JP2016156019A - Resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition which can achieve a low dielectric loss tangent of a cured product of the resin composition, and can suppress a smear in a via hole after the cured product has been subjected to drilling and roughening treatment.SOLUTION: A specific resin composition contains an epoxide resin, an active ester compound and a smear suppression component.SELECTED DRAWING: None

Description

  The present invention relates to a resin composition. Furthermore, it is related with a sheet-like laminated material, a multilayer printed wiring board, and a semiconductor device.

  In recent years, electronic devices have become smaller and higher in performance, and in multilayer printed wiring boards, the build-up layer has been multilayered, miniaturization and higher density of wiring are required, and dielectrics are also required to reduce transmission loss. There is a need for an insulating material having a low tangent.

  Patent Document 1 discloses an epoxy resin composition for sealing containing an epoxy resin, a curing agent, and carbon black, and describes prevention of aggregation of carbon black. However, the concepts of smear and low dielectric loss tangent were not disclosed or directed at all.

JP 2008-121010 A

  When drilling an insulating layer of a multilayer printed wiring board, smear (resin residue) is generated in the via hole, and it is necessary to remove the smear in the roughening process. However, according to the knowledge of the present inventors, when a multilayer printed wiring board was produced using a low dielectric loss tangent resin composition containing an active ester compound, the inside of the via hole was roughened after the insulating layer was drilled. Even so, a new problem has arisen that it is difficult to remove smear (resin residue) in the via hole.

  Therefore, the problem to be solved by the present invention is to achieve low dielectric loss tangent of the cured product of the resin composition and to suppress smear in the via hole after the cured product is drilled and roughened. It is providing the resin composition which can be performed.

  As a result of intensive studies to solve the above problems, the present inventors have completed the present invention in a specific resin composition containing an epoxy resin, an active ester compound and a smear suppressing component.

That is, the present invention includes the following contents.
[1] A resin composition containing (A) an epoxy resin, (B) an active ester compound and (C) a smear-suppressing component, and when the nonvolatile component of the resin composition is 100% by mass, (C) A resin composition, wherein the smear suppressing component is 0.001 to 10% by mass.
[2] The resin composition as described in [1] above, wherein the content of the (B) active ester compound is 1 to 30% by mass when the nonvolatile component in the resin composition is 100% by mass. .
[3] The resin composition as described in [1] or [2] above, wherein the (C) smear suppressing component is an organic smear suppressing component.
[4] The resin composition as described in [3] above, wherein the organic smear suppressing component is at least one selected from the group consisting of pigments, dyes, rubber particles, antioxidants and infrared absorbers. object.
[5] The resin composition as described in [3] above, wherein the organic smear suppressing component is a pigment and / or rubber particles.
[6] The resin composition as described in [3] above, wherein the organic smear suppressing component is a pigment.
[7] The resin composition as described in [3] above, wherein the organic smear suppressing component is at least one selected from the group consisting of a blue pigment, a yellow pigment, a red pigment and a green pigment.
[8] The resin composition as described in [3] above, wherein the organic smear suppressing component is a mixed pigment obtained by mixing a blue pigment, a yellow pigment and a red pigment.
[9] The resin composition as described in any one of [1] to [8] above, further comprising (D) an inorganic filler.
[10] The resin composition as described in [9] above, wherein (D) the inorganic filler has an average particle size of 0.01 to 5 μm.
[11] The above [9] or [10], wherein the content of the inorganic filler (D) is 40 to 85% by mass when the nonvolatile component in the resin composition is 100% by mass. Resin composition.
[12] The resin composition as described in any one of [9] to [11] above, wherein the amount of carbon per unit weight of the inorganic filler is 0.02 to 3%.
[13] The resin composition is cured to form an insulating layer, and after the surface of the insulating layer is roughened, the root mean square roughness Rq of the surface of the insulating layer is 500 nm or less, and the surface of the insulating layer is plated. The above-mentioned [1], wherein the peel strength between the conductor layer and the insulating layer obtained is 0.3 kgf / cm or more, and the dielectric loss tangent of the cured product of the resin composition is 0.05 or less. [12] The resin composition according to any of [12].
[14] The resin composition according to any one of [1] to [13], which is a resin composition for an insulating layer of a multilayer printed wiring board.
[15] A sheet-like laminated material comprising the resin composition according to any one of [1] to [14].
[16] A multilayer printed wiring board, wherein an insulating layer is formed of a cured product of the resin composition according to any one of [1] to [14].
[17] A semiconductor device using the multilayer printed wiring board according to [16].
[18] The sheet-like laminate material according to [15] above is laminated on a circuit board, the resin composition is thermally cured to form an insulating layer, and a hole is formed in the insulating layer formed on the circuit board from above the support. A method for producing a multilayer printed wiring board, characterized in that a via hole is formed by processing.

  A specific resin composition containing an epoxy resin, an active ester compound and a smear suppressing component can achieve a low dielectric loss tangent of a cured product of the resin composition, and a via hole after the cured product is drilled and roughened It has become possible to provide a resin composition capable of suppressing internal smear.

  The present invention is a resin composition containing (A) an epoxy resin, (B) an active ester compound, and (C) a smear-suppressing component. When the nonvolatile component of the resin composition is 100% by mass, ) A resin composition characterized in that the smear suppressing component is 0.001 to 10% by mass.

<(A) Epoxy resin>
Although it does not specifically limit as (A) epoxy resin used for this invention, It is preferable to contain the epoxy resin which has a 2 or more epoxy group in 1 molecule. Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthol type epoxy resin, naphthalene Type epoxy resin, naphthylene ether type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, anthracene type epoxy resin, linear aliphatic epoxy resin, butadiene structure Epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, cyclohexanedimethanol type epoxy resin, trimethylol type epoxy resin, halo Emissions epoxy resins. These may be used alone or in combination of two or more.

  Among these, bisphenol A type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy from the viewpoint of improving heat resistance, insulation reliability, and adhesion to metal foil. Resins, glycidyl ester type epoxy resins, anthracene type epoxy resins, and epoxy resins having a butadiene structure are preferred. Specifically, for example, bisphenol A type epoxy resin (“Epicoat 828EL”, “YL980” manufactured by Mitsubishi Chemical Corporation), bisphenol F type epoxy resin (“jER806H”, “YL983U” manufactured by Mitsubishi Chemical Corporation), Naphthalene type bifunctional epoxy resin (“HP4032”, “HP4032D”, “HP4032SS”, “EXA4032SS” manufactured by DIC Corporation), naphthalene type tetrafunctional epoxy resin (“HP4700”, “HP4710” manufactured by DIC Corporation), Naphthol type epoxy resin (“ESN-475V” manufactured by Toto Kasei Co., Ltd.), epoxy resin having a butadiene structure (“PB-3600” manufactured by Daicel Chemical Industries, Ltd.), biphenyl type epoxy resin (Nippon Kayaku Co., Ltd.) "NC3000H", "NC3000L", "NC3100", Mitsubishi Chemical "YX4000", "YX4000H", "YX4000HK", "YL6121"), anthracene type epoxy resin (Mitsubishi Chemical Corporation "YX8800"), naphthylene ether type epoxy resin (DIC Corporation) “EXA-7310”, “EXA-7311”, “EXA-7311L”, “EXA7311-G3”), glycidyl ester type epoxy resin (“EX711”, “EX721” manufactured by Nagase ChemteX Corporation), Purin Co., Ltd. Tech "R540").

  Among them, it is preferable to use a liquid epoxy resin and a solid epoxy resin in combination, and an aromatic epoxy resin (hereinafter referred to as “liquid epoxy resin”) having two or more epoxy groups in one molecule and liquid at 20 ° C. And an aromatic epoxy resin having 3 or more epoxy groups in one molecule and a solid aromatic epoxy resin (hereinafter referred to as “solid epoxy resin”) at a temperature of 20 ° C. More preferred. In addition, the aromatic epoxy resin as used in the field of this invention means the epoxy resin which has an aromatic ring structure in the molecule | numerator. When using a liquid epoxy resin and a solid epoxy resin together as an epoxy resin, when using the resin composition in the form of an adhesive film, the resin composition has an appropriate flexibility and the cured product of the resin composition has an appropriate breaking strength. From the point of having, the mixture ratio (liquid epoxy resin: solid epoxy resin) is preferably in the range of 1: 0.1 to 1: 4, more preferably in the range of 1: 0.1 to 1: 2, by mass ratio. A range of 1: 0.3 to 1: 1.8 is more preferred, and a range of 1: 0.6 to 1: 1.5 is even more preferred.

  In the resin composition of the present invention, from the viewpoint of improving the mechanical strength and insulation reliability of the cured product of the resin composition, when the nonvolatile component in the resin composition is 100% by mass, (A) the content of the epoxy resin The amount is preferably 3 to 40% by mass, more preferably 5 to 35% by mass, and still more preferably 10 to 30% by mass.

<(B) Active ester compound>
The (B) active ester compound in the present invention is a compound having one or more active ester groups in one molecule, can lower the dielectric loss tangent of the resin composition, and can reduce the root mean square roughness to Rq as well. . (B) The active ester compound can react with an epoxy resin or the like, and a compound having two or more active ester groups in one molecule is preferable. In general, compounds having two or more ester groups with high reaction activity in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferably used. .

  From the viewpoint of improving heat resistance, an active ester compound obtained by condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound is more preferable. An active ester compound obtained by reacting a carboxylic acid compound with one or more selected from a phenol compound, a naphthol compound, and a thiol compound is more preferable. An aromatic compound having two or more active ester groups in one molecule obtained by reacting a carboxylic acid compound with an aromatic compound having a phenolic hydroxyl group is even more preferable. And an aromatic compound obtained by reacting a carboxylic acid compound having at least two or more carboxy groups in one molecule with an aromatic compound having a phenolic hydroxyl group, and in one molecule of the aromatic compound. Especially preferred are aromatic compounds having two or more active ester groups. Further, it may be linear or multi-branched. Further, if the carboxylic acid compound having at least two or more carboxy groups in a molecule is a compound containing an aliphatic chain, the compatibility with the resin composition can be increased, and any compound having an aromatic ring can be used. Heat resistance can be increased.

  Specific examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Of these, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid and terephthalic acid are preferred, and isophthalic acid and terephthalic acid are more preferred from the viewpoint of heat resistance. Specific examples of the thiocarboxylic acid compound include thioacetic acid and thiobenzoic acid.

  Specific examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenol phthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, and o-cresol. , M-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone Phloroglucin, benzenetriol, dicyclopentadienyl diphenol, phenol novolac and the like. Among them, from the viewpoint of improving heat resistance and solubility, bisphenol A, bisphenol F, bisphenol S, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, catechol, α-naphthol, β-naphthol, 1,5 -Dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadienyl diphenol, phenol novolac are preferred, catechol, 1 , 5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophene Non-tetrahydrobenzophenone, phloroglucin, benzenetriol, dicyclopentadienyl diphenol, and phenol novolak are more preferable. 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxy More preferred are hydroxybenzophenone, tetrahydroxybenzophenone, dicyclopentadienyl diphenol, phenol novolac, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dicyclopentadienyl diphenol, Phenol novolac is even more preferred, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthal Emissions, dicyclopentadienyl diphenol especially preferred, dicyclopentadienyl diphenol is particularly preferred. Specific examples of the thiol compound include benzenedithiol and triazinedithiol. The active ester compound may be used alone or in combination of two or more.

  More specifically, the active ester compound containing a dicyclopentadienyl diphenol structure includes a compound represented by the following formula (1).

(In the formula, R represents a phenyl group or a naphthyl group, k represents 0 or 1, and n represents an average number of repeating units of 0.05 to 2.5.)

  From the viewpoint of reducing the dielectric loss tangent and improving the heat resistance, R is preferably a naphthyl group, k is preferably 0, and n is preferably 0.25 to 1.5.

  (B) As an active ester compound, the active ester compound currently disclosed by Unexamined-Japanese-Patent No. 2004-277460 may be used, and a commercially available active ester compound can also be used. Specific examples of commercially available active ester compounds include an active ester curing agent containing a dicyclopentadienyl structure, an active ester curing agent containing a naphthalene structure, and an active ester curing containing an acetylated product of phenol novolac. An active ester type curing agent containing a benzoylated product of a phenol novolac is preferable, and an active ester type curing agent containing a naphthalene structure and an active ester type curing agent containing a dicyclopentadienyl diphenol structure are more preferable. EXB9451, EXB9460, EXB9460S, HPC-8000-65T (manufactured by DIC Corporation) as an active ester type curing agent containing a dicyclopentadienyl diphenol structure, EXB9416-70BK as an active ester type curing agent containing a naphthalene structure ( DIC Corporation), DC808 (manufactured by Mitsubishi Chemical Corporation) as an active ester-based curing agent containing an acetylated product of phenol novolac, and YLH1026 (Mitsubishi Chemical Corporation) as an active ester-based curing agent containing a benzoylated product of phenol novolac. Manufactured), and the like.

  (B) The content of the active ester compound is preferably 30% by mass or less when the nonvolatile component in the resin composition is 100% by mass from the viewpoint of improving heat resistance and further suppressing the occurrence of smear. More preferably, it is more preferably 10% by mass or less. On the other hand, from the viewpoint of improving the peel strength, when the nonvolatile component in the resin composition is 100% by mass, 1% by mass or more is preferable, 3% by mass or more is more preferable, and 5% by mass or more is more preferable.

  In addition, when the number of epoxy groups of (A) the epoxy resin is 1, the number of reactive groups of the (B) active ester compound is preferably 0.2 to 2 in terms of improving the mechanical properties of the resin composition. 3-1.5 are more preferable and 0.4-1 are still more preferable. Here, “the number of epoxy groups of the epoxy resin” is a value obtained by totaling the values obtained by dividing the solid mass of each epoxy resin present in the resin composition by the epoxy equivalent for all epoxy resins. The “reactive group” means a functional group capable of reacting with an epoxy group, and the “reactive group number of the active ester compound” means the solid content mass of the active ester compound present in the resin composition. This is the sum of all values divided by reactive group equivalents.

<(C) Smear suppressing component>
The smear-suppressing component used in the present invention is a component that can suppress smearing of a via hole after drilling and roughening a cured product of the resin composition. Here, smear suppression includes both meanings of reducing the amount of smear generated during drilling and making it easier to remove smear during roughening. Examples of the smear suppressing component include an organic smear suppressing component and an inorganic smear suppressing component, and an organic smear suppressing component is preferable from the viewpoint of improving insulation reliability. Specifically, examples of the organic smear suppressing component include pigments, dyes, rubber particles, antioxidants, infrared absorbers, and the like, and examples of the inorganic smear suppressing component include metal compound powder and metal powder. . (C) As the smear suppressing component, it is preferable to use one or more selected from the group consisting of pigments, dyes, rubber particles, antioxidants and infrared absorbers. Of these, pigments and / or rubber particles are more preferable, and pigments are more preferable from the viewpoints of excellent smear suppression ability and excellent peel strength. These may be used alone or in combination of two or more.

  Examples of the pigment include a blue pigment, a yellow pigment, a red pigment, a black pigment, and a green pigment. Examples of blue pigments include phthalocyanine, anthraquinone, and dioxazine pigments. Examples of yellow pigments include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, and anthraquinone pigments. Examples of red pigments include monoazo, disazo, azo lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone pigments. Examples of the black pigment include carbon black and graphite. Examples of the green pigment include phthalocyanine-based pigments. One or more pigments may be used in combination, and one or more pigments selected from the group consisting of blue pigments, yellow pigments, red pigments, black pigments, and green pigments can be appropriately blended. Especially, it is preferable to use 1 or more types selected from the group which consists of a blue pigment, a yellow pigment, a red pigment, and a green pigment from the point which can improve insulation reliability further, and a blue pigment, a yellow pigment, and red It is more preferable to use a mixed pigment obtained by mixing pigments. In preparing a mixed pigment comprising a mixture of a blue pigment, a yellow pigment and a red pigment, the blue pigment and the yellow pigment can be effectively absorbed from the laser during drilling and smearing can be further suppressed. And the mass ratio of the red pigment is preferably 2 to 6: 5 to 9: 6 to 10, and more preferably 3 to 5: 6 to 8: 7 to 9.

  As dyes, azo (monoazo, disazo, etc.) dyes, azo-methine dyes, anthraquinone dyes, quinoline dyes, ketone imine dyes, fluorone dyes, nitro dyes, xanthene dyes, acenaphthene dyes, quinophthalone dyes, aminoketone dyes, methine dyes, perylenes And dyes, coumarin dyes, perinone dyes, triphenyl dyes, triallylmethane dyes, phthalocyanine dyes, incrophenol dyes, azine dyes, or mixtures thereof.

  Examples of the rubber particles include core-shell type rubber particles, cross-linked acrylonitrile butadiene rubber particles, cross-linked styrene butadiene rubber particles, and acrylic rubber particles. The core-shell type rubber particles are rubber particles having a core layer and a shell layer. For example, a two-layer structure in which an outer shell layer is made of a glassy polymer and an inner core layer is made of a rubbery polymer, or Examples include a three-layer structure in which the outer shell layer is made of a glassy polymer, the intermediate layer is made of a rubbery polymer, and the core layer is made of a glassy polymer.

  Examples of the antioxidant include hindered phenol-based antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants. Commercially available products include pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate (“IRGANOX 1010” manufactured by Ciba Japan Co., Ltd.), 2,2-thio-diethylenebis [ 3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] (“IRGANOX 1035” manufactured by Ciba Japan Co., Ltd.), 1,3,5-tris [[3,5-bis (1, 1-dimethylethyl) -4-hydroxyphenyl] methyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione ("IRGANOX 3114" manufactured by Ciba Japan Co., Ltd.) Can be mentioned.

  Examples of infrared absorbers include phthalocyanine compounds, anthraquinone compounds, nickel complexes, and the like. Examples of commercially available products include IR-14 (manufactured by Nippon Shokubai Co., Ltd.), TX-HA-1 (manufactured by Nippon Shokubai Co., Ltd.), and the like.

  As metal compound powder, titania such as titanium oxide, magnesia such as magnesium oxide, iron oxide such as iron oxide, nickel oxide such as nickel oxide, zinc oxide such as manganese dioxide and zinc oxide, silicon dioxide, Aluminum oxide, rare earth oxide, cobalt oxide such as cobalt oxide, tin oxide such as tin oxide, tungsten oxide such as tungsten oxide, silicon carbide, tungsten carbide, boron nitride, silicon nitride, titanium nitride, aluminum nitride, sulfuric acid Examples thereof include powders of barium, rare earth oxysulfides, or mixtures thereof.

  Examples of metal powders include silver, aluminum, bismuth, cobalt, copper, iron, magnesium, manganese, molybdenum, nickel, palladium, antimony, silicon, tin, titanium, vanadium, tungsten, zinc, or alloys or mixtures thereof. Is mentioned.

  (C) The content of the smear suppressing component is preferably 10% by mass or less and more preferably 5% by mass or less with respect to 100% by mass of the non-volatile component in the resin composition from the viewpoint of preventing a decrease in cured properties. 4 mass% or less is further more preferable, 3 mass% or less is still more preferable, and 2 mass% or less is especially preferable. Further, from the viewpoint of improving the smear suppressing ability, 0.001% by mass or more is preferable, 0.01% by mass or more is more preferable, and 0.02% by mass with respect to 100% by mass of the nonvolatile component in the resin composition. The above is more preferable, 0.05% by mass or more is still more preferable, 0.08% by mass or more is particularly preferable, and 0.1% by mass or more is particularly preferable.

<(D) Inorganic filler>
The resin composition of the present invention may further contain (D) an inorganic filler for the purpose of reducing the linear thermal expansion coefficient and improving the smear removability during the roughening treatment. (D) Examples of inorganic fillers include silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, and titanium. Examples thereof include barium acid, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate. Of these, silica is preferable. As silica, amorphous silica, pulverized silica, fused silica, crystalline silica, synthetic silica, hollow silica and the like are preferable, and fused silica is more preferable. Moreover, spherical silica is preferable as the silica. You may use these 1 type or in combination of 2 or more types. Examples of commercially available spherical fused silica include “SO-C2” and “SO-C1” manufactured by Admatechs.

  (D) The average particle diameter of the inorganic filler is not particularly limited, but the upper limit of the average particle diameter of the inorganic filler is the total of the inorganic filler from the viewpoint of forming fine wiring on the insulating layer. From the viewpoint of suppressing the occurrence of smear during drilling by increasing the surface area, it is preferably 5 μm or less, more preferably 3 μm or less, further preferably 1 μm or less, even more preferably 0.7 μm or less, and 0.5 μm or less. Particularly preferred is 0.4 μm or less, particularly preferred is 0.3 μm or less. On the other hand, the lower limit of the average particle size of the inorganic filler is preferably 0.01 μm or more from the viewpoint of preventing the viscosity of the varnish from increasing and handling properties from being lowered when the resin composition is a varnish. 0.03 μm or more is more preferable, 0.05 μm or more is further preferable, 0.07 μm or more is particularly preferable, and 0.1 μm or more is particularly preferable. The average particle diameter of the inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be prepared on a volume basis by a laser diffraction / scattering particle size distribution measuring apparatus, and the median diameter can be measured as the average particle diameter. As the measurement sample, an inorganic filler dispersed in water by ultrasonic waves can be preferably used. As a laser diffraction scattering type particle size distribution measuring device, LA-500, 750, 950, etc. manufactured by Horiba, Ltd. can be used.

  (D) The content of the inorganic filler is not particularly limited, but from the viewpoint of preventing the flexibility when the resin composition is in the form of a film, the nonvolatile component in the resin composition is 100 masses. % Is preferably 85% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less. In addition, from the viewpoint of lowering the thermal expansion coefficient of the insulating layer, increasing the total surface area of the inorganic filler, suppressing smear generation during drilling, and making it easier to remove smear during roughening treatment, When the non-volatile component in the composition is 100% by mass, 40% by mass or more is preferable, 50% by mass or more is more preferable, 60% by mass or more is further preferable, and 70% by mass or more is even more preferable.

  (D) Inorganic fillers are aminosilane coupling agents, ureidosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, and silane couplings from the viewpoint of improving moisture resistance and dispersibility. Agents, vinyl silane coupling agents, styryl silane coupling agents, acrylate silane coupling agents, isocyanate silane coupling agents, sulfide silane coupling agents, organosilazane compounds, titanate coupling agents, etc. It is preferable that the surface treatment is performed. In particular, after the surface treatment of the inorganic filler with an organosilazane compound, the surface treatment with a silane coupling agent further improves the moisture resistance and dispersibility of the inorganic filler. These may be used alone or in combination of two or more.

  Specifically, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldiethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane Aminosilane coupling agents such as N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane, 3-ureidopropyltriethoxysilane, etc. Ureidosilane coupling agent, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyl (dimethoxy) methylsilane Epoxysilane coupling agents such as glycidylbutyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyl Mercaptosilane-based coupling agents such as dimethoxysilane, 11-mercaptoundecyltrimethoxysilane, methyltrimethoxysilane, octadecyltrimethoxysilane, phenyltrimethoxysilane, methacroxypropyltrimethoxysilane, imidazolesilane, triazinesilane, tert- Silane coupling agents such as butyltrimethoxysilane, vinylsilanes such as vinyltrimethoxysilane, vinyltriethoxysilane, vinylmethyldiethoxysilane Coupling agent, styrylsilane coupling agent such as p-styryltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyldimethoxysilane, 3-methacryloxy Acrylate silane coupling agents such as propyltriethoxysilane and 3-methacryloxypropyldiethoxysilane, isocyanate silane coupling agents such as 3-isocyanatopropyltrimethoxysilane, bis (triethoxysilylpropyl) disulfide, bis (tri Ethoxysilylpropyl) sulfidesilane coupling agents such as tetrasulfide, hexamethyldisilazane, 1,3-divinyl-1,1,3,3-tetramethyldisilazane, hexaf Enyldisilazane, trisilazane, cyclotrisilazane, 2,2,4,4,6,6-hexamethylcyclotrisilazane, octamethylcyclotetrasilazane, hexabutyldisilazane, hexaoctyldisilazane, 1,3-diethyltetramethyldi Silazane, 1,3-di-n-octyltetramethyldisilazane, 1,3-diphenyltetramethyldisilazane, 1,3-dimethyltetraphenyldisilazane, 1,3-diethyltetramethyldisilazane, 1,1, Organosilazane compounds such as 3,3-tetraphenyl-1,3-dimethyldisilazane, 1,3-dipropyltetramethyldisilazane, hexamethylcyclotrisilazane, dimethylaminotrimethylsilazane, tetramethyldisilazane, tetra-n -Butyl titanate dimer, titani Mu-i-propoxyoctylene glycolate, tetra-n-butyl titanate, titanium octylene glycolate, diisopropoxy titanium bis (triethanolaminate), dihydroxy titanium bis lactate, dihydroxy bis (ammonium lactate) titanium, bis (dioctyl pyro) Phosphate) ethylene titanate, bis (dioctylpyrophosphate) oxyacetate titanate, tri-n-butoxy titanium monostearate, tetra-n-butyl titanate, tetra (2-ethylhexyl) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, Tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) Phosphite titanate, isopropyl trioctanoyl titanate, isopropyl tricumyl phenyl titanate, isopropyl triisostearoyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl dimethacrylisostearoyl titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl tridodecylbenzenesulfonyl titanate And titanate coupling agents such as isopropyltris (dioctylpyrophosphate) titanate and isopropyltri (N-amidoethyl / aminoethyl) titanate. Of these, aminosilane coupling agents are preferred because they are excellent in moisture resistance, dispersibility, and properties of cured products, and organosilazane compounds are preferred because they are excellent in improving dispersibility of resin varnishes. Commercially available surface treatment agents include “KBM403” (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd. and “KBM803” (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd. “KBE903” (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., “KBM573” (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and the like.

  Moreover, the inorganic filler surface-treated with the surface treatment agent can measure the amount of carbon per unit weight of the inorganic filler after being washed with a solvent (for example, methyl ethyl ketone). Here, “the amount of carbon per unit weight of the inorganic filler” is the percentage of the amount of carbon (g) bonded to 1 g of the inorganic filler. Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment material, and ultrasonic cleaning is performed at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid content, the carbon amount per unit weight of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, “EMIA-320V” manufactured by HORIBA, Ltd. can be used.

  The amount of carbon per unit weight of the inorganic filler is preferably 0.02% or more in terms of improving the dispersibility of the inorganic filler and stabilizing the root mean square roughness after the roughening treatment of the cured product. 05% or more is more preferable, and 0.1% or more is still more preferable. On the other hand, it is preferably 3% or less, more preferably 2% or less, and even more preferably 1% or less from the viewpoint of preventing an increase in the melt viscosity of the resin varnish or the adhesive film.

<(E) Curing accelerator>
The resin composition of the present invention may further contain (E) a curing accelerator for the purpose of adjusting the curing time and the curing temperature. (E) Although it does not specifically limit as a hardening accelerator, An imidazole type hardening accelerator, an amine type hardening accelerator, an organic phosphine compound, an organic phosphonium salt compound, etc. are mentioned. These may be used alone or in combination of two or more.

  Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2- Ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1- Cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2- Feni Imidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- ( 1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 -[2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4 -Methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-be Jill imidazolium chloride, 2-methyl-imidazoline, adduct of 2-phenyl-imidazo imidazole compounds such as phosphorus and imidazole compound and an epoxy resin. These may be used alone or in combination of two or more.

  Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5 , 4, 0) -undecene (hereinafter abbreviated as DBU) and the like. These may be used alone or in combination of two or more.

  Examples of organic phosphine compounds and organic phosphonium salt compounds include TPP, TPP-K, TPP-S, TPTP-S, TBP-DA, TPP-SCN, and TPTP-SCN (trade names of Hokuko Chemical Co., Ltd.). . These may be used alone or in combination of two or more.

  (E) The content of the curing accelerator is preferably 0.01 to 3% by mass with respect to 100% by mass of the non-volatile component in the resin composition from the viewpoint of storage stability of the resin varnish and efficiency of curing. More preferably, the content is 1-2% by mass.

<(F) Thermoplastic resin>
By further including (F) a thermoplastic resin in the resin composition of the invention, the viscosity of the resin varnish obtained from the resin composition can be adjusted to a suitable range, and the flexibility of the cured product can be increased. Can be increased. The thermoplastic resin is not particularly limited, and examples thereof include phenoxy resin, polyvinyl acetal resin, polyimide resin, polyamideimide resin, polyamide resin, polyethersulfone resin, polysulfone resin, polybutadiene resin, and ABS resin. Of these, phenoxy resins and polyvinyl acetal resins are preferred, and phenoxy resins are more preferred from the viewpoint of enhancing the flexibility of the cured product and contributing to adhesion. These may be used alone or in combination of two or more. The thermoplastic resin preferably has a glass transition temperature of 80 ° C. or higher.

  The weight average molecular weight of the thermoplastic resin is preferably in the range of 5,000 to 800,000, more preferably in the range of 10,000 to 200,000, still more preferably in the range of 15,000 to 150,000, and in the range of 20,000 to 100,000. Is even more preferred. By being in this range, the effect of improving film forming ability and mechanical strength is sufficiently exhibited, and compatibility with the epoxy resin can be made into a factory. In addition, the weight average molecular weight in this invention is measured by the gel permeation chromatography (GPC) method (polystyrene conversion). Specifically, the weight average molecular weight by the GPC method is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, and Shodex K-800P / K-804L / K manufactured by Showa Denko KK as a column. -804L can be measured at a column temperature of 40 ° C. using chloroform or the like as a mobile phase, and can be calculated using a standard polystyrene calibration curve.

  Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, Examples thereof include those having one or more skeletons selected from a trimethylcyclohexane skeleton. Two or more phenoxy resins may be mixed and used. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. Examples of commercially available products include 1256, 4250 (bisphenol A skeleton-containing phenoxy resin) manufactured by Mitsubishi Chemical Corporation, YX8100 (bisphenol S skeleton-containing phenoxy resin) manufactured by Mitsubishi Chemical Corporation, and YX6954 (bisphenol manufactured by Mitsubishi Chemical Corporation). Acetophenone skeleton-containing phenoxy resin). Examples of commercially available products include FX280 and FX293 manufactured by Nippon Steel Chemical Co., Ltd., YL7553, YL6954, YL6794, YL7213, YL7290, and YL7482 manufactured by Mitsubishi Chemical Corporation.

  Specific examples of the polyvinyl acetal resin include those manufactured by Denki Kagaku Kogyo Co., Ltd., electrified butyral 4000-2, 5000-A, 6000-C, 6000-EP, and Sekisui Chemical Co., Ltd., ESREC BH series, BX series, and KS. Series, BL series, BM series and the like. Specific examples of the polyimide resin include polyimide “Rika Coat SN20” and “Rika Coat PN20” manufactured by Shin Nippon Rika Co., Ltd. Also, a linear polyimide obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride (as described in JP 2006-37083 A), a polysiloxane skeleton-containing polyimide (JP 2002-2002). And modified polyimides such as those described in JP-A No. 12667 and JP-A No. 2000-319386. Specific examples of the polyamideimide resin include polyamideimides “Bilomax HR11NN” and “Bilomax HR16NN” manufactured by Toyobo Co., Ltd. In addition, modified polyamideimides such as polysiloxane skeleton-containing polyamideimides “KS9100” and “KS9300” manufactured by Hitachi Chemical Co., Ltd. may be mentioned. Specific examples of the polyethersulfone resin include polyethersulfone “PES5003P” manufactured by Sumitomo Chemical Co., Ltd. Specific examples of the polysulfone resin include polysulfone “P1700” and “P3500” manufactured by Solven Advanced Polymers Co., Ltd.

  Although content of a thermoplastic resin is not specifically limited, From the point of adjustment of melt viscosity of a sheet-like laminated material and adjustment of resin varnish viscosity, it is 0.00 with respect to 100 mass% of non-volatile components in a resin composition. 5-30 mass% is preferable and 1-20 mass% is more preferable.

<(G) Curing agent>
The resin composition of the present invention may further contain (G) a curing agent. Thereby, the insulation reliability of the hardened | cured material of a resin composition, peel strength, and a mechanical characteristic can be improved. (G) Although it does not specifically limit as a hardening | curing agent, For example, a phenol type hardening | curing agent, a cyanate ester type hardening | curing agent, a benzoxazine type hardening | curing agent, an acid anhydride type hardening | curing agent etc. can be mentioned. These can use 1 type (s) or 2 or more types. Among these, a phenol-based curing agent and a cyanate ester-based curing agent are preferable from the viewpoints of improving smear removability and improving dielectric characteristics.

  The phenolic curing agent is not particularly limited, and examples thereof include a phenol novolak resin, a triazine skeleton-containing phenol novolak resin, a naphthol novolak resin, a naphthol aralkyl type resin, a triazine skeleton-containing naphthol resin, and a biphenyl aralkyl type phenol resin. For example, “MEH-7700”, “MEH-7810”, “MEH-7785” (manufactured by Meiwa Kasei Co., Ltd.), “NHN”, “CBN”, “GPH” (Nippon Kayaku) As a naphthol aralkyl type resin, “SN170”, “SN180”, “SN190”, “SN475”, “SN485”, “SN495”, “SN375”, “SN395” (manufactured by Tohto Kasei Co., Ltd.) ), “TD2090” (manufactured by DIC Corporation) as a phenol novolac resin, and “LA3018”, “LA7052”, “LA7054”, “LA1356” (manufactured by DIC Corporation) as triazine skeleton-containing phenol novolac resins. . A phenol type hardening | curing agent may use together 1 type (s) or 2 or more types.

  Although there is no restriction | limiting in particular as cyanate ester type hardening | curing agent, Novolac type (phenol novolak type, alkylphenol novolak type, etc.) cyanate ester type hardening agent, dicyclopentadiene type cyanate ester type hardening agent, bisphenol type (bisphenol A type, bisphenol) Fate, bisphenol S type, etc.) cyanate ester curing agents, and prepolymers in which these are partially triazines. Although the weight average molecular weight of a cyanate ester hardening | curing agent is not specifically limited, 500-4500 are preferable and 600-3000 are more preferable. Specific examples of the cyanate ester curing agent include, for example, bisphenol A dicyanate, polyphenol cyanate (oligo (3-methylene-1,5-phenylene cyanate), 4,4′-methylenebis (2,6-dimethylphenyl cyanate), 4,4′-ethylidenediphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1-bis (4-cyanatephenylmethane), bis (4-cyanate-3, Bifunctional cyanate resins such as 5-dimethylphenyl) methane, 1,3-bis (4-cyanatephenyl-1- (methylethylidene)) benzene, bis (4-cyanatephenyl) thioether, bis (4-cyanatephenyl) ether , Phenol novolac, Examples thereof include polyfunctional cyanate resins derived from resole novolac, dicyclopentadiene structure-containing phenol resins, prepolymers in which these cyanate resins are partially triazines, and these may be used alone or in combination of two or more. Examples of commercially available cyanate ester resins include phenol novolac polyfunctional cyanate ester resins (manufactured by Lonza Japan Co., Ltd., PT30, cyanate equivalent 124), and some or all of bisphenol A dicyanate are triazines and trimers. The prepolymer (Lonza Japan Co., Ltd. product, BA230, cyanate equivalent 232), dicyclopentadiene structure containing cyanate ester resin (Lonza Japan Co., Ltd. product, DT-4000, DT-7000) etc. are mentioned.

  Although there is no restriction | limiting in particular as a benzoxazine type hardening | curing agent, Specifically, Fa, Pd (made by Shikoku Kasei Co., Ltd.), HFB2006M (made by Showa Polymer Co., Ltd.), etc. are mentioned.

  Although content of the (G) hardening | curing agent in a resin composition is not specifically limited, From a viewpoint of preventing that the hardened | cured material of a resin composition becomes weak, 100 mass% of non-volatile components in a resin composition On the other hand, 0.5-10 mass% is preferable and 1-6 mass% is more preferable.

<Other ingredients>
The resin composition of the present invention further includes thermosetting components such as maleimide compounds, bisallyl nadiimide compounds, vinyl benzyl resins, vinyl benzyl ether resins, silicone powder, nylon as long as the effects of the present invention are not impaired as required. Organic fillers such as powder and fluorine powder, thickeners such as olben and benton, silicone, fluorine and polymer antifoaming or leveling agents, imidazole, thiazole, triazole, silane coupling agent, etc. Non-stickiness imparting agents, phosphorus compounds, flame retardants such as metal hydroxides, and the like.

  The resin composition of the present invention is appropriately mixed with the above components and, if necessary, kneaded or mixed by a kneading means such as a three-roll, ball mill, bead mill, or sand mill, or a stirring means such as a super mixer or a planetary mixer. By doing so, it can be produced as a resin varnish. And the hardened | cured material of the resin composition of this invention can achieve low dielectric loss tangent, and can suppress the smear in the via hole after drilling a hardened | cured material and roughening it.

  The dielectric loss tangent of the cured product of the resin composition of the present invention can be measured by the method described in <Measurement of dielectric loss tangent> described later. Specifically, it can be measured at a frequency of 5.8 GHz and a measurement temperature of 23 ° C. by the cavity resonator perturbation method. From the viewpoints of preventing heat generation at high frequencies, reducing signal delay and signal noise, the dielectric loss tangent is preferably 0.05 or less, more preferably 0.04 or less, still more preferably 0.03 or less, and even more preferably 0.02 or less. Preferably, 0.01 or less is especially preferable. On the other hand, the lower limit value of the dielectric loss tangent is not particularly limited, but is preferably 0.001 or more.

  The root mean square roughness Rq of the cured product of the resin composition of the present invention can be grasped by the measurement method described in <Measurement of root mean square roughness (Rq)> described later. It is desirable that the surface of the insulating layer after the roughening treatment has fine irregularities in terms of reducing the loss of electrical signals. The root mean square roughness Rq is an example of the density of the irregularities on the surface of the insulating layer. From this index, it can be seen that the surface of the insulating layer is not a simple average value of the unevenness on the surface of the insulating layer, but has a dense uneven shape. Specifically, the root mean square roughness Rq of the insulating layer surface after curing the resin composition to form an insulating layer and roughening the surface of the insulating layer is preferably 500 nm or less, and preferably 400 nm or less. More preferably, it is more preferably 300 nm or less, still more preferably 200 nm or less, and even more preferably 100 nm or less. The lower limit is preferably 5 nm or more, more preferably 10 nm or more, and still more preferably 20 nm or more from the viewpoint of obtaining good adhesion with the plated conductor layer.

  The peel strength of the cured product of the resin composition of the present invention can be grasped by the measurement method described in <Measurement of peel strength (peel strength) of plated conductor layer> described later. Specifically, the resin composition is cured to form an insulating layer, and the surface of the insulating layer after roughening is plated with a conductor layer obtained by plating and the insulating layer has a peel strength of 0.3 kgf / cm or more, preferably 0.5 kgf / cm or more, and more preferably 0.6 kgf / cm or more. On the other hand, the upper limit value is not particularly limited, but is generally 1.2 kgf / cm or less.

  The use of the resin composition of the present invention is not particularly limited, but sheet-like laminated materials such as adhesive films and prepregs, circuit boards (for laminated boards, multilayer printed wiring boards, etc.), solder resists, underfill materials, die bonding It can be used in a wide range of applications where a resin composition is required, such as materials, semiconductor sealing materials, hole-filling resins, and component-filling resins. Among them, in the resin composition of the present invention, it is possible to suppress smear in the via hole after the cured product is drilled and roughened, so that the plating adhesion in the via hole is improved, thereby improving the via hole. It is possible to prevent the generation of voids and to ensure the conduction reliability between the insulating layers of the multilayer printed wiring board formed in multiple stages. That is, in the production of a multilayer printed wiring board, it can be suitably used as a resin composition for forming an insulating layer (resin composition for an insulating layer of a multilayer printed wiring board) and for forming a conductor layer by plating. The resin composition (a resin composition for an insulating layer of a multilayer printed wiring board in which a conductor layer is formed by plating) can be more suitably used. The resin composition of the present invention can be applied to a circuit board in a varnish state to form an insulating layer, but in general, it is preferably used in the form of a sheet-like laminated material such as an adhesive film or a prepreg. . The softening point of the resin composition is preferably 40 to 150 ° C. from the viewpoint of the laminate property of the sheet-like laminated material.

<Sheet laminated material>
(Adhesive film)
In one embodiment, the sheet-like laminated material of the present invention is an adhesive film. The adhesive film is obtained by forming a resin composition layer on a support. The adhesive film is a method known to those skilled in the art, for example, preparing a resin varnish in which a resin composition is dissolved in an organic solvent, and applying the resin varnish to a support using a die coater or the like, further heating, Or it can manufacture by drying an organic solvent by hot air spraying etc. and forming a resin composition layer.

  Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone and cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, and carbitols such as cellosolve and butyl carbitol. And aromatic hydrocarbons such as toluene and xylene, amide solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. Two or more organic solvents may be used in combination.

  The drying conditions are not particularly limited, but drying is performed so that the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Depending on the amount of organic solvent in the varnish and the boiling point of the organic solvent, for example, a resin composition layer is formed by drying a varnish containing 30 to 60% by mass of an organic solvent at 50 to 150 ° C. for about 3 to 10 minutes. can do.

  The thickness of the resin composition layer formed in the adhesive film is preferably equal to or greater than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the resin composition layer preferably has a thickness of 10 to 100 μm. From the viewpoint of thinning, 15 to 80 μm is more preferable.

  Examples of the support include polyolefin films such as polyethylene, polypropylene, and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyester films such as polyethylene naphthalate, polycarbonate films, and polyimide films. Various plastic films are listed. Moreover, you may use release foil, metal foil, such as copper foil and aluminum foil. Among these, from the viewpoint of versatility, a plastic film is preferable and a polyethylene terephthalate film is more preferable. The support and a protective film described later may be subjected to surface treatment such as mud treatment or corona treatment. The release treatment may be performed with a release agent such as a silicone resin release agent, an alkyd resin release agent, or a fluororesin release agent.

  The thickness of the support is not particularly limited, but when drilling from the support, the resin residue is less likely to remain even when the energy of laser irradiation is large, and the occurrence of smear can be suppressed to 10 μm or more. Is preferable, 20 μm or more is more preferable, and 30 μm or more is still more preferable. Further, from the viewpoint of improving cost performance and enabling efficient drilling when drilling from the support, it is preferably 150 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less.

  A protective film according to the support can be further laminated on the surface of the resin composition layer opposite to the surface to which the support is in close contact. In this case, the adhesive film includes a support, a resin composition layer formed on the support, and a protective film formed on the resin composition layer. Although the thickness of a protective film is not specifically limited, For example, it is 1-40 micrometers. By laminating the protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches. The adhesive film can also be stored in a roll.

(Prepreg)
In one embodiment, the sheet-like laminated material of the present invention is a prepreg. The prepreg can be produced by impregnating the resin composition of the present invention into a sheet-like reinforcing base material by a hot melt method or a solvent method, and heating and semi-curing it. That is, it can be set as the prepreg which will be in the state which impregnated the sheet-like reinforcement base material with the resin composition of this invention. As a sheet-like reinforcement base material, what consists of a fiber currently used as prepreg fibers, such as glass cloth and an aramid fiber, can be used, for example. And what formed the prepreg on the support body is suitable.

  In the hot melt method, the resin composition is once coated on a support without being dissolved in an organic solvent, and then laminated on a sheet-like reinforcing substrate, or directly applied to a sheet-like reinforcing substrate by a die coater. Thus, a prepreg is manufactured. In the solvent method, a resin varnish is prepared by dissolving a resin in an organic solvent in the same manner as the adhesive film, and a sheet-like reinforcing base material is immersed in the varnish, and then the resin-like varnish is impregnated into the sheet-like reinforcing base material. It is a method of drying. Alternatively, the adhesive film can be prepared by continuously laminating the adhesive film from both sides of the sheet-like reinforcing substrate under heating and pressure conditions. A support, a protective film, and the like can be used in the same manner as the adhesive film.

<Multilayer printed wiring board using sheet-like laminated material>
Next, an example of a method for producing a multilayer printed wiring board using the sheet-like laminated material produced as described above will be described.

  First, a sheet-like laminated material is laminated (laminated) on one side or both sides of a circuit board using a vacuum laminator. Examples of the substrate used for the circuit substrate include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, and the like. In addition, a circuit board means here that the conductor layer (circuit) patterned was formed in the one or both surfaces of the above boards. Also, in a multilayer printed wiring board in which conductor layers and insulating layers are alternately laminated, one of the outermost layers of the multilayer printed wiring board is a conductor layer (circuit) in which one or both sides are patterned. It is included in the circuit board. The surface of the conductor layer may be previously roughened by blackening, copper etching, or the like.

When the sheet-like laminated material has a protective film, after removing the protective film, the sheet-like laminated material and the circuit board are preheated as necessary, while pressing and heating the sheet-like laminated material. Laminate to circuit board. In a preferred embodiment, the sheet-like laminate material of the present invention is laminated to a circuit board under reduced pressure by a vacuum laminating method. Lamination conditions are not particularly limited. For example, the pressure bonding temperature (laminating temperature) is preferably 70 to 140 ° C., and the pressure bonding pressure (laminating pressure) is preferably 1 to 11 kgf / cm ² (9.8 × 10 ^{4 to} 107.9 × 10 ⁴ N / m ² ), the pressure bonding time (laminating time) is preferably 5 to 180 seconds, and the lamination is preferably performed under reduced pressure with an air pressure of 20 mmHg (26.7 hPa) or less. The laminating method may be a batch method or a continuous method using a roll. The vacuum lamination can be performed using a commercially available vacuum laminator. Commercially available vacuum laminators include, for example, a vacuum applicator manufactured by Nichigo-Morton Co., Ltd., a vacuum pressurizing laminator manufactured by Meiki Seisakusho Co., Ltd., a roll dry coater manufactured by Hitachi Industries, Ltd., and Hitachi AIC Co., Ltd. ) Made vacuum laminator and the like.

  After laminating the sheet-like laminated material on the circuit board, it is cooled to around room temperature, and then peeled off when the support is peeled off, and the resin composition is thermoset to form an insulating layer. Thereby, an insulating layer can be formed on the circuit board. The thermosetting conditions may be appropriately selected according to the type and content of the resin component in the resin composition, but preferably 150 ° C. to 220 ° C. for 20 to 180 minutes, more preferably 160 ° C. to 210 ° C. In the range of 30 to 120 minutes. After the insulating layer is formed, if the support is not peeled before curing, it can be peeled off here if necessary.

Moreover, a sheet-like laminated material can also be laminated | stacked on the single side | surface or both surfaces of a circuit board using a vacuum press machine. The lamination process for heating and pressurizing under reduced pressure can be performed using a general vacuum hot press machine. For example, it can be performed by pressing a metal plate such as a heated SUS plate from the support layer side. The pressing condition is that the degree of vacuum is usually 1 × 10 ⁻² MPa or less, preferably 1 × 10 ⁻³ MPa or less. Although heating and pressurization can be carried out in one stage, it is preferable to carry out the conditions separately in two or more stages from the viewpoint of controlling the oozing of the resin. For example, the first stage press is performed at a temperature of 70 to 150 ° C. and the pressure is within a range of 1 to 15 kgf / cm ^2. The second stage press is performed at a temperature of 150 to 200 ° C. and a pressure of 1 to 40 kgf / cm 2. ^It is preferable to carry out in the range of ² . The time for each stage is preferably 30 to 120 minutes. Thus, an insulating layer can be formed on a circuit board by thermosetting the resin composition layer. Examples of commercially available vacuum hot press machines include MNPC-V-750-5-200 (manufactured by Meiki Seisakusho Co., Ltd.), VH1-1603 (manufactured by Kitagawa Seiki Co., Ltd.), and the like.

  Next, a hole is formed in the insulating layer formed on the circuit board to form a via hole and a through hole. The drilling can be performed by a known method such as drilling, laser, or plasma, or by combining these methods as necessary. Among these, drilling with a laser such as a carbon dioxide laser or a YAG laser is the most common method. In addition, the sheet-like laminated material of the present invention is laminated on a circuit board, the resin composition layer is thermoset to form an insulating layer, and the insulating layer formed on the circuit board is punched from the support to form a via hole. It is preferable to produce a multilayer printed wiring board by forming the substrate, and it is preferable to peel the support after drilling. Thus, by forming a via hole by drilling from the support, it is possible to suppress the occurrence of smear. Further, in order to cope with the thinning of the multilayer printed wiring board, the top diameter (diameter) of the via hole is preferably 15 to 70 μm, more preferably 20 to 65 μm, and still more preferably 25 to 60 μm.

  Next, the surface of the insulating layer is roughened. Examples of the dry roughening treatment include plasma treatment, and examples of the wet roughening treatment include a method in which a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing solution are performed in this order. Either dry or wet roughening treatment may be adopted, but wet roughening treatment can remove smear in the via hole while forming uneven anchors on the insulating layer surface. preferable. The swelling treatment with the swelling liquid is performed by immersing the insulating layer in the swelling liquid at 50 to 80 ° C. for 5 to 20 minutes (preferably at 55 to 70 ° C. for 8 to 15 minutes). Examples of the swelling liquid include an alkaline solution and a surfactant solution, and an alkaline solution is preferable. Examples of the alkaline solution include sodium hydroxide solution and potassium hydroxide solution. Examples of commercially available swelling liquids include Swelling Dip Securigans P (Swelling Dip Securigans SBU) and Swelling Dip Securigans SBU manufactured by Atotech Japan Co., Ltd. be able to. The roughening treatment with an oxidizing agent is performed by immersing the insulating layer in an oxidizing agent solution at 60 to 80 ° C. for 10 to 30 minutes (preferably at 70 to 80 ° C. for 15 to 25 minutes). Examples of the oxidizing agent include alkaline permanganate solution in which potassium permanganate and sodium permanganate are dissolved in an aqueous solution of sodium hydroxide, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid and the like. it can. The concentration of permanganate in the alkaline permanganate solution is preferably 5 to 10% by weight. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as Concentrate Compact CP and Dosing Solution Securigans P manufactured by Atotech Japan. The neutralization treatment with the neutralizing solution is performed by immersing the insulating layer in the neutralizing solution at 30 to 50 ° C. for 3 to 10 minutes (preferably at 35 to 45 ° C. for 3 to 8 minutes). As the neutralizing solution, an acidic aqueous solution is preferable, and as a commercially available product, Reduction Solution / Secligant P manufactured by Atotech Japan Co., Ltd. may be mentioned.

  Next, a conductor layer is formed on the insulating layer by dry plating or wet plating. As the dry plating, a known method such as vapor deposition, sputtering, or ion plating can be used. Examples of wet plating include a method in which a conductive layer is formed by combining electroless plating and electrolytic plating, a method in which a plating resist having a pattern opposite to that of the conductive layer is formed, and a conductive layer is formed only by electroless plating. It is done. As a subsequent pattern formation method, for example, a subtractive method or a semi-additive method known to those skilled in the art can be used. And the multilayer printed wiring board which laminated | stacked the buildup layer in multiple stages can be manufactured by repeating the above-mentioned series of processes several times. In the present invention, since the occurrence of smear is suppressed, the conduction reliability between layers can be ensured. Therefore, the sheet-like laminated material of the present invention can be suitably used for forming a build-up layer of a multilayer printed wiring board.

<Semiconductor device>
A semiconductor device can be manufactured by using the multilayer printed wiring board of the present invention. A semiconductor device can be manufactured by mounting a semiconductor chip in a conductive portion of the multilayer printed wiring board of the present invention. The “conduction location” is a “location where an electrical signal is transmitted in a multilayer printed wiring board”, and the location may be a surface or an embedded location. The semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.

  The semiconductor chip mounting method for manufacturing the semiconductor device of the present invention is not particularly limited as long as the semiconductor chip functions effectively, but specifically, a wire bonding mounting method, a flip chip mounting method, and no bumps. Examples include a mounting method using a build-up layer (BBUL), a mounting method using an anisotropic conductive film (ACF), and a mounting method using a non-conductive film (NCF).

  EXAMPLES Hereinafter, although this invention is demonstrated in detail using an Example and a comparative example, these do not restrict | limit this invention in any meaning. In the following description, “part” means “part by mass”.

<Measurement method / Evaluation method>
First, various measurement methods and evaluation methods will be described.

<Smear evaluation>
About the adhesive film obtained by each Example and each comparative example, smear (resin residue) was evaluated according to the following.

(1) Fabrication of circuit board A circuit pattern was formed by etching on both sides of a glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, board thickness 0.8 mm, R5715ES manufactured by Matsushita Electric Works Co., Ltd.) Further, a roughening treatment was performed with a microetching agent (CZ8100 manufactured by MEC Co., Ltd.), and a circuit board was produced.

(2) Lamination of adhesive film The adhesive film produced in each example and each comparative example was subjected to the above (1) using a batch type vacuum pressure laminator MVLP-500 (trade name, manufactured by Meiki Co., Ltd.). Lamination was performed on both sides of the produced circuit board. Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then pressure bonding at 100 ° C. for 30 seconds at a pressure of 0.74 MPa.

(3) Curing of resin composition layer In Examples 1-8 and Comparative Example 1, the PET film was peeled from the laminated adhesive film, and the resin composition layer was cured under curing conditions at 170 ° C for 30 minutes. An insulating layer was formed. In Example 9, the PET film was not peeled off, and the resin composition layer was cured under a curing condition of 170 ° C. for 30 minutes to form an insulating layer.

(4) Via hole formation Using a CO ₂ laser processing machine (YB-HCS03T04) manufactured by Matsushita Welding Systems Co., Ltd., drilling the insulating layer under the conditions of a frequency of 1000 Hz and a pulse width of 13 μs and a shot number of 3, and the insulating layer surface A via hole having a top diameter (diameter) of 60 μm was formed. In Example 9, the PET film was then peeled off.

(5) Roughening treatment The circuit board was immersed in a swelling dip securigant P of Atotech Japan Co., Ltd., which is a swelling liquid, at 60 ° C. for 10 minutes. Next, it was immersed for 20 minutes at 80 ° C. in a concentrated compact P (KMnO ₄ : 60 g / L, NaOH: 40 g / L aqueous solution) of Atotech Japan Co., Ltd., which is a roughening solution (oxidant). Finally, it was immersed for 5 minutes at 40 ° C. in a reduction solution securigant P of Atotech Japan Co., Ltd., which is a neutralizing solution.

(6) Evaluation of residue at bottom of via hole The periphery of the bottom of the via hole was observed with a scanning electron microscope (SEM), and the maximum smear length from the wall surface of the bottom of the via hole was measured from the obtained image. ◎: Maximum smear length of less than 2 μm, ◎: Maximum smear length of 2 μm or more and less than 3.5 μm, ○: Maximum smear length of 3.5 μm or more and less than 5 μm, and X: Maximum smear length of 5 μm or more.

<Measurement of peel strength (peel strength) of plating conductor layer, measurement of root mean square roughness (Rq), and evaluation of insulation reliability>
(1) Surface treatment of laminated board Glass cloth base epoxy resin double-sided copper-clad laminated board with inner layer circuit (copper foil thickness 18μm, remaining copper ratio 60%, substrate thickness 0.3mm, Matsushita Electric Works, Ltd.) Both surfaces of R5715ES) were immersed in CZ8100 manufactured by Mec Co., Ltd., and the copper surface was roughened.

(2) Lamination of adhesive film The adhesive film prepared in each example and each comparative example was subjected to both sides of a laminate using a batch type vacuum pressure laminator MVLP-500 (trade name, manufactured by Meiki Seisakusho Co., Ltd.). Laminated. Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then pressure bonding for 30 seconds at 100 ° C. and a pressure of 0.74 MPa.

(3) Curing of resin composition The PET film was peeled from the laminated adhesive film, and the resin composition was cured under curing conditions of 170 ° C for 30 minutes.

(4) Roughening treatment The laminate was immersed in a swelling dip secu-ligand P containing diethylene glycol monobutyl ether of Atotech Japan Co., Ltd. for 10 minutes at 60 ° C. and then used as a roughening solution. Soaked in Concentrate Compact P (KMnO ₄ : 60 g / L, NaOH: 40 g / L aqueous solution) at 80 ° C. for 20 minutes, and finally as a neutralizing solution, Atotech Japan Co., Ltd. -It was immersed in securigant P for 5 minutes at 40 ° C. The laminate after the roughening treatment was designated as sample A.

(5) Plating formation by semi-additive method In order to form a circuit on the surface of the insulating layer, the laminate was immersed in an electroless plating solution containing PdCl ₂ and then immersed in an electroless copper plating solution. After annealing for 30 minutes at 150 ° C., an etching resist was formed. After pattern formation by etching, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 30 μm. Next, annealing was performed at 180 ° C. for 60 minutes. This laminate was designated as Sample B.

(6) Measurement of root mean square roughness (Rq value) For sample A, using a non-contact type surface roughness meter (WYKO NT3300 manufactured by Becoin Instruments Co., Ltd.), the measurement range is 121 μm × 50 V lens. Rq value was calculated | required by the numerical value obtained as 92 micrometers. And it was set as the measured value by calculating | requiring the average value of 10 each.

(7) Measurement of peel strength (peel strength) of plated conductor layer Cut the conductor layer of sample B into a 10 mm wide and 100 mm long part, peel off one end, and grasping tool (TS Co., Ltd.) -E, auto-comb type tester AC-50C-SL), and the load (kgf / cm) when 35 mm was peeled off in the vertical direction at a speed of 50 mm / min at room temperature was measured.

(8) Evaluation of insulation reliability A resist tape cut out in a circular shape (Elep Masking Tape N380, manufactured by Nitto Denko Corporation) is pasted on the conductor layer of Sample B and immersed in an aqueous ferric chloride solution for 30 minutes. It was. The portion of the conductor layer where the resist tape was not applied was removed, and an evaluation substrate in which a circular conductor layer was formed on the insulating layer was produced. Thereafter, a portion of the insulating layer was shaved to expose the underlying copper foil. And the exposed copper foil and the circular conductor layer were connected by wiring (wire). A DC power supply (TP018-3D, manufactured by Takasago Seisakusho Co., Ltd.) was connected to the wiring of the evaluation board, and a voltage of 3.3 V was applied for 200 hours under the conditions of 130 ° C. and 85% RH. After 200 hours, the resistance value is measured. A resistance value of 1.0 × 10 ⁸ Ω or more is indicated as “◯”, and a resistance value of 1.0 × 10 ⁷ Ω or more and less than 1.0 × 10 ⁸ Ω is indicated as “△”. And less than 1.0 × 10 ⁷ Ω was defined as “x”.

<Measurement of dielectric loss tangent>
The adhesive films obtained in each Example and each Comparative Example were thermally cured at 190 ° C. for 90 minutes, and the PET film was peeled off to obtain a sheet-like cured product. The cured product was cut into a test piece having a width of 2 mm and a length of 80 mm, and a cavity resonator perturbation method dielectric constant measuring device CP521 manufactured by Kanto Electronics Application Development Co., Ltd. and a network analyzer E8362B manufactured by Agilent Technology Co., Ltd. were used. The dielectric loss tangent (tan δ) was measured at a measurement frequency of 5.8 GHz by the cavity resonator perturbation method. Two test pieces were measured, and the average value was calculated.

(Example 1)
10 parts of liquid bisphenol A type epoxy resin (epoxy equivalent 180, “828US” manufactured by Mitsubishi Chemical Corporation) and 20 parts biphenyl type epoxy resin (epoxy equivalent 291; “NC3000H” manufactured by Nippon Kayaku Co., Ltd.) (Hereinafter abbreviated as “MEK”) 15 parts and 15 parts of cyclohexanone were heated and dissolved with stirring. There, 28 parts of active ester compound (“HPC8000-65T” manufactured by DIC Corporation, active ester equivalent 223, 65% solid content toluene solution), triazine-containing cresol novolak resin (“LA3018-50P” manufactured by DIC Corporation) , Phenol equivalent 151, 2-methoxypropanol solution having a solid content of 50% 7 parts, curing accelerator (manufactured by Guangei Chemical Industry Co., Ltd., “4-dimethylaminopyridine”) 0.1 part, spherical silica (average particle size) 0.5 μm, “SO-C2” with aminosilane treatment, manufactured by Admatechs Co., Ltd., 140 parts of carbon amount per unit weight 0.18%, phenoxy resin (YL7553BH30, solid content 30% by mass of MEK and cyclohexanone 1 1 part, 7 parts of weight average molecular weight 40000), blue pigment (manufactured by Dainichi Seika Co., Ltd., cyanine blue 4 20) 0.04 part, 0.07 part of yellow pigment (manufactured by BASF Corp., Paliotrol Yellow K1841), 0.08 part of red pigment (manufactured by Clariant Japan Co., Ltd., PV Fast Pink E01) are mixed, and high speed A resin varnish was prepared by uniformly dispersing with a rotary mixer. Next, the resin varnish is applied on a polyethylene terephthalate film (thickness 38 μm, hereinafter abbreviated as “PET film”) with a die coater so that the resin thickness after drying becomes 40 μm, and 80 to 120 ° C. It was dried for 6 minutes at (average 100 ° C.) to obtain a sheet-like adhesive film.

(Example 2)
0.04 part of the blue pigment, 0.07 part of the yellow pigment and 0.08 part of the red pigment in Example 1 were changed to 0.4 part of the blue pigment, 0.66 part of the yellow pigment and 0.84 part of the red pigment. Except for the above, a resin varnish was prepared in exactly the same manner as in Example 1. Next, an adhesive film was obtained in the same manner as in Example 1.

Example 3
0.04 part of the blue pigment, 0.07 part of the yellow pigment and 0.08 part of the red pigment in Example 1 were changed to 0.9 part of the blue pigment, 1.4 parts of the yellow pigment and 1.6 parts of the red pigment. Except for the above, a resin varnish was prepared in exactly the same manner as in Example 1. Next, an adhesive film was obtained in the same manner as in Example 1.

Example 4
A resin varnish was prepared in exactly the same manner as in Example 1, except that 0.04 part of the blue pigment, 0.07 part of the yellow pigment and 0.08 part of the red pigment in Example 1 were changed to 3 parts of carbon black. . Next, an adhesive film was obtained in the same manner as in Example 1.

(Example 5)
Except for changing 0.04 part of the blue pigment, 0.07 part of the yellow pigment, and 0.08 part of the red pigment of Example 1 to 3.5 parts of rubber particles (“AC3816N” manufactured by Ganz Kasei Co., Ltd.) A resin varnish was prepared in exactly the same manner as in Example 1. Next, an adhesive film was obtained in the same manner as in Example 1.

Example 6
Except for changing 0.04 part of the blue pigment, 0.07 part of the yellow pigment and 0.08 part of the red pigment of Example 1 to 3.5 parts of the antioxidant (“IRGANOX1010” manufactured by BASF Corporation), A resin varnish was prepared in exactly the same manner as in Example 1. Next, an adhesive film was obtained in the same manner as in Example 1.

(Example 7)
0.04 part of the blue pigment, 0.07 part of the yellow pigment and 0.08 part of the red pigment in Example 1 were changed to 3.5 parts of an infrared absorber ("IR-14" manufactured by Nippon Shokubai Co., Ltd.) Except for the above, a resin varnish was prepared in exactly the same manner as in Example 1. Next, an adhesive film was obtained in the same manner as in Example 1.

(Example 8)
140 parts of spherical silica of Example 2 (average particle size 0.5 μm, “SO-C2” with aminosilane treatment, manufactured by Admatechs Co., Ltd., carbon amount 0.18%) is added to spherical silica (average particle size). Resin in exactly the same manner as in Example 2 except that the diameter was changed to 100 parts with a diameter of 0.25 μm, “SO-C1” with aminosilane treatment, manufactured by Admatechs Co., Ltd., and a carbon amount of 0.8% per unit weight. A varnish was prepared. Next, an adhesive film was obtained in the same manner as in Example 1.

Example 9
The same adhesive film as in Example 2 was used.

(Comparative Example 1)
A resin varnish was produced in the same manner as in Example 1 except that 0.04 part of the blue pigment, 0.07 part of the yellow pigment and 0.08 part of the red pigment were not added. Next, an adhesive film was obtained in the same manner as in Example 1.

  The results are shown in Table 1.

  As is apparent from Table 1, in the examples, it is found that the dielectric loss tangent is low and the smear suppression in the via hole is excellent. Furthermore, in Examples 1 to 3 and 5 to 9, the insulation reliability was particularly excellent, and in Examples 3, 8 and 9, smear was further suppressed. On the other hand, although Comparative Example 1 had a low dielectric loss tangent, smear remained.

  Resin composition that can achieve low dielectric loss tangent of cured product of resin composition and can suppress smear in via hole after drilling and roughening cured product, sheet-like laminated material, multilayer print Wiring boards and semiconductor devices can be provided. Furthermore, electric products such as computers, mobile phones, digital cameras, and televisions equipped with these, and vehicles such as motorcycles, automobiles, trains, ships, and aircraft can be provided.

Claims (13)

(A) an epoxy resin, (B) an active ester compound, (C) a smear suppressing component, and (D) an inorganic filler,
When the nonvolatile component of the resin composition is 100% by mass, the content of the (B) active ester compound is 5% by mass or more,
When the nonvolatile component of the resin composition is 100% by mass, the (C) smear suppressing component is 0.001 to 10% by mass,
When the nonvolatile component of the resin composition is 100% by mass, (D) the inorganic filler is 70% by mass or more,
(C) A resin composition wherein the smear suppressing component is rubber particles.   2. The resin composition according to claim 1, wherein the content of the active ester compound (B) is 5 to 30 mass% when the nonvolatile component in the resin composition is 100 mass%.   The resin composition according to claim 1 or 2, wherein the content of the (B) active ester compound is 5 to 10% by mass when the nonvolatile component in the resin composition is 100% by mass.   The content of the inorganic filler (D) is 70 to 85% by mass when the nonvolatile component in the resin composition is 100% by mass, according to any one of claims 1 to 3. Resin composition.   The resin composition according to any one of claims 1 to 4, wherein an amount of carbon per unit weight of the inorganic filler is 0.02 to 3%.   After the resin composition is cured to form an insulating layer, and the surface of the insulating layer is roughened, the root mean square roughness Rq of the surface of the insulating layer is 500 nm or less, and obtained by plating the surface of the insulating layer. The peel strength between the conductor layer to be formed and the insulating layer is 0.3 kgf / cm or more, and the dielectric loss tangent of the cured product of the resin composition is 0.05 or less. 2. The resin composition according to item 1.   It is a resin composition for insulating layers of a multilayer printed wiring board, The resin composition of any one of Claims 1-6 characterized by the above-mentioned.   A sheet-like laminated material comprising the resin composition according to claim 1.   A multilayer printed wiring board, wherein an insulating layer is formed from a cured product of the resin composition according to claim 1.   A semiconductor device using the multilayer printed wiring board according to claim 9.   The sheet-like laminated material according to claim 8 is laminated on a circuit board, the resin composition is thermally cured to form an insulating layer, and a via hole is formed in the insulating layer formed on the circuit board. A method for producing a multilayer printed wiring board characterized by the above.   The method for producing a multilayer printed wiring board according to claim 11, wherein the top diameter of the via hole is 60 μm or less.   The method for producing a multilayer printed wiring board according to claim 11, wherein the maximum smear length from the wall surface of the bottom of the via hole is less than 5 μm.