JP2016155683A - Peeling device and peeling method of laminate and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method of a laminate which can prevent breakage of the laminate and maintain adsorptive holding of a substrate to a flexible plate while improving the fixing workability of a connection member to the flexible plate, and a manufacturing method of an electronic device.SOLUTION: A through hole 43 is provided on a flexible plate 42, a bolt 84 constituting a pad 82 is inserted to the through hole 43 from a laminate (a reinforcement plate 3B) side, thereby the fixing workability of the bolt 84 to the flexible plate 42 can be improved. A double-sided adhesive tape 56 being a shield member is arranged between a space part 94 formed on the flexible plate 42 from the through hole 43 and the reinforcement plate 3B adsorbed on the flexible plate 42 and the vacuum suction force of the flexible plate 42 with respect to the space part 94 is shielded by the double-sided adhesive tape 56.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a peeling apparatus and a peeling method for a laminate, and a method for manufacturing an electronic device.

  As electronic devices such as display panels, solar cells, and thin-film secondary batteries become thinner and lighter, substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices are made thinner. Is desired.

  However, as the substrate becomes thinner, the handling of the substrate deteriorates, so functional layers for electronic devices (thin film transistor (TFT: Thin Film Transistor), color filter (CF: Color Filter)) are formed on the surface of the substrate. It becomes difficult to do.

  Therefore, a glass reinforcing plate (second substrate) is attached to the back surface of the substrate to form a laminated body in which the substrate is reinforced with the reinforcing plate, and a functional layer is formed on the exposed surface of the substrate in the state of the laminated body. An electronic device manufacturing method has been proposed. In this manufacturing method, since the handling property of the substrate is improved, the functional layer can be favorably formed on the exposed surface of the substrate. And a reinforcement board is peeled from a board | substrate after formation of a functional layer.

  The method of peeling a reinforcing plate disclosed in Patent Document 1 is a direction in which the reinforcing plate and / or the substrate are separated from each other from one of the two corners located on the diagonal line of the rectangular laminate. This is performed by sequentially bending and deforming. At this time, in order to perform peeling smoothly, a peeling start part is created at one corner of the laminate. The peeling start portion is created by inserting a predetermined amount of a peeling blade from the end face of the laminate to the interface between the substrate and the reinforcing plate.

  The peeling device of Patent Document 1 includes a stage, a flexible plate, a plurality of pads (connecting members), a plurality of driving devices (movable bodies), a control device, and the like. According to the peeling apparatus of Patent Document 1, the substrate is sucked and held on the stage, and the reinforcing plate is sucked and held on the flexible plate. To the flexible plate, rods of a plurality of driving devices are connected via a plurality of pads. And a control apparatus controls the position of the rod of the some drive device with respect to a stage for every rod. Specifically, the positions of the rods of the plurality of driving devices are controlled so that the reinforcing plate is sequentially bent and deformed from the peeling start portion in a state where the substrate is supported flat on the stage. Thereby, a reinforcement board can be peeled from a board | substrate.

Japanese Patent No. 5155454

  In the peeling device of Patent Document 1, the pad (connecting member) is fixed to the surface of the flexible plate opposite to the laminated body, and the tip of the rod of the driving device is attached to the pad via a joint. . In such an attachment form, when the pad is fixed to the flexible plate, the rod and the joint of the driving device are in the way, so there is a problem that the pad cannot be easily fixed to the flexible plate. .

  Therefore, in order to improve the work of fixing the pad to the flexible plate, the following measures have been studied.

  FIG. 16 is an enlarged cross-sectional view of a main part showing a first conventional form for fixing the pad 100 to the flexible plate 102.

  The flexible plate 102 shown in the figure mainly includes a deflection plate 104 that controls the flexibility of the flexible plate 102 and a rubber plate 108 that is bonded to the surface of the deflection plate 104 and vacuum-adsorbs the laminated body 106. Composed. The rubber plate 108 and the deflecting plate 104 are provided with through holes 110 and 112 for inserting and arranging the pad 100. In the first embodiment, the pad 100 is fitted and fixed to the through holes 110 and 112 from the laminated body side (A) of the flexible plate 102. Thereby, the pad 100 can be easily fixed to the flexible plate 102. That is, since the pad 100 is fixed to the flexible plate 102 from the laminated body side (A) of the flexible plate 102, the rod and the joint of the driving device become an obstacle when the pad 100 is fixed to the flexible plate 102. There is nothing.

  However, in the first embodiment, when the laminated body 106 is vacuum-adsorbed to the rubber plate 108 of the flexible plate 102, the space 114 of the through holes 110 and 112 is laminated with the pad 100 by the suction action of the rubber plate 108. It is blocked by the body 106 and becomes a vacuum. For this reason, as shown in FIG. 17, a part 106 </ b> A of the stacked body 106 positioned in the space 114 may be pulled into the space 114 and cracked due to local deformation.

  FIG. 18 is an enlarged cross-sectional view of a main part showing a second conventional form for fixing the pad 100 to the flexible plate 102.

  In the second embodiment shown in the figure, a rubber block 116 for level adjustment is arranged in the space 114 so that a part 106A of the laminated body 106 is not drawn into the space 114.

  However, in the second embodiment, since the rubber block 116 does not follow the bending deformation of the flexible plate 102, a part 106 </ b> A of the laminated body 106 that is in contact with the rubber block 116 is separated from the other part at the time of peeling. Since it is no longer deformed, that is, it is locally deformed when viewed from other deformed parts, it may break.

  FIG. 19 is an enlarged cross-sectional view of a main part showing a third conventional configuration for fixing the pad 100 to the flexible plate 102.

  In the third embodiment shown in the figure, in order to prevent the space 114 from becoming a vacuum, the flexible plate 104 is provided with a vent hole 118 communicating with the space 114, and the space 114 is defined via the vent 118. Open to the atmosphere.

  If the bent plate 104 is provided with the vent hole 118 that communicates with the space 114, the space 114 communicates with the atmosphere, so that the problem of the first embodiment can be solved. However, since the vacuum between the rubber plate 108 and the laminate 106 is broken, there is a problem that the laminate 106 cannot be adsorbed.

  As described above, in the first to third embodiments, although the fixing operation of the pad 100 to the flexible plate 102 can be improved, there is a problem that a part 106A of the laminated body 106 is damaged, and the laminated body 106 cannot be adsorbed. There was a problem.

  16 to 19, reference numeral 120 denotes a bending plate interposed between the bending plate 104 and the rubber plate 108, and the bending plate 120 is bonded to the bending plate 104 via a double-sided adhesive tape 122. The Further, the rubber plate 108 is bonded to the flexible plate 120 via a double-sided adhesive tape 124. Reference numeral 126 denotes a suction through hole provided in the flexible plate 102, and the through hole 126 communicates with a frame-shaped suction groove 128 formed along the outer periphery of the rubber plate 108. ing. That is, the laminated body 106 is vacuum-adsorbed to the rubber plate 108 by sucking air in the suction groove 128 through the through hole 126.

  The present invention has been made in view of such a problem, and maintains the damage of the laminate and the adsorption holding of the substrate to the flexible plate while improving the fixing workability of the connecting member to the flexible plate. An object of the present invention is to provide a peeling apparatus and peeling method for a laminate, and a method for manufacturing an electronic device.

  In order to achieve the above object, one embodiment of a laminate peeling apparatus according to the present invention includes a first substrate and a second substrate, and the first substrate and the second substrate can be peeled off. In the substrate peeling apparatus for sequentially peeling the interface between the first substrate and the second substrate from one end side to the other end side with respect to the laminated body bonded, the first of the laminate body A support member for supporting the substrate, a flexible plate for vacuum-sucking the second substrate of the laminate on its suction surface, and a connecting member on the surface of the flexible plate opposite to the suction surface And a movable body that bends and deforms the flexible plate by being independently moved with respect to the support portion and sequentially peels the interface, and the connecting member includes: The flexible plate is inserted through a through hole provided in the flexible plate, and the flexible plate is shaped by the through hole. A shielding member is disposed between the formed space portion and the second substrate adsorbed to the flexible plate, and the vacuum suction force of the flexible plate against the space portion is blocked by the shielding member. It is characterized by.

  In order to achieve the above object, one embodiment of the laminate peeling method of the present invention includes a first substrate and a second substrate, and the first substrate and the second substrate can be peeled off. In the method for peeling a substrate, in which the interface between the first substrate and the second substrate is sequentially peeled from one end side to the other end side with respect to the laminated body bonded, the first of the laminate body A supporting step of supporting the substrate by a support portion, an adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate, and the second substrate of the laminate from the one end side. A peeling step in which the flexible plate is bent and deformed by a plurality of movable bodies via a connecting member so as to bend and deform sequentially toward the end side, and the interface is sequentially peeled, and in the peeling step, The connecting member is disposed through the through-hole provided in the flexible plate, A shielding member is disposed between the space formed in the flexible plate by the hole and the second substrate adsorbed by the flexible plate, and vacuum suction of the flexible plate to the space is performed. The force is blocked by the shielding member.

  In one aspect of the method for producing an electronic device of the present invention, in order to achieve the above object, the first substrate and the second substrate are attached to the first substrate so that the first substrate and the second substrate are detachable. In the method of manufacturing an electronic device, comprising: a functional layer forming step of forming a functional layer on the exposed surface of the substrate; and a separation step of separating the second substrate from the first substrate on which the functional layer is formed. The separation step includes a supporting step of supporting the first substrate of the laminate by a support portion, an adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate, and the lamination The flexible substrate is bent and deformed by a plurality of movable bodies via a connecting member so that the second substrate of the body is sequentially bent and deformed from one end side to the other end side, and the second substrate is formed. And a peeling step of sequentially peeling from the first substrate. In the step, the connecting member is disposed by being inserted through a through hole provided in the flexible plate, and is adsorbed to the space formed in the flexible plate by the through hole and the flexible plate. Further, a shielding member is disposed between the second substrate and the vacuum suction force of the flexible plate with respect to the space portion is blocked by the shielding member.

  According to one aspect of the present invention, since the through hole is provided in the flexible plate, the connecting member is inserted into the through hole from the laminated body side and arranged, thereby fixing the connecting member to the flexible plate. Can improve. In addition, a shielding member is disposed between the space formed in the flexible plate by the through hole and the second substrate adsorbed by the flexible plate, and the vacuum suction force of the flexible plate to the space is reduced. Since it is blocked by the shielding member, it is possible to prevent the laminate (second substrate) from being damaged due to the space being evacuated, and to maintain the adsorption holding of the substrate to the flexible plate.

  In one embodiment of the present invention, the shielding member is a resin sheet, and is preferably attached to the flexible plate.

  According to this aspect, the vacuum suction force of the flexible plate against the space portion can be shielded by the resin sheet such as a plastic tape attached to the flexible plate, and the flexible plate Therefore, it is possible to maintain the adsorption and holding of the laminate with respect to the flexible plate.

  In one aspect of the present invention, it is preferable that the space portion communicates with the atmosphere through a vent hole provided in at least one of the flexible plate and the connecting member.

  According to this aspect, even when a slight vacuum suction force acts on the space portion from the flexible plate, the space portion is open to the atmosphere, so that a part of the laminate is sucked into the space portion. Can be prevented. Further, even if a very slight vacuum suction force acting on the space is released to the atmosphere, the vacuum suction and holding of the laminate by the flexible plate is not affected.

  According to the peeling apparatus and peeling method for a laminate and the method for manufacturing an electronic device according to the present invention, damage to the laminate is improved while improving the fixing workability of the connecting member to the flexible board, and the substrate is attached to the flexible board. Adsorption holding can be maintained.

The principal part enlarged side view which shows an example of the laminated body provided to the manufacturing process of an electronic device The principal part enlarged side view which shows an example of the laminated body produced in the middle of the manufacturing process of LCD Explanatory drawing which showed the peeling start part creation method by the peeling start part creation apparatus Plan view of a laminate in which a peeling start part is created by the peeling start part creation method The longitudinal cross-sectional view which showed the structure of the peeling apparatus of embodiment The top view of the flexible board which showed the arrangement position of a plurality of connecting bars to a flexible board Explanatory drawing showing the configuration of the flexible plate Longitudinal sectional view of the peeling device that peels the interface of the laminate Longitudinal sectional view showing the pad mounting structure to the connecting bar Pad longitudinal section showing pad operation Cross-sectional view of the main part of the flexible plate showing how the bolts are attached to the flexible plate Explanatory drawing which showed the peeling method which peels the reinforcement board of the laminated body by which the peeling start part was created by the peeling start part creation method in time series Explanatory drawing which showed the peeling method which peels the reinforcement board of a laminated body in time series following FIG. 12B and 12C are enlarged perspective views of main parts. Sectional drawing of the principal part of the flexible board which showed another form of the vent hole with which a flexible board is equipped The principal part expanded sectional view which showed the conventional 1st form for improving the fixing operation | work of the pad with respect to a flexible board The principal part expanded sectional view which showed that a part of laminated body was attracted | sucked to the space part of the flexible board The principal part expanded sectional view which showed the conventional 2nd form for improving the fixing operation | work of the pad with respect to a flexible board The principal part expanded sectional view which showed the conventional 3rd form for improving the fixing operation | work of the pad with respect to a flexible board

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  Below, the case where the peeling apparatus and peeling method of the laminated body which concern on this invention are used at the manufacturing process (manufacturing method) of an electronic device is demonstrated.

  An electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. As a display panel, a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display) can be illustrated.

[Manufacturing process of electronic devices]
An electronic device is manufactured by forming a functional layer for an electronic device (in the case of LCD, a thin film transistor (TFT) and a color filter (CF)) on the surface of a substrate made of glass, resin, metal, or the like.

  Prior to the formation of the functional layer, the back surface of the substrate is bonded to a reinforcing plate to form a laminate. Thereafter, a functional layer is formed on the surface of the substrate in the state of the laminate. Then, after the functional layer is formed, the reinforcing plate is peeled from the substrate.

  That is, the electronic device manufacturing process includes a functional layer forming process for forming a functional layer on the surface of the substrate in the state of a laminate, and a separation process for separating the reinforcing plate from the substrate on which the functional layer is formed. In this separation step, the laminate peeling apparatus and peeling method according to the present invention are applied.

[Laminate 1]
FIG. 1 is an enlarged side view of an essential part showing an example of a laminated body 1.

  The laminate 1 includes a substrate (first substrate) 2 on which a functional layer is formed, and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. The reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the front surface 3 a, and the back surface 2 b of the substrate 2 is bonded to the resin layer 4. That is, the substrate 2 is detachably attached to the reinforcing plate 3 through the resin layer 4 by van der Waals force acting between the resin layer 4 or the adhesive force of the resin layer 4.

[Substrate 2]
The substrate 2 has a functional layer formed on its surface (exposed surface) 2a. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, a glass substrate is suitable as the substrate 2 for an electronic device because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. Further, as the linear expansion coefficient becomes smaller, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to be displaced during cooling.

  Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, it is preferable to select and use a glass suitable for the type of electronic device to be produced and a glass suitable for the production process. For example, it is preferable to employ glass (non-alkali glass) that does not substantially contain an alkali metal component for the glass substrate for a liquid crystal panel.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed as the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, and even more preferably 0.1 mm or less, in order to reduce the weight and thickness of the electronic device. Set to When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll. However, from the viewpoint of manufacturing the glass substrate and handling the glass substrate, the thickness is 0.03 mm or more. Preferably there is.

  In FIG. 1, the substrate 2 is composed of a single substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the board | substrate 2 can also be comprised with the laminated body which laminated | stacked the several board | substrate.

[Reinforcement plate 3]
Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

  The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type and thickness of the substrate 2 to be reinforced. The reinforcing plate 3 may be thicker or thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2.

  In this example, the reinforcing plate 3 is constituted by a single substrate, but the reinforcing plate 3 can also be constituted by a laminated body in which a plurality of substrates are laminated.

[Resin layer 4]
In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling process, the interface between the resin layer 4 and the substrate 2 is peeled off.

  Although resin which comprises the resin layer 4 is not specifically limited, Acrylic resin, polyolefin resin, polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin can be illustrated. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 4-20 micrometers. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matters can be absorbed by the deformation of the resin layer 4. On the other hand, when the thickness of the resin layer 4 is 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not used more than necessary, which is economical.

  The outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entire substrate 2.

  Moreover, although the resin layer 4 is comprised by 1 layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer. In this case, the type of resin constituting each layer may be different.

  Furthermore, in the embodiment, the resin layer 4 that is an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

  Furthermore, although the laminated body 1 of FIG. 1 includes the resin layer 4 as an adsorption layer, the resin layer 4 may be eliminated and the substrate 2 and the reinforcing plate 3 may be configured. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. In this case, it is preferable to form an inorganic thin film on the surface 3a of the reinforcing plate 3 so that the substrate 2 which is a glass substrate and the reinforcing plate 3 which is a glass plate do not adhere at a high temperature.

[Laminated body 6 of embodiment in which functional layer is formed]
A functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 through the functional layer forming step. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed in a predetermined pattern by photolithography or etching.

  FIG. 2 is an enlarged side view of an essential part showing an example of a rectangular laminate 6 produced during the manufacturing process of the LCD.

  The laminate 6 is configured by laminating a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B in this order. That is, the laminate 6 in FIG. 2 corresponds to a laminate in which the laminate 1 shown in FIG. 1 is arranged symmetrically with the functional layer 7 in between. Hereinafter, a laminate composed of the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminate 1A, and a laminate composed of the substrate 2B, the resin layer 4B, and the reinforcement plate 3B is referred to as a second laminate 1B. Called.

  A thin film transistor (TFT) as the functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter as the functional layer 7 is formed on the surface 2Ba of the substrate 2B of the second laminated body 1B. (CF) is formed.

  The first laminate 1A and the second laminate 1B are integrated by superimposing the surfaces 2Aa and 2Ba of the substrates 2A and 2B. Thereby, the laminated body 6 having a structure in which the first laminated body 1A and the second laminated body 1B are arranged symmetrically with the functional layer 7 interposed therebetween is manufactured.

  In the laminate 6, after the peeling start portion is formed with a knife in the peeling start portion creation step of the separation step, the reinforcing plates 3 </ b> A and 3 </ b> B are sequentially peeled off in the separation step of the separation step, and then the polarizing plate and the backlight Etc. are attached, and LCD which is a product is manufactured.

[Peeling start part creation device 10]
FIG. 3 is an explanatory view showing the configuration of the peeling start part creation device 10 used in the peeling start part creation step, and FIG. 3 (A) shows the positional relationship between the laminate 6 and the knife N. 3B is an explanatory diagram for creating the peeling start portion 26 at the interface 24 by the knife N, and FIG. 3C is an explanatory diagram showing a state immediately before creating the peeling start portion 30 at the interface 28. 3D is an explanatory diagram for creating the peeling start portion 30 on the interface 28 by the knife N, and FIG. 3E is an explanatory diagram of the laminate 6 in which the peeling start portions 26 and 30 are created. FIG. 4 is a plan view of the laminate 6 in which the peeling start portions 26 and 30 are created.

  At the time of creating the peeling start portions 26 and 30, the laminated body 6 is supported horizontally (X-axis direction in the drawing) with the back surface 3Bb of the reinforcing plate 3B being sucked and held by the table 12, as shown in FIG.

  The knife N is horizontally supported by the holder 14 such that the blade edge faces the end surface of the corner (one end side) 6A of the laminate 6. In addition, the position of the knife N is adjusted by the height adjusting device 16 in the height direction (Z-axis direction in the drawing). Furthermore, the knife N and the laminated body 6 are relatively moved in the horizontal direction by a feeding device 18 such as a ball screw device. The feeding device 18 may move at least one of the knife N and the table 12 in the horizontal direction. In the embodiment, the knife N is moved. Furthermore, a liquid supply device 22 for supplying the liquid 20 is disposed above the knife N on the upper surface of the knife N before or during insertion.

[Peeling start part creation method]
The peeling start part creation method by the peeling start part creation apparatus 10 sets the insertion position of the knife N to the corner 6A of the laminated body 6 at a position overlapping in the thickness direction of the laminated body 6, and the knife N The amount of insertion is set to be different for each of the interfaces 24 and 28.

  The creation procedure will be described.

  In the initial state, the cutting edge of the knife N exists at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B, which is the first insertion position. Therefore, first, as shown in FIG. 3A, the knife N is moved in the height direction, and the height of the blade edge of the knife N is set to the height of the interface 24.

  Thereafter, as shown in FIG. 3B, the knife N is moved horizontally toward the corner 6 </ b> A of the stacked body 6, and a predetermined amount of the knife N is inserted into the interface 24. In addition, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N at the time of or before the insertion of the knife N. As a result, the substrate 2B at the corner 6A is peeled off from the resin layer 4B, so that a triangular peeling start portion 26 is created at the interface 24 in plan view as shown in FIG. Although supply of the liquid 20 is not essential, if the liquid 20 is used, the liquid 20 remains in the peeling start portion 26 even after the knife N is removed, and thus the peeling start portion 26 that cannot be reattached can be created.

  Next, the knife N is pulled out from the corner 6A in the horizontal direction, and as shown in FIG. 3C, the cutting edge of the knife N is moved to the height of the interface 28 between the substrate 2A and the resin layer 4A which is the second insertion position. Set to

  Thereafter, as shown in FIG. 3D, the knife N is moved horizontally toward the laminated body 6 and a predetermined amount of the knife N is inserted into the interface 28. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the knife N. As a result, as shown in FIG. 3D, a peeling start portion 30 is created at the interface 28. Here, the amount of insertion of the knife N into the interface 28 is smaller than the amount of insertion into the interface 24. The above is the peeling start part creation method. Note that the amount of insertion of the knife N into the interface 24 may be smaller than the amount of insertion into the interface 28.

  The laminate 6 in which the peeling start portions 26 and 30 are created is taken out from the peeling start portion creating apparatus 10 and is transported to a peeling apparatus described later, and the interfaces 24 and 28 are sequentially peeled by the peeling apparatus.

  Although details of the peeling method will be described later, as shown by an arrow A in FIG. 4, by peeling the laminated body 6 from the corner 6 </ b> A toward the corner (other end side) 6 </ b> B opposite to the corner 6 </ b> A, a peeling start portion The interface 24 having a large area 26 is first peeled off starting from the peeling start portion 26. Thereby, the reinforcing plate 3B is peeled off. Thereafter, the laminated body 6 is bent again from the corner 6 </ b> A toward the corner 6 </ b> B, whereby the interface 28 having a small area of the peeling start portion 30 is peeled off from the peeling start portion 30. Thereby, the reinforcing plate 3A is peeled off.

  The insertion amount of the knife N is preferably set to 7 mm or more, more preferably about 15 to 20 mm, depending on the size of the laminate 6.

[Peeling device 40]
FIG. 5 is a longitudinal sectional view showing the configuration of the peeling device 40 of the embodiment. 6 shows a plurality (19 in FIG. 6) of connecting bars 44A, 44B, 44C, 44D, 44E, 44F, 44G, 44H, 44I, 44J, 44K, 44L, 44M, 44N, 44O, 44P, 44Q, 44R, 44S, and a plurality of driving devices (movable bodies) 48A, 48B, 48C, 48D, 48E, 48F, 48G, 48H, 48I, 48J, 48K, 48L, 48M, 48N , 48O, 48P, 48Q, 48R, 48S are plan views schematically showing the flexible plate 42. 5 corresponds to a cross-sectional view taken along line B-B in FIG. 6, and in FIG. 6, the stacked body 6 is indicated by a solid line.

  As shown in FIG. 5, the peeling device 40 includes a pair of movable devices 46 and 46 that are disposed above and below the laminated body 6. Since the movable devices 46 and 46 have the same configuration, the movable device 46 disposed on the lower side of FIG. 5 will be described here, and the description of the movable device 46 disposed on the upper side will be omitted by attaching the same reference numerals. .

  The movable device 46 includes the above-described plurality of long connecting bars 44A to 44S, the plurality of driving devices 48A to 48S described above for moving the connecting bars 44A to 44S up and down for each of the connecting bars 44A to 44S, and the driving device 48A. It is comprised by the controller 50 etc. which control drive device 48A-48S for every -48S. The connection bars 44A to 44S and the drive devices 48A to 48S will be described later.

  The flexible plate 42 holds the reinforcing plate 3B by vacuum suction in order to bend and deform the reinforcing plate 3B.

[Flexible plate 42]
7A is a plan view of the flexible plate 42, and FIG. 7B is an enlarged vertical sectional view of the flexible plate 42 taken along the line CC in FIG. 7A. In FIG. 7C, a suction portion 54 constituting the flexible plate 42 is detachably provided via a double-sided adhesive tape 56 with respect to the rectangular flexible plate 52 constituting the flexible plate 42. It is an expanded longitudinal cross-sectional view of the flexible board 42 which shows that.

  As described above, the flexible plate 42 is configured such that the suction portion 54 is detachably attached to the flexible plate 52 via the double-sided adhesive tape 56.

  The suction part 54 includes a flexible plate 58 that is thinner than the flexible plate 52. The lower surface of the bending plate 58 is detachably attached to the upper surface of the bending plate 52 via a double-sided adhesive tape 56.

  Further, the suction portion 54 is provided with a rectangular breathable sheet (suction surface) 60 that sucks and holds the inner surface of the reinforcing plate 3B of the laminate 6. The thickness of the breathable sheet 60 is 2 mm or less, preferably 1 mm or less for the purpose of reducing the tensile stress generated in the reinforcing plate 3B at the time of peeling, and in the embodiment, the thickness of 0.5 mm is used.

  Further, the adsorbing portion 54 is provided with a seal frame member 62 that surrounds the air permeable sheet 60 and that contacts the outer peripheral surface of the reinforcing plate 3B. The seal frame member 62 and the air permeable sheet 60 are bonded to the upper surface of the flexible plate 58 via a double-sided adhesive tape 64. Further, the seal frame member 62 is a closed-cell sponge having a Shore E hardness of 20 degrees or more and 50 degrees or less, and the thickness thereof is configured to be 0.3 mm to 0.5 mm thicker than the thickness of the breathable sheet 60. Has been.

  A frame-shaped groove 66 is provided between the breathable sheet 60 and the seal frame member 62. In addition, a plurality of through holes 68 are opened in the deflecting plate 52, and one end of these through holes 68 communicates with the groove 66, and the other end is connected to an intake source (for example, via a suction pipe not shown). Connected to a vacuum pump).

  Therefore, when the intake source is driven, air in the suction pipe, the through hole 68, and the groove 66 is sucked, so that the inner surface of the reinforcing plate 3B of the laminate 6 is vacuum-adsorbed and held on the air-permeable sheet 60. In addition, the outer peripheral surface of the reinforcing plate 3B is pressed against the seal frame member 62. Thereby, the airtightness of the adsorption space surrounded by the seal frame member 62 is improved.

The bending plate 52 has higher bending rigidity than the bending plate 58, the air permeable sheet 60, and the seal frame member 62, and the bending rigidity of the bending plate 52 dominates the bending rigidity of the flexible plate 42. The flexural rigidity per unit width (1 mm) of the flexible plate 42 is preferably 1000 to 40000 N · mm ² / mm. For example, in a portion where the width of the flexible plate 42 is 100 mm, the bending rigidity is 100000 to 4000000 N · mm ² . By setting the bending rigidity of the flexible plate 42 to 1000 N · mm ² / mm or more, it is possible to prevent the reinforcing plate 3B from being bent and held by the flexible plate 42 from being bent. In addition, by setting the bending rigidity of the flexible plate 42 to 40000 N · mm ² / mm or less, the reinforcing plate 3B attracted and held by the flexible plate 42 can be appropriately bent and deformed.

  The flexible plates 52 and 58 are resin members having a Young's modulus of 10 GPa or less, and are resin members such as polycarbonate resin, polyvinyl chloride (PVC) resin, acrylic resin, and polyacetal (POM) resin.

[Movable device 46]
A plurality of connection bars 44 </ b> A to 44 </ b> S constituting the movable device 46 of FIG. 5 are fixed to the lower surface (surface opposite to the suction surface) of the bending plate 52 via pads (connection members) 82.

<Connection bars 44A-44S>
As shown in FIG. 6, the connecting bars 44 </ b> A to 44 </ b> S are made of, for example, aluminum having high rigidity, and the longitudinal axis thereof is the boundary between the already peeled portion and the unpeeled portion of the interfaces 24 and 28 (see FIG. 5) of the laminate 6. It arrange | positions along the peeling front L (refer FIG. 6, FIG. 8) which is a line.

  On the other hand, the corner 52A of the flexible plate 52 corresponding to the corner 6A of the laminated body 6 extends in a direction opposite to the peeling progress direction A of the peeling front L. Two connecting bars 44A and 44B and two driving devices 48A and 48B are disposed in the corner 52A along the peeling progress direction A. That is, the corner 6A is peeled off by moving the two drive devices 48A and 48B arranged at the corner 52A upward.

  Further, the connecting bars 44A to 44S are arranged at intervals along the peeling progress direction (arrow A in FIG. 6) of the interfaces 24 and 28 (see FIG. 5). Thereby, since the connection bar 44A-44S longitudinal axis and the advancing peeling front L correspond, the reinforcement board 3B can be peeled smoothly from the board | substrate 2B.

  Further, the connecting bars 44A to 44O are each configured to have a length corresponding to the length of the peeling front L.

  Furthermore, the driving devices 48A to 48S connected to the connection bars 44A to 44S are arranged at positions where the connection bars 44A to 44S are equally divided in the longitudinal direction. That is, the connecting bars 44A, 44B, 44R, and 44S arranged outside the peeling start end and the peeling end end do not pass the peeling front below the connecting bars 44A, 48B, 48R, and 48S. One unit is arranged at the center in the longitudinal direction of 44B, 44R, and 44S. The connecting bars 44C, 44D, 44P, and 44Q disposed at the peeling start end and the peeling end end are shorter than the other portions in the length of the peeling front L that passes below the connecting bars 44C, 44D, 44P, and 44P. , 48Q are arranged at the center in the longitudinal direction of the connecting bars 44C, 44D, 44P, 44Q, respectively. The other connecting bars 44E to 44O have a longer length of the peeling front L that passes below them than the other parts, so that the driving devices 48E to 48O divide the connecting bars 44E to 44O into three equal parts in the longitudinal direction. As shown in FIG. Thereby, since the power from the drive devices 48A to 48S can be transmitted uniformly in the longitudinal direction of the connecting bars 44A to 44S, the reinforcing plate 3B can be more smoothly separated from the substrate 2B. The number of divisions in the longitudinal direction is not limited to two divisions and three divisions, and may be four or more divisions.

  These driving devices 48 </ b> A to 48 </ b> S are moved up and down independently by the controller 50.

  That is, the controller 50 controls the driving devices 48A to 48S to connect the connecting bar 44A located on the corner 6A side of the laminated body 6 in FIG. The bar 44S is sequentially moved downward. By this operation, as shown in the longitudinal sectional view of FIG. 8, the interface 24 of the laminate 6 is peeled off from the peeling start portion 26 (see FIG. 4). In addition, the laminated body 6 shown in FIG. 5, FIG. 8 is the laminated body 6 by which the peeling start parts 26 and 30 were created by the peeling start part preparation method demonstrated in FIG.

  The drive devices 48A to 48S are constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotational motion of the servo motor is converted into linear motion in the ball screw mechanism and transmitted to the rod 70 of the ball screw mechanism. The connecting bars 44A to 44S are connected to the tip of the rod 70 through a ball joint and a skid mechanism (not shown). Thereby, the connection bars 44 </ b> A to 44 </ b> S can be tilted following the bending deformation of the flexible plate 42. Therefore, the flexible plate 42 can be sequentially bent and deformed from the corner portion 6A toward the corner portion 6B without applying an excessive force to the flexible plate 42. The driving devices 48A to 48S are not limited to a rotary servo motor and a ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder).

  The frame 74 is moved downward by a drive unit (not shown) when the peeled reinforcing plate 3B is removed from the flexible plate 42.

  The controller 50 is configured as a computer including a recording medium such as a CPU, a ROM, and a RAM. The controller 50 controls the plurality of drive devices 48A to 48S for each of the drive devices 48A to 48S by causing the CPU to execute the program recorded on the recording medium, and moves the plurality of connecting bars 44A to 44S up and down. Control.

<Pad 82>
FIG. 9 is a longitudinal sectional view showing a structure for attaching the pad 82 to the connecting bar 44D. 10A is a longitudinal sectional view of the pad 82 when not compressed, and FIG. 10B is a longitudinal sectional view of the pad 82 when compressed. 9 and 10 illustrate the pad 82 attached to the connection bar 44D, the pads 82 attached to the other connection bars 44A to 44C and 44E to 44S have the same configuration. The pad 82 includes a bolt 84, a spring 86, a stopper 88, and a nut 90.

  FIG. 11 is a cross-sectional view of the main part showing a mounting form of the bolt 84 to the flexible plate 42.

  The bolt 84 is disposed through the through hole 43 provided in the flexible plate 42 from the reinforcing plate 3B side. Then, the bolt 84 is rotated by relatively rotating the nut 92 and the bolt 84 screwed into the bolt 84 after a hexagon wrench (not shown) is inserted into the hexagon hole 85A of the base 84A of the bolt 84. Fastened to the flexible plate 42.

  Returning to FIG. 10, the screw portion 84B of the bolt 84 protrudes outward from the through hole 45 of the connection bar 44D. The screw portion 84B is inserted into the spring 86, and the spring 86 is interposed between the base portion 84A and the connecting bar 44D. The connecting bar 44D has a U-shaped cross section.

  A stopper 88 having a diameter larger than that of the through hole 45 is fixed to the screw portion 84 </ b> B protruding from the through hole 45 by the nut 90. As shown in FIG. 10A, the spring 86 is held at the precompressed length when the stopper 88 is in contact with the surface of the connecting bar 44D. Thereby, the pad 82 becomes an uncompressed form. In FIG. 9, when the connecting bar 44D is lowered by the driving device 48D, the surface of the connecting bar 44D comes into contact with the stopper 88, so that the flexible plate 42 can be lowered via the stopper 88 and the bolt 84. .

  In addition, due to variations in the flatness of the flexible plate 52 of the flexible plate 42, the interval between the pair of upper and lower flexible plates 42, 42 (the interval between the support portion and the flexible plate) varies. In this case, the spring 86 contracts as shown in FIG. 10B so as to absorb the variation. Further, the variation in straightness of the connecting bar 44D is also absorbed by the spring 86 contracting. Thereby, even if the said space | interval and the said linear advance degree have dispersion | variation, the connection bar 44D can be reliably attached to the bending board 52. FIG.

[Peeling method of reinforcing plates 3A and 3B by peeling device 40]
12 (A) to 12 (C) to 13 (A) to 13 (C) show the laminate 6 in which the peeling start portions 26 and 30 are created at the corner 6A by the peeling start portion creating method described in FIG. The peeling method is shown. That is, in the drawing, a peeling method for peeling the reinforcing plates 3A and 3B of the laminate 6 is shown in time series.

  Moreover, the carrying-in operation | work of carrying in the laminated body 6 to the peeling apparatus 40, and carrying out the peeled reinforcement board 3A, 3B and the panel P are performed by the conveying apparatus 80 provided with the suction pad 78 shown to FIG. 12 (A). In FIGS. 12 and 13, the movable device 46 is not shown in order to avoid complexity of the drawings. The panel P is a product panel in which the substrate 2A excluding the reinforcing plates 3A and 3B and the substrate 2B are attached via the functional layer 7.

  FIG. 12A is a side view of the peeling device 40 in which the stacked body 6 is placed on the lower flexible plate 42 by the operations indicated by arrows E and F of the transport device 80. In this case, the lower flexible plate 42 and the upper flexible plate 42 are arranged so that the conveying device 80 is inserted between the lower flexible plate 42 and the upper flexible plate 42. Is moved in advance to a relatively sufficiently retracted position. When the laminate 6 is placed on the lower flexible plate 42, the reinforcing plate 3 </ b> B of the laminate 6 is held by vacuum suction by the lower flexible plate 42. That is, FIG. 12A shows an adsorption process in which the reinforcing plate 3B as the second substrate is adsorbed and held by the lower flexible plate.

  In FIG. 12B, the lower flexible plate 42 and the upper flexible plate 42 are moved in a direction in which the lower flexible plate 42 and the upper flexible plate 42 are relatively approached, and the reinforcing plate 3 </ b> A of the laminate 6 is moved to the upper flexible plate 42. It is a side view of the peeling apparatus 40 of the state hold | maintained by vacuum suction. That is, FIG. 12B shows an adsorption step in which the reinforcing plate 3A as the first substrate is adsorbed and held by the upper flexible plate (supporting portion) 42. FIG. 14A is a perspective view corresponding to FIG. 12B, and is an enlarged perspective view of the corner portion 6A of the laminate 6.

  When the substrate 2 of the laminate 1 shown in FIG. 1 is peeled from the reinforcing plate 3 by the peeling device 40, the substrate 2, which is the first substrate, is removed by the upper flexible plate (supporting portion) 42. Supporting (supporting step), the reinforcing plate 3 as the second substrate is sucked and held by the lower flexible plate 42 (sucking step). In this case, the support part that supports the substrate 2 is not limited to the flexible plate 42, and may be any member that can detachably support the substrate 2. However, by using the flexible plate 42 as the support portion, the substrate 2 and the reinforcing plate 3 can be simultaneously curved and peeled, so that the peeling is performed in comparison with the form in which only the substrate 2 or the reinforcing plate 3 is curved. There is an advantage that power can be reduced.

  Returning to FIG. 12, FIG. 12C shows the interface 24 of the laminated body 6 while the lower flexible plate 42 is bent and deformed downward from the corner 6 </ b> A to the corner 6 </ b> B of the laminated body 6. It is the side view which showed the state which peels from the peeling start part 26 (refer FIG. 4). That is, in the plurality of connection bars 44A to 44S of the lower flexible plate 42 shown in FIG. 8, the connection bar located on the corner 6B side from the connection bar 44A located on the corner 6A side of the laminate 6. 44S is sequentially moved downward to peel the interface 24 (peeling step). FIG. 14B is a perspective view corresponding to FIG. 12C, and is an enlarged perspective view of the corner portion 6A of the laminate 6. According to the figure, it can be seen that the flexible plate 42 is bent and deformed by the downward movement of the connecting bars 44A to 44E, and the reinforcing plate 3B is peeled off from the substrate 2B.

  In conjunction with the above operation, in the plurality of connection bars 44 </ b> A to 44 </ b> S of the upper flexible plate 42, the connection bar 44 </ b> A positioned on the corner 6 </ b> A side of the stacked body 6 is connected to the corner 6 </ b> B side. The interface 24 may be peeled off by sequentially moving the bar 44S upward. Thereby, a peeling force can be made small compared with the form which curves only the reinforcement board 3B.

  FIG. 13A is a side view of the peeling device 40 in a state where the interface 24 is completely peeled. According to the figure, the peeled reinforcing plate 3B is vacuum-sucked and held on the lower flexible plate 42, and the laminated body 6 (a laminated body composed of the reinforcing plate 3A and the panel P) excluding the reinforcing plate 3B is allowed to be on the upper side. The flexible plate 42 is held by vacuum suction.

  Further, the lower flexible plate 42 and the upper flexible plate 42 are relatively positioned so that the conveying device 80 shown in FIG. 12A is inserted between the upper and lower flexible plates 42. Therefore, it is moved to a fully retracted position.

  Thereafter, the vacuum suction of the lower flexible plate 42 is first released. Next, the reinforcing plate 3B is sucked and held by the suction pad 78 of the transport device 80 via the resin layer 4B. Next, the reinforcing plate 3B is unloaded from the peeling device 40 by the operation of the conveying device 80 indicated by arrows G and H in FIG.

  FIG. 13B is a side view in which the laminate 6 excluding the reinforcing plate 3B is vacuum-sucked and held by the lower flexible plate 42 and the upper flexible plate 42. FIG. That is, the lower flexible plate 42 and the upper flexible plate 42 are moved in a relatively approaching direction, and the substrate 2B is vacuum held by the lower flexible plate 42 (support). Process).

  FIG. 13C illustrates the interface 28 of the laminate 6 with the peeling start portion 30 (see FIG. 13) while the upper flexible plate 42 is bent upward from the corner 6A toward the corner 6B of the laminate 6. 4 is a side view showing a state of peeling from the starting point. That is, in the plurality of connection bars 44A to 44S of the upper flexible plate 42 shown in FIG. 8, the connection bar 44S positioned on the corner 6B side from the connection bar 44A positioned on the corner 6A side of the laminate 6. Are sequentially moved upward to peel the interface 28 (peeling step). In conjunction with this operation, the plurality of connecting bars 44A to 44S of the lower flexible plate 42 are positioned on the corner 6B side from the connecting bar 44A positioned on the corner 6A side of the laminate 6. The interface 28 may be peeled off by sequentially moving the connecting bar 44S downward. Thereby, a peeling force can be made small compared with the form which curves only reinforcement board 3A.

  Thereafter, the reinforcing plate 3A completely peeled off from the panel P is taken out from the upper flexible plate 42, and the panel P is taken out from the lower flexible plate 42. The above is the peeling method of the laminated body 6 in which the peeling start parts 26 and 30 were created in the corner 6A.

[Features of peeling device 40]
As shown in FIG. 11, the through hole 43 is provided in the flexible plate 52 of the flexible plate 42, and the bolt 84 constituting the pad 82 is disposed through the through hole 43 from the laminated body (reinforcing plate 3 </ b> B) side. There is a special feature. Thereby, the workability of fixing the bolt 84 to the flexible plate 42 can be improved. The suction portion 54 is attached to the flexible plate 52 with a double-sided adhesive tape 56 after the bolts 84 are attached to the through holes 43.

  As a result, the double-sided adhesive tape 56 as a shielding member is disposed between the space portion 94 formed in the flexible plate 42 by the through hole 43 and the reinforcing plate 3B adsorbed to the flexible plate 42. The vacuum suction force of the flexible plate 42 against the portion 94 is characterized by being blocked by the double-sided adhesive tape 56. Thereby, the breakage of the reinforcing plate 3B due to the vacuum of the space portion 94 can be prevented, and the adsorption and holding of the reinforcing plate 3B with respect to the flexible plate 42 can be maintained.

  An example of the double-sided adhesive tape 56 is a plastic tape.

  Further, the space 94 of the flexible plate 42 is characterized in that it communicates with the atmosphere through the air holes 96. Although the ventilation hole 96 shown in FIG. 11 is provided in the bending plate 52 of the flexible plate 42, it is not limited to this. For example, as shown in the cross-sectional view of the main part of another form of the flexible plate 42 shown in FIG. 15, the base 84 </ b> A of the bolt 84 is provided with a vent hole 84 </ b> C, and the vent groove is formed along the bolt fitting hole 53 of the flexible plate 52. 53A, the nut 92 may be provided with a ventilation groove 92A, and the air hole 84C, the ventilation groove 53A, and the ventilation groove 92A may be communicated with each other to allow the space portion 94 to communicate with the atmosphere. Further, only the bolt 84 may be provided with a vent hole that allows the space portion 94 to communicate with the atmosphere. That is, a vent hole may be provided in at least one of the flexible plate 52 or the pad 82.

  Thereby, even if a very small vacuum suction force acts on the space portion 94 from the flexible plate 42, the space portion 94 is always open to the atmosphere. The suction to 94 can be prevented. Further, even if a very small vacuum suction force acting on the space portion 94 is opened to the atmosphere, the vacuum suction holding of the reinforcing plate 3B by the flexible plate 42 is not affected.

  N ... knife, P ... panel, 1 ... laminated body, 1A ... first laminated body, 1B ... second laminated body, 2 ... substrate, 2a ... surface of substrate, 2b ... back surface of substrate, 2A ... substrate, 2Aa ... surface of substrate, 2Ab ... back surface of substrate, 2B ... substrate, 2Ba ... surface of substrate, 2Bb ... back surface of substrate, 3 ... reinforcing plate, 3a ... surface of reinforcing plate, 3b ... back surface of reinforcing plate, 3A ... reinforcing plate 3Aa ... the surface of the reinforcing plate, 3Ab ... the back surface of the reinforcing plate, 3B ... the reinforcing plate, 3Ba ... the surface of the reinforcing plate, 3Bb ... the back surface of the reinforcing plate, 4 ... the resin layer, 4A ... the resin layer, 4B ... the resin layer, 6 ... Laminate, 6A, 6B ... Corner, 7 ... Functional layer, 8 ... Reinforcement plate, 10 ... Peeling start creation device, 12 ... Table, 14 ... Holder, 16 ... Height adjustment device, 18 ... Feeding device, 20 ... liquid, 22 ... liquid supply device, 24 ... interface, 26 ... peeling start part, 28 ... interface, 30 ... peeling open Part, 32, 34 ... peeling start part, 40 ... peeling apparatus, 42 ... flexible plate, 43 ... through hole, 44A-44S ... connecting bar, 46 ... movable device, 48A-48S ... driving device, 50 ... controller, 52 ... Deflection plate, 53 ... Bolt fitting hole, 53A ... Ventilation groove, 54 ... Adsorption part, 56 ... Double-sided adhesive tape, 58 ... Deflection plate, 60 ... Breathable sheet, 62 ... Seal frame member, 64 ... Double-sided adhesion sheet , 66 ... groove, 68 ... through hole, 70 ... rod, 72 ... ball joint, 74 ... frame, 78 ... suction pad, 80 ... transport device, 82 ... pad, 84 ... bolt, 84A ... base, 84C ... vent hole, 85A ... Hexagonal hole, 86 ... Spring, 88 ... Stopper, 90 ... Nut, 92 ... Nut, 92A ... Vent groove, 94 ... Space, 96 ... Vent hole

Claims (5)

A laminated body including a first substrate and a second substrate, the first substrate and the second substrate being detachably bonded to each other, the first substrate and the second substrate In the substrate peeling apparatus for sequentially peeling the interface from one end side to the other end side,
A support part for supporting the first substrate of the laminate;
A flexible plate that vacuum-sucks the second substrate of the laminate on its suction surface;
The flexible plate is fixed to a surface opposite to the suction surface of the flexible plate via a connecting member, and is flexibly deformed by being moved independently with respect to the support portion. A movable body for sequentially peeling the interface,
The connecting member is disposed through a through hole provided in the flexible plate,
A shielding member is disposed between the space formed in the flexible plate by the through hole and the second substrate adsorbed by the flexible plate;
A laminate peeling apparatus, wherein a vacuum suction force of the flexible plate with respect to the space is blocked by a shielding member.   The peeling device for a laminate according to claim 1, wherein the shielding member is a resin sheet, and is attached to the flexible plate.   The peeling device for a laminate according to claim 1 or 2, wherein the space portion communicates with the atmosphere through a vent hole provided in at least one of the flexible plate or the connecting member. A laminated body including a first substrate and a second substrate, the first substrate and the second substrate being detachably bonded to each other, the first substrate and the second substrate In the peeling method of the substrate that peels sequentially from one end side to the other end side of the interface,
A supporting step of supporting the first substrate of the laminate by a support portion;
An adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate;
The flexible board is bent and deformed by a plurality of movable bodies via a connecting member so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side, and the interface is sequentially formed. A peeling step for peeling,
In the peeling step,
The connecting member is disposed through a through hole provided in the flexible plate,
A shielding member is disposed between the space formed in the flexible plate by the through hole and the second substrate adsorbed by the flexible plate;
A laminate peeling method, wherein a vacuum suction force of the flexible plate to the space is blocked by a shielding member. A functional layer forming step of forming a functional layer on an exposed surface of the first substrate with respect to a laminate in which the first substrate and the second substrate are detachably attached, and the functional layer is formed. Separating the second substrate from the first substrate, and a method for manufacturing an electronic device comprising:
The separation step includes
A supporting step of supporting the first substrate of the laminate by a support portion;
An adsorption step of adsorbing the second substrate of the laminate on an adsorption surface of a flexible plate;
The flexible plate is bent and deformed by a plurality of movable bodies via a connecting member so that the second substrate of the laminate is sequentially bent and deformed from one end side to the other end side. A peeling step of sequentially peeling the substrate from the first substrate,
In the peeling step,
The connecting member is disposed through a through hole provided in the flexible plate,
A shielding member is disposed between the space formed in the flexible plate by the through hole and the second substrate adsorbed by the flexible plate;
The method of manufacturing an electronic device, wherein a vacuum suction force of the flexible plate with respect to the space is blocked by a shielding member.

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