JP2016157920A5 - - Google Patents
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- Publication number
- JP2016157920A5 JP2016157920A5 JP2015247981A JP2015247981A JP2016157920A5 JP 2016157920 A5 JP2016157920 A5 JP 2016157920A5 JP 2015247981 A JP2015247981 A JP 2015247981A JP 2015247981 A JP2015247981 A JP 2015247981A JP 2016157920 A5 JP2016157920 A5 JP 2016157920A5
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- shielding sheet
- wave shielding
- adhesive layer
- sheet according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive Effects 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 150000002902 organometallic compounds Chemical class 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- -1 isocyanate compound Chemical class 0.000 claims description 3
- 125000004430 oxygen atoms Chemical group O* 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 125000004433 nitrogen atoms Chemical group N* 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 239000011231 conductive filler Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 210000001787 Dendrites Anatomy 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 239000011889 copper foil Substances 0.000 description 7
- 125000000524 functional group Chemical group 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000004445 quantitative analysis Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015247981A JP2016157920A (ja) | 2015-12-18 | 2015-12-18 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015247981A JP2016157920A (ja) | 2015-12-18 | 2015-12-18 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015035207A Division JP5861790B1 (ja) | 2015-02-25 | 2015-02-25 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018200080A Division JP6733721B2 (ja) | 2018-10-24 | 2018-10-24 | 電磁波シールド性配線回路基板および電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016157920A JP2016157920A (ja) | 2016-09-01 |
| JP2016157920A5 true JP2016157920A5 (fr) | 2018-02-15 |
Family
ID=56826844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015247981A Pending JP2016157920A (ja) | 2015-12-18 | 2015-12-18 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2016157920A (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI782213B (zh) * | 2018-10-29 | 2022-11-01 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
| TWI771595B (zh) * | 2018-10-29 | 2022-07-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
| KR102400969B1 (ko) * | 2018-12-18 | 2022-05-24 | 토요잉크Sc홀딩스주식회사 | 전자 부품 탑재 기판 및 전자 기기 |
| US11812546B2 (en) * | 2020-05-13 | 2023-11-07 | Sumitomo Electric Printed Circuits, Inc. | High-frequency circuit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014090151A (ja) * | 2012-10-05 | 2014-05-15 | Toyo Ink Sc Holdings Co Ltd | 電磁波シールド性カバーレイフィルム、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント配線板 |
| JP2014141603A (ja) * | 2013-01-25 | 2014-08-07 | Toyo Ink Sc Holdings Co Ltd | 誘電特性に優れる接着剤組成物、それを用いた接着剤シート、およびプリント配線板 |
| JP6139284B2 (ja) * | 2013-06-11 | 2017-05-31 | 住友電工プリントサーキット株式会社 | シールドフィルム及びプリント配線板 |
-
2015
- 2015-12-18 JP JP2015247981A patent/JP2016157920A/ja active Pending
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