられたキャビティの内底面に板状部材を配置する工程と、流動性樹脂によってキャビティを満たされた状態にする工程と、第１の型と第２の型とを型締めすることによって、板状部材と機能部材とを接触させる工程と、第１の型と第２の型とを型締めした状態において、少なくとも機能部材と電子素子とグラウンド配線パターンと実装済基板の主面とを流動性樹脂に浸漬する工程と、流動性樹脂を硬化させて硬化樹脂からなる封止樹脂を形成する工程と、第１の型と第２の型とを型開きすることによって、電子素子とグラウンド配線パターンと機能部材と板状部材と封止樹脂とを少なくとも有する電子部品を第２の型から分離する工程とを備え、封止樹脂を形成する工程において、機能部材によってグラウンド配線パターンが板状部材に対して電気的に接続されることを特徴とする。   An electronic component manufacturing method according to the present invention includes an electronic device, a bonding pad electrically connected to a connection electrode of the electronic device, a ground wiring pattern, and a conductive material electrically connected in advance to the ground wiring pattern. A step of preparing a mounted substrate having a functional member having a main surface on the main surface, a step of preparing a plate member having conductivity, and temporarily mounting the mounted substrate at a predetermined position of the first mold A step, a step of disposing a plate-like member on the inner bottom surface of the cavity provided in the second die opposite to the first die, a step of filling the cavity with a flowable resin, In the process of bringing the plate-shaped member and the functional member into contact with each other by clamping the mold and the second mold, and in a state where the first mold and the second mold are clamped, at least the functional member and the electronic Element and ground A step of immersing the wiring pattern and the principal surface of the mounted substrate in a fluid resin; a step of curing the fluid resin to form a sealing resin made of a cured resin; and a first mold and a second mold. Separating the electronic component having at least an electronic element, a ground wiring pattern, a functional member, a plate-like member, and a sealing resin by opening the mold, and forming a sealing resin The ground wiring pattern is electrically connected to the plate-like member by the functional member.

本発明に係る電子部品の製造方法は、主面に装着された電子素子と、電子素子の接続電極に電気的に接続されたボンディングパッドと、主面に対して予め熱的に接続され熱伝導性を有する機能部材とを有する実装済基板を準備する工程と、熱伝導性を有する板状部材を準備する工程と、第１の型の所定の位置に実装済基板を一時的に固定する工程と、第１の型に相対向する第２の型に設けられたキャビティの内底面に板状部材を配置する工程と、流動性樹脂によってキャビティを満たされた状態にする工程と、第１の型と第２の型とを型締めすることによって、板状部材と機能部材とを接触させる工程と、第１の型と第２の型とを型締めした状態において、少なくとも機能部材と電子素子とグラウンド配線パターンと実装済基板の主面とを流動性樹脂に浸漬する工程と、流動性樹脂を硬化させて硬化樹脂からなる封止樹脂を形成する工程と、第１の型と第２の型とを型開きすることによって、電子素子とグラウンド配線パターンと機能部材と板状部材と封止樹脂とを少なくとも有する電子部品を第２の型から分離する工程とを備え、封止樹脂を形成する工程において、機能部材によって実装済基板が板状部材に対して熱的に接続されることを特徴とする。   An electronic component manufacturing method according to the present invention includes an electronic element mounted on a main surface, a bonding pad electrically connected to a connection electrode of the electronic element, and a thermal connection that is thermally connected to the main surface in advance. A step of preparing a mounted substrate having a functional member having a property, a step of preparing a plate member having thermal conductivity, and a step of temporarily fixing the mounted substrate at a predetermined position of the first mold And a step of disposing a plate-like member on the inner bottom surface of the cavity provided in the second die opposite to the first die, a step of filling the cavity with the fluid resin, At least the functional member and the electronic element in the step of bringing the plate-shaped member and the functional member into contact with each other by clamping the mold and the second mold, and the first mold and the second mold being clamped , Ground wiring pattern and main surface of mounted board An electronic element and a ground wiring by opening the first mold and the second mold, and the step of immersing in the conductive resin, the step of curing the fluid resin to form the sealing resin made of the cured resin, and the first mold and the second mold A step of separating the electronic component having at least a pattern, a functional member, a plate-like member, and a sealing resin from the second mold, and in the step of forming the sealing resin, the substrate mounted by the functional member is a plate-like member It is characterized by being thermally connected to.

本発明に係る電子部品の製造方法は、上述した電子部品の製造方法において、封止樹脂を形成する工程では、実装済基板が導電性部材を板状部材に向かって押圧した状態において流動性樹脂を硬化させることを特徴とする。   The method for manufacturing an electronic component according to the present invention is the above-described method for manufacturing an electronic component, wherein in the step of forming the sealing resin, the flowable resin in a state where the mounted substrate presses the conductive member toward the plate-shaped member. Is cured.

本発明に係る電子部品の製造方法は、上述した電子部品の製造方法において、封止樹脂を形成する工程では、流動性樹脂が硬化する際の圧縮応力によって導電性部材と板状部材とが互いに圧接された状態において流動性樹脂を硬化させることを特徴とする。   In the method of manufacturing an electronic component according to the present invention, in the above-described method of manufacturing an electronic component, in the step of forming the sealing resin, the conductive member and the plate-shaped member are brought into contact with each other by compressive stress when the fluid resin is cured. The fluid resin is cured in the pressed state.

本発明に係る電子部品の製造装置は、電子素子と、電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され電子素子とグラウンド配線パターンとを少なくとも覆う封止樹脂と、封止樹脂に固着され導電性を有する板状部材と、実装済基板が有するグラウンド配線パターンに対して予め電気的に接続され板状部材に対して電気的に接続され導電性を有する機能部材とを備える電子部品を製造する電子部品の製造装置であって、実装済基板が一時的に固定される第１の型と、第１の型に相対向する、キャビティを有する第２の型とを備え、キャビティの内底面に板状部材が配置され、第１の型と第２の型とが型締めされた状態において、キャビティに満たされた流動性樹脂が板状部材を覆い、第１の型と第２の型とが型締めされた状態において、機能部材と板状部材とが接触し、第１の型と第２の型とが型締めされた状態において、キャビティに満たされた流動性樹脂が硬化して封止樹脂が形成されることを特徴とする。   An apparatus for manufacturing an electronic component according to the present invention includes a mounted substrate having a main surface of an electronic element, a bonding pad electrically connected to a connection electrode of the electronic element, and a ground wiring pattern, and a fluid resin is cured. A sealing resin that covers at least the electronic element and the ground wiring pattern, a plate member that is fixed to the sealing resin and has conductivity, and a ground wiring pattern that the mounted substrate has. An electronic component manufacturing apparatus that manufactures an electronic component including a conductive functional member that is connected and electrically connected to a plate-shaped member, wherein the mounted substrate is temporarily fixed. And a second mold having a cavity opposite to the first mold, a plate-like member is disposed on the inner bottom surface of the cavity, and the first mold and the second mold are clamped In this case, in the state where the fluid resin filled in the cavity covers the plate-like member and the first die and the second die are clamped, the functional member and the plate-like member are in contact with each other. In a state where the mold and the second mold are clamped, the fluid resin filled in the cavity is cured to form a sealing resin.

本発明に係る電子部品の製造装置は、電子素子と、電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され電子素子とグラウンド配線パターンとを少なくとも覆う封止樹脂と、封止樹脂に固着され熱伝導性を有する板状部材と、実装済基板に対して予め熱的に接続され板状部材に対して熱的に接続され熱伝導性を有する機能部材とを備える電子部品を製造する電子部品の製造装置であって、実装済基板が一時的に固定される第１の型と、第１の型に相対向する、キャビティを有する第２の型とを備え、キャビティの内底面に板状部材が配置され、第１の型と第２の型とが型締めされた状態において、キャビティに満たされた流動性樹脂が板状部材を覆い、第１の型と第２の型とが型締めされた状態において、機能部材と板状部材とが接触し、第１の型と第２の型とが型締めされた状態において、キャビティに満たされた流動性樹脂が硬化して封止樹脂が形成されることを特徴とする。   An apparatus for manufacturing an electronic component according to the present invention includes a mounted substrate having a main surface of an electronic element, a bonding pad electrically connected to a connection electrode of the electronic element, and a ground wiring pattern, and a fluid resin is cured. A sealing resin that at least covers the electronic element and the ground wiring pattern, a plate member that is fixed to the sealing resin and has thermal conductivity, and a plate that is thermally connected to the mounted substrate in advance. An electronic component manufacturing apparatus for manufacturing an electronic component comprising a functional member thermally connected to a member and having thermal conductivity, wherein a first mold on which a mounted substrate is temporarily fixed; And a second mold having a cavity opposite to the first mold, a plate-like member is disposed on the inner bottom surface of the cavity, and the first mold and the second mold are clamped together. Met In a state where the fluid resin covers the plate member and the first die and the second die are clamped, the functional member and the plate member are in contact with each other, and the first die and the second die are In a state where the mold is clamped, the fluid resin filled in the cavity is cured to form a sealing resin.

本発明に係る電子部品の製造装置は、上述した電子部品の製造装置において、板状部材に設けられた第１の位置合わせ部と、キャビティに設けられた第２の位置合わせ部とを備え、第１の位置合わせ部と第２の位置合わせ部とによって板状部材とキャビティとが位置合わせされることを特徴とする。   An electronic component manufacturing apparatus according to the present invention includes the first alignment unit provided in the plate-like member and the second alignment unit provided in the cavity in the electronic component manufacturing apparatus described above. The plate member and the cavity are aligned by the first alignment portion and the second alignment portion.

本発明に係る電子部品の製造装置は、上述した電子部品の製造装置において、第１の型と第２の型とが型締めされた状態において、流動性樹脂が硬化する際の圧縮応力によって導電性部材と板状部材とが互いに圧接された状態において流動性樹脂が硬化することを特徴とする。   The electronic component manufacturing apparatus according to the present invention is the above-described electronic component manufacturing apparatus, in which the first mold and the second mold are clamped to conduct electricity by compressive stress when the fluid resin is cured. The fluid resin is cured in a state where the adhesive member and the plate-like member are pressed against each other.

本発明によれば、電子部品を製造する際の生産性が高く、電磁波を良好に遮蔽し、良好な放熱性を有する電子部品と、従来の製造工程を削減してその電子部品を製造できる製造方法及び製造装置とを提供することが可能になる。   According to the present invention, an electronic component that has high productivity when manufacturing an electronic component, shields electromagnetic waves well, has good heat dissipation, and can manufacture the electronic component by reducing the conventional manufacturing process. It becomes possible to provide a method and a manufacturing apparatus.

本発明に係る電子部品の構成を示す概略断面図である。It is a schematic sectional drawing which shows the structure of the electronic component which concerns on this invention. 本発明に係る電子部品の製造方法の実施例１において工程の一部を示す概略断面図であり、（ａ）は実装済基板と板状部材とを準備する工程、（ｂ）は実装済基板を上型に一時的に固定する工程、（ｃ）は板状部材を下型に配置する工程を示す。BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows a part of process in Example 1 of the manufacturing method of the electronic component which concerns on this invention, (a) is the process of preparing a mounted substrate and a plate-shaped member, (b) is a mounted substrate. (C) shows the process of arrange | positioning a plate-shaped member to a lower mold | type. 本発明に係る電子部品を製造する工程の一部を示す概略断面図であり、（ａ）は下型のキャビティ部に液状樹脂を注入する工程、（ｂ）は上型と下型とを型締めして液状樹脂を硬化させて封止樹脂を成形する工程、（ｃ）は上型と下型とを型開きして下型と電子部品とを分離する工程を示す。It is a schematic sectional drawing which shows a part of process of manufacturing the electronic component which concerns on this invention, (a) is a process which inject | pours liquid resin in the cavity part of a lower mold | type, (b) is a type | mold with an upper mold | type and a lower mold | type. (C) shows a process of opening the upper mold and the lower mold and separating the lower mold and the electronic component by fastening the liquid resin to form the sealing resin. 本発明に係る電子部品の製造方法の実施例２において工程の一部を示す概略断面図であり、（ａ）は実装済基板を上型に一時的に固定し、下型のキャビティ部に板状部材を設置した後に液状樹脂を注入する工程、（ｂ）は上型と下型とを型締めして液状樹脂を硬化させて封止樹脂を成形する工程、（ｃ）は上型と下型とを型開きして下型と電子部品とを分離する工程を示す。It is a schematic sectional drawing which shows a part of process in Example 2 of the manufacturing method of the electronic component which concerns on this invention, (a) fixes the mounted board | substrate temporarily to an upper mold | type, and plate | boards to the cavity part of a lower mold | type A step of injecting a liquid resin after installing the shaped member, (b) a step of clamping the upper die and the lower die to cure the liquid resin and molding a sealing resin, and (c) an upper die and a lower die A process of opening the mold and separating the lower mold and the electronic component is shown. 本発明に係る電子部品の製造方法の実施例３において工程の一部を示す概略断面図であり、（ａ）は実装済基板を上型に一時的に固定し、下型のキャビティ部に板状部材を設置した後に液状樹脂を注入する工程、（ｂ）は上型と下型とを型締めして液状樹脂を硬化させて封止樹脂を成形する工程、（ｃ）は上型と下型とを型開きして下型と電子部品とを分離する工程を示す。It is a schematic sectional drawing which shows a part of process in Example 3 of the manufacturing method of the electronic component which concerns on this invention, (a) fixes the mounted board | substrate temporarily to an upper mold | type, and plate | boards to the cavity part of a lower mold | type A step of injecting a liquid resin after installing the shaped member, (b) a step of clamping the upper die and the lower die to cure the liquid resin and molding a sealing resin, and (c) an upper die and a lower die A process of opening the mold and separating the lower mold and the electronic component is shown. 本発明に係る電子部品の製造方法の実施例４において工程の一部を示す概略断面図であり、（ａ）は実装済基板を上型に一時的に固定し、下型のキャビティ部に板状部材を設置した後に液状樹脂を注入する工程、（ｂ）は上型と下型とを型締めして液状樹脂を硬化させて封止樹脂を成形する工程、（ｃ）は上型と下型とを型開きして下型と電子部品とを分離する工程を示す。It is a schematic sectional drawing which shows a part of process in Example 4 of the manufacturing method of the electronic component which concerns on this invention, (a) fixes the mounted board | substrate temporarily to an upper mold | type, and plate | boards to the cavity part of a lower mold | type A step of injecting a liquid resin after installing the shaped member, (b) a step of clamping the upper die and the lower die to cure the liquid resin and molding a sealing resin, and (c) an upper die and a lower die A process of opening the mold and separating the lower mold and the electronic component is shown. 図６に続く工程の一部を示す概略断面図であり、（ａ）は封止済基板を個片化する工程、（ｂ）は実施例４の工程で製造された電子部品を示す。FIG. 7 is a schematic cross-sectional view showing a part of the process following FIG. 6, where (a) shows a process of separating a sealed substrate into pieces, and (b) shows an electronic component manufactured in the process of Example 4.

本発明の実施例１を、添付図面に基づいて詳細に説明する。本出願書類におけるいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。   Embodiment 1 of the present invention will be described in detail with reference to the accompanying drawings. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding.

図１は、本実施例に係る電子部品１の構造を示す。図１に示される電子部品１は、少なくとも、配線基板２と、電子素子３と、封止樹脂４と、電磁シールド板又は放熱板の少なくとも一方として機能する板状部材５と、配線基板２と板状部材５とを電気的に接続させる導電性部材６とを有する。   FIG. 1 shows the structure of an electronic component 1 according to this embodiment. An electronic component 1 shown in FIG. 1 includes at least a wiring board 2, an electronic element 3, a sealing resin 4, a plate-like member 5 functioning as at least one of an electromagnetic shield plate or a heat sink, a wiring board 2, It has the electroconductive member 6 which connects the plate-shaped member 5 electrically.

配線基板２は、複数の絶縁層と配線層とを積層してなる、矩形状の平面形状を有する積層体である。配線基板２の両面と絶縁層間とには回路配線が形成され、それらの回路配線はビアホール導体等を経由して相互に電気的に接続される。配線基板２としては、例えば、ガラスエポキシ基板をベース基板として、それぞれ銅からなる配線、層間配線、ビアホール導体を有するプリント基板が挙げられる。配線基板２の主面は、電源系パターンと信号系及び電源系のボンディングパッド７とを有する。電源系パターンには、＋電源パターン（図示なし）とグラウンド配線パターン８とが含まれる。＋電源パターンとグラウンド配線パターン８とボンディングパッド７とは、配線基板２内部のビアホール導体等を経由して、配線基板２の下面又は側面に形成される外部接続導体（図示せず）に電気的に接続される。   The wiring board 2 is a laminated body having a rectangular planar shape formed by laminating a plurality of insulating layers and wiring layers. Circuit wiring is formed between both surfaces of the wiring board 2 and the insulating layer, and these circuit wirings are electrically connected to each other via via-hole conductors. Examples of the wiring board 2 include a printed board having a glass epoxy board as a base board and wiring each made of copper, an interlayer wiring, and a via-hole conductor. The main surface of the wiring board 2 has a power supply system pattern and signal and power supply system bonding pads 7. The power supply system pattern includes a + power supply pattern (not shown) and a ground wiring pattern 8. The power supply pattern, the ground wiring pattern 8 and the bonding pad 7 are electrically connected to an external connection conductor (not shown) formed on the lower surface or side surface of the wiring board 2 via a via-hole conductor or the like inside the wiring board 2. Connected to.

IC（Integrated Circuit）等の半導体素子からなる電子素子３が、配線基板２の主面９に、例えばダイボンド材や導電性樹脂を使用して装着される。電子素子３の上面には、複数の接続電極１０が形成される。接続電極１０は、ループ形状をなす金属細線（ワイヤ）１１によってボンディングパッド７に電気的に接続される。金属細線１１は、例えばＡｕやＡｌやＣｕ等からなり、その直径は通常１８μｍ〜３５μｍである。   An electronic element 3 made of a semiconductor element such as an IC (Integrated Circuit) is mounted on the main surface 9 of the wiring board 2 using, for example, a die bond material or a conductive resin. A plurality of connection electrodes 10 are formed on the upper surface of the electronic element 3. The connection electrode 10 is electrically connected to the bonding pad 7 by a thin metal wire (wire) 11 having a loop shape. The fine metal wire 11 is made of, for example, Au, Al, Cu or the like, and its diameter is usually 18 μm to 35 μm.

配線基板２の一方の面（主面；半導体素子を実装する面）には、導電性部材６が形成される。導電性部材６は、配線基板２のグラウンド配線パターン８と板状部材５とを電気的に接続されるために使用される。導電性部材６の材料としては、例えば、金、黄銅、銅、アルミニウム等を使用する。図１は、配線基板２の主面におけるグラウンド配線パターン８に、クリーム半田１２を使用して導電性部材６を接合することによって、配線基板２に導電性部材６を垂直方向に接続する例を示す。導電性部材６は、配線基板２の一方の面から突出する柱状、螺旋状、アーチ状、ループ状、リボン状、球体状、帯状、箔状、壁状等の形状を有する。   A conductive member 6 is formed on one surface (main surface; a surface on which a semiconductor element is mounted) of the wiring board 2. The conductive member 6 is used to electrically connect the ground wiring pattern 8 of the wiring board 2 and the plate-like member 5. As a material of the conductive member 6, for example, gold, brass, copper, aluminum or the like is used. FIG. 1 shows an example in which the conductive member 6 is connected to the wiring board 2 in the vertical direction by bonding the conductive member 6 to the ground wiring pattern 8 on the main surface of the wiring board 2 using the cream solder 12. Show. The conductive member 6 has a columnar shape, a spiral shape, an arch shape, a loop shape, a ribbon shape, a spherical shape, a strip shape, a foil shape, a wall shape, or the like protruding from one surface of the wiring board 2.

導電性部材６とグラウンド配線パターン８とを電気的に接続するクリーム半田１２として、後述する成形型１４による成形温度（硬化温度）よりも高い融点を有する材料を採用することが好ましい。クリーム半田は、例えば、Ｓｎ、Ａｇ、Ｃｕ等を含み、導電性部材６とグラウンド配線パターン８の接続面又は接続面の周囲に形成される。   As the cream solder 12 that electrically connects the conductive member 6 and the ground wiring pattern 8, it is preferable to employ a material having a melting point higher than a molding temperature (curing temperature) by a molding die 14 described later. The cream solder includes, for example, Sn, Ag, Cu, and the like, and is formed on the connection surface of the conductive member 6 and the ground wiring pattern 8 or around the connection surface.

電磁シールド板又は放熱板の少なくとも一方として機能する板状部材５は、黄銅、銅，アルミニウム、半田、導電性樹脂等の導電性材料からなり、長方形又は正方形の平面形状を有する。板状部材５は、配線基板２の主面９に対して向かい合うように配置される。板状部材５として、板状の絶縁性材料の少なくとも一方の面に、無電解めっき、蒸着、スクリーン印刷等の方法によって、黄銅、銅、アルミニウム、半田、導通性樹脂等が膜状に形成された部材を使用してもよい。導電性部材６としては、壁状の形状を有する金属板を使用できる。金属板としては、例えば、Ｃｕ、Ａｌ、亜鉛めっき鋼板、黄銅等からなる薄板を使用できる。板状部材５の形状を、板に壁部が設けられた箱状にしてもよい。この場合には、図１において、板状部材５の左右の両端又は中間部から壁部が下方に伸び、壁部の下端とグラウンド配線パターン８とが電気的に接続されることが好ましい。   The plate-like member 5 that functions as at least one of an electromagnetic shield plate or a heat radiating plate is made of a conductive material such as brass, copper, aluminum, solder, or conductive resin, and has a rectangular or square planar shape. The plate-like member 5 is disposed so as to face the main surface 9 of the wiring board 2. As the plate member 5, brass, copper, aluminum, solder, conductive resin or the like is formed in a film shape on at least one surface of the plate-like insulating material by a method such as electroless plating, vapor deposition, or screen printing. Other members may be used. As the conductive member 6, a metal plate having a wall shape can be used. As the metal plate, for example, a thin plate made of Cu, Al, galvanized steel plate, brass or the like can be used. The shape of the plate-like member 5 may be a box shape in which a wall is provided on the plate. In this case, in FIG. 1, it is preferable that the wall portion extends downward from the left and right ends or the middle portion of the plate-like member 5 and the lower end of the wall portion and the ground wiring pattern 8 are electrically connected.

封止樹脂４は、電子素子３、接続電極１０、金属細線１１、＋電源パターン（図示なし）、グラウンド配線パターン８、ボンディングパッド７、配線基板２の主面９及び導電性部材６を封止するための樹脂として機能する。封止樹脂４としては、例えば、エポキシ樹脂やシリコーン樹脂等の熱硬化性樹脂や、熱可塑性樹脂を使用する。   The sealing resin 4 seals the electronic element 3, the connection electrode 10, the fine metal wire 11, the + power supply pattern (not shown), the ground wiring pattern 8, the bonding pad 7, the main surface 9 of the wiring substrate 2, and the conductive member 6. To function as a resin. As the sealing resin 4, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin is used.

本実施例に係る電子部品１の製造方法を説明する。電子部品１は、図２（ａ）に示す少なくとも電子素子３と導電性部材６とが装着された実装済基板１３を樹脂封止することによって製造される。図２（ｂ）に示す樹脂封止用の成形型１４は、上型１５と下型１６とを有する。上型１５は、実装済基板１３を固定する固定具（図示せず）又は吸着機構（図示せず）の少なくとも一方を有する。下型１６は、キャビティ１７を有する。キャビティ１７内の底面の隅には、キャビティ１７に対して板状部材５を位置合わせするための突起１８を設ける。   A method for manufacturing the electronic component 1 according to this embodiment will be described. The electronic component 1 is manufactured by resin-sealing a mounted substrate 13 on which at least the electronic element 3 and the conductive member 6 shown in FIG. A molding die 14 for resin sealing shown in FIG. 2B has an upper die 15 and a lower die 16. The upper mold 15 has at least one of a fixture (not shown) or a suction mechanism (not shown) that fixes the mounted substrate 13. The lower mold 16 has a cavity 17. Protrusions 18 for aligning the plate-like member 5 with respect to the cavity 17 are provided at the corners of the bottom surface in the cavity 17.

まず、図２（ａ）に示すように、次の２つの部材（中間体）を準備する。第１の部材は実装済基板１３である。実装済基板１３には少なくとも電子素子３と導電性部材６とが装着される。電子素子３の接続電極１０と配線基板２の電源系パターン及びボンディングパッド７とが、金属細線１１によって電気的に接続される。導電性部材６は、配線基板２のグラウンド配線パターン８の少なくとも一部にクリーム半田１２によって電気的に接続される。   First, as shown in FIG. 2A, the following two members (intermediates) are prepared. The first member is a mounted substrate 13. At least the electronic element 3 and the conductive member 6 are mounted on the mounted substrate 13. The connection electrode 10 of the electronic element 3 and the power supply system pattern and the bonding pad 7 of the wiring board 2 are electrically connected by the thin metal wire 11. The conductive member 6 is electrically connected to at least a part of the ground wiring pattern 8 of the wiring board 2 by cream solder 12.

第２の部材は、板状部材５である。板状部材５の隅には、位置合わせ用の切り欠き１９が予め形成される。板状部材５において導電性部材６が接合される面（接合面）には、予めクリーム半田２０が塗布される。クリーム半田２０としては、樹脂成形における硬化温度（例えば、約１８０℃）よりも低い融点を有する材料、言い換えれば、低融点のクリーム半田２０を採用することが好ましい。このことによって、クリーム半田２０は硬化温度において溶融している状態にある。したがって、クリーム半田２０が塗布された板状部材５は、予め１８０℃程度に加熱された成形型１４に設置することによって導電性部材６を接合することができる状態になる。   The second member is a plate-like member 5. A notch 19 for alignment is formed in advance at the corner of the plate-like member 5. Cream solder 20 is applied in advance to the surface (joint surface) to which the conductive member 6 is joined in the plate-like member 5. As the cream solder 20, it is preferable to employ a material having a melting point lower than the curing temperature (for example, about 180 ° C.) in resin molding, in other words, the low melting point cream solder 20. As a result, the cream solder 20 is melted at the curing temperature. Therefore, the plate-like member 5 to which the cream solder 20 is applied is in a state where the conductive member 6 can be joined by being placed in the molding die 14 heated to about 180 ° C. in advance.

次に、図２（ｂ）に示すように、上型１５における所定の位置に、固定具や吸着機構によって実装済基板１３を一時的に固定する。所定の位置とは、平面視して実装済基板１３の主面９（配線基板２の主面９）内にキャビティ１７が含まれる位置である。   Next, as shown in FIG. 2B, the mounted substrate 13 is temporarily fixed at a predetermined position in the upper mold 15 by a fixture or a suction mechanism. The predetermined position is a position where the cavity 17 is included in the main surface 9 of the mounted substrate 13 (main surface 9 of the wiring board 2) in plan view.

次に、図２（ｃ）に示すように、キャビティ１７を構成する下型１６の内底面（以下「キャビティ１７の内底面」という。）において、キャビティ１７の突起１８と板状部材５の切り欠き１９（図２（ａ）参照）とによって、キャビティ１７と板状部材５とを位置合わせして、板状部材５を配置する。   Next, as shown in FIG. 2 (c), on the inner bottom surface of the lower mold 16 constituting the cavity 17 (hereinafter referred to as “inner bottom surface of the cavity 17”), the protrusion 18 of the cavity 17 and the plate-like member 5 are cut. The cavity 17 and the plate member 5 are aligned by the notch 19 (see FIG. 2A), and the plate member 5 is arranged.

次に、図３（ａ）に示すように、キャビティ１７（図３（ｃ）参照）の内底面に配置した板状部材５を覆うようにして、常温において液状である絶縁性の液状樹脂２１（流動性樹脂）を注入する。液状樹脂２１として、例えば熱硬化性樹脂を使用する。   Next, as shown in FIG. 3A, an insulating liquid resin 21 that is liquid at room temperature so as to cover the plate-like member 5 disposed on the inner bottom surface of the cavity 17 (see FIG. 3C). Inject (flowable resin). As the liquid resin 21, for example, a thermosetting resin is used.

次に、図３（ａ）に示された状態から図３（ｂ）に示されるように、上型１５と下型１６とを型締めする。このことによって、最初に、実装済基板１３の主面９に装着された導電性部材６を、キャビティ１７に注入された液状樹脂２１に侵漬する（漬ける）。次に、実装済基板１３の主面２０における電子素子３，ボンディングパッド７、＋電源パターン（図示なし）、グラウンド配線パターン８、金属細線１１、及び、実装済基板１３の主面を、液状樹脂２１に浸漬する（漬ける）。最後に、導電性部材６を板状部材５に接触させる。型締めした状態を一定時間（少なくとも２０秒以上）保つ。この間、液状樹脂２１を加圧しながら下型１６に設けられたヒータ（図示なし）を使用して、所定の硬化温度によって液状樹脂２１を加熱する。このことにより、図３（ａ）、（ｂ）に示すように、液状樹脂２１を硬化させて硬化樹脂からなる封止樹脂４を成形する。   Next, as shown in FIG. 3B from the state shown in FIG. 3A, the upper mold 15 and the lower mold 16 are clamped. As a result, first, the conductive member 6 mounted on the main surface 9 of the mounted substrate 13 is immersed (immersed) in the liquid resin 21 injected into the cavity 17. Next, the electronic element 3 on the main surface 20 of the mounted substrate 13, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the fine metal wires 11, and the main surface of the mounted substrate 13 are made of liquid resin. Immerse in 21 (soak). Finally, the conductive member 6 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds). During this time, the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while pressurizing the liquid resin 21. As a result, as shown in FIGS. 3A and 3B, the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.

次に、図３（ｃ）に示すように、上型１５と下型１６とを型開きする。このことによって下型１６と成形された封止樹脂４を有する封止済基板２２とを分離する。封止済基板２２が冷却される過程において、溶融したクリーム半田２０が硬化する。ここまでの工程によって、封止済基板２２からなる電子部品１を完成させる。   Next, as shown in FIG. 3C, the upper mold 15 and the lower mold 16 are opened. Thus, the lower mold 16 and the sealed substrate 22 having the molded sealing resin 4 are separated. In the process in which the sealed substrate 22 is cooled, the melted cream solder 20 is cured. The electronic component 1 composed of the sealed substrate 22 is completed through the steps so far.

本実施例によれば、導電性部材６が接合する板状部材５の接合面にクリーム半田２０を塗布する。下型１６に設けられたヒータ（図示なし）を使用して、液状樹脂２１を加熱させて硬化させる工程において、クリーム半田２０を加熱してクリーム半田２０を溶融させる。このことにより、溶融したクリーム半田２０が導電性部材６の端面（図では下面）とその端面の周囲の側面とに存在する状態において、板状部材５に導電性部材６を確実に接触させる。板状部材５と導電性部材６とが接触した状態において、液状樹脂２１を硬化させる。電子部品１が冷却される過程において溶融したクリーム半田２０が硬化する。したがって、導電性部材６と既に硬化した状態にあるクリーム半田１２とクリーム半田２０が硬化した半田とによって板状部材５とグラウンド配線パターン８とを確実に電気的に接続することができる。言い換えれば、液状樹脂２１が硬化する際の圧縮応力によって押圧されてたわんだ（変形した）導電性部材６が板状部材５に接触して、電子部品１が冷却される過程において溶融したクリーム半田２０を硬化させる。したがって、板状部材５とグラウンド配線パターン８とをいっそう確実に電気的に接続することができる。   According to the present embodiment, the cream solder 20 is applied to the joining surface of the plate-like member 5 to which the conductive member 6 is joined. In the process of heating and curing the liquid resin 21 using a heater (not shown) provided in the lower mold 16, the cream solder 20 is heated to melt the cream solder 20. This ensures that the conductive member 6 is brought into contact with the plate-like member 5 in a state where the melted cream solder 20 exists on the end surface (lower surface in the drawing) of the conductive member 6 and the side surface around the end surface. In a state where the plate-like member 5 and the conductive member 6 are in contact, the liquid resin 21 is cured. In the process in which the electronic component 1 is cooled, the melted cream solder 20 is cured. Therefore, the plate-like member 5 and the ground wiring pattern 8 can be reliably electrically connected by the conductive member 6 and the solder cream 12 that has already been cured and the solder that the cream solder 20 has cured. In other words, the cream solder melted in the process in which the conductive member 6 bent (deformed) pressed by the compressive stress when the liquid resin 21 is cured contacts the plate-like member 5 and the electronic component 1 is cooled. 20 is cured. Therefore, the plate-like member 5 and the ground wiring pattern 8 can be more reliably electrically connected.

クリーム半田１２は、硬化温度よりも高い融点を有する。液状樹脂２１を加熱させて硬化させる工程以降の工程においてクリーム半田１２は硬化した状態を維持するので、導電性部材６が固定された状態が維持される。したがって、導電性部材６がずれることが防止されるので、板状部材５とグラウンド配線パターン８とをいっそう確実に電気的に接続することができる。   The cream solder 12 has a melting point higher than the curing temperature. Since the cream solder 12 maintains the cured state in the steps after the step of heating and curing the liquid resin 21, the state where the conductive member 6 is fixed is maintained. Therefore, since the conductive member 6 is prevented from being displaced, the plate-like member 5 and the ground wiring pattern 8 can be electrically connected more reliably.

本実施例によれば、樹脂封止する工程において、板状部材５とグラウンド配線パターン８との電気的な接続と、板状部材５の固定とを並行して行う。したがって、電子部品１を製造する際の生産性が向上する。特に、板状部材５の形状を箱状にした場合には、電磁波を良好に遮蔽する特性と良好な放熱性とを有する電子部品１が得られる。本実施例において、導電性部材６と板状部材５とは、それぞれ導電性を有する。この場合には、板状部材５は、電磁遮蔽機能を有する機能部材である。   According to the present embodiment, in the step of resin sealing, the electrical connection between the plate member 5 and the ground wiring pattern 8 and the fixing of the plate member 5 are performed in parallel. Therefore, productivity when manufacturing the electronic component 1 is improved. In particular, when the shape of the plate-like member 5 is a box shape, the electronic component 1 having a property of shielding electromagnetic waves well and a good heat dissipation property can be obtained. In the present embodiment, the conductive member 6 and the plate-like member 5 each have conductivity. In this case, the plate-like member 5 is a functional member having an electromagnetic shielding function.

本発明の実施例２を、図４に基づいて詳細に説明する。本実施例における電子部品１の製造方法は、実施例１と異なる導電性部材２３を使用して電子部品１を製造する方法である。   A second embodiment of the present invention will be described in detail with reference to FIG. The manufacturing method of the electronic component 1 in the present embodiment is a method of manufacturing the electronic component 1 using the conductive member 23 different from the first embodiment.

図４（ａ）に示すように、導電性部材２３は、配線基板２のグランド配線パターン上において、周知のワイヤボンディングにより形成された垂直方向に形成された複数のループ状の金属細線によって構成される。これらの金属細線は、例えばＡｕやＡｌ等の金属材料からなり、接続電極１０とボンディングパッド７を接続する金属細線１１の径と同等又は同等以上の太さを有することが好ましい。導電性部材２３の太さは、例えば１００μｍ〜５００μｍに設定される。導電性部材２３は、電子素子３を囲うようにして形成される。板状部材５には、導電性部材２３が接合される箇所に、クリーム半田２０が予め塗布される。本実施例は、これらの２つの部材（中間体）を例に挙げて説明する。   As shown in FIG. 4A, the conductive member 23 is constituted by a plurality of loop-shaped metal thin wires formed in the vertical direction formed by well-known wire bonding on the ground wiring pattern of the wiring board 2. The These fine metal wires are made of, for example, a metal material such as Au or Al, and preferably have a thickness equal to or greater than the diameter of the fine metal wires 11 that connect the connection electrodes 10 and the bonding pads 7. The thickness of the conductive member 23 is set to 100 μm to 500 μm, for example. The conductive member 23 is formed so as to surround the electronic element 3. Cream solder 20 is applied to the plate-like member 5 in advance at a location where the conductive member 23 is joined. In the present embodiment, these two members (intermediates) will be described as examples.

まず、図４（ａ）に示すように、次の２つの部材（中間体）を準備する。第１の部材は、配線基板２に導電性部材２３が形成された、実装済基板２４である。上型１５における所定の位置に実装済基板２４を配置する。所定の位置とは、平面視して実装済基板２４の主面内にキャビティ１７（図４（ｃ）参照）が含まれる位置である。第２の部材は、板状部材５である。下型１６のキャビティ１７の内底面に板状部材５を配置する。下型１６のキャビティ１７内に、板状部材５を覆うように液状樹脂２１を注入する。   First, as shown in FIG. 4A, the following two members (intermediates) are prepared. The first member is a mounted substrate 24 in which a conductive member 23 is formed on the wiring substrate 2. The mounted substrate 24 is disposed at a predetermined position in the upper mold 15. The predetermined position is a position where the cavity 17 (see FIG. 4C) is included in the main surface of the mounted substrate 24 in plan view. The second member is a plate-like member 5. The plate member 5 is disposed on the inner bottom surface of the cavity 17 of the lower mold 16. A liquid resin 21 is injected into the cavity 17 of the lower mold 16 so as to cover the plate-like member 5.

次に、図４（ｂ）に示すように、上型１５と下型１６とを型締めする。このことによって、最初に、実装済基板２４の主面に装着された導電性部材２３をキャビティ１７に注入された液状樹脂２１に侵漬する（漬ける）。次に、実装済基板２４の主面２５における電子素子３、ボンディングパッド７、＋電源パターン（図示なし）、グラウンド配線パターン８、金属細線１１、及び、実装済基板２４の主面２５を液状樹脂２１に浸漬する（漬ける）。最後に導電性部材２３を板状部材５に接触させる。型締めした状態を一定時間（少なくとも２０秒以上）保つ。この間、液状樹脂２１を加圧しながら、下型１６に設けられたヒータ（図示なし）を使用して所定の硬化温度によって液状樹脂２１を加熱する。このことにより、図４（ａ）、（ｂ）に示すように、液状樹脂２１を硬化させて硬化樹脂からなる封止樹脂４を成形する。   Next, as shown in FIG. 4B, the upper mold 15 and the lower mold 16 are clamped. As a result, first, the conductive member 23 mounted on the main surface of the mounted substrate 24 is immersed (immersed) in the liquid resin 21 injected into the cavity 17. Next, the electronic device 3, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the metal thin wire 11, and the main surface 25 of the mounted substrate 24 on the main surface 25 of the mounted substrate 24 are liquid resin. Immerse in 21 (soak). Finally, the conductive member 23 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds). During this time, the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while the liquid resin 21 is pressurized. As a result, as shown in FIGS. 4A and 4B, the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.

次に、図４（ｃ）に示すように、上型１５と下型１６とを型開きする。このことによって、下型１６と成形された封止樹脂４を有する封止済基板２６とを分離する。封止済基板２６が冷却される過程において、溶融したクリーム半田２０が硬化する。ここまでの工程によって、封止済基板２６からなる電子部品１を完成させる。   Next, as shown in FIG. 4C, the upper mold 15 and the lower mold 16 are opened. As a result, the lower mold 16 and the sealed substrate 26 having the molded sealing resin 4 are separated. In the process of cooling the sealed substrate 26, the melted cream solder 20 is cured. The electronic component 1 composed of the sealed substrate 26 is completed through the steps so far.

本実施例によれば、実施例１と同様の効果が得られる。加えて、ワイヤボンディングによって導電性部材２３を形成する工程において、図１に示された接続電極１０とボンディングパッド７とを接続するために使用される既存のワイヤボンディング装置を使用することができる。したがって、既存の製造装置を活用することによって、電磁波を良好に遮蔽する特性と良好な放熱性とを有する電子部品１を製造できる。   According to the present embodiment, the same effect as in the first embodiment can be obtained. In addition, in the step of forming the conductive member 23 by wire bonding, an existing wire bonding apparatus used for connecting the connection electrode 10 and the bonding pad 7 shown in FIG. 1 can be used. Therefore, the electronic component 1 which has the characteristic which shields electromagnetic waves favorably, and favorable heat dissipation can be manufactured by utilizing the existing manufacturing apparatus.

本発明の実施例３を、図５に基づいて詳細に説明する。本実施例における電子部品１の製造方法は、実施例１と実施例２とは異なる導電性部材２７を使用して電子部品１を製造する方法である。   A third embodiment of the present invention will be described in detail with reference to FIG. The manufacturing method of the electronic component 1 in the present embodiment is a method of manufacturing the electronic component 1 using the conductive member 27 different from the first embodiment and the second embodiment.

図５（ａ）に示すように、導電性部材２７は、配線基板２のグランド配線パターンの上に、電子素子３を完全に囲うようにして配置されて、クリーム半田１２によって固定された枠状の部材である。導電性部材２７は、実装済基板２８において複数の電子素子３の一部（１個又は複数個。図では右側に示される。）を完全に囲う。   As shown in FIG. 5A, the conductive member 27 is arranged on the ground wiring pattern of the wiring board 2 so as to completely surround the electronic element 3 and is fixed by the cream solder 12. It is a member. The conductive member 27 completely surrounds a part (one or a plurality, shown on the right side in the drawing) of the plurality of electronic elements 3 on the mounted substrate 28.

図５（ａ）に示すように、次の２つの部材（中間体）を準備する。第１の部材は、配線基板２に導電性部材２７が形成された、実装済基板２８である。図５（ａ）に示す導電性部材２７は、両端に折り曲げられた部分を有する角括弧（［）状の断面形状を有する。実装済基板２８には複数の電子素子３が装着される。上型１５における所定の位置に実装済基板２８を配置する。所定の位置とは、平面視して実装済基板２８の主面２９内にキャビティ１７（図５（ｃ）参照）が含まれる位置である。   As shown in FIG. 5A, the following two members (intermediates) are prepared. The first member is a mounted substrate 28 in which a conductive member 27 is formed on the wiring substrate 2. The conductive member 27 shown in FIG. 5A has a square bracket ([) -like cross-sectional shape having portions bent at both ends. A plurality of electronic elements 3 are mounted on the mounted substrate 28. The mounted substrate 28 is disposed at a predetermined position in the upper mold 15. The predetermined position is a position where the cavity 17 (see FIG. 5C) is included in the main surface 29 of the mounted substrate 28 in plan view.

第２の部材は、板状部材５である。例えば、板状部材５の相対向する隅に、位置合わせ用の切り欠き１９（図２（ａ）参照）が予め形成される。キャビティ１７の内底面は、板状部材５の位置合わせ用の切り欠き１９に対応する位置に突起１８を有する。   The second member is a plate-like member 5. For example, a notch 19 for alignment (see FIG. 2A) is formed in advance at opposite corners of the plate-like member 5. The inner bottom surface of the cavity 17 has a protrusion 18 at a position corresponding to the notch 19 for alignment of the plate-like member 5.

まず、下型１６のキャビティ１７の内底面に板状部材５を配置する。次に、下型１６のキャビティ１７内に、板状部材５を覆うように液状樹脂２１を注入する。   First, the plate-like member 5 is disposed on the inner bottom surface of the cavity 17 of the lower mold 16. Next, the liquid resin 21 is injected into the cavity 17 of the lower mold 16 so as to cover the plate-like member 5.

次に、図５（ｂ）に示すように、上型１５と下型１６とを型締めする。このことによって、最初に、実装済基板２８の主面２９に装着された導電性部材２７を、キャビティ１７に注入された液状樹脂２１に侵漬する（漬ける）。次に、実装済基板２８の主面２９における電子素子３、ボンディングパッド７、＋電源パターン（図示なし）、グラウンド配線パターン８、金属細線１１、及び、実装済基板２８の主面２９を液状樹脂２１に浸漬する（漬ける）。最後に、導電性部材２７を板状部材５に接触させる。型締めした状態を一定時間（少なくとも２０秒以上）保つ。この間、液状樹脂２１を加圧しながら、下型１６に設けられたヒータ（図示なし）を使用して、所定の硬化温度によって液状樹脂２１を加熱する。このことにより、図５（ａ）、（ｂ）に示すように、液状樹脂２１を硬化させて硬化樹脂からなる封止樹脂４を成形する。   Next, as shown in FIG. 5B, the upper mold 15 and the lower mold 16 are clamped. As a result, first, the conductive member 27 mounted on the main surface 29 of the mounted substrate 28 is immersed (immersed) in the liquid resin 21 injected into the cavity 17. Next, the electronic device 3, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the metal thin wire 11, and the main surface 29 of the mounted substrate 28 on the main surface 29 of the mounted substrate 28 are liquid resin. Immerse in 21 (soak). Finally, the conductive member 27 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds). During this time, the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while pressurizing the liquid resin 21. Thus, as shown in FIGS. 5A and 5B, the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.

次に、図５（ｃ）に示すように、上型１５と下型１６とを型開きする。このことによって、下型１６と成形された封止樹脂４を有する封止済基板２２とを分離する。封止済基板２２が冷却される過程において、溶融したクリーム半田２０が硬化する。ここまでの工程によって、封止済基板２２からなる電子部品１を完成させる。   Next, as shown in FIG. 5C, the upper mold 15 and the lower mold 16 are opened. Thereby, the lower mold 16 and the sealed substrate 22 having the molded sealing resin 4 are separated. In the process in which the sealed substrate 22 is cooled, the melted cream solder 20 is cured. The electronic component 1 composed of the sealed substrate 22 is completed through the steps so far.

本実施例によれば、導電性部材６が電子素子３を部分的に取り囲むようにして装着される。樹脂封止することによって、複数の電子部品の一部が部分的に遮蔽された電子部品１を製造することができる。この電子部品１は、複数の電子素子３を有する実装済基板１３を製造する際に採用される製造方法である。この製造方法によれば、例えば、電磁的影響を受けやすい、電磁的影響を与えやすい、熱を大量に発生する等の特性を有する特定の電子素子３（１個又は複数個）を対象にして遮蔽する又は放熱することができる。電磁的影響を与えやすい電子素子３及び熱を大量に発生する電子素子３の例としては、大電流をスイッチングする電力制御用の素子等が挙げられる。電磁的影響を受けやすい電子素子３の例としては、高周波信号を取り扱う回路に使用される素子が挙げられる。複数の電子素子３を含む回路モジュールを、導電性部材６が部分的に取り囲むようにしてもよい。   According to this embodiment, the conductive member 6 is mounted so as to partially surround the electronic element 3. By encapsulating the resin, it is possible to manufacture the electronic component 1 in which some of the plurality of electronic components are partially shielded. This electronic component 1 is a manufacturing method employed when manufacturing a mounted substrate 13 having a plurality of electronic elements 3. According to this manufacturing method, for example, specific electronic elements 3 (one or more) having characteristics such as being susceptible to electromagnetic influence, being easily affected by electromagnetic influence, and generating a large amount of heat are targeted. Can be shielded or dissipated. Examples of the electronic element 3 that is easily affected by electromagnetic waves and the electronic element 3 that generates a large amount of heat include a power control element that switches a large current. As an example of the electronic element 3 that is susceptible to electromagnetic influence, an element used in a circuit that handles a high-frequency signal can be cited. A conductive module 6 may partially surround a circuit module including a plurality of electronic elements 3.

本発明の実施例４を、図６、図７に基づいて詳細に説明する。本実施例における電子部品１の製造方法は、実施例１、２及び３と異なる導電性部材３０を使用して電子部品１を製造する方法である。本実施例によれば、配線基板２に少なくとも２つ以上の電子素子３を装着し、樹脂封止された封止済基板２２を個片化することによって複数の電子部品１を製造することができる。   A fourth embodiment of the present invention will be described in detail with reference to FIGS. The manufacturing method of the electronic component 1 in the present embodiment is a method of manufacturing the electronic component 1 using the conductive member 30 different from the first, second, and third embodiments. According to the present embodiment, it is possible to manufacture a plurality of electronic components 1 by mounting at least two or more electronic elements 3 on the wiring board 2 and separating the sealed substrate 22 sealed with resin. it can.

図６（ａ）に示すように、導電性部材３０は、電子素子３を完全に囲うようにして配線基板２のグラウンド配線パターン８上に配置されて、クリーム半田１２によって固定された枠状の部材である。複数の導電性部材３０は、実装済基板３１において複数の電子素子３をそれぞれに囲う。   As shown in FIG. 6A, the conductive member 30 is disposed on the ground wiring pattern 8 of the wiring board 2 so as to completely surround the electronic element 3 and is fixed to the cream solder 12. It is a member. The plurality of conductive members 30 surround each of the plurality of electronic elements 3 on the mounted substrate 31.

まず、図６（ａ）に示すように、次の２つの部材（中間体）を準備する。第１の部材は、配線基板２に導電性部材３０が形成された、実装済基板３１である。実装済基板３１には複数の電子素子３が装着される。第２の部材は、板状部材５である。   First, as shown in FIG. 6A, the following two members (intermediates) are prepared. The first member is a mounted substrate 31 in which the conductive member 30 is formed on the wiring substrate 2. A plurality of electronic elements 3 are mounted on the mounted substrate 31. The second member is a plate-like member 5.

まず、上型１５における所定の位置に実装済基板３１を配置する。所定の位置とは、平面視して実装済基板３１の主面内にキャビティ１７（図６（ｃ）参照）が含まれる位置である。次に、下型１６のキャビティ１７の内底面に板状部材５を配置する。また下型１６のキャビティ１７内に、板状部材５を覆うように液状樹脂２１を注入する。 First, the mounted substrate 31 is arranged at a predetermined position in the upper mold 15. The predetermined position is a position where the cavity 17 (see FIG. 6C) is included in the main surface of the mounted substrate 31 in plan view. Next, the plate-like member 5 is disposed on the inner bottom surface of the cavity 17 of the lower mold 16. A liquid resin 21 is injected into the cavity 17 of the lower mold 16 so as to cover the plate-like member 5.

次に、図６（ｂ）に示すように、上型１５と下型１６とを型締めする。このことによって、最初に、実装済基板３１の主面に装着された導電性部材３０を、キャビティ１７に注入された液状樹脂２１に侵漬する（漬ける）。次に、実装済基板３１の主面における電子素子３、ボンディングパッド７、＋電源パターン（図示なし）、グラウンド配線パターン８、金属細線１１、及び、実装済基板３１の主面を液状樹脂２１に浸漬する（漬ける）。最後に導電性部材６を板状部材５に接触させる。型締めした状態を一定時間（少なくとも２０秒以上）保つ。この間、液状樹脂２１を加圧しながら、下型１６に設けられたヒータ（図示なし）を使用して所定の硬化温度によって液状樹脂２１を加熱する。このことにより、図６（ａ）、（ｂ）に示すように、液状樹脂２１を硬化させて硬化樹脂からなる封止樹脂４を成形する。   Next, as shown in FIG. 6B, the upper mold 15 and the lower mold 16 are clamped. As a result, first, the conductive member 30 mounted on the main surface of the mounted substrate 31 is immersed (immersed) in the liquid resin 21 injected into the cavity 17. Next, the electronic device 3, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the metal thin wire 11, and the main surface of the mounted substrate 31 on the main surface of the mounted substrate 31 are made into the liquid resin 21. Immerse (soak). Finally, the conductive member 6 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds). During this time, the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while the liquid resin 21 is pressurized. As a result, as shown in FIGS. 6A and 6B, the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.

次に、図６（ｃ）に示すように、上型１５と下型１６とを型開きする。このことによって下型１６と成形された封止樹脂４を有する封止済基板２２とを分離する。封止済基板２２が冷却される過程において、溶融したクリーム半田２０が硬化する。   Next, as shown in FIG. 6C, the upper mold 15 and the lower mold 16 are opened. Thus, the lower mold 16 and the sealed substrate 22 having the molded sealing resin 4 are separated. In the process in which the sealed substrate 22 is cooled, the melted cream solder 20 is cured.

次に、図７（ａ）に示すように、封止済基板２２をステージ（図示なし）に仮固定する。回転刃３２を使用して、封止済基板２２において仮想的に設けられた格子状のダイシングライン３３において、Ｙ方向とＸ方向とに沿って封止済基板２２を切断する。これにより、封止済基板２２を分離して個片化する。図７（ｂ）に示すように、封止済基板２２が個片化されて電子部品１が完成する。   Next, as shown in FIG. 7A, the sealed substrate 22 is temporarily fixed to a stage (not shown). Using the rotary blade 32, the sealed substrate 22 is cut along the Y direction and the X direction in a lattice-shaped dicing line 33 virtually provided on the sealed substrate 22. As a result, the sealed substrate 22 is separated into individual pieces. As shown in FIG. 7B, the sealed substrate 22 is separated into pieces, and the electronic component 1 is completed.

本実施例によれば、実施例１と同様の効果が得られる。加えて、１枚の封止済基板２２から複数個の電子部品１が製造される。したがって、電子部品１を製造する際の生産性がいっそう向上する。   According to the present embodiment, the same effect as in the first embodiment can be obtained. In addition, a plurality of electronic components 1 are manufactured from one sealed substrate 22. Therefore, the productivity when manufacturing the electronic component 1 is further improved.

なお、各実施例では、樹脂封止する際に圧縮成形を例として挙げている。成形方法としてトランスファー成形や射出成形を使用してもよい。成形型１４の上型１５又は下型１６の一方又は双方にキャビティ１７を設けてもよい。   In each example, compression molding is taken as an example when resin sealing is performed. Transfer molding or injection molding may be used as the molding method. A cavity 17 may be provided in one or both of the upper mold 15 and the lower mold 16 of the mold 14.

板状部材５とキャビティ１７とを位置合わせするために、例えば、次の３つの手段を使用できる。第１に、キャビティ１７の内底面の形状を、板状部材５の平面形状と同じにしてその平面形状よりもわずかに大きくすることである。第２に、板状部材５にプレス加工などで凹部又は穴を予め形成し、その凹部又は穴に対応する形状を有するピン又は突起１８等をキャビティ１７の内底面に予め設けることである。第３に、板状部材５にプレス加工などで突出部を予め形成し、その突出部に対応する形状を有する凹部をキャビティ１７の内底面に予め設けることである。   In order to align the plate member 5 and the cavity 17, for example, the following three means can be used. First, the shape of the inner bottom surface of the cavity 17 is made the same as the planar shape of the plate-like member 5 and slightly larger than the planar shape. Secondly, a concave portion or a hole is formed in advance in the plate-like member 5 by press working or the like, and a pin or a protrusion 18 having a shape corresponding to the concave portion or the hole is provided in advance on the inner bottom surface of the cavity 17. Thirdly, a protrusion is formed in advance on the plate-like member 5 by pressing or the like, and a recess having a shape corresponding to the protrusion is provided in advance on the inner bottom surface of the cavity 17.

導電性部材６の断面形状は、線分状でもよい。導電性部材６の断面形状は、一端に折り曲げられた部分を有する「Ｌ」字状であることが好ましい。導電性部材６の断面形状は、両端に折り曲げられた部分を有する角括弧（［）等の形状であることがいっそう好ましい（図５参照）。これらの形状を有する導電性部材６（以下「折り曲げ部付導電性部材６」という。）を使用する場合には、折り曲げられた部分（以下「折り曲げ部」という。）における面がグラウンド配線パターン８に面接触する。このことによって、折り曲げ部付導電性部材６は、グラウンド配線パターン８に対して確実に電気的に接続される。   The cross-sectional shape of the conductive member 6 may be a line segment. The cross-sectional shape of the conductive member 6 is preferably an “L” shape having a portion bent at one end. The cross-sectional shape of the conductive member 6 is more preferably a shape such as square brackets ([) having portions bent at both ends (see FIG. 5). When the conductive member 6 having these shapes (hereinafter referred to as “conductive member 6 with a bent portion”) is used, the surface of the bent portion (hereinafter referred to as “bent portion”) is the ground wiring pattern 8. In surface contact. Thus, the conductive member 6 with the bent portion is reliably electrically connected to the ground wiring pattern 8.

折曲げ部付導電性部材６を含む金属板において、少なくともグラウンド配線パターン８と板状部材５とに接触する部分（例えば、両端部及びその周辺、折曲げ部におけるグラウンド配線パターン８に接触する面等）が表面処理されていることが好ましい。導電性部材６の表面処理としては、材料に応じて、半田めっき、導電性樹脂によるコーティング等を使用できる。   In a metal plate including the conductive member 6 with a bent portion, at least a portion in contact with the ground wiring pattern 8 and the plate-like member 5 (for example, a surface in contact with the ground wiring pattern 8 at both end portions and the periphery thereof and the bent portion) Etc.) is preferably surface-treated. As the surface treatment of the conductive member 6, solder plating, coating with a conductive resin, or the like can be used depending on the material.

導電性部材６において板状部材５に接続される端面は、微細な凹凸形状又は微細な鋭角形状を有する面であってもよい。これらの形状は、型締めした状態において、液状樹脂２１が硬化する際の圧縮応力によって導電性部材がたわみながら板状部材に圧接されることによって、板状部材５の表面に食い込む。これらの形状が板状部材５の表面に食い込んだ状態において樹脂封止する。これによって、板状部材５と導電性部材６との間にクリーム半田２０を介在させることなく、板状部材５と導電性部材６とを電気的に接続できる。   The end face connected to the plate-like member 5 in the conductive member 6 may be a surface having a fine uneven shape or a fine acute angle shape. These shapes bite into the surface of the plate-like member 5 when the conductive member is pressed against the plate-like member while being bent by the compressive stress when the liquid resin 21 is cured in a state where the mold is clamped. Resin sealing is performed in a state in which these shapes bite into the surface of the plate-like member 5. Thereby, the plate-like member 5 and the conductive member 6 can be electrically connected without interposing the cream solder 20 between the plate-like member 5 and the conductive member 6.

樹脂材料として、液状樹脂２１を例として挙げた。本発明において使用する樹脂材料としては、顆粒状、粉末状、タブレット状等の固形状の樹脂材料を使用してもよい。この場合には、樹脂材料を加熱して溶融させて、溶融樹脂からなる流動性樹脂を生成する。   As the resin material, the liquid resin 21 is taken as an example. As the resin material used in the present invention, solid resin materials such as granules, powders, and tablets may be used. In this case, the resin material is heated and melted to produce a fluid resin made of a molten resin.

封止樹脂４の平面形状は、長方形以外でもよい。封止樹脂４の平面形状に合わせて、板状部材５の形状は長方形以外でもよい。長方形以外の形状としては、例えば、円形、円形の外側に向かって突出した部分が設けられた形状、円形の内側方向に向かって切り欠かれた部分が設けられた形状等が挙げられる。   The planar shape of the sealing resin 4 may be other than a rectangle. According to the planar shape of the sealing resin 4, the shape of the plate-like member 5 may be other than a rectangle. Examples of the shape other than the rectangle include a circle, a shape provided with a portion protruding toward the outside of the circle, a shape provided with a portion cut out toward the inside of the circle, and the like.

電子素子３としては、メモリ、パワートランジスター、パワーダイオード、ＣＭＯＳセンサ等を使用してもよい。電子素子３には、コネクタ、電池、センサ等が含まれる。電子素子３には、抵抗器、キャパシタ、インダクタ等の受動素子、水晶発振子、フィルタ等が含まれる。加えて、電子素子３と受動素子とを組み合わせてもよい。   As the electronic element 3, a memory, a power transistor, a power diode, a CMOS sensor, or the like may be used. The electronic element 3 includes a connector, a battery, a sensor, and the like. The electronic element 3 includes passive elements such as resistors, capacitors, and inductors, crystal oscillators, filters, and the like. In addition, the electronic element 3 and the passive element may be combined.

電子素子３の電気的な接続方法として、ワイヤボンディングを例として挙げた。接続方法においてフリップチップボンディング等を使用してもよい。   As an electrical connection method of the electronic element 3, wire bonding is taken as an example. Flip chip bonding or the like may be used in the connection method.

導電性接着剤を使用して、Ｃｕ、Ａｌ等からなり適当な基部と立ち上がり部とを有する箔又は薄板を、板状部材に貼り付けてもよい。ノズルを使用して、導電性樹脂等の導電性の流動性材料を、配線基板２の上に吐出してもよい。   Using a conductive adhesive, a foil or a thin plate made of Cu, Al or the like and having an appropriate base portion and a rising portion may be attached to the plate-like member. A conductive fluid material such as a conductive resin may be discharged onto the wiring board 2 using a nozzle.

各実施例は、プリント基板を例として挙げた。配線基板２は、セラミック基板、金属ベース基板、リードフレーム等でもよい。   In each example, a printed circuit board is taken as an example. The wiring substrate 2 may be a ceramic substrate, a metal base substrate, a lead frame, or the like.

各実施例において、金属ベース基板を使用してもよい。金属ベース基板の基材である金属は、通常はグラウンド電位にして使用される。基材である金属と導電性部材６とを電気的に接続することによって、良好な電磁遮蔽性に加えていっそう良好な放熱性を有する電子部品が得られる。   In each embodiment, a metal base substrate may be used. The metal that is the base material of the metal base substrate is usually used at a ground potential. By electrically connecting the metal, which is a base material, and the conductive member 6, an electronic component having much better heat dissipation in addition to good electromagnetic shielding properties can be obtained.

各実施例において、グラウンド配線パターン８以外の部分であって電気的に中立な部分に、導電性部材６に代えて突出部材を配置してもよい。その突出部材と板状部材５とは高い熱伝導性を有することが好ましい。この場合には、板状部材５は放熱機能を有する機能部材である。   In each embodiment, a projecting member may be arranged in a portion other than the ground wiring pattern 8 and in an electrically neutral portion instead of the conductive member 6. It is preferable that the projecting member and the plate-like member 5 have high thermal conductivity. In this case, the plate-like member 5 is a functional member having a heat dissipation function.

各実施例においては、クリーム半田１２を塗布することによって、実装済基板１３のグラウンド配線パターン８部上に接合した導電性部材６を例として挙げた。クリーム半田１２に代えて半田めっきを使用してもよい。導電性部材６として、電子部品１を取り囲む枠形状のものを使用してもよい。また導電性部材６として、電子素子３を部分的に取り囲む板状（壁状）の形状を有する金属板等を使用してもよい。   In each embodiment, the conductive member 6 bonded to the ground wiring pattern 8 part of the mounted substrate 13 by applying the cream solder 12 is taken as an example. Instead of cream solder 12, solder plating may be used. A frame-shaped member surrounding the electronic component 1 may be used as the conductive member 6. Further, as the conductive member 6, a metal plate having a plate shape (wall shape) partially surrounding the electronic element 3 may be used.

今回開示された実施形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内でのすべての変更が含まれることが意図される。例えば、図２（ｂ）、（ｃ）に示すように、導電性部材６を有する配線基板２を固定具や吸着機構によって上型１５の所定の位置に一時的に取り付ける工程と、板状部材５を下型１６のキャビティ１７の内底面に配置する工程とを入れ替えてもよい。例えば、図４（ａ）に示された実装済基板２４を製造する際に、導電性部材６を装着する工程（実施例２におけるワイヤボンディングを含む）と、電子素子３（チップ）を実装してワイヤボンディングする工程とを入れ替えてもよい。   It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. For example, as shown in FIGS. 2B and 2C, a step of temporarily attaching the wiring board 2 having the conductive member 6 to a predetermined position of the upper mold 15 by a fixture or a suction mechanism, and a plate-like member The step of arranging 5 on the inner bottom surface of the cavity 17 of the lower mold 16 may be interchanged. For example, when the mounted substrate 24 shown in FIG. 4A is manufactured, the step of mounting the conductive member 6 (including wire bonding in the second embodiment) and the electronic element 3 (chip) are mounted. The step of wire bonding may be interchanged.

１ 電子部品
２ 配線基板
３ 電子素子
４ 封止樹脂
５ 板状部材（機能部材）
６ 導電性部材、折り曲げ部付導電性部材
７ ボンディングパッド
８ グラウンド配線パターン
９ 主面
１０ 接続電極
１１ 金属細線
１２ クリーム半田
１３ 実装済基板
１４ 成形型
１５ 上型（第１の型）
１６ 下型（第２の型）
１７ キャビティ
１８ 突起（第２の位置合わせ部）
１９ 切り欠き（第１の位置合わせ部）
２０ クリーム半田
２１ 液状樹脂（流動性樹脂）
２２ 封止済基板
２３ 導電性部材
２４ 実装済基板
２５ 主面
２６ 封止済基板
２７ 導電性部材
２８ 実装済基板
２９ 主面
３０ 導電性部材
３１ 実装済基板
３２ 回転刃
３３ ダイシングライン DESCRIPTION OF SYMBOLS 1 Electronic component 2 Wiring board 3 Electronic element 4 Sealing resin 5 Plate-shaped member (functional member)
6 Conductive Member, Conductive Member with Bending Part 7 Bonding Pad 8 Ground Wiring Pattern 9 Main Surface 10 Connection Electrode 11 Metal Thin Wire 12 Cream Solder 13 Mounted Substrate 14 Mold 15 Upper Mold (First Mold)
16 Lower mold (second mold)
17 Cavity 18 Protrusion (second alignment part)
19 Notch (first alignment part)
20 Cream solder 21 Liquid resin (flowable resin)
DESCRIPTION OF SYMBOLS 22 Encapsulated substrate 23 Conductive member 24 Mounted substrate 25 Main surface 26 Sealed substrate 27 Conductive member 28 Mounted substrate 29 Main surface 30 Conductive member 31 Mounted substrate 32 Rotary blade 33 Dicing line

Claims (12)

電子素子と、前記電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され前記電子素子と前記グラウンド配線パターンとを少なくとも覆う封止樹脂とを備える電子部品であって、
前記封止樹脂における前記実装済基板とは反対側の面に固着され、導電性を有する板状部材と、
前記実装済基板が有する前記グラウンド配線パターンに対して予め電気的に接続され、前記板状部材に対して電気的に接続され、導電性を有する機能部材とを備え、
前記機能部材が前記封止樹脂によって覆われていることを特徴とする電子部品。 An electronic device, a mounting pad electrically connected to a connection electrode of the electronic device, a mounted substrate having a ground wiring pattern on a main surface, and a fluid resin is formed to cure the electronic device and the electronic device An electronic component comprising at least a sealing resin that covers a ground wiring pattern,
A plate-like member that is fixed to the surface opposite to the mounted substrate in the sealing resin and has conductivity;
It is electrically connected to the ground wiring pattern of the mounted substrate in advance, electrically connected to the plate-like member, and has a conductive functional member,
The electronic component, wherein the functional member is covered with the sealing resin. 電子素子と、前記電子素子の接続電極に電気的に接続されたボンディングパッドとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され前記電子素子を少なくとも覆う封止樹脂とを備える電子部品であって、
前記封止樹脂における前記実装済基板とは反対側の面に固着され、熱伝導性を有する板状部材と、
前記実装済基板が有する前記主面に対して予め熱的に接続され、前記板状部材に対して熱的に接続され、熱伝導性を有する機能部材とを備え、
前記機能部材が前記封止樹脂によって覆われていることを特徴とする電子部品。 A mounted substrate having, on a main surface, an electronic element and a bonding pad electrically connected to a connection electrode of the electronic element; a sealing resin formed by curing a fluid resin and covering at least the electronic element; An electronic component comprising:
A plate-like member fixed to the surface opposite to the mounted substrate in the sealing resin, and having thermal conductivity;
It is thermally connected in advance to the main surface of the mounted substrate, is thermally connected to the plate-like member, and includes a functional member having thermal conductivity,
The electronic component, wherein the functional member is covered with the sealing resin. 請求項１又は２に記載された電子部品において、
前記実装済基板が前記機能部材を前記板状部材に向かって押圧した状態において前記流動性樹脂が硬化することによって、前記機能部材が前記板状部材に対して電気的に又は熱的に接続されたことを特徴とする電子部品。 In the electronic component according to claim 1 or 2,
The functional member is electrically or thermally connected to the plate-like member by curing the flowable resin in a state where the mounted substrate presses the functional member toward the plate-like member. An electronic component characterized by that. 請求項１又は２に記載された電子部品において、
前記流動性樹脂が硬化する際の圧縮応力によって前記機能部材と前記板状部材とが互いに圧接された状態において前記流動性樹脂が硬化することによって、前記機能部材が前記板状部材に電気的に又は熱的に接続されたことを特徴とする電子部品。 In the electronic component according to claim 1 or 2,
In the state where the functional member and the plate-like member are pressed against each other by the compressive stress when the fluid resin is cured, the functional member is electrically connected to the plate-like member. An electronic component characterized by being thermally connected. 電子素子と、前記電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンと、前記グラウンド配線パターンに対して予め電気的に接続され導電性を有する機能部材とを主面において有する実装済基板を準備する工程と、
導電性を有する板状部材を準備する工程と、
第１の型の所定の位置に前記実装済基板を一時的に固定する工程と、
前記第１の型に相対向する第２の型に設けられたキャビティの内底面に前記板状部材を配置する工程と、
流動性樹脂によって前記キャビティを満たされた状態にする工程と、
前記第１の型と前記第２の型とを型締めすることによって、前記板状部材と前記機能部材とを接触させる工程と、
前記第１の型と前記第２の型とを型締めした状態において、少なくとも前記機能部材と前記電子素子と前記グラウンド配線パターンと前記実装済基板の主面とを前記流動性樹脂に浸漬する工程と、
前記流動性樹脂を硬化させて硬化樹脂からなる封止樹脂を形成する工程と、
前記第１の型と前記第２の型とを型開きすることによって、前記電子素子と前記グラウンド配線パターンと前記機能部材と前記板状部材と前記封止樹脂とを少なくとも有する電子部品を前記第２の型から分離する工程とを備え、
前記封止樹脂を形成する工程において、前記機能部材によって前記グラウンド配線パターンが前記板状部材に対して電気的に接続されることを特徴とする電子部品の製造方法。 On the main surface, an electronic element, a bonding pad electrically connected to the connection electrode of the electronic element, a ground wiring pattern, and a functional member electrically connected in advance to the ground wiring pattern and having conductivity Preparing a mounted substrate having,
Preparing a plate-like member having conductivity;
Temporarily fixing the mounted substrate at a predetermined position of the first mold;
Disposing the plate-like member on an inner bottom surface of a cavity provided in a second mold opposite to the first mold;
Filling the cavity with a flowable resin;
A step of bringing the plate-shaped member and the functional member into contact with each other by clamping the first mold and the second mold;
A step of immersing at least the functional member, the electronic element, the ground wiring pattern, and the main surface of the mounted substrate in the fluid resin in a state where the first mold and the second mold are clamped. When,
Curing the fluid resin to form a sealing resin made of a cured resin;
An electronic component having at least the electronic element, the ground wiring pattern, the functional member, the plate member, and the sealing resin is formed by opening the first mold and the second mold. A step of separating from the two molds,
In the step of forming the sealing resin, the ground wiring pattern is electrically connected to the plate member by the functional member. 主面に装着された電子素子と、前記電子素子の接続電極に電気的に接続されたボンディングパッドと、前記主面に対して予め熱的に接続され熱伝導性を有する機能部材とを有する実装済基板を準備する工程と、
熱伝導性を有する板状部材を準備する工程と、
第１の型の所定の位置に前記実装済基板を一時的に固定する工程と、
前記第１の型に相対向する第２の型に設けられたキャビティの内底面に前記板状部材を配置する工程と、
流動性樹脂によって前記キャビティを満たされた状態にする工程と、
前記第１の型と前記第２の型とを型締めすることによって、前記板状部材と前記機能部材とを接触させる工程と、
前記第１の型と前記第２の型とを型締めした状態において、少なくとも前記機能部材と前記電子素子と前記グラウンド配線パターンと前記実装済基板の主面とを前記流動性樹脂に浸漬する工程と、
前記流動性樹脂を硬化させて硬化樹脂からなる封止樹脂を形成する工程と、
前記第１の型と前記第２の型とを型開きすることによって、前記電子素子と前記グラウンド配線パターンと前記機能部材と前記板状部材と前記封止樹脂とを少なくとも有する電子部品を前記第２の型から分離する工程とを備え、
前記封止樹脂を形成する工程において、前記機能部材によって前記実装済基板が前記板状部材に対して熱的に接続されることを特徴とする電子部品の製造方法。 Mounting having an electronic element mounted on the main surface, a bonding pad electrically connected to a connection electrode of the electronic element, and a functional member thermally connected to the main surface in advance and having thermal conductivity Preparing a finished substrate;
Preparing a plate-like member having thermal conductivity;
Temporarily fixing the mounted substrate at a predetermined position of the first mold;
Disposing the plate-like member on an inner bottom surface of a cavity provided in a second mold opposite to the first mold;
Filling the cavity with a flowable resin;
A step of bringing the plate-shaped member and the functional member into contact with each other by clamping the first mold and the second mold;
A step of immersing at least the functional member, the electronic element, the ground wiring pattern, and the main surface of the mounted substrate in the fluid resin in a state where the first mold and the second mold are clamped. When,
Curing the fluid resin to form a sealing resin made of a cured resin;
An electronic component having at least the electronic element, the ground wiring pattern, the functional member, the plate member, and the sealing resin is formed by opening the first mold and the second mold. A step of separating from the two molds,
In the step of forming the sealing resin, the mounted substrate is thermally connected to the plate member by the functional member. 請求項５又は６に記載された電子部品の製造方法において、
前記封止樹脂を形成する工程では、前記実装済基板が前記機能部材を前記板状部材に向かって押圧した状態において前記流動性樹脂を硬化させることを特徴とする電子部品の製造方法。 In the manufacturing method of the electronic component according to claim 5 or 6,
In the step of forming the sealing resin, the flowable resin is cured in a state where the mounted substrate presses the functional member toward the plate-like member. 請求項５又は６に記載された電子部品の製造方法において、
前記封止樹脂を形成する工程では、前記流動性樹脂が硬化する際の圧縮応力によって前記機能部材と前記板状部材とが互いに圧接された状態において前記流動性樹脂を硬化させることを特徴とする電子部品の製造方法。 In the manufacturing method of the electronic component according to claim 5 or 6,
In the step of forming the sealing resin, the fluid resin is cured in a state where the functional member and the plate-like member are pressed against each other by a compressive stress when the fluid resin is cured. Manufacturing method of electronic components. 電子素子と、前記電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され前記電子素子と前記グラウンド配線パターンとを少なくとも覆う封止樹脂と、前記封止樹脂に固着され導電性を有する板状部材と、前記実装済基板が有する前記グラウンド配線パターンに対して予め電気的に接続され前記板状部材に対して電気的に接続され導電性を有する機能部材とを備える電子部品を製造する電子部品の製造装置であって、
前記実装済基板が一時的に固定される第１の型と、
前記第１の型に相対向する、キャビティを有する第２の型とを備え、
前記キャビティの内底面に前記板状部材が配置され、
前記第１の型と前記第２の型とが型締めされた状態において、前記キャビティに満たされた前記流動性樹脂が前記板状部材を覆い、
前記第１の型と前記第２の型とが型締めされた状態において、前記機能部材と前記板状部材とが接触し、
前記第１の型と前記第２の型とが型締めされた状態において、前記キャビティに満たされた前記流動性樹脂が硬化して前記封止樹脂が形成されることを特徴とする電子部品の製造装置。 An electronic device, a mounting pad electrically connected to a connection electrode of the electronic device, a mounted substrate having a ground wiring pattern on a main surface, and a fluid resin is formed to cure the electronic device and the electronic device A sealing resin that covers at least the ground wiring pattern, a plate-like member that is fixed to the sealing resin and has conductivity, and is electrically connected in advance to the ground wiring pattern that the mounted substrate has. An electronic component manufacturing apparatus for manufacturing an electronic component comprising a functional member electrically connected to a member and having conductivity,
A first mold on which the mounted substrate is temporarily fixed;
A second mold having a cavity opposite to the first mold,
The plate-like member is disposed on the inner bottom surface of the cavity,
In the state where the first mold and the second mold are clamped, the fluid resin filled in the cavity covers the plate-shaped member,
In a state where the first mold and the second mold are clamped, the functional member and the plate-shaped member are in contact with each other,
In the electronic component, the fluid resin filled in the cavity is cured to form the sealing resin in a state where the first mold and the second mold are clamped. manufacturing device. 電子素子と、前記電子素子の接続電極に電気的に接続されたボンディングパッドと、グラウンド配線パターンとを主面において有する実装済基板と、流動性樹脂が硬化することによって形成され前記電子素子と前記グラウンド配線パターンとを少なくとも覆う封止樹脂と、前記封止樹脂に固着され熱伝導性を有する板状部材と、前記実装済基板に対して予め熱的に接続され前記板状部材に対して熱的に接続され熱伝導性を有する機能部材とを備える電子部品を製造する電子部品の製造装置であって、
前記実装済基板が一時的に固定される第１の型と、
前記第１の型に相対向する、キャビティを有する第２の型とを備え、
前記キャビティの内底面に前記板状部材が配置され、
前記第１の型と前記第２の型とが型締めされた状態において、前記キャビティに満たされた前記流動性樹脂が前記板状部材を覆い、
前記第１の型と前記第２の型とが型締めされた状態において、前記機能部材と前記板状部材とが接触し、
前記第１の型と前記第２の型とが型締めされた状態において、前記キャビティに満たされた前記流動性樹脂が硬化して前記封止樹脂が形成されることを特徴とする電子部品の製造装置。 An electronic device, a mounting pad electrically connected to a connection electrode of the electronic device, a mounted substrate having a ground wiring pattern on a main surface, and a fluid resin is formed to cure the electronic device and the electronic device A sealing resin that covers at least the ground wiring pattern, a plate-like member that is fixed to the sealing resin and has thermal conductivity, and is thermally connected to the mounted substrate in advance, and heats the plate-like member. An electronic component manufacturing apparatus for manufacturing an electronic component comprising a functional member having a thermal conductivity and being connected to the device,
A first mold on which the mounted substrate is temporarily fixed;
A second mold having a cavity opposite to the first mold,
The plate-like member is disposed on the inner bottom surface of the cavity,
In the state where the first mold and the second mold are clamped, the fluid resin filled in the cavity covers the plate-shaped member,
In a state where the first mold and the second mold are clamped, the functional member and the plate-shaped member are in contact with each other,
In the electronic component, the fluid resin filled in the cavity is cured to form the sealing resin in a state where the first mold and the second mold are clamped. manufacturing device. 請求項９又は１０に記載された電子部品の製造装置において、
前記板状部材に設けられた第１の位置合わせ部と、
前記キャビティに設けられた第２の位置合わせ部とを備え、
前記第１の位置合わせ部と前記第２の位置合わせ部とによって前記板状部材と前記キャビティとが位置合わせされることを特徴とする電子部品の製造装置。 In the electronic component manufacturing apparatus according to claim 9 or 10,
A first alignment portion provided on the plate member;
A second alignment portion provided in the cavity,
The electronic component manufacturing apparatus, wherein the plate member and the cavity are aligned by the first alignment portion and the second alignment portion. 請求項９又は１０に記載された電子部品の製造装置において、
前記第１の型と前記第２の型とが型締めされた状態において、
前記流動性樹脂が硬化する際の圧縮応力によって前記機能部材と前記板状部材とが互いに圧接された状態において前記流動性樹脂が硬化することを特徴とする電子部品の製造装置。 In the electronic component manufacturing apparatus according to claim 9 or 10,
In a state where the first mold and the second mold are clamped,
An apparatus for manufacturing an electronic component, wherein the fluid resin is cured in a state where the functional member and the plate-like member are pressed against each other by compressive stress when the fluid resin is cured.
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